FI20002472A - Pintamikromekaaninen absoluuttipaineanturi ja menetelmä sen valmistamiseksi - Google Patents

Pintamikromekaaninen absoluuttipaineanturi ja menetelmä sen valmistamiseksi Download PDF

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Publication number
FI20002472A
FI20002472A FI20002472A FI20002472A FI20002472A FI 20002472 A FI20002472 A FI 20002472A FI 20002472 A FI20002472 A FI 20002472A FI 20002472 A FI20002472 A FI 20002472A FI 20002472 A FI20002472 A FI 20002472A
Authority
FI
Finland
Prior art keywords
absolute pressure
pressure sensor
manufacture
surface micromechanical
movable electrode
Prior art date
Application number
FI20002472A
Other languages
English (en)
Swedish (sv)
Other versions
FI20002472A0 (fi
FI112644B (fi
Inventor
Martti Blomberg
Original Assignee
Vaisala Oyj
Valtion Teknillinen
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vaisala Oyj, Valtion Teknillinen filed Critical Vaisala Oyj
Publication of FI20002472A0 publication Critical patent/FI20002472A0/fi
Priority to FI20002472A priority Critical patent/FI112644B/fi
Priority to EP01982512A priority patent/EP1337458B1/en
Priority to JP2002541035A priority patent/JP3857231B2/ja
Priority to US10/416,267 priority patent/US6931935B2/en
Priority to AU2002214074A priority patent/AU2002214074A1/en
Priority to PCT/FI2001/000970 priority patent/WO2002038491A1/en
Priority to CN01821908.XA priority patent/CN1225400C/zh
Priority to AT01982512T priority patent/ATE514652T1/de
Priority to RU2003113320/28A priority patent/RU2258914C2/ru
Publication of FI20002472A publication Critical patent/FI20002472A/fi
Application granted granted Critical
Publication of FI112644B publication Critical patent/FI112644B/fi

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0072—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance
    • G01L9/0073—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance using a semiconductive diaphragm

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)
FI20002472A 2000-11-10 2000-11-10 Pintamikromekaaninen absoluuttipaineanturi ja menetelmä sen valmistamiseksi FI112644B (fi)

Priority Applications (9)

Application Number Priority Date Filing Date Title
FI20002472A FI112644B (fi) 2000-11-10 2000-11-10 Pintamikromekaaninen absoluuttipaineanturi ja menetelmä sen valmistamiseksi
AU2002214074A AU2002214074A1 (en) 2000-11-10 2001-11-07 Surface-micromachined absolute pressure sensor and a method for manufacturing thereof
JP2002541035A JP3857231B2 (ja) 2000-11-10 2001-11-07 表面微細加工した絶対圧力センサとその製造方法
US10/416,267 US6931935B2 (en) 2000-11-10 2001-11-07 Surface-micromachined absolute pressure sensor and a method for manufacturing thereof
EP01982512A EP1337458B1 (en) 2000-11-10 2001-11-07 Surface-micromachined absolute pressure sensor and a method for manufacturing thereof
PCT/FI2001/000970 WO2002038491A1 (en) 2000-11-10 2001-11-07 Surface-micromachined absolute pressure sensor and a method for manufacturing thereof
CN01821908.XA CN1225400C (zh) 2000-11-10 2001-11-07 表面微型机械加工的绝对压力传感器及其制造方法
AT01982512T ATE514652T1 (de) 2000-11-10 2001-11-07 Oberflächig mikrohergestellter absolutdrucksensor und dessen herstellungsverfahren
RU2003113320/28A RU2258914C2 (ru) 2000-11-10 2001-11-07 Датчик абсолютного давления с микрообработанной поверхностью и способ его изготовления

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20002472A FI112644B (fi) 2000-11-10 2000-11-10 Pintamikromekaaninen absoluuttipaineanturi ja menetelmä sen valmistamiseksi
FI20002472 2000-11-10

Publications (3)

