DK337387A - Korrosionsfast loddemiddel med lav giftighed - Google Patents

Korrosionsfast loddemiddel med lav giftighed

Info

Publication number
DK337387A
DK337387A DK337387A DK337387A DK337387A DK 337387 A DK337387 A DK 337387A DK 337387 A DK337387 A DK 337387A DK 337387 A DK337387 A DK 337387A DK 337387 A DK337387 A DK 337387A
Authority
DK
Denmark
Prior art keywords
corrosion resistant
low toxicity
resistant solder
solder
toxicity
Prior art date
Application number
DK337387A
Other languages
Danish (da)
English (en)
Other versions
DK337387D0 (da
Inventor
Alfonso T Lubrano
Thomas S Bannos
Malcolm Warren
Robert A Dorvel
Original Assignee
Engelhard Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Engelhard Corp filed Critical Engelhard Corp
Publication of DK337387D0 publication Critical patent/DK337387D0/da
Publication of DK337387A publication Critical patent/DK337387A/da

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12708—Sn-base component
    • Y10T428/12715—Next to Group IB metal-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12903—Cu-base component
    • Y10T428/1291—Next to Co-, Cu-, or Ni-base component

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacture And Refinement Of Metals (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
DK337387A 1986-07-03 1987-07-01 Korrosionsfast loddemiddel med lav giftighed DK337387A (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/882,050 US4778733A (en) 1986-07-03 1986-07-03 Low toxicity corrosion resistant solder

Publications (2)

Publication Number Publication Date
DK337387D0 DK337387D0 (da) 1987-07-01
DK337387A true DK337387A (da) 1988-01-04

Family

ID=25379780

Family Applications (1)

Application Number Title Priority Date Filing Date
DK337387A DK337387A (da) 1986-07-03 1987-07-01 Korrosionsfast loddemiddel med lav giftighed

Country Status (9)

Country Link
US (1) US4778733A (fi)
EP (1) EP0251611A3 (fi)
JP (1) JPS6313689A (fi)
KR (1) KR880001363A (fi)
CA (1) CA1265685A (fi)
DK (1) DK337387A (fi)
FI (1) FI872614A (fi)
MY (1) MY101567A (fi)
NO (1) NO872772L (fi)

Families Citing this family (77)

