FR1280466A - Perfectionnements aux semi-conducteurs - Google Patents

Perfectionnements aux semi-conducteurs

Info

Publication number
FR1280466A
FR1280466A FR853279A FR853279A FR1280466A FR 1280466 A FR1280466 A FR 1280466A FR 853279 A FR853279 A FR 853279A FR 853279 A FR853279 A FR 853279A FR 1280466 A FR1280466 A FR 1280466A
Authority
FR
France
Prior art keywords
refinements
semiconductor
semiconductor refinements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR853279A
Other languages
English (en)
Inventor
Gerhard W H Helwig
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Standard Electric Corp
Original Assignee
International Standard Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Standard Electric Corp filed Critical International Standard Electric Corp
Application granted granted Critical
Publication of FR1280466A publication Critical patent/FR1280466A/fr
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/298Semiconductor material, e.g. amorphous silicon
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14Metallic material, boron or silicon
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02367Substrates
    • H01L21/0237Materials
    • H01L21/02373Group 14 semiconducting materials
    • H01L21/02381Silicon, silicon germanium, germanium
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02518Deposited layers
    • H01L21/02521Materials
    • H01L21/02524Group 14 semiconducting materials
    • H01L21/02532Silicon, silicon germanium, germanium
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02612Formation types
    • H01L21/02617Deposition types
    • H01L21/02631Physical deposition at reduced pressure, e.g. MBE, sputtering, evaporation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/185Joining of semiconductor bodies for junction formation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157Partial encapsulation or coating
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
  • Light Receiving Elements (AREA)
  • Physical Vapour Deposition (AREA)
FR853279A 1960-02-20 1961-02-20 Perfectionnements aux semi-conducteurs Expired FR1280466A (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DEST16141A DE1184178B (de) 1960-02-20 1960-02-20 Verfahren zum Stabilisieren der Oberflaeche von Halbleiterkoerpern mit pn-UEbergaengen durch Vakuumbedampfen
DEST16252A DE1185896B (de) 1960-02-20 1960-03-19 Verfahren zum Stabilisieren der Oberflaeche von Halbleiterkoerpern mit p-n-UEbergaengen

Publications (1)

Publication Number Publication Date
FR1280466A true FR1280466A (fr) 1961-12-29

Family

ID=25993947

Family Applications (1)

Application Number Title Priority Date Filing Date
FR853279A Expired FR1280466A (fr) 1960-02-20 1961-02-20 Perfectionnements aux semi-conducteurs

Country Status (3)

Country Link
DE (2) DE1184178B (fr)
FR (1) FR1280466A (fr)
GB (1) GB954915A (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2359510A1 (fr) * 1976-07-20 1978-02-17 Siemens Ag Composant a semi-conducteurs comportant une couche de protection realisant une passivation

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3979768A (en) * 1966-03-23 1976-09-07 Hitachi, Ltd. Semiconductor element having surface coating comprising silicon nitride and silicon oxide films
JPS6022497B2 (ja) * 1974-10-26 1985-06-03 ソニー株式会社 半導体装置
JPS51128268A (en) * 1975-04-30 1976-11-09 Sony Corp Semiconductor unit
FR2335951A1 (fr) * 1975-12-19 1977-07-15 Radiotechnique Compelec Dispositif semiconducteur a surface passivee et procede d'obtention de la structure de passivation
FR2376513A1 (fr) * 1976-12-31 1978-07-28 Radiotechnique Compelec Dispositif semiconducteur muni d'un film protecteur
US4179528A (en) * 1977-05-18 1979-12-18 Eastman Kodak Company Method of making silicon device with uniformly thick polysilicon
DE2836911C2 (de) * 1978-08-23 1986-11-06 Siemens AG, 1000 Berlin und 8000 München Passivierungsschicht für Halbleiterbauelemente
DE2922005A1 (de) * 1979-05-30 1980-12-04 Siemens Ag Halbleiterbauelement mit passiviertem halbleiterkoerper
DE2944937A1 (de) * 1979-11-07 1981-06-04 Siemens AG, 1000 Berlin und 8000 München Halbleiterbauelement
DE3138324A1 (de) * 1981-09-25 1983-04-14 Siemens AG, 1000 Berlin und 8000 München Integrierter halbleiterschaltkreis

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR805066A (fr) * 1935-08-02 1936-11-10 Dispositif pour la production de dépôts par sublimation dans le vide
DE895199C (de) * 1945-04-19 1953-11-02 Telefunken Gmbh Kontaktdetektor
US2789258A (en) * 1955-06-29 1957-04-16 Raytheon Mfg Co Intrinsic coatings for semiconductor junctions
DE1057207C2 (de) * 1956-05-31 1961-02-23 Siemens Ag Verfahren zur Herstellung von Halbleiterschichten, insbesondere fuer Hallgeneratoren
BE562973A (fr) * 1956-12-06 1900-01-01
DE1077500B (de) * 1957-03-07 1960-03-10 Degussa Verfahren zum UEberziehen von Metallen, insbesondere Unedelmetallen mit einem Lot

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2359510A1 (fr) * 1976-07-20 1978-02-17 Siemens Ag Composant a semi-conducteurs comportant une couche de protection realisant une passivation

Also Published As

Publication number Publication date
DE1185896B (de) 1965-01-21
DE1184178B (de) 1964-12-23
GB954915A (en) 1964-04-08

Similar Documents

Publication Publication Date Title
FR1291322A (fr) Perfectionnements aux semi-conducteurs
BE609568A (fr) Perfectionnements aux aérosols
BE605371A (fr) Perfectionnements aux décalcomanies
CH382859A (de) Halbleitergerät
CH400369A (de) Halbleiteranordnung
FR1299909A (fr) Perfectionnements aux interrupteurs
CH382858A (de) Halbleiteranordnung
FR1280466A (fr) Perfectionnements aux semi-conducteurs
CH392703A (de) Halbleiteranordnung
CH390401A (de) Halbleiteranordnung
CH391109A (de) Halbleiteranordnung
FR1304051A (fr) Perfectionnements aux polyuréthanes
CH394400A (de) Halbleitervorrichtung
FR1269278A (fr) Perfectionnements aux sécheuses-repasseuses
CH380823A (de) Halbleiteranordnung
FR1268866A (fr) Perfectionnements aux stores
FR1283242A (fr) Perfectionnements aux stores
FR1306257A (fr) Perfectionnements aux semi-conducteurs
FR1288309A (fr) Perfectionnements aux semiconducteurs
FR1271174A (fr) Perfectionnements aux soutien-gorge
BE600689A (fr) Semi-conducteurs
BE609777A (fr) Perfectionnements aux semi-conducteurs.
BE617952A (fr) Perfectionnements aux fixe-cravates
CH397874A (de) Halbleitervorrichtung
FR1307725A (fr) Perfectionnement aux semi-conducteurs