FR1280466A - Perfectionnements aux semi-conducteurs - Google Patents
Perfectionnements aux semi-conducteursInfo
- Publication number
- FR1280466A FR1280466A FR853279A FR853279A FR1280466A FR 1280466 A FR1280466 A FR 1280466A FR 853279 A FR853279 A FR 853279A FR 853279 A FR853279 A FR 853279A FR 1280466 A FR1280466 A FR 1280466A
- Authority
- FR
- France
- Prior art keywords
- refinements
- semiconductor
- semiconductor refinements
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/298—Semiconductor material, e.g. amorphous silicon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02373—Group 14 semiconducting materials
- H01L21/02381—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02524—Group 14 semiconducting materials
- H01L21/02532—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02631—Physical deposition at reduced pressure, e.g. MBE, sputtering, evaporation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/185—Joining of semiconductor bodies for junction formation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3157—Partial encapsulation or coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
- Light Receiving Elements (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DEST16141A DE1184178B (de) | 1960-02-20 | 1960-02-20 | Verfahren zum Stabilisieren der Oberflaeche von Halbleiterkoerpern mit pn-UEbergaengen durch Vakuumbedampfen |
DEST16252A DE1185896B (de) | 1960-02-20 | 1960-03-19 | Verfahren zum Stabilisieren der Oberflaeche von Halbleiterkoerpern mit p-n-UEbergaengen |
Publications (1)
Publication Number | Publication Date |
---|---|
FR1280466A true FR1280466A (fr) | 1961-12-29 |
Family
ID=25993947
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR853279A Expired FR1280466A (fr) | 1960-02-20 | 1961-02-20 | Perfectionnements aux semi-conducteurs |
Country Status (3)
Country | Link |
---|---|
DE (2) | DE1184178B (fr) |
FR (1) | FR1280466A (fr) |
GB (1) | GB954915A (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2359510A1 (fr) * | 1976-07-20 | 1978-02-17 | Siemens Ag | Composant a semi-conducteurs comportant une couche de protection realisant une passivation |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3979768A (en) * | 1966-03-23 | 1976-09-07 | Hitachi, Ltd. | Semiconductor element having surface coating comprising silicon nitride and silicon oxide films |
JPS6022497B2 (ja) * | 1974-10-26 | 1985-06-03 | ソニー株式会社 | 半導体装置 |
JPS51128268A (en) * | 1975-04-30 | 1976-11-09 | Sony Corp | Semiconductor unit |
FR2335951A1 (fr) * | 1975-12-19 | 1977-07-15 | Radiotechnique Compelec | Dispositif semiconducteur a surface passivee et procede d'obtention de la structure de passivation |
FR2376513A1 (fr) * | 1976-12-31 | 1978-07-28 | Radiotechnique Compelec | Dispositif semiconducteur muni d'un film protecteur |
US4179528A (en) * | 1977-05-18 | 1979-12-18 | Eastman Kodak Company | Method of making silicon device with uniformly thick polysilicon |
DE2836911C2 (de) * | 1978-08-23 | 1986-11-06 | Siemens AG, 1000 Berlin und 8000 München | Passivierungsschicht für Halbleiterbauelemente |
DE2922005A1 (de) * | 1979-05-30 | 1980-12-04 | Siemens Ag | Halbleiterbauelement mit passiviertem halbleiterkoerper |
DE2944937A1 (de) * | 1979-11-07 | 1981-06-04 | Siemens AG, 1000 Berlin und 8000 München | Halbleiterbauelement |
DE3138324A1 (de) * | 1981-09-25 | 1983-04-14 | Siemens AG, 1000 Berlin und 8000 München | Integrierter halbleiterschaltkreis |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR805066A (fr) * | 1935-08-02 | 1936-11-10 | Dispositif pour la production de dépôts par sublimation dans le vide | |
DE895199C (de) * | 1945-04-19 | 1953-11-02 | Telefunken Gmbh | Kontaktdetektor |
US2789258A (en) * | 1955-06-29 | 1957-04-16 | Raytheon Mfg Co | Intrinsic coatings for semiconductor junctions |
DE1057207C2 (de) * | 1956-05-31 | 1961-02-23 | Siemens Ag | Verfahren zur Herstellung von Halbleiterschichten, insbesondere fuer Hallgeneratoren |
BE562973A (fr) * | 1956-12-06 | 1900-01-01 | ||
DE1077500B (de) * | 1957-03-07 | 1960-03-10 | Degussa | Verfahren zum UEberziehen von Metallen, insbesondere Unedelmetallen mit einem Lot |
-
1960
- 1960-02-20 DE DEST16141A patent/DE1184178B/de active Pending
- 1960-03-19 DE DEST16252A patent/DE1185896B/de active Pending
-
1961
- 1961-02-17 GB GB5950/61A patent/GB954915A/en not_active Expired
- 1961-02-20 FR FR853279A patent/FR1280466A/fr not_active Expired
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2359510A1 (fr) * | 1976-07-20 | 1978-02-17 | Siemens Ag | Composant a semi-conducteurs comportant une couche de protection realisant une passivation |
Also Published As
Publication number | Publication date |
---|---|
DE1185896B (de) | 1965-01-21 |
DE1184178B (de) | 1964-12-23 |
GB954915A (en) | 1964-04-08 |
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