FI20125088L - Menetelmä ja järjestely sähköisesti johtavan materiaalin siirtämiseksi juoksevassa muodossa painettavalle alustalle - Google Patents

Menetelmä ja järjestely sähköisesti johtavan materiaalin siirtämiseksi juoksevassa muodossa painettavalle alustalle Download PDF

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Publication number
FI20125088L
FI20125088L FI20125088A FI20125088A FI20125088L FI 20125088 L FI20125088 L FI 20125088L FI 20125088 A FI20125088 A FI 20125088A FI 20125088 A FI20125088 A FI 20125088A FI 20125088 L FI20125088 L FI 20125088L
Authority
FI
Finland
Prior art keywords
arrangement
conductive material
electrically conductive
liquid form
printing substrate
Prior art date
Application number
FI20125088A
Other languages
English (en)
Swedish (sv)
Other versions
FI125906B (fi
Inventor
Juha Maijala
Petri Sirvioe
Original Assignee
Stora Enso Oyj
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to FI20125088A priority Critical patent/FI125906B/fi
Application filed by Stora Enso Oyj filed Critical Stora Enso Oyj
Priority to BR112014018777-0A priority patent/BR112014018777B1/pt
Priority to DK13743392.6T priority patent/DK2810541T3/en
Priority to PL13743392T priority patent/PL2810541T3/pl
Priority to RU2014133100A priority patent/RU2617703C2/ru
Priority to CA2862587A priority patent/CA2862587C/en
Priority to AU2013214093A priority patent/AU2013214093B2/en
Priority to JP2014555273A priority patent/JP6262151B2/ja
Priority to KR1020147024548A priority patent/KR102023585B1/ko
Priority to ES13743392.6T priority patent/ES2688706T3/es
Priority to MX2014009162A priority patent/MX2014009162A/es
Priority to CN201380007268.1A priority patent/CN104170533B/zh
Priority to MYPI2014002234A priority patent/MY176775A/en
Priority to IN6613DEN2014 priority patent/IN2014DN06613A/en
Priority to PCT/FI2013/050098 priority patent/WO2013113994A1/en
Priority to PT13743392T priority patent/PT2810541T/pt
Priority to US14/375,147 priority patent/US10085350B2/en
Priority to EP13743392.6A priority patent/EP2810541B1/en
Publication of FI20125088L publication Critical patent/FI20125088L/fi
Application granted granted Critical
Publication of FI125906B publication Critical patent/FI125906B/fi

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/30—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to control volume of flow, e.g. with adjustable passages
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
    • B05B12/16—Arrangements for controlling delivery; Arrangements for controlling the spray area for controlling the spray area
    • B05B12/18—Arrangements for controlling delivery; Arrangements for controlling the spray area for controlling the spray area using fluids, e.g. gas streams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B17/00—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups
    • B05B17/04—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods
    • B05B17/06—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations
    • B05B17/0607—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations generated by electrical means, e.g. piezoelectric transducers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B5/00—Electrostatic spraying apparatus; Spraying apparatus with means for charging the spray electrically; Apparatus for spraying liquids or other fluent materials by other electric means
    • B05B5/16—Arrangements for supplying liquids or other fluent material
    • B05B5/1608—Arrangements for supplying liquids or other fluent material the liquid or other fluent material being electrically conductive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/038—Textiles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0386—Paper sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B17/00—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups
    • B05B17/04—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods
    • B05B17/06—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations
    • B05B17/0607—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations generated by electrical means, e.g. piezoelectric transducers
    • B05B17/0615—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations generated by electrical means, e.g. piezoelectric transducers spray being produced at the free surface of the liquid or other fluent material in a container and subjected to the vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B5/00—Electrostatic spraying apparatus; Spraying apparatus with means for charging the spray electrically; Apparatus for spraying liquids or other fluent materials by other electric means
    • B05B5/08—Plant for applying liquids or other fluent materials to objects
    • B05B5/14—Plant for applying liquids or other fluent materials to objects specially adapted for coating continuously moving elongated bodies, e.g. wires, strips, pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/111—Preheating, e.g. before soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1121—Cooling, e.g. specific areas of a PCB being cooled during reflow soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1333—Deposition techniques, e.g. coating
    • H05K2203/1344—Spraying small metal particles or droplets of molten metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • H05K3/146—By vapour deposition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Textile Engineering (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Coating Apparatus (AREA)
  • Nozzles (AREA)
FI20125088A 2012-01-30 2012-01-30 Menetelmä ja järjestely sähköisesti johtavan materiaalin siirtämiseksi juoksevassa muodossa painettavalle alustalle FI125906B (fi)

