ES8601494A1 - Procedimiento para la produccion de imagenes en relieve - Google Patents

Procedimiento para la produccion de imagenes en relieve

Info

Publication number
ES8601494A1
ES8601494A1 ES529622A ES529622A ES8601494A1 ES 8601494 A1 ES8601494 A1 ES 8601494A1 ES 529622 A ES529622 A ES 529622A ES 529622 A ES529622 A ES 529622A ES 8601494 A1 ES8601494 A1 ES 8601494A1
Authority
ES
Spain
Prior art keywords
substd
bond
contg
opt
formula
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES529622A
Other languages
English (en)
Spanish (es)
Other versions
ES529622A0 (es
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Novartis AG
Original Assignee
Ciba Geigy AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ciba Geigy AG filed Critical Ciba Geigy AG
Publication of ES529622A0 publication Critical patent/ES529622A0/es
Publication of ES8601494A1 publication Critical patent/ES8601494A1/es
Expired legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/037Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/029Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/038Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0387Polyamides or polyimides
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055Radiation sensitive composition or product or process of making
    • Y10S430/114Initiator containing
    • Y10S430/117Free radical
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055Radiation sensitive composition or product or process of making
    • Y10S430/114Initiator containing
    • Y10S430/126Halogen compound containing
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/148Light sensitive titanium compound containing

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Polymerisation Methods In General (AREA)
  • Paints Or Removers (AREA)
ES529622A 1983-02-11 1984-02-10 Procedimiento para la produccion de imagenes en relieve Expired ES8601494A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH78583 1983-02-11

Publications (2)

Publication Number Publication Date
ES529622A0 ES529622A0 (es) 1985-11-01
ES8601494A1 true ES8601494A1 (es) 1985-11-01

Family

ID=4195129

Family Applications (1)

Application Number Title Priority Date Filing Date
ES529622A Expired ES8601494A1 (es) 1983-02-11 1984-02-10 Procedimiento para la produccion de imagenes en relieve

Country Status (6)

Country Link
US (1) US4548891A (enExample)
EP (1) EP0119162B1 (enExample)
JP (1) JPS59172641A (enExample)
CA (1) CA1239499A (enExample)
DE (1) DE3470100D1 (enExample)
ES (1) ES8601494A1 (enExample)

Families Citing this family (58)

