ES8605833A1 - Procedimiento para la fabricacion de substratos plasticos metalizados para espejos asi como soportes de informacion y analogos. - Google Patents
Procedimiento para la fabricacion de substratos plasticos metalizados para espejos asi como soportes de informacion y analogos.Info
- Publication number
- ES8605833A1 ES8605833A1 ES537729A ES537729A ES8605833A1 ES 8605833 A1 ES8605833 A1 ES 8605833A1 ES 537729 A ES537729 A ES 537729A ES 537729 A ES537729 A ES 537729A ES 8605833 A1 ES8605833 A1 ES 8605833A1
- Authority
- ES
- Spain
- Prior art keywords
- acrylic resin
- resin articles
- wet
- wet metallization
- basic nitrogen
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/285—Sensitising or activating with tin based compound or composition
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2026—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by radiant energy
- C23C18/204—Radiation, e.g. UV, laser
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Optics & Photonics (AREA)
- Toxicology (AREA)
- Inorganic Chemistry (AREA)
- Chemically Coating (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
- Laminated Bodies (AREA)
Abstract
METODO DE FABRICACION DE SUSTRATOS PLASTICOS METALIZADOS, QUE TIENEN APLICACIONES COMO ESPEJOS Y COMO SOPORTES DE INFORMACION Y ANALOGOS. CONSISTE EN EL TRATAMIENTO DE LA SUPERFICIE DE LOS OBJETOS PREVISTOS PARA EL METALIZADO, QUE CONSTA DE UN SUSTRATO DE MATERIAL PLASTICO CONSISTENTE EN UN POLIMERIZADO QUE, POR LO MENOS EN UN 0,01% CONSTA DE DERIVADOS QUE CONTIENEN GRUPOS AMINO, DEL ACIDO ACRILICO O METACRILICO, CON ACIDOS CARBOXILICOS AROMATICOS, SUSTITUIDOS CON UNO O VARIOS GRUPOS HIDROXI; SENSIBILIZACION CON UNA DISOLUCION DE SAL METALICA REDUCTORA, TAL COMO DISOLUCION ACIDA DEL CLORURO DE ESTAÑO (II); Y METALIZACION EN HUMEDO DEL SUSTRATO DEL MATERIAL PLASTICO ASI TRATADO MEDIANTE APLICACION DE UNA DISOLUCION AMONIACAL DE NITRATO DE PLATA.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19833341536 DE3341536A1 (de) | 1983-11-17 | 1983-11-17 | Kunststoffsubstrat zur verankerung von metallueberzuegen |
DE19843435898 DE3435898A1 (de) | 1984-09-29 | 1984-09-29 | Kunststoffsubstrat zur verankerung von metallueberzuegen |
Publications (2)
Publication Number | Publication Date |
---|---|
ES537729A0 ES537729A0 (es) | 1986-04-01 |
ES8605833A1 true ES8605833A1 (es) | 1986-04-01 |
Family
ID=25815681
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES537729A Expired ES8605833A1 (es) | 1983-11-17 | 1984-11-16 | Procedimiento para la fabricacion de substratos plasticos metalizados para espejos asi como soportes de informacion y analogos. |
Country Status (7)
Country | Link |
---|---|
US (1) | US4663199A (es) |
CH (1) | CH662818A5 (es) |
ES (1) | ES8605833A1 (es) |
FR (1) | FR2555185A1 (es) |
GB (1) | GB2152062B (es) |
IT (1) | IT1179821B (es) |
NL (1) | NL8403498A (es) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN87100440B (zh) * | 1987-01-27 | 1988-05-11 | 中国人民解放军装甲兵工程学院 | 在不导电材料上刷镀铜的方法 |
US5271870A (en) * | 1987-08-27 | 1993-12-21 | The United States Of America As Represented By The Department Of Energy | Process for introducing electrical conductivity into high-temperature polymeric materials |
