BR7205636D0 - Unidade de circuito eletronico e processo para fabrica-la - Google Patents
Unidade de circuito eletronico e processo para fabrica-laInfo
- Publication number
- BR7205636D0 BR7205636D0 BR5636/72A BR563672A BR7205636D0 BR 7205636 D0 BR7205636 D0 BR 7205636D0 BR 5636/72 A BR5636/72 A BR 5636/72A BR 563672 A BR563672 A BR 563672A BR 7205636 D0 BR7205636 D0 BR 7205636D0
- Authority
- BR
- Brazil
- Prior art keywords
- manufacture
- electronic circuit
- circuit unit
- electronic
- unit
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49822—Multilayer substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
- H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US17314571A | 1971-08-19 | 1971-08-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
BR7205636D0 true BR7205636D0 (pt) | 1973-07-03 |
Family
ID=22630733
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR5636/72A BR7205636D0 (pt) | 1971-08-19 | 1972-08-17 | Unidade de circuito eletronico e processo para fabrica-la |
Country Status (10)
Country | Link |
---|---|
US (1) | US3760090A (pt) |
JP (1) | JPS4830376A (pt) |
AU (1) | AU4258172A (pt) |
BR (1) | BR7205636D0 (pt) |
CA (1) | CA989981A (pt) |
DE (1) | DE2236007A1 (pt) |
ES (1) | ES405978A1 (pt) |
FR (1) | FR2149350A1 (pt) |
GB (1) | GB1403111A (pt) |
IT (1) | IT963918B (pt) |
Families Citing this family (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3874549A (en) * | 1972-05-26 | 1975-04-01 | Norman Hascoe | Hermetic sealing cover for a container for a semiconductor device |
US3872583A (en) * | 1972-07-10 | 1975-03-25 | Amdahl Corp | LSI chip package and method |
JPS5548700B2 (pt) * | 1973-01-30 | 1980-12-08 | ||
US3911138B1 (en) * | 1973-02-26 | 1996-10-29 | Childrens Hosp Medical Center | Artificial blood and method for supporting oxygen transport in animals |
JPS5073178A (pt) * | 1973-11-02 | 1975-06-17 | ||
US3934336A (en) * | 1975-01-13 | 1976-01-27 | Burroughs Corporation | Electronic package assembly with capillary bridging connection |
US4038488A (en) * | 1975-05-12 | 1977-07-26 | Cambridge Memories, Inc. | Multilayer ceramic multi-chip, dual in-line packaging assembly |
US4342069A (en) * | 1979-07-02 | 1982-07-27 | Mostek Corporation | Integrated circuit package |
US4298769A (en) * | 1979-12-14 | 1981-11-03 | Standard Microsystems Corp. | Hermetic plastic dual-in-line package for a semiconductor integrated circuit |
NL8020334A (pt) * | 1980-02-12 | 1982-01-04 | Mostek Corporation Te Carrollton, Texas, Ver. St. V. Am. | |
US4296456A (en) * | 1980-06-02 | 1981-10-20 | Burroughs Corporation | Electronic package for high density integrated circuits |
GB2079534A (en) * | 1980-07-02 | 1982-01-20 | Fairchild Camera Instr Co | Package for semiconductor devices |
US4441119A (en) * | 1981-01-15 | 1984-04-03 | Mostek Corporation | Integrated circuit package |
FR2498814B1 (fr) * | 1981-01-26 | 1985-12-20 | Burroughs Corp | Boitier pour circuit integre, moyen pour le montage et procede de fabrication |
JPS58446U (ja) * | 1981-06-25 | 1983-01-05 | 富士通株式会社 | 混成集積回路装置 |
DE3129134A1 (de) * | 1981-07-23 | 1983-02-03 | Siemens AG, 1000 Berlin und 8000 München | Elektronische bauteile |
US4682414A (en) * | 1982-08-30 | 1987-07-28 | Olin Corporation | Multi-layer circuitry |
CA1257828A (en) * | 1984-04-16 | 1989-07-25 | William Mccormick | Perfluoro compound dispersions containing reduced amounts of surfactant and process of preparation |
US4659931A (en) * | 1985-05-08 | 1987-04-21 | Grumman Aerospace Corporation | High density multi-layered integrated circuit package |
