FI872614A0 - Laogtoxiskt, korrosionsbestaendigt lod. - Google Patents
Laogtoxiskt, korrosionsbestaendigt lod.Info
- Publication number
- FI872614A0 FI872614A0 FI872614A FI872614A FI872614A0 FI 872614 A0 FI872614 A0 FI 872614A0 FI 872614 A FI872614 A FI 872614A FI 872614 A FI872614 A FI 872614A FI 872614 A0 FI872614 A0 FI 872614A0
- Authority
- FI
- Finland
- Prior art keywords
- laogtoxiskt
- korrosionsbestaendigt
- lod
- korrosionsbestaendigt lod
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12708—Sn-base component
- Y10T428/12715—Next to Group IB metal-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12903—Cu-base component
- Y10T428/1291—Next to Co-, Cu-, or Ni-base component
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacture And Refinement Of Metals (AREA)
- Preventing Corrosion Or Incrustation Of Metals (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/882,050 US4778733A (en) | 1986-07-03 | 1986-07-03 | Low toxicity corrosion resistant solder |
Publications (2)
Publication Number | Publication Date |
---|---|
FI872614A0 true FI872614A0 (fi) | 1987-06-11 |
FI872614A FI872614A (fi) | 1988-01-04 |
Family
ID=25379780
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FI872614A FI872614A (fi) | 1986-07-03 | 1987-06-11 | Laogtoxiskt, korrosionsbestaendigt lod. |
Country Status (9)
Country | Link |
---|---|
US (1) | US4778733A (fi) |
EP (1) | EP0251611A3 (fi) |
JP (1) | JPS6313689A (fi) |
KR (1) | KR880001363A (fi) |
CA (1) | CA1265685A (fi) |
DK (1) | DK337387A (fi) |
FI (1) | FI872614A (fi) |
MY (1) | MY101567A (fi) |
NO (1) | NO872772L (fi) |
Families Citing this family (77)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4758407A (en) * | 1987-06-29 | 1988-07-19 | J.W. Harris Company | Pb-free, tin base solder composition |
GB8807730D0 (en) * | 1988-03-31 | 1988-05-05 | Cookson Group Plc | Low toxicity soldering compositions |
US4879096A (en) * | 1989-04-19 | 1989-11-07 | Oatey Company | Lead- and antimony-free solder composition |
US5102748A (en) * | 1991-05-03 | 1992-04-07 | Taracorp, Inc. | Non-leaded solders |
ES2036452B1 (es) * | 1991-06-12 | 1995-12-16 | Electro Materiales Klk S A | Metodo de conexion de cables electricos sobre superficies de acero y placa de molde-crisol para llevar a cabo dicho metodo. |
US5287037A (en) * | 1991-12-03 | 1994-02-15 | General Electric Company | Metal ferrules for hermetically sealing electric lamps |
US5314758A (en) * | 1992-03-27 | 1994-05-24 | The Louis Berkman Company | Hot dip terne coated roofing material |
KR930019848A (ko) * | 1992-01-04 | 1993-10-19 | 존 알. 코렌 | 내후성 박편 지붕재료 및 제조방법 |
US5397652A (en) * | 1992-03-27 | 1995-03-14 | The Louis Berkman Company | Corrosion resistant, colored stainless steel and method of making same |
US5455122A (en) * | 1993-04-05 | 1995-10-03 | The Louis Berkman Company | Environmental gasoline tank |
US6652990B2 (en) | 1992-03-27 | 2003-11-25 | The Louis Berkman Company | Corrosion-resistant coated metal and method for making the same |
US5491035A (en) * | 1992-03-27 | 1996-02-13 | The Louis Berkman Company | Coated metal strip |
US5489490A (en) * | 1993-04-05 | 1996-02-06 | The Louis Berkman Company | Coated metal strip |
US5401586A (en) * | 1993-04-05 | 1995-03-28 | The Louis Berkman Company | Architectural material coating |
