ES373779A1 - Un metodo de fabricar dispositivos semiconductores. - Google Patents

Un metodo de fabricar dispositivos semiconductores.

Info

Publication number
ES373779A1
ES373779A1 ES373779A ES373779A ES373779A1 ES 373779 A1 ES373779 A1 ES 373779A1 ES 373779 A ES373779 A ES 373779A ES 373779 A ES373779 A ES 373779A ES 373779 A1 ES373779 A1 ES 373779A1
Authority
ES
Spain
Prior art keywords
translation
machine
legally binding
google translate
semiconductor devices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES373779A
Other languages
English (en)
Spanish (es)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Publication of ES373779A1 publication Critical patent/ES373779A1/es
Expired legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/148—Details about the circuit board integration, e.g. integrated with the diaphragm surface or encapsulation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0061—Electrical connection means
    • G01L19/0084—Electrical connection means to the outside of the housing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/147—Details about the mounting of the sensor to support or covering means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
    • G01L9/0052—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements
    • G01L9/0054—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements integral with a semiconducting diaphragm
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R21/00—Variable-resistance transducers
    • H04R21/02—Microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones
    • H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
    • H04R7/04—Plane diaphragms
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones
    • H04R7/16—Mounting or tensioning of diaphragms or cones
    • H04R7/18—Mounting or tensioning of diaphragms or cones at the periphery
    • H04R7/22—Clamping rim of diaphragm or cone against seating

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Multimedia (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Pressure Sensors (AREA)
  • Measuring Fluid Pressure (AREA)
  • Recrystallisation Techniques (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
ES373779A 1968-11-29 1969-11-21 Un metodo de fabricar dispositivos semiconductores. Expired ES373779A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL6817089A NL162254B (nl) 1968-11-29 1968-11-29 Halfgeleiderinrichting voor het omzetten van mechanische spanningen in elektrische signalen en werkwijze voor het vervaardigen daarvan.

Publications (1)

Publication Number Publication Date
ES373779A1 true ES373779A1 (es) 1972-05-16

Family

ID=19805282

Family Applications (2)

Application Number Title Priority Date Filing Date
ES373779A Expired ES373779A1 (es) 1968-11-29 1969-11-21 Un metodo de fabricar dispositivos semiconductores.
ES400839A Expired ES400839A1 (es) 1968-11-29 1972-03-16 Un dispositivo semiconductor para convertir tensiones meca-nicas en senales electricas.

Family Applications After (1)

Application Number Title Priority Date Filing Date
ES400839A Expired ES400839A1 (es) 1968-11-29 1972-03-16 Un dispositivo semiconductor para convertir tensiones meca-nicas en senales electricas.

Country Status (10)

Country Link
AT (1) AT316894B (xx)
BE (1) BE742331A (xx)
BR (1) BR6914557D0 (xx)
CH (1) CH518006A (xx)
DE (1) DE1959527C3 (xx)
ES (2) ES373779A1 (xx)
FR (1) FR2024961A1 (xx)
GB (1) GB1295650A (xx)
NL (1) NL162254B (xx)
SE (2) SE363700B (xx)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4071838A (en) 1976-02-09 1978-01-31 Diax Corporation Solid state force transducer and method of making same
US4191057A (en) * 1978-06-28 1980-03-04 Gould Inc. Inversion layer sprain gauge
DE2841312C2 (de) * 1978-09-22 1985-06-05 Robert Bosch Gmbh, 7000 Stuttgart Monolithischer Halbleiter-Drucksensor und Verfahren zu dessen Herstellung
JPS5550668A (en) * 1978-10-06 1980-04-12 Hitachi Ltd Semiconductor pressure converter
IT1212404B (it) * 1979-02-22 1989-11-22 Rca Corp Metodo comportante un singolo attacco per la formazione di un mesa presentante una parete a piu'gradini.
ATE80942T1 (de) * 1988-04-21 1992-10-15 Marelli Autronica Elektrischer kraft- und/oder verformungsmessfuehler, insbesondere zum gebrauch als druckmessfuehler.
US4904978A (en) * 1988-04-29 1990-02-27 Solartron Electronics, Inc. Mechanical sensor for high temperature environments
JP2719448B2 (ja) * 1991-01-24 1998-02-25 三菱電機株式会社 半導体圧力検出装置
DE212005000047U1 (de) * 2004-08-20 2007-08-02 Semitool, Inc., Kalispell System zum Dünnen eines Halbleiter-Werkstücks
CN113555346B (zh) * 2020-08-21 2023-05-23 友达光电股份有限公司 电路基板以及电路基板的应变量的测量方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3270554A (en) * 1961-01-04 1966-09-06 Bell Telephone Labor Inc Diffused layer transducers
US3277698A (en) * 1963-11-15 1966-10-11 Bell Telephone Labor Inc Stress sensing semiconductive devices
NL153947B (nl) * 1967-02-25 1977-07-15 Philips Nv Werkwijze voor het vervaardigen van halfgeleiderinrichtingen, waarbij een selectief elektrolytisch etsproces wordt toegepast en halfgeleiderinrichting verkregen met toepassing van de werkwijze.
BE711537A (xx) * 1968-03-01 1968-09-02