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US5314758A (en) * 1992-03-27 1994-05-24 The Louis Berkman Company Hot dip terne coated roofing material
KR930019848A (ko) * 1992-01-04 1993-10-19 존 알. 코렌 내후성 박편 지붕재료 및 제조방법
US5491036A (en) * 1992-03-27 1996-02-13 The Louis Berkman Company Coated strip
US5397652A (en) * 1992-03-27 1995-03-14 The Louis Berkman Company Corrosion resistant, colored stainless steel and method of making same
US6794060B2 (en) 1992-03-27 2004-09-21 The Louis Berkman Company Corrosion-resistant coated metal and method for making the same
US6652990B2 (en) 1992-03-27 2003-11-25 The Louis Berkman Company Corrosion-resistant coated metal and method for making the same
US5489490A (en) * 1993-04-05 1996-02-06 The Louis Berkman Company Coated metal strip
US5597656A (en) * 1993-04-05 1997-01-28 The Louis Berkman Company Coated metal strip
US5401586A (en) * 1993-04-05 1995-03-28 The Louis Berkman Company Architectural material coating
US5455122A (en) * 1993-04-05 1995-10-03 The Louis Berkman Company Environmental gasoline tank
US5491035A (en) * 1992-03-27 1996-02-13 The Louis Berkman Company Coated metal strip
US5429882A (en) * 1993-04-05 1995-07-04 The Louis Berkman Company Building material coating
US6080497A (en) * 1992-03-27 2000-06-27 The Louis Berkman Company Corrosion-resistant coated copper metal and method for making the same
US6861159B2 (en) 1992-03-27 2005-03-01 The Louis Berkman Company Corrosion-resistant coated copper and method for making the same
US5256370B1 (en) * 1992-05-04 1996-09-03 Indium Corp America Lead-free alloy containing tin silver and indium
US5354624A (en) * 1992-07-15 1994-10-11 The Louis Berkman Company Coated copper roofing material
DE4315188C1 (de) * 1992-09-02 1994-04-07 Degussa Verwendung einer kadmiumfreien Silberlegierung als Hartlot
US5352407A (en) * 1993-04-29 1994-10-04 Seelig Karl F Lead-free bismuth free tin alloy solder composition
US5405577A (en) * 1993-04-29 1995-04-11 Seelig; Karl F. Lead-free and bismuth-free tin alloy solder composition
US5344607A (en) * 1993-06-16 1994-09-06 International Business Machines Corporation Lead-free, high tin, ternary solder alloy of tin, bismuth, and indium
US5393489A (en) * 1993-06-16 1995-02-28 International Business Machines Corporation High temperature, lead-free, tin based solder composition
US5368814A (en) * 1993-06-16 1994-11-29 International Business Machines, Inc. Lead free, tin-bismuth solder alloys
US5411703A (en) * 1993-06-16 1995-05-02 International Business Machines Corporation Lead-free, tin, antimony, bismtuh, copper solder alloy
US5328660A (en) * 1993-06-16 1994-07-12 International Business Machines Corporation Lead-free, high temperature, tin based multi-component solder
US5527628A (en) * 1993-07-20 1996-06-18 Iowa State University Research Foudation, Inc. Pb-free Sn-Ag-Cu ternary eutectic solder
US5427865A (en) * 1994-05-02 1995-06-27 Motorola, Inc. Multiple alloy solder preform
US5415944A (en) * 1994-05-02 1995-05-16 Motorola, Inc. Solder clad substrate
JPH08215880A (ja) * 1995-02-14 1996-08-27 Ishikawa Kinzoku Kk 無鉛はんだ
CA2214130C (en) 1996-09-19 2003-12-02 Northern Telecom Limited Assemblies of substrates and electronic components
US5837191A (en) * 1996-10-22 1998-11-17 Johnson Manufacturing Company Lead-free solder
US5985212A (en) * 1996-12-12 1999-11-16 H-Technologies Group, Incorporated High strength lead-free solder materials
US6231691B1 (en) 1997-02-10 2001-05-15 Iowa State University Research Foundation, Inc. Lead-free solder
EP0977900A4 (en) 1997-04-22 2001-06-13 Ecosolder Internat Pty Ltd LEAD-FREE LOT
JP3760586B2 (ja) * 1997-09-05 2006-03-29 株式会社村田製作所 半田組成物
US6197253B1 (en) 1998-12-21 2001-03-06 Allen Broomfield Lead-free and cadmium-free white metal casting alloy
SE524748C2 (sv) 1999-03-09 2004-09-28 Matsushita Electric Ind Co Ltd Irreciprok kretsanordning, tillverkningsförfarande av sådan samt mobil kommunikationsapparat där denna kretsanordning används
JP3753168B2 (ja) 1999-08-20 2006-03-08 千住金属工業株式会社 微小チップ部品接合用ソルダペースト
WO2001078931A1 (fr) * 2000-04-17 2001-10-25 Fujitsu Limited Assemblage par brasure
US6429388B1 (en) 2000-05-03 2002-08-06 International Business Machines Corporation High density column grid array connections and method thereof
US6660226B1 (en) 2000-08-07 2003-12-09 Murata Manufacturing Co., Ltd. Lead free solder and soldered article
US6896172B2 (en) * 2000-08-22 2005-05-24 Senju Metal Industry Co., Ltd. Lead-free solder paste for reflow soldering
JP2002124756A (ja) * 2000-10-18 2002-04-26 Nitto Denko Corp 回路基板および回路基板の端子部の接続構造
US20040241039A1 (en) * 2000-10-27 2004-12-02 H-Technologies Group High temperature lead-free solder compositions
US6784086B2 (en) 2001-02-08 2004-08-31 International Business Machines Corporation Lead-free solder structure and method for high fatigue life
EP2942410A1 (en) * 2001-03-01 2015-11-11 Senju Metal Industry Co., Ltd. Lead-free solder paste
US6924044B2 (en) * 2001-08-14 2005-08-02 Snag, Llc Tin-silver coatings
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US6805974B2 (en) * 2002-02-15 2004-10-19 International Business Machines Corporation Lead-free tin-silver-copper alloy solder composition
US6767411B2 (en) 2002-03-15 2004-07-27 Delphi Technologies, Inc. Lead-free solder alloy and solder reflow process
US6892925B2 (en) * 2002-09-18 2005-05-17 International Business Machines Corporation Solder hierarchy for lead free solder joint
US6854636B2 (en) * 2002-12-06 2005-02-15 International Business Machines Corporation Structure and method for lead free solder electronic package interconnections
US20040151616A1 (en) * 2003-02-04 2004-08-05 Sabarese Daniel M. Lead-free alloys, composition thereof, methods of preparation and uses for soldering and babbitting
US6917113B2 (en) 2003-04-24 2005-07-12 International Business Machines Corporatiion Lead-free alloys for column/ball grid arrays, organic interposers and passive component assembly
KR100698662B1 (ko) 2003-12-02 2007-03-23 에프씨엠 가부시끼가이샤 주석-은-구리 3원합금으로 이루어지는 표면을 형성한단자, 그것을 갖는 부품 및 제품
WO2005090622A1 (en) * 2004-03-24 2005-09-29 Agency For Science, Technology And Research Lead free solder alloy
US20060038302A1 (en) * 2004-08-19 2006-02-23 Kejun Zeng Thermal fatigue resistant tin-lead-silver solder
JP4238229B2 (ja) 2005-04-20 2009-03-18 Ｙｋｋ株式会社 スライドファスナー用上止
WO2006122240A2 (en) * 2005-05-11 2006-11-16 American Iron & Metal Company, Inc. Tin alloy solder compositions
CN1313631C (zh) * 2005-08-02 2007-05-02 马莒生 一种锡银铜镍铝系无铅焊料合金
US7754343B2 (en) * 2005-08-17 2010-07-13 Oracle America, Inc. Ternary alloy column grid array
US20070059548A1 (en) * 2005-08-17 2007-03-15 Sun Microsystems, Inc. Grid array package using tin/silver columns
US20070117475A1 (en) * 2005-11-23 2007-05-24 Regents Of The University Of California Prevention of Sn whisker growth for high reliability electronic devices
US20080308300A1 (en) * 2007-06-18 2008-12-18 Conti Mark A Method of manufacturing electrically conductive strips
JP5502732B2 (ja) * 2007-07-23 2014-05-28 ヘンケル リミテッド ハンダ用フラックス
US8197612B2 (en) * 2008-04-29 2012-06-12 International Business Machines Corporation Optimization of metallurgical properties of a solder joint
US20100059576A1 (en) * 2008-09-05 2010-03-11 American Iron & Metal Company, Inc. Tin alloy solder composition
JP5224550B2 (ja) * 2010-03-24 2013-07-03 ルネサスエレクトロニクス株式会社 半導体装置
CN103608951B (zh) * 2011-06-17 2017-03-08 株式会社Lg 化学 钎焊连接器、具有该钎焊连接器的电池模块和包括该电池模块的电池组
US9314069B2 (en) 2011-07-20 2016-04-19 Ykk Corporation Top stop for slider
KR101401477B1 (ko) * 2012-08-02 2014-05-29 주식회사 엘지화학 이차전지용 커넥팅 부품, 이를 포함하는 배터리 모듈 및 배터리 팩
JP6734553B1 (ja) * 2019-03-29 2020-08-05 千住金属工業株式会社 ソルダペースト