JPS62142850U (pt) * | 1986-03-04 | 1987-09-09 | ||
US4982494A (en) * | 1989-02-06 | 1991-01-08 | Kyocera America, Inc. | Methods of making a low capacitance integrated circuit package |
US4931854A (en) * | 1989-02-06 | 1990-06-05 | Kyocera America, Inc. | Low capacitance integrated circuit package |
US5134247A (en) * | 1989-02-21 | 1992-07-28 | Cray Research Inc. | Reduced capacitance chip carrier |
US5086334A (en) * | 1989-12-08 | 1992-02-04 | Cray Research Inc. | Chip carrier |
US5280413A (en) * | 1992-09-17 | 1994-01-18 | Ceridian Corporation | Hermetically sealed circuit modules having conductive cap anchors |
US6627393B2 (en) * | 1993-06-04 | 2003-09-30 | Biotime, Inc. | Solutions for use as plasma expanders and substitutes |
US5455385A (en) * | 1993-06-28 | 1995-10-03 | Harris Corporation | Multilayer LTCC tub architecture for hermetically sealing semiconductor die, external electrical access for which is provided by way of sidewall recesses |
US6031723A (en) * | 1994-08-18 | 2000-02-29 | Allen-Bradley Company, Llc | Insulated surface mount circuit board construction |
US5648892A (en) * | 1995-09-29 | 1997-07-15 | Allen-Bradley Company, Inc. | Wireless circuit board system for a motor controller |
US5616888A (en) * | 1995-09-29 | 1997-04-01 | Allen-Bradley Company, Inc. | Rigid-flex circuit board having a window for an insulated mounting area |
US5670749A (en) * | 1995-09-29 | 1997-09-23 | Allen-Bradley Company, Inc. | Multilayer circuit board having a window exposing an enhanced conductive layer for use as an insulated mounting area |
US5641944A (en) * | 1995-09-29 | 1997-06-24 | Allen-Bradley Company, Inc. | Power substrate with improved thermal characteristics |
WO2001015228A1 (fr) * | 1999-08-19 | 2001-03-01 | Seiko Epson Corporation | Panneau de cablage, procede de fabrication d'un panneau de cablage, dispositif semiconducteur, procede de fabrication d'un dispositif semiconducteur, carte a circuit imprime et appareil electronique |
KR100699488B1 (ko) * | 2005-07-19 | 2007-03-26 | 삼성전자주식회사 | 인덕터를 구비한 패키징 칩 |
US20150252666A1 (en) | 2014-03-05 | 2015-09-10 | Baker Hughes Incorporated | Packaging for electronics in downhole assemblies |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3349481A (en) * | 1964-12-29 | 1967-10-31 | Alpha Microelectronics Company | Integrated circuit sealing method and structure |
US3601522A (en) * | 1970-06-18 | 1971-08-24 | American Lava Corp | Composite ceramic package breakaway notch |
-
1971
- 1971-08-19 US US00173145A patent/US3760090A/en not_active Expired - Lifetime
-
1972
- 1972-05-15 CA CA142,162A patent/CA989981A/en not_active Expired
- 1972-05-23 AU AU42581/72A patent/AU4258172A/en not_active Expired
- 1972-07-12 GB GB3258672A patent/GB1403111A/en not_active Expired
- 1972-07-17 JP JP47071569A patent/JPS4830376A/ja active Pending
- 1972-07-19 FR FR7226018A patent/FR2149350A1/fr not_active Withdrawn
- 1972-07-21 DE DE2236007A patent/DE2236007A1/de active Pending
- 1972-08-11 IT IT28130/72A patent/IT963918B/it active
- 1972-08-17 BR BR5636/72A patent/BR7205636D0/pt unknown
- 1972-08-19 ES ES405978A patent/ES405978A1/es not_active Expired
Also Published As
Publication number | Publication date |
---|---|
IT963918B (it) | 1974-01-21 |
AU4258172A (en) | 1973-11-29 |
FR2149350A1 (pt) | 1973-03-30 |
GB1403111A (en) | 1975-08-13 |
CA989981A (en) | 1976-05-25 |
ES405978A1 (es) | 1975-09-16 |
JPS4830376A (pt) | 1973-04-21 |
US3760090A (en) | 1973-09-18 |
DE2236007A1 (de) | 1973-02-22 |
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