Also Published As

Publication number Publication date
ES400839A1 (es) 1975-02-01
FR2024961A1 (xx) 1970-09-04
BR6914557D0 (pt) 1973-01-02
NL6817089A (xx) 1970-06-02
GB1295650A (xx) 1972-11-08
AT316894B (de) 1974-07-25
DE1959527B2 (de) 1981-03-19
NL162254B (nl) 1979-11-15
SE363700B (xx) 1974-01-28
DE1959527C3 (de) 1981-12-10
SE384437B (sv) 1976-05-03
BE742331A (xx) 1970-05-27
CH518006A (de) 1972-01-15
DE1959527A1 (de) 1970-06-11

Similar Documents

Publication Publication Date Title
NL163058C (nl) Werkwijze ter vervaardiging van een halfgeleider- inrichting, waarbij een metaallaag, die ten minste gedeeltelijk in aanraking is met een halfgeleider- lichaam wordt gebombardeerd met ionen.
CH555597A (de) Verfahren zum stabilisieren von halbleitervorrichtungen mit oxyd- und nitridschichten.
DK135328B (da) Fremgangsmåde til fremstilling af en elektrode til brug ved elektrolyse.
ES302213A1 (es) El metodo de atacar localmente una pieza delgada de material semiconductor en matrices en forma de tronco de cono.
NL154560B (nl) Werkwijze voor het reinigen van het oppervlak van een op een halfgeleider aangebrachte metaallaag door kathodeverstuiving, alsmede met deze werkwijze vervaardigde halfgeleiderinrichting.
ES321208A1 (es) Un metodo de producir un dispositivo semiconductor.
NL163370C (nl) Werkwijze voor het vervaardigen van een halfgeleider- inrichting met een geleiderpatroon.
NL173907C (nl) Grondplaat met geleiderpatroon en werkwijze voor het vervaardigen daarvan.
ES373779A1 (es) Un metodo de fabricar dispositivos semiconductores.
BR7102038D0 (pt) Processo de contato de solidos fluidificados em estagios
NL147789B (nl) Werkwijze voor het afzetten van een isolerende laag door verstuiven van materiaal uit een di-elektrische trefplaat, alsmede voorwerp, voorzien van een isolatielaag, verkregen volgens deze werkwijze.
ES374091A1 (es) Metodo para la fabricacion de un dispositivo semiconductor de barrera de potencial.
CH502122A (de) Einrichtung zum Bearbeiten von kontinuierlich durch Prozess-Atmosphären transportiertem Material
DK120351B (da) Fremgangsmåde til fremstilling af et kornlag til anvendelse i et halvlederelektrodesystem.
CS192452B2 (en) Method of performing the chemical,physical and physical-chemical processes and device for performing the same
ES334684A1 (es) Metodo de fabricacion de dispositivos semiconductores del tipo de contactos-soporte.
EG11032A (en) Method for protecting electrically conductive raw material elements,immersed in fluride melts bathe under d.c.
AT324013B (de) Elektrische kontaktanordnung für eine vorrichtung zur elektrolytischen abscheidung von metallen in platten- oder bandform, insbesondere kupfer
NL184430C (nl) Werkwijze voor het behandelen van een isolerend substraat, ten einde dit geschikt te maken voor het stroomloos daarop afzetten van een metaalpatroon.
BE767500A (fr) Composant electrique, et procede permettant sa fabrication
FR96081E (fr) Procédé de récupération du cuivre.
NL142758B (nl) Cilinderslot met elektrisch alarmcontact.
DK122136B (da) Fremgangsmåde ved katalytisk udfældning af metallag på et ledende eller ikke-ledende underlag.
ES365378A1 (es) Procedimiento para elaborar un elemento sensible a la ra- diacion electromagnetica.
ES330277A1 (es) Un metodo para depositar sobre superficies no metalicas una capa a base de paladio.

Legal Events

Date Code Title Description
FD1A Patent lapsed

Effective date: 19900409