CH391109A - Halbleiteranordnung - Google Patents

Halbleiteranordnung

Info

Publication number
CH391109A
CH391109A CH546861A CH546861A CH391109A CH 391109 A CH391109 A CH 391109A CH 546861 A CH546861 A CH 546861A CH 546861 A CH546861 A CH 546861A CH 391109 A CH391109 A CH 391109A
Authority
CH
Switzerland
Prior art keywords
semiconductor device
semiconductor
Prior art date
Application number
CH546861A
Other languages
English (en)
Inventor
Geyer Karl-Heinz Dipl-Phys Dr
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of CH391109A publication Critical patent/CH391109A/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
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    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
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    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3135—Double encapsulation or coating and encapsulation
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    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
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    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
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    • H01L2924/01327—Intermediate phases, i.e. intermetallics compounds
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    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
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    • H01L2924/12036—PN diode
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    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CH546861A 1960-05-18 1961-05-09 Halbleiteranordnung CH391109A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DES68563A DE1185728B (de) 1960-05-18 1960-05-18 Halbleiteranordnung, insbesondere Flaechengleichrichter oder -transistor mit einem einkristallinen Halbleiterelement

Publications (1)

Publication Number Publication Date
CH391109A true CH391109A (de) 1965-04-30

Family

ID=63144754

Family Applications (1)

Application Number Title Priority Date Filing Date
CH546861A CH391109A (de) 1960-05-18 1961-05-09 Halbleiteranordnung

Country Status (4)

Country Link
CH (1) CH391109A (de)
DE (1) DE1185728B (de)
FR (1) FR1289309A (de)
GB (1) GB971703A (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1184000B (de) * 1962-05-18 1964-12-23 Siemens Ag Einbau eines scheibenfoermigen elektrischen Halbleiterbauelementes in einer Aussparung eines anderen Konstruktionsteiles, insbesondere einem Gehaeuse einer elektrischen Maschine oder einem von diesem getragenen Zusatzteil
CH410200A (de) * 1962-06-21 1966-03-31 Ckd Praha Narodni Podnik Vakuumdichter Verschluss für Halbleiterelemente und Verfahren zu dessen Herstellung
DE1279847B (de) * 1965-01-13 1968-10-10 Siemens Ag Kapazitive Halbleiterdiode und Verfahren zu ihrer Herstellung
DE1299076B (de) * 1966-06-10 1969-07-10 Siemens Ag Halbleiter-Scheibenzellen-Anordnung mit mindestens einem Paar zwischen Druckstuecken eingespannten Zellen
JPS5030428B1 (de) * 1969-03-31 1975-10-01
GB1381778A (en) * 1972-06-08 1975-01-29 Cableform Ltd Semiconductor clamping means
CH592961A5 (de) * 1975-09-23 1977-11-15 Bbc Brown Boveri & Cie

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1108663A (fr) * 1953-10-19 1956-01-16 Licentia Gmbh Système conducteur électrique asymétrique
BE534817A (de) * 1954-01-14 1900-01-01
CH338903A (de) * 1954-10-04 1959-06-15 Westinghouse Electric Corp Kühlvorrichtung für Halbleiteranordnungen, insbesondere für p-n-Leistungsgleichrichter
DE1042762B (de) * 1955-02-26 1958-11-06 Siemens Ag Flaechengleichrichter bzw. -transistor, welcher mit mindestens einer seiner Elektroden flaechenhaft mit einem die Verlustwaerme abfuehrenden Koerper in Kontakt steht
DE1039648B (de) * 1955-04-30 1958-09-25 Siemens Ag Flaechengleichrichter bzw. -transistor

Also Published As

Publication number Publication date
FR1289309A (fr) 1962-03-30
DE1185728B (de) 1965-01-21
GB971703A (en) 1964-10-07

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