JPH0826462B2 (ja) * | 1987-11-30 | 1996-03-13 | 龍徳 四十宮 | 表面金属化重合体成形物の製造方法 |
EP1260278B1 (en) * | 2001-05-25 | 2007-10-31 | Nippon Paint Co., Ltd. | Method of coating a plastic molding, ultraviolet-curable under coating for metal evaporation, and plastic moldings |
US8465469B2 (en) * | 2002-09-12 | 2013-06-18 | Medtronic Vascular, Inc. | Reinforced catheter and methods of making |
DE102005051632B4 (de) * | 2005-10-28 | 2009-02-19 | Enthone Inc., West Haven | Verfahren zum Beizen von nicht leitenden Substratoberflächen und zur Metallisierung von Kunststoffoberflächen |
KR101678013B1 (ko) * | 2016-02-15 | 2016-11-21 | 주식회사 베프스 | 금속성분의 액중 농도 지시체를 포함하는 도금액 및 이를 이용한 도금 방법 |
US20170251557A1 (en) * | 2016-02-29 | 2017-08-31 | Rohm And Haas Electronic Materials Llc | Horizontal method of electroless metal plating of substrates with ionic catalysts |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3094430A (en) * | 1961-12-11 | 1963-06-18 | John E Marshall Jr | Method of applying mirror coating to acrylic base |
DE1569434A1 (de) * | 1964-10-06 | 1969-06-26 | Schering Ag | Verfahren zum Modifizieren von Kunststoffoberflaechen fuer nachfolgende Galvanisierung |
US3524754A (en) * | 1967-04-28 | 1970-08-18 | Shell Oil Co | Metal plating of plastics |
BE733892A (es) * | 1969-05-30 | 1969-11-03 | ||
GB1343212A (en) * | 1971-01-11 | 1974-01-10 | Macdermid Ltd | Treatmetn of resin substrates for the reception of metal doposits |
US3779790A (en) * | 1971-12-08 | 1973-12-18 | Hooker Chemical Corp | Metal plating of synthetic polymers |
JPS4948171A (es) * | 1972-09-11 | 1974-05-10 | ||
US3998602A (en) * | 1975-02-07 | 1976-12-21 | Carl Horowitz | Metal plating of polymeric substrates |
US4244789A (en) * | 1979-01-24 | 1981-01-13 | Stauffer Chemical Company | Method of metallizing materials |
US4246320A (en) * | 1979-03-15 | 1981-01-20 | Stauffer Chemical Company | Plated acrylate/styrene/acrylonitrile article |
US4363844A (en) * | 1980-09-22 | 1982-12-14 | Lewis Terry W | Metallized information carrying discs |
NL8103375A (nl) * | 1981-07-16 | 1983-02-16 | Philips Nv | Methode voor de vervaardiging van een kunstsof voorwerp dat voorzien is van een metaallaag. |
-
1984
- 1984-11-12 FR FR8417185A patent/FR2555185A1/fr active Pending
- 1984-11-15 NL NL8403498A patent/NL8403498A/nl not_active Application Discontinuation
- 1984-11-16 ES ES537729A patent/ES8605833A1/es not_active Expired
- 1984-11-16 CH CH5501/84A patent/CH662818A5/de not_active IP Right Cessation
- 1984-11-16 IT IT6815184A patent/IT1179821B/it active
- 1984-11-19 GB GB8429143A patent/GB2152062B/en not_active Expired
-
1986
- 1986-03-07 US US06/838,186 patent/US4663199A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US4663199A (en) | 1987-05-05 |
FR2555185A1 (fr) | 1985-05-24 |
GB8429143D0 (en) | 1984-12-27 |
ES537729A0 (es) | 1986-04-01 |
NL8403498A (nl) | 1985-06-17 |
IT1179821B (it) | 1987-09-16 |
CH662818A5 (de) | 1987-10-30 |
IT8468151A1 (it) | 1986-05-16 |
GB2152062A (en) | 1985-07-31 |
GB2152062B (en) | 1988-02-03 |
IT8468151A0 (it) | 1984-11-16 |
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