Priority Applications (18)

Application Number Priority Date Filing Date Title
FI20125088A FI125906B (fi) 2012-01-30 2012-01-30 Menetelmä ja järjestely sähköisesti johtavan materiaalin siirtämiseksi juoksevassa muodossa painettavalle alustalle
MX2014009162A MX2014009162A (es) 2012-01-30 2013-01-30 Metodo y arreglo para transferir material electricamente conductor en forma fluida sobre un sustrato a ser impreso.
PL13743392T PL2810541T3 (pl) 2012-01-30 2013-01-30 Sposób i system do przenoszenia materiału przewodzącego prąd elektryczny w postaci płynnej na podłoże do zadrukowania
RU2014133100A RU2617703C2 (ru) 2012-01-30 2013-01-30 Способ и установка для переноса электропроводящего материала в текучей форме на подложку для печати
CA2862587A CA2862587C (en) 2012-01-30 2013-01-30 Method and arrangement for transferring electrically conductive material in fluid form on a substrate to be printed
AU2013214093A AU2013214093B2 (en) 2012-01-30 2013-01-30 Method and arrangement for transferring electrically conductive material in fluid form on a substrate to be printed
JP2014555273A JP6262151B2 (ja) 2012-01-30 2013-01-30 印刷される基板上に導電性材料を流体形態で転写する方法及び構成
KR1020147024548A KR102023585B1 (ko) 2012-01-30 2013-01-30 전기전도성 재료를 인쇄될 기질 상에서 유체 형태로 이송시키기 위한 방법 및 어레인지먼트
BR112014018777-0A BR112014018777B1 (pt) 2012-01-30 2013-01-30 Método e disposição para transferir material eletricamente condutor na forma fluida sobre um substrato a ser impresso
DK13743392.6T DK2810541T3 (en) 2012-01-30 2013-01-30 METHOD AND DEVICE FOR TRANSFER OF ELECTRIC CONDUCTIVE MATERIAL IN FLUID FORM ON A SUBSTRATE TO BE PRESSED
CN201380007268.1A CN104170533B (zh) 2012-01-30 2013-01-30 在将要印刷的衬底上以流体形式转移导电材料的方法和结构
MYPI2014002234A MY176775A (en) 2012-01-30 2013-01-30 Method and arrangement for transferring electrically conductive material in fluid form on a substrate to be printed
IN6613DEN2014 IN2014DN06613A (fi) 2012-01-30 2013-01-30
PCT/FI2013/050098 WO2013113994A1 (en) 2012-01-30 2013-01-30 Method and arrangement for transferring electrically conductive material in fluid form on a substrate to be printed
PT13743392T PT2810541T (pt) 2012-01-30 2013-01-30 Método e configuração para a transferência de material eletricamente condutor em forma de fluido para um substrato a imprimir
US14/375,147 US10085350B2 (en) 2012-01-30 2013-01-30 Method and arrangement for transferring electrically conductive material in fluid form on a substrate to be printed
EP13743392.6A EP2810541B1 (en) 2012-01-30 2013-01-30 Method and arrangement for transferring electrically conductive material in fluid form on a substrate to be printed
ES13743392.6T ES2688706T3 (es) 2012-01-30 2013-01-30 Método y disposición para transferir material conductor de electricidad en forma fluida sobre un sustrato a imprimir