US5597656A (en) * | 1993-04-05 | 1997-01-28 | The Louis Berkman Company | Coated metal strip |
US5429882A (en) * | 1993-04-05 | 1995-07-04 | The Louis Berkman Company | Building material coating |
US6794060B2 (en) | 1992-03-27 | 2004-09-21 | The Louis Berkman Company | Corrosion-resistant coated metal and method for making the same |
US6080497A (en) * | 1992-03-27 | 2000-06-27 | The Louis Berkman Company | Corrosion-resistant coated copper metal and method for making the same |
US6861159B2 (en) * | 1992-03-27 | 2005-03-01 | The Louis Berkman Company | Corrosion-resistant coated copper and method for making the same |
US5491036A (en) * | 1992-03-27 | 1996-02-13 | The Louis Berkman Company | Coated strip |
US5256370B1 (en) * | 1992-05-04 | 1996-09-03 | Indium Corp America | Lead-free alloy containing tin silver and indium |
US5354624A (en) * | 1992-07-15 | 1994-10-11 | The Louis Berkman Company | Coated copper roofing material |
DE4315188C1 (de) * | 1992-09-02 | 1994-04-07 | Degussa | Verwendung einer kadmiumfreien Silberlegierung als Hartlot |
US5352407A (en) * | 1993-04-29 | 1994-10-04 | Seelig Karl F | Lead-free bismuth free tin alloy solder composition |
US5405577A (en) * | 1993-04-29 | 1995-04-11 | Seelig; Karl F. | Lead-free and bismuth-free tin alloy solder composition |
US5344607A (en) * | 1993-06-16 | 1994-09-06 | International Business Machines Corporation | Lead-free, high tin, ternary solder alloy of tin, bismuth, and indium |
US5393489A (en) * | 1993-06-16 | 1995-02-28 | International Business Machines Corporation | High temperature, lead-free, tin based solder composition |
US5328660A (en) * | 1993-06-16 | 1994-07-12 | International Business Machines Corporation | Lead-free, high temperature, tin based multi-component solder |
US5411703A (en) * | 1993-06-16 | 1995-05-02 | International Business Machines Corporation | Lead-free, tin, antimony, bismtuh, copper solder alloy |
US5368814A (en) * | 1993-06-16 | 1994-11-29 | International Business Machines, Inc. | Lead free, tin-bismuth solder alloys |
US5527628A (en) * | 1993-07-20 | 1996-06-18 | Iowa State University Research Foudation, Inc. | Pb-free Sn-Ag-Cu ternary eutectic solder |
US5415944A (en) * | 1994-05-02 | 1995-05-16 | Motorola, Inc. | Solder clad substrate |
US5427865A (en) * | 1994-05-02 | 1995-06-27 | Motorola, Inc. | Multiple alloy solder preform |
JPH08215880A (ja) * | 1995-02-14 | 1996-08-27 | Ishikawa Kinzoku Kk | 無鉛はんだ |
CA2214130C (en) | 1996-09-19 | 2003-12-02 | Northern Telecom Limited | Assemblies of substrates and electronic components |
US5837191A (en) * | 1996-10-22 | 1998-11-17 | Johnson Manufacturing Company | Lead-free solder |
US5985212A (en) * | 1996-12-12 | 1999-11-16 | H-Technologies Group, Incorporated | High strength lead-free solder materials |
US6231691B1 (en) | 1997-02-10 | 2001-05-15 | Iowa State University Research Foundation, Inc. | Lead-free solder |
BR9807975A (pt) | 1997-04-22 | 2000-03-08 | Ecosolder International Pty Lt | Composição de solda, solda, utilização de uma solda, método de união de dois ou mais componentes e componente eletrônico ou placa de circuito impresso |
JP3760586B2 (ja) * | 1997-09-05 | 2006-03-29 | 株式会社村田製作所 | 半田組成物 |
