CH533360A - Halbleiterbauelement - Google Patents

Halbleiterbauelement

Info

Publication number
CH533360A
CH533360A CH933071A CH933071A CH533360A CH 533360 A CH533360 A CH 533360A CH 933071 A CH933071 A CH 933071A CH 933071 A CH933071 A CH 933071A CH 533360 A CH533360 A CH 533360A
Authority
CH
Switzerland
Prior art keywords
semiconductor component
semiconductor
component
Prior art date
Application number
CH933071A
Other languages
English (en)
Inventor
Sitte Bernd
Original Assignee
Bbc Brown Boveri & Cie
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bbc Brown Boveri & Cie filed Critical Bbc Brown Boveri & Cie
Priority to CH933071A priority Critical patent/CH533360A/de
Priority to DE19717126644 priority patent/DE7126644U/de
Priority to DE19712134648 priority patent/DE2134648A1/de
Publication of CH533360A publication Critical patent/CH533360A/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
CH933071A 1971-06-25 1971-06-25 Halbleiterbauelement CH533360A (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CH933071A CH533360A (de) 1971-06-25 1971-06-25 Halbleiterbauelement
DE19717126644 DE7126644U (de) 1971-06-25 1971-07-12 Halbleiterbauelement
DE19712134648 DE2134648A1 (de) 1971-06-25 1971-07-12 Halbleiterbauelement

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH933071A CH533360A (de) 1971-06-25 1971-06-25 Halbleiterbauelement

Publications (1)

Publication Number Publication Date
CH533360A true CH533360A (de) 1973-01-31

Family

ID=4350827

Family Applications (1)

Application Number Title Priority Date Filing Date
CH933071A CH533360A (de) 1971-06-25 1971-06-25 Halbleiterbauelement

Country Status (2)

Country Link
CH (1) CH533360A (de)
DE (2) DE2134648A1 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10122837B4 (de) * 2001-05-11 2006-06-22 Ixys Semiconductor Gmbh Leistungshalbleiter-Modul

Also Published As

Publication number Publication date
DE2134648A1 (de) 1972-12-28
DE7126644U (de) 1973-04-19

Similar Documents

Publication Publication Date Title
AT361042B (de) Integrierte halbleiterschaltung
AT323963B (de) Bauelement
IT949770B (it) Componente semiconduttore
IT947244B (it) Dispositivo semiconduttore
IT975353B (it) Dispositivo semiconduttore
CH546482A (de) Halbleiterbauelement.
BE788036A (fr) Elements semiconducteurs piezo-electriques
AT376844B (de) Halbleiterbauteil
IT959277B (it) Dispositivo semiconduttore
ATA405972A (de) Bauelement
AT316689B (de) Thyristor
IT952873B (it) Dispositivo semiconduttore
CH541869A (de) Halbleiterbauelement
IT968868B (it) Dispoitivo semiconduttore
SE408354B (sv) Styrbar halvledarlikriktare
IT949161B (it) Dispositivo semiconduttore
CH517379A (de) Halbleitervorrichtung
CH539953A (de) Halbleiterbauelement
SE388080B (sv) Halvledarkomponent
AT312225B (de) Bauelement
CH512050A (de) Bauelement
CH516874A (de) Halbleiterbauelement
AT319402B (de) Thyristor
CH533360A (de) Halbleiterbauelement
AT330422B (de) Bauelement

Legal Events

Date Code Title Description
PL Patent ceased