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20125088A FI125906B (fi) 2012-01-30 2012-01-30 Menetelmä ja järjestely sähköisesti johtavan materiaalin siirtämiseksi juoksevassa muodossa painettavalle alustalle
FI20125088 2012-01-30

Publications (2)

Publication Number Publication Date
FI20125088L true FI20125088L (fi) 2013-07-31
FI125906B FI125906B (fi) 2016-03-31

Family

ID=48904462

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20125088A FI125906B (fi) 2012-01-30 2012-01-30 Menetelmä ja järjestely sähköisesti johtavan materiaalin siirtämiseksi juoksevassa muodossa painettavalle alustalle

Country Status (18)

Country Link
US (1) US10085350B2 (fi)
EP (1) EP2810541B1 (fi)
JP (1) JP6262151B2 (fi)
KR (1) KR102023585B1 (fi)
CN (1) CN104170533B (fi)
AU (1) AU2013214093B2 (fi)
BR (1) BR112014018777B1 (fi)
CA (1) CA2862587C (fi)
DK (1) DK2810541T3 (fi)
ES (1) ES2688706T3 (fi)
FI (1) FI125906B (fi)
IN (1) IN2014DN06613A (fi)
MX (1) MX2014009162A (fi)
MY (1) MY176775A (fi)
PL (1) PL2810541T3 (fi)
PT (1) PT2810541T (fi)
RU (1) RU2617703C2 (fi)
WO (1) WO2013113994A1 (fi)

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CN106658984A (zh) * 2016-10-27 2017-05-10 江门崇达电路技术有限公司 解决喷锡板水洗后出现水印的工艺及设备
CN108970896B (zh) * 2018-06-20 2019-12-24 荆门市格林美新材料有限公司 一种正极材料极片刮涂装置
CN110142175B (zh) * 2019-05-22 2021-05-25 昆山东申塑料科技有限公司 自动化喷涂产线
EP4136291B1 (en) * 2020-04-15 2024-04-10 RESO Oberflächentechnik GmbH Electrically conductive paper
CN116095978A (zh) * 2023-02-15 2023-05-09 北京梦之墨科技有限公司 一种平整度改善的导电结构及其制作方法
CN116031010B (zh) * 2023-02-17 2025-05-27 北京梦之墨科技有限公司 导电结构、低温导电浆料的印刷平整化方法及设备

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Also Published As

Publication number Publication date
WO2013113994A1 (en) 2013-08-08
RU2014133100A (ru) 2016-03-27
PL2810541T3 (pl) 2018-12-31
DK2810541T3 (en) 2018-10-08
IN2014DN06613A (fi) 2015-05-22
CN104170533A (zh) 2014-11-26
JP2015508704A (ja) 2015-03-23
BR112014018777A8 (pt) 2017-07-11
CA2862587C (en) 2020-04-07
MY176775A (en) 2020-08-21
US10085350B2 (en) 2018-09-25
BR112014018777B1 (pt) 2022-05-17
CN104170533B (zh) 2017-04-05
CA2862587A1 (en) 2013-08-08
EP2810541A1 (en) 2014-12-10
EP2810541B1 (en) 2018-07-25
MX2014009162A (es) 2014-08-27
AU2013214093A1 (en) 2014-08-21
FI125906B (fi) 2016-03-31
ES2688706T3 (es) 2018-11-06
US20150024119A1 (en) 2015-01-22
AU2013214093B2 (en) 2017-02-23
RU2617703C2 (ru) 2017-04-26
BR112014018777A2 (fi) 2017-06-20
PT2810541T (pt) 2018-10-26
EP2810541A4 (en) 2016-01-06
JP6262151B2 (ja) 2018-01-17
KR102023585B1 (ko) 2019-09-23
KR20140129078A (ko) 2014-11-06

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