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US4822718A (en) * 1982-09-30 1989-04-18 Brewer Science, Inc. Light absorbing coating
US4590287A (en) * 1983-02-11 1986-05-20 Ciba-Geigy Corporation Fluorinated titanocenes and photopolymerizable composition containing same
JPS59160139A (ja) * 1983-03-04 1984-09-10 Hitachi Ltd 感光性重合体組成物
US4515887A (en) * 1983-08-29 1985-05-07 General Electric Company Photopatternable dielectric compositions, method for making and use
JPS60198537A (ja) * 1984-01-24 1985-10-08 ゼネラル・エレクトリツク・カンパニイ ホトパタ−ニングの可能な誘電体組成物並びにその製造方法および使用方法
US4713401A (en) * 1984-12-20 1987-12-15 Martin Riediker Titanocenes and a radiation-polymerizable composition containing these titanocenes
EP0188205B1 (de) * 1985-01-15 1988-06-22 Ciba-Geigy Ag Polyamidester-Fotoresist-Formulierungen gesteigerter Empfindlichkeit
GB8515475D0 (en) * 1985-06-19 1985-07-24 Ciba Geigy Ag Forming images
US5194365A (en) * 1985-06-19 1993-03-16 Ciba-Geigy Corporation Method for forming images
US4786569A (en) * 1985-09-04 1988-11-22 Ciba-Geigy Corporation Adhesively bonded photostructurable polyimide film
EP0254230A3 (en) * 1986-07-22 1988-11-23 Asahi Kasei Kogyo Kabushiki Kaisha Heat-resistant photoresist film
DE3784199D1 (de) * 1986-08-01 1993-03-25 Ciba Geigy Ag Titanocene und deren verwendung.
AU599400B2 (en) * 1986-08-01 1990-07-19 Ciba-Geigy Ag Titanocenes and their use
DE3864530D1 (de) * 1987-02-02 1991-10-10 Ciba Geigy Ag Photoinitiatorengemische enthaltend ein titanocen und ein 3-ketocoumarin.
GB8715435D0 (en) * 1987-07-01 1987-08-05 Ciba Geigy Ag Forming images
US5270431A (en) * 1987-07-23 1993-12-14 Basf Aktiengesellschaft Preparation of oligomeric or polymeric radiation-reactive intermediates for solvent-structured layers
JP2640470B2 (ja) * 1987-08-19 1997-08-13 旭化成工業株式会社 新しい感光性組成物
US5026625A (en) * 1987-12-01 1991-06-25 Ciba-Geigy Corporation Titanocenes, the use thereof, and n-substituted fluoroanilines
US5008302A (en) * 1987-12-01 1991-04-16 Ciba-Geigy Corporation Titanocenes, the use thereof, and N-substituted pyrroles
US4987056A (en) * 1988-06-02 1991-01-22 Toyo Boseki Kabushiki Kaisha Photopolymerizable composition
DE3832032A1 (de) * 1988-09-21 1990-03-22 Hoechst Ag Photopolymerisierbares gemisch und daraus hergestelltes aufzeichnungsmaterial
US5102775A (en) * 1988-09-30 1992-04-07 Kansai Paint Co., Ltd. Visible light sensitive electrodeposition coating composition and image-forming method using the same
US4997869A (en) * 1988-10-11 1991-03-05 Ethyl Corporation Production of electronic coatings by spin coating a partially fluorinated polyimide composition
US4996254A (en) * 1988-10-11 1991-02-26 Ethyl Corporation Production of electronic coatings by spin coating a partially fluorinated polyamic acid composition
US5037673A (en) * 1988-10-11 1991-08-06 Ethyl Corporation Method of spin coating a solution of partially fluorinated polyamic acid polymer and cycloaliphatic ketone solvent
JP2880523B2 (ja) * 1989-05-26 1999-04-12 日立化成工業株式会社 感光性樹脂組成物及びこれを用いた感光性エレメント
WO1990012051A1 (en) * 1989-03-30 1990-10-18 Brewer Science, Inc. Base-soluble polyimide release layers for use in microlithographic processing
US5057399A (en) * 1989-03-31 1991-10-15 Tony Flaim Method for making polyimide microlithographic compositions soluble in alkaline media
DE4007428A1 (de) * 1990-03-09 1991-09-12 Hoechst Ag Photopolymerisierbares gemisch und daraus hergestelltes aufzeichnungsmaterial
DE4008815A1 (de) * 1990-03-20 1991-09-26 Hoechst Ag Photopolymerisierbares gemisch und daraus hergestelltes aufzeichnungsmaterial
US5514521A (en) * 1990-08-22 1996-05-07 Brother Kogyo Kabushiki Kaisha Photocurable composition
GB9105561D0 (en) * 1991-03-15 1991-05-01 Coates Brothers Plc Image formation
TW237456B (enExample) * 1992-04-09 1995-01-01 Ciba Geigy
JP3141517B2 (ja) 1992-05-14 2001-03-05 ブラザー工業株式会社 光硬化型組成物
DE69308671T2 (de) * 1992-07-22 1997-10-16 Asahi Chemical Ind Photoempfindliche Polyimid-Zusammensetzung
JPH0680776A (ja) * 1992-09-02 1994-03-22 Asahi Chem Ind Co Ltd ポリイミド前駆体及び組成物
EP0624826B1 (de) * 1993-05-14 1997-07-16 OCG Microelectronic Materials Inc. Verfahren zur Herstellung von Reliefstrukturen durch i-Linien-Bestrahlung
JP3687988B2 (ja) * 1993-09-03 2005-08-24 日立化成工業株式会社 i線ステッパ用感光性樹脂組成物
DE4418645C1 (de) 1994-05-27 1995-12-14 Sun Chemical Corp Lichtempfindliches Gemisch und daraus herstellbares Aufzeichnungsmaterial
US6071667A (en) 1995-04-13 2000-06-06 Hitachi Chemical Co., Ltd. Photosensitive resin composition containing a photosensitive polyamide resin
US5837422A (en) * 1995-07-25 1998-11-17 Mitsubishi Chemical Corporation Photopolymerizable composition and photosensitive lithographic printing plate employing it
US5856065A (en) * 1996-03-27 1999-01-05 Olin Microelectronic Chemicals, Inc. Negative working photoresist composition based on polyimide primers
GB9611291D0 (en) * 1996-05-30 1996-07-31 Dow Corning Room temperature curable compositions
WO1999013381A1 (en) * 1997-09-11 1999-03-18 Arch Specialty Chemicals, Inc. A negatively acting photoresist composition based on polyimide precursors
US6511789B2 (en) 2000-06-26 2003-01-28 Arch Specialty Chemicals, Inc. Photosensitive polyimide precursor compositions
US7335319B2 (en) * 2002-02-06 2008-02-26 Arch Specialty Chemicals, Inc. Semiconductor stress buffer coating edge bead removal compositions and method for their use
US6936384B2 (en) 2002-08-01 2005-08-30 Kodak Polychrome Graphics Llc Infrared-sensitive composition containing a metallocene derivative
EP1609024B1 (en) * 2003-03-11 2015-09-30 Fujifilm Electronic Materials USA, Inc. Photosensitive resin compositions
JP4878796B2 (ja) * 2004-09-06 2012-02-15 富士フイルム株式会社 光学フィルムの製造方法
JP2006145992A (ja) * 2004-11-22 2006-06-08 Sharp Corp 液晶表示装置及びその製造方法
US8399569B2 (en) 2007-05-23 2013-03-19 Showa Denko K.K. Reactive urethane compound having ether bond, curable composition, and cured material
US20100227269A1 (en) 2009-03-04 2010-09-09 Simpson Christopher D Imageable elements with colorants
JP6210986B2 (ja) 2011-09-07 2017-10-11 マイクロケム コーポレイション 低表面エネルギー基板上にレリーフパターンを製作するためのエポキシ配合物及び方法
US9962430B2 (en) 2012-02-15 2018-05-08 Chirhoclin, Inc. Methods for treating pain associated with chronic pancreatitis
WO2013134104A2 (en) 2012-03-08 2013-09-12 Microchem Corp. Photoimageable compositions and processes for fabrication of relief patterns on low surface energy substrates
US11406718B2 (en) 2012-05-29 2022-08-09 Chirhoclin, Inc. Methods of detecting pancreobiliary ductal leaks
JP6167089B2 (ja) 2014-03-27 2017-07-19 富士フイルム株式会社 感光性樹脂組成物、硬化膜、硬化膜の製造方法および半導体デバイス
US11744878B2 (en) 2020-08-19 2023-09-05 Chirhoclin, Inc. Methods for treatment of COVID-19 syndrome