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US1239195A (en) * 1916-06-13 1917-09-04 Leonard Lorentowicz Composition for repairing scored cylinders.
CH80998A (fr) * 1918-08-09 1920-01-02 Gustave Ferriere Soudure pour l'aluminium
US1437641A (en) * 1919-09-11 1922-12-05 Pfyffer Solder for aluminum and its alloys
DE6912361U (de) * 1969-03-27 1969-07-31 Ver Deutsche Metallwerke Ag Lotring zur verwendung beim loeten von rohrverbindungen.
US4357162A (en) * 1979-10-04 1982-11-02 Motorola, Inc. Solder composition
US4373974A (en) * 1981-04-02 1983-02-15 Mcdonnell Douglas Corporation Solder composition
US4670217A (en) * 1985-07-26 1987-06-02 J. W. Harris Company Solder composition

Also Published As

Publication number Publication date
NO872772L (no) 1988-01-04
NO872772D0 (no) 1987-07-02
FI872614A0 (fi) 1987-06-11
JPS6313689A (ja) 1988-01-20
EP0251611A2 (en) 1988-01-07
EP0251611A3 (en) 1989-05-31
DK337387D0 (da) 1987-07-01
MY101567A (en) 1991-12-17
KR880001363A (ko) 1988-04-23
US4778733A (en) 1988-10-18
FI872614A (fi) 1988-01-04
CA1265685A (en) 1990-02-13

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