FI20070415A0 - Suojamaadoitus - Google Patents

Suojamaadoitus

Info

Publication number
FI20070415A0
FI20070415A0 FI20070415A FI20070415A FI20070415A0 FI 20070415 A0 FI20070415 A0 FI 20070415A0 FI 20070415 A FI20070415 A FI 20070415A FI 20070415 A FI20070415 A FI 20070415A FI 20070415 A0 FI20070415 A0 FI 20070415A0
Authority
FI
Finland
Prior art keywords
protective earth
earth
protective
Prior art date
Application number
FI20070415A
Other languages
English (en)
Swedish (sv)
Other versions
FI20070415L (fi
Inventor
Kaija Lehtimaeki
Greta Maakangas
Mikko Heikonen
Original Assignee
Elcoteq Se
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Elcoteq Se filed Critical Elcoteq Se
Priority to FI20070415A priority Critical patent/FI20070415L/fi
Publication of FI20070415A0 publication Critical patent/FI20070415A0/fi
Priority to FI20070468U priority patent/FIU20070468U0/fi
Priority to CN200880020036A priority patent/CN101755496A/zh
Priority to RU2009145643/07A priority patent/RU2009145643A/ru
Priority to PCT/FI2008/000059 priority patent/WO2008145804A2/en
Priority to US12/601,716 priority patent/US20100157545A1/en
Priority to CA002688334A priority patent/CA2688334A1/en
Priority to JP2010509854A priority patent/JP2010528482A/ja
Priority to MX2009012821A priority patent/MX2009012821A/es
Priority to BRPI0810939-7A2A priority patent/BRPI0810939A2/pt
Publication of FI20070415L publication Critical patent/FI20070415L/fi

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0064—Earth or grounding circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/0919—Exposing inner circuit layers or metal planes at the side edge of the PCB or at the walls of large holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structure Of Printed Boards (AREA)
FI20070415A 2007-05-25 2007-05-25 Suojamaadoitus FI20070415L (fi)

Priority Applications (10)

Application Number Priority Date Filing Date Title
FI20070415A FI20070415L (fi) 2007-05-25 2007-05-25 Suojamaadoitus
FI20070468U FIU20070468U0 (fi) 2007-05-25 2007-11-30 Piirikortin häiriösuoja ja maadoitus
BRPI0810939-7A2A BRPI0810939A2 (pt) 2007-05-25 2008-05-26 Módulo eletrônico blindado contra interferências e método de seu fornecimento.
PCT/FI2008/000059 WO2008145804A2 (en) 2007-05-25 2008-05-26 Interference shielded electronics module and method for providing the same
RU2009145643/07A RU2009145643A (ru) 2007-05-25 2008-05-26 Экранированный от помех электронный модуль и способ создания такого модуля
CN200880020036A CN101755496A (zh) 2007-05-25 2008-05-26 干扰被屏蔽的电子模块及其制造方法
US12/601,716 US20100157545A1 (en) 2007-05-25 2008-05-26 Interference shielded electronics module and method for providing the same
CA002688334A CA2688334A1 (en) 2007-05-25 2008-05-26 Interference shielded electronics module and method for providing the same
JP2010509854A JP2010528482A (ja) 2007-05-25 2008-05-26 干渉シールド電子機器モジュール及び同モジュールを提供する方法
MX2009012821A MX2009012821A (es) 2007-05-25 2008-05-26 Modulo de aparatos electronicos protegidos contra interferencia y metodo para proporcionar el mismo.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI20070415A FI20070415L (fi) 2007-05-25 2007-05-25 Suojamaadoitus

Publications (2)

Publication Number Publication Date
FI20070415A0 true FI20070415A0 (fi) 2007-05-25
FI20070415L FI20070415L (fi) 2008-11-26

Family

ID=38069455

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20070415A FI20070415L (fi) 2007-05-25 2007-05-25 Suojamaadoitus

Country Status (9)

