CH533360A - Halbleiterbauelement - Google Patents

Halbleiterbauelement

Info

Publication number
CH533360A
CH533360A CH933071A CH933071A CH533360A CH 533360 A CH533360 A CH 533360A CH 933071 A CH933071 A CH 933071A CH 933071 A CH933071 A CH 933071A CH 533360 A CH533360 A CH 533360A
Authority
CH
Switzerland
Prior art keywords
semiconductor component
semiconductor
component
Prior art date
Application number
CH933071A
Other languages
English (en)
Inventor
Sitte Bernd
Original Assignee
Bbc Brown Boveri & Cie
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bbc Brown Boveri & Cie filed Critical Bbc Brown Boveri & Cie
Priority to CH933071A priority Critical patent/CH533360A/de
Priority to DE19717126644U priority patent/DE7126644U/de
Priority to DE19712134648 priority patent/DE2134648A1/de
Publication of CH533360A publication Critical patent/CH533360A/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/138—Containers comprising a conductive base serving as an interconnection having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
CH933071A 1971-06-25 1971-06-25 Halbleiterbauelement CH533360A (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CH933071A CH533360A (de) 1971-06-25 1971-06-25 Halbleiterbauelement
DE19717126644U DE7126644U (de) 1971-06-25 1971-07-12 Halbleiterbauelement
DE19712134648 DE2134648A1 (de) 1971-06-25 1971-07-12 Halbleiterbauelement

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH933071A CH533360A (de) 1971-06-25 1971-06-25 Halbleiterbauelement

Publications (1)

Publication Number Publication Date
CH533360A true CH533360A (de) 1973-01-31

Family

ID=4350827

Family Applications (1)

Application Number Title Priority Date Filing Date
CH933071A CH533360A (de) 1971-06-25 1971-06-25 Halbleiterbauelement

Country Status (2)

Country Link
CH (1) CH533360A (de)
DE (2) DE2134648A1 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10122837B4 (de) * 2001-05-11 2006-06-22 Ixys Semiconductor Gmbh Leistungshalbleiter-Modul

Also Published As

Publication number Publication date
DE7126644U (de) 1973-04-19
DE2134648A1 (de) 1972-12-28

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Legal Events

Date Code Title Description
PL Patent ceased