US6197253B1 (en) | 1998-12-21 | 2001-03-06 | Allen Broomfield | Lead-free and cadmium-free white metal casting alloy |
SE524748C2 (sv) | 1999-03-09 | 2004-09-28 | Matsushita Electric Ind Co Ltd | Irreciprok kretsanordning, tillverkningsförfarande av sådan samt mobil kommunikationsapparat där denna kretsanordning används |
JP3753168B2 (ja) | 1999-08-20 | 2006-03-08 | 千住金属工業株式会社 | 微小チップ部品接合用ソルダペースト |
TW453930B (en) * | 2000-04-17 | 2001-09-11 | Fujitsu Ltd | Solder bonding |
US6429388B1 (en) | 2000-05-03 | 2002-08-06 | International Business Machines Corporation | High density column grid array connections and method thereof |
US6660226B1 (en) | 2000-08-07 | 2003-12-09 | Murata Manufacturing Co., Ltd. | Lead free solder and soldered article |
US6896172B2 (en) * | 2000-08-22 | 2005-05-24 | Senju Metal Industry Co., Ltd. | Lead-free solder paste for reflow soldering |
JP2002124756A (ja) * | 2000-10-18 | 2002-04-26 | Nitto Denko Corp | 回路基板および回路基板の端子部の接続構造 |
US20040241039A1 (en) * | 2000-10-27 | 2004-12-02 | H-Technologies Group | High temperature lead-free solder compositions |
US6784086B2 (en) | 2001-02-08 | 2004-08-31 | International Business Machines Corporation | Lead-free solder structure and method for high fatigue life |
EP2147740B1 (en) * | 2001-03-01 | 2015-05-20 | Senju Metal Industry Co., Ltd | Lead-free solder paste |
US6924044B2 (en) * | 2001-08-14 | 2005-08-02 | Snag, Llc | Tin-silver coatings |
GB2380964B (en) | 2001-09-04 | 2005-01-12 | Multicore Solders Ltd | Lead-free solder paste |
US6805974B2 (en) | 2002-02-15 | 2004-10-19 | International Business Machines Corporation | Lead-free tin-silver-copper alloy solder composition |
US6767411B2 (en) | 2002-03-15 | 2004-07-27 | Delphi Technologies, Inc. | Lead-free solder alloy and solder reflow process |
US6892925B2 (en) * | 2002-09-18 | 2005-05-17 | International Business Machines Corporation | Solder hierarchy for lead free solder joint |
US6854636B2 (en) * | 2002-12-06 | 2005-02-15 | International Business Machines Corporation | Structure and method for lead free solder electronic package interconnections |
US20040151616A1 (en) * | 2003-02-04 | 2004-08-05 | Sabarese Daniel M. | Lead-free alloys, composition thereof, methods of preparation and uses for soldering and babbitting |
US6917113B2 (en) | 2003-04-24 | 2005-07-12 | International Business Machines Corporatiion | Lead-free alloys for column/ball grid arrays, organic interposers and passive component assembly |
KR100698662B1 (ko) | 2003-12-02 | 2007-03-23 | 에프씨엠 가부시끼가이샤 | 주석-은-구리 3원합금으로 이루어지는 표면을 형성한단자, 그것을 갖는 부품 및 제품 |
WO2005090622A1 (en) * | 2004-03-24 | 2005-09-29 | Agency For Science, Technology And Research | Lead free solder alloy |
US20060038302A1 (en) * | 2004-08-19 | 2006-02-23 | Kejun Zeng | Thermal fatigue resistant tin-lead-silver solder |
JP4238229B2 (ja) | 2005-04-20 | 2009-03-18 | Ykk株式会社 | スライドファスナー用上止 |
WO2006122240A2 (en) * | 2005-05-11 | 2006-11-16 | American Iron & Metal Company, Inc. | Tin alloy solder compositions |
CN1313631C (zh) * | 2005-08-02 | 2007-05-02 | 马莒生 | 一种锡银铜镍铝系无铅焊料合金 |
US7754343B2 (en) * | 2005-08-17 | 2010-07-13 | Oracle America, Inc. | Ternary alloy column grid array |
US20070059548A1 (en) * | 2005-08-17 | 2007-03-15 | Sun Microsystems, Inc. | Grid array package using tin/silver columns |