Publication Number Publication Date
FI20002472A0 FI20002472A0 (fi) 2000-11-10
FI20002472A true FI20002472A (fi) 2002-05-11
FI112644B FI112644B (fi) 2003-12-31

Family

ID=8559475

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20002472A FI112644B (fi) 2000-11-10 2000-11-10 Pintamikromekaaninen absoluuttipaineanturi ja menetelmä sen valmistamiseksi

Country Status (9)

Country Link
US (1) US6931935B2 (fi)
EP (1) EP1337458B1 (fi)
JP (1) JP3857231B2 (fi)
CN (1) CN1225400C (fi)
AT (1) ATE514652T1 (fi)
AU (1) AU2002214074A1 (fi)
FI (1) FI112644B (fi)
RU (1) RU2258914C2 (fi)
WO (1) WO2002038491A1 (fi)

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DE10117486A1 (de) 2001-04-07 2002-10-17 Bosch Gmbh Robert Verfahren zur Herstelung eines Halbleiterbauelements sowie ein nach dem Verfahren hergestelltes Halbleiterbauelement
DE10247487A1 (de) 2002-10-11 2004-05-06 Infineon Technologies Ag Membran und Verfahren zu deren Herstellung
DE102004015442A1 (de) * 2004-03-30 2005-10-20 Bosch Gmbh Robert Verfahren zum Verschließen von perforierten Membranen
US6923069B1 (en) 2004-10-18 2005-08-02 Honeywell International Inc. Top side reference cavity for absolute pressure sensor
DE102005016243B3 (de) * 2005-04-08 2006-09-28 Austriamicrosystems Ag Mikromechanisches Bauelement, Verfahren zur Herstellung und Verwendung
US7560789B2 (en) * 2005-05-27 2009-07-14 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
EP1926679A2 (en) * 2005-09-09 2008-06-04 Koninklijke Philips Electronics N.V. A method of manufacturing a microsystem, such a microsystem, a stack of foils comprising such a microsystem, an electronic device comprising such a microsystem and use of the electronic device
US20080280112A1 (en) * 2005-09-09 2008-11-13 Koninklijke Philips Electronics, N.V. Method fo Manufacturing a Microsystem, Such a Microsystem, a Stack of Foils Comprising Such a Microsystem, an Electronic Device Comprising Such a Microsystem and Use of the Electronic Device
US7417784B2 (en) * 2006-04-19 2008-08-26 Qualcomm Mems Technologies, Inc. Microelectromechanical device and method utilizing a porous surface
US7711239B2 (en) 2006-04-19 2010-05-04 Qualcomm Mems Technologies, Inc. Microelectromechanical device and method utilizing nanoparticles
WO2008103632A2 (en) * 2007-02-20 2008-08-28 Qualcomm Mems Technologies, Inc. Equipment and methods for etching of mems
KR20100061731A (ko) * 2007-09-14 2010-06-08 퀄컴 엠이엠스 테크놀로지스, 인크. Ｍｅｍｓ 제조에 이용되는 에칭 방법
US8022490B2 (en) 2008-03-24 2011-09-20 Conexant Systems, Inc. Micro electro-mechanical sensor (MEMS) fabricated with ribbon wire bonds
DE102008028300B4 (de) * 2008-06-13 2021-10-07 Tdk Electronics Ag Leiterplatte mit flexiblem Bereich und Verfahren zur Herstellung
RU2465681C2 (ru) * 2009-02-19 2012-10-27 Государственное образовательное учреждение высшего профессионального образования "Московский государственный технический университет имени Н.Э. Баумана" (МГТУ им. Н.Э. Баумана) Способ изготовления чувствительного элемента датчика давления жидких и газообразных сред
US8393222B2 (en) 2010-02-27 2013-03-12 Codman Neuro Sciences Sárl Apparatus and method for minimizing drift of a piezo-resistive pressure sensor due to progressive release of mechanical stress over time
KR101184459B1 (ko) 2010-05-06 2012-09-19 삼성전기주식회사 압력센서
US8659816B2 (en) 2011-04-25 2014-02-25 Qualcomm Mems Technologies, Inc. Mechanical layer and methods of making the same
RU2477846C1 (ru) * 2011-12-02 2013-03-20 Федеральное государственное унитарное предприятие "Всероссийский научно-исследовательский институт автоматики им. Н.Л. Духова" (ФГУП "ВНИИА") Датчик абсолютного давления
CN102539029B (zh) * 2012-02-29 2013-09-25 上海交通大学 基于柔性mems技术的三维流体应力传感器及其阵列
FR3002219B1 (fr) * 2013-02-19 2015-04-10 Commissariat Energie Atomique Procede de fabrication d'une structure micromecanique et/ou nanomecanique comportant une surface poreuse
DE102017213354A1 (de) 2017-08-02 2019-02-07 Robert Bosch Gmbh Mikromechanische Drucksensorvorrichtung und entsprechendes Herstellungsverfahren
CN209326840U (zh) 2018-12-27 2019-08-30 热敏碟公司 压力传感器及压力变送器
WO2022019167A1 (ja) * 2020-07-21 2022-01-27 株式会社村田製作所 圧力センサ構造、圧力センサ装置および圧力センサ構造の製造方法
US20230088319A1 (en) * 2021-09-21 2023-03-23 Invensense, Inc. Pressure sensor with high stability