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US3740305A (en) * 1971-10-01 1973-06-19 Gen Electric Composite materials bonded with siloxane containing polyimides
US3717558A (en) * 1972-03-30 1973-02-20 Scm Corp Photopolymerization catalyst comprising a metallocene and an active halogen-containing compound
NL177718C (nl) * 1973-02-22 1985-11-01 Siemens Ag Werkwijze ter vervaardiging van reliefstructuren uit warmte-bestendige polymeren.
US4126466A (en) * 1974-07-22 1978-11-21 E. I. Du Pont De Nemours And Company Composite, mask-forming, photohardenable elements
DE2437348B2 (de) * 1974-08-02 1976-10-07 Ausscheidung in: 24 62 105 Verfahren zur herstellung von reliefstrukturen
US4030948A (en) * 1975-07-21 1977-06-21 Abe Berger Polyimide containing silicones as protective coating on semiconductor device
US4173673A (en) * 1975-11-17 1979-11-06 E. I. Du Pont De Nemours And Company Dot-etchable masks from photopolymerizable elements
DE2919841A1 (de) * 1979-05-16 1980-11-20 Siemens Ag Verfahren zur phototechnischen herstellung von reliefstrukturen
US4414312A (en) * 1980-09-03 1983-11-08 E. I. Du Pont De Nemours & Co. Photopolymerizable polyamide ester resin compositions containing an oxygen scavenger
US4329419A (en) * 1980-09-03 1982-05-11 E. I. Du Pont De Nemours And Company Polymeric heat resistant photopolymerizable composition for semiconductors and capacitors
JPS57168942A (en) * 1981-04-13 1982-10-18 Hitachi Ltd Photosensitive polymer composition
US4454220A (en) * 1982-01-04 1984-06-12 E. I. Du Pont De Nemours And Company Electrical device containing a radiation-sensitive polyimide precursor composition derived from a diaryl fluoro compound

Also Published As

Publication number Publication date
JPH0352050B2 (enExample) 1991-08-08
US4548891A (en) 1985-10-22
EP0119162A2 (de) 1984-09-19
ES529622A0 (es) 1985-11-01
EP0119162A3 (en) 1985-09-18
EP0119162B1 (de) 1988-03-23
DE3470100D1 (en) 1988-04-28
CA1239499A (en) 1988-07-19
JPS59172641A (ja) 1984-09-29

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Legal Events

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PC1A Transfer granted
PC1A Transfer granted
FD1A Patent lapsed

Effective date: 20040403