US20070117475A1 (en) * | 2005-11-23 | 2007-05-24 | Regents Of The University Of California | Prevention of Sn whisker growth for high reliability electronic devices |
US20080308300A1 (en) * | 2007-06-18 | 2008-12-18 | Conti Mark A | Method of manufacturing electrically conductive strips |
WO2009013210A1 (en) * | 2007-07-23 | 2009-01-29 | Henkel Limited | Solder flux |
US8197612B2 (en) * | 2008-04-29 | 2012-06-12 | International Business Machines Corporation | Optimization of metallurgical properties of a solder joint |
US20100059576A1 (en) * | 2008-09-05 | 2010-03-11 | American Iron & Metal Company, Inc. | Tin alloy solder composition |
JP5224550B2 (ja) * | 2010-03-24 | 2013-07-03 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
JP6292407B2 (ja) * | 2011-06-17 | 2018-03-14 | エルジー・ケム・リミテッド | ソルダリングコネクター、これを含むバッテリーモジュール、及びバッテリーパック |
US9314069B2 (en) | 2011-07-20 | 2016-04-19 | Ykk Corporation | Top stop for slider |
KR101401477B1 (ko) * | 2012-08-02 | 2014-05-29 | 주식회사 엘지화학 | 이차전지용 커넥팅 부품, 이를 포함하는 배터리 모듈 및 배터리 팩 |
JP6734553B1 (ja) * | 2019-03-29 | 2020-08-05 | 千住金属工業株式会社 | ソルダペースト |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1239195A (en) * | 1916-06-13 | 1917-09-04 | Leonard Lorentowicz | Composition for repairing scored cylinders. |
CH80998A (fr) * | 1918-08-09 | 1920-01-02 | Gustave Ferriere | Soudure pour l'aluminium |
US1437641A (en) * | 1919-09-11 | 1922-12-05 | Pfyffer | Solder for aluminum and its alloys |
DE6912361U (de) * | 1969-03-27 | 1969-07-31 | Ver Deutsche Metallwerke Ag | Lotring zur verwendung beim loeten von rohrverbindungen. |
US4357162A (en) * | 1979-10-04 | 1982-11-02 | Motorola, Inc. | Solder composition |
US4373974A (en) * | 1981-04-02 | 1983-02-15 | Mcdonnell Douglas Corporation | Solder composition |
US4670217A (en) * | 1985-07-26 | 1987-06-02 | J. W. Harris Company | Solder composition |
JPS6468A (en) * | 1987-02-27 | 1989-01-05 | Ajinomoto Co Inc | Tertiary amino-alcohol compound and production of optically active secondary alcohol using said compound |
-
1986
- 1986-07-03 US US06/882,050 patent/US4778733A/en not_active Expired - Fee Related
-
1987
- 1987-01-09 JP JP62001953A patent/JPS6313689A/ja active Pending
- 1987-06-11 FI FI872614A patent/FI872614A/fi not_active Application Discontinuation
- 1987-06-16 MY MYPI87000820A patent/MY101567A/en unknown
- 1987-06-22 EP EP87305504A patent/EP0251611A3/en not_active Ceased
- 1987-06-26 CA CA000540706A patent/CA1265685A/en not_active Expired - Lifetime
- 1987-07-01 DK DK337387A patent/DK337387A/da unknown
- 1987-07-02 NO NO872772A patent/NO872772L/no unknown
- 1987-07-03 KR KR1019870007073A patent/KR880001363A/ko not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
NO872772D0 (no) | 1987-07-02 |
NO872772L (no) | 1988-01-04 |
US4778733A (en) | 1988-10-18 |
MY101567A (en) | 1991-12-17 |
KR880001363A (ko) | 1988-04-23 |
FI872614A (fi) | 1988-01-04 |
CA1265685A (en) | 1990-02-13 |
DK337387A (da) | 1988-01-04 |
JPS6313689A (ja) | 1988-01-20 |
EP0251611A2 (en) | 1988-01-07 |
EP0251611A3 (en) | 1989-05-31 |
DK337387D0 (da) | 1987-07-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FD | Application lapsed |
Owner name: ENGELHARD CORPORATION |