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JPH0750789B2 (ja) * 1986-07-18 1995-05-31 日産自動車株式会社 半導体圧力変換装置の製造方法
US5177661A (en) * 1989-01-13 1993-01-05 Kopin Corporation SOI diaphgram sensor
US5506454A (en) * 1991-03-20 1996-04-09 Hitachi, Ltd. System and method for diagnosing characteristics of acceleration sensor
US5707077A (en) * 1991-11-18 1998-01-13 Hitachi, Ltd. Airbag system using three-dimensional acceleration sensor
US5802684A (en) * 1993-09-14 1998-09-08 Nikon Corporation Process for producing a vibration angular-velocity sensor
EP0714017B1 (de) * 1994-11-24 2000-07-12 Siemens Aktiengesellschaft Kapazitiver Drucksensor
FI100918B (fi) 1995-02-17 1998-03-13 Vaisala Oy Pintamikromekaaninen, symmetrinen paine-eroanturi
JPH08236784A (ja) * 1995-02-23 1996-09-13 Tokai Rika Co Ltd 加速度センサ及びその製造方法
US5831162A (en) * 1997-01-21 1998-11-03 Delco Electronics Corporation Silicon micromachined motion sensor and method of making
JP3362714B2 (ja) * 1998-11-16 2003-01-07 株式会社豊田中央研究所 静電容量型圧力センサおよびその製造方法
US6816301B1 (en) * 1999-06-29 2004-11-09 Regents Of The University Of Minnesota Micro-electromechanical devices and methods of manufacture
DE10032579B4 (de) * 2000-07-05 2020-07-02 Robert Bosch Gmbh Verfahren zur Herstellung eines Halbleiterbauelements sowie ein nach dem Verfahren hergestelltes Halbleiterbauelement

Also Published As

Publication number Publication date
CN1486277A (zh) 2004-03-31
EP1337458A1 (en) 2003-08-27
JP2004513356A (ja) 2004-04-30
FI20002472A0 (fi) 2000-11-10
US6931935B2 (en) 2005-08-23
RU2258914C2 (ru) 2005-08-20
ATE514652T1 (de) 2011-07-15
AU2002214074A1 (en) 2002-05-21
US20040020303A1 (en) 2004-02-05
FI112644B (fi) 2003-12-31
CN1225400C (zh) 2005-11-02
JP3857231B2 (ja) 2006-12-13
EP1337458B1 (en) 2011-06-29
WO2002038491A1 (en) 2002-05-16

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