Country Link
US (1) US20100157545A1 (fi)
JP (1) JP2010528482A (fi)
CN (1) CN101755496A (fi)
BR (1) BRPI0810939A2 (fi)
CA (1) CA2688334A1 (fi)
FI (1) FI20070415L (fi)
MX (1) MX2009012821A (fi)
RU (1) RU2009145643A (fi)
WO (1) WO2008145804A2 (fi)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102550140B (zh) 2009-10-01 2015-05-27 松下电器产业株式会社 组件及其制造方法
JP5668627B2 (ja) * 2011-07-19 2015-02-12 株式会社村田製作所 回路モジュール
CN104602366B (zh) * 2013-10-30 2018-09-25 太阳诱电株式会社 通信模块
JP6163421B2 (ja) * 2013-12-13 2017-07-12 株式会社東芝 半導体装置、および、半導体装置の製造方法
CN105374925B (zh) * 2014-08-22 2018-07-13 无锡极目科技有限公司 一种基于无机物的led磊晶积层电路板及其制备方法
TWI572150B (zh) * 2014-10-20 2017-02-21 財團法人資訊工業策進會 信號發射裝置、訊息產生系統與信號功率調整方法
WO2016121491A1 (ja) * 2015-01-30 2016-08-04 株式会社村田製作所 電子回路モジュール
CN106686932B (zh) * 2015-11-05 2019-12-13 精能医学股份有限公司 植入式电子装置的防水结构
CN115226385A (zh) * 2016-01-08 2022-10-21 北京大基康明医疗设备有限公司 一种整合机柜电场屏蔽设备
EP3232751B1 (de) * 2016-04-12 2018-07-18 MD Elektronik GmbH Elektrische steckkupplungsvorrichtung
KR101896435B1 (ko) * 2016-11-09 2018-09-07 엔트리움 주식회사 전자파차폐용 전자부품 패키지 및 그의 제조방법
CN108976451A (zh) * 2017-06-01 2018-12-11 苏州国动环保节能科技有限公司 一种消除电器使用时产生的电磁辐射的涂料使用方法
DE102017210894A1 (de) * 2017-06-28 2019-01-03 Robert Bosch Gmbh Elektronikmodul und Verfahren zur Herstellung eines Elektronikmoduls
RU2713650C1 (ru) * 2019-03-19 2020-02-06 Акционерное общество "Российская корпорация ракетно-космического приборостроения и информационных систем" (АО "Российские космические системы") Устройство экранирования электронных узлов многослойной СВЧ платы от электромагнитного излучения
EP3817043A1 (en) * 2019-10-31 2021-05-05 Heraeus Deutschland GmbH & Co KG Electromagnetic interference shielding in recesses of electronic modules
CN112867226B (zh) * 2019-11-27 2022-12-06 鹏鼎控股(深圳)股份有限公司 高频传输电路板及其制作方法
CN112770482B (zh) * 2020-12-04 2023-11-28 深圳国人无线通信有限公司 一种印制板组件及屏蔽结构
CN112908963B (zh) * 2021-01-19 2022-12-23 青岛歌尔智能传感器有限公司 基板结构、制备方法及电子产品
CN113766818A (zh) * 2021-08-06 2021-12-07 展讯通信（上海）有限公司 多层堆叠封装组件及多层组件的封装方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH073660Y2 (ja) * 1989-02-27 1995-01-30 任天堂株式会社 Ｅｍｉ対策用回路基板
JP2001339016A (ja) * 2000-05-30 2001-12-07 Alps Electric Co Ltd 面実装型電子回路ユニット
JP3718131B2 (ja) * 2001-03-16 2005-11-16 松下電器産業株式会社 高周波モジュールおよびその製造方法
US7187060B2 (en) * 2003-03-13 2007-03-06 Sanyo Electric Co., Ltd. Semiconductor device with shield
JP2005276980A (ja) 2004-03-24 2005-10-06 Matsushita Electric Ind Co Ltd 回路部品内蔵モジュールの製造方法
WO2005099331A1 (ja) * 2004-03-30 2005-10-20 Matsushita Electric Industrial Co., Ltd. モジュール部品およびその製造方法
JP2006286915A (ja) 2005-03-31 2006-10-19 Taiyo Yuden Co Ltd 回路モジュール
JP4614278B2 (ja) * 2005-05-25 2011-01-19 アルプス電気株式会社 電子回路ユニット、及びその製造方法

Also Published As

Publication number Publication date
FI20070415L (fi) 2008-11-26
WO2008145804A9 (en) 2009-01-22
BRPI0810939A2 (pt) 2014-12-23
CA2688334A1 (en) 2008-12-04
RU2009145643A (ru) 2011-06-27
WO2008145804A3 (en) 2009-03-05
CN101755496A (zh) 2010-06-23
US20100157545A1 (en) 2010-06-24
MX2009012821A (es) 2010-04-01
WO2008145804A2 (en) 2008-12-04
JP2010528482A (ja) 2010-08-19

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Legal Events

Date Code Title Description
FA Application withdrawn [patent]