ES2687656T3 - Sensor de temperatura de área grande - Google Patents
Sensor de temperatura de área grande Download PDFInfo
- Publication number
- ES2687656T3 ES2687656T3 ES13743386.8T ES13743386T ES2687656T3 ES 2687656 T3 ES2687656 T3 ES 2687656T3 ES 13743386 T ES13743386 T ES 13743386T ES 2687656 T3 ES2687656 T3 ES 2687656T3
- Authority
- ES
- Spain
- Prior art keywords
- network
- electrically conductive
- detection device
- contacts
- node
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- AMWRITDGCCNYAT-UHFFFAOYSA-L hydroxy(oxo)manganese;manganese Chemical compound [Mn].O[Mn]=O.O[Mn]=O AMWRITDGCCNYAT-UHFFFAOYSA-L 0.000 description 2
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
- G01K7/22—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor
- G01K7/24—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor in a specially-adapted circuit, e.g. bridge circuit
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K3/00—Thermometers giving results other than momentary value of temperature
- G01K3/02—Thermometers giving results other than momentary value of temperature giving means values; giving integrated values
- G01K3/06—Thermometers giving results other than momentary value of temperature giving means values; giving integrated values in respect of space
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/16—Resistor networks not otherwise provided for
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C13/00—Resistors not provided for elsewhere
- H01C13/02—Structural combinations of resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/008—Thermistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/04—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K2213/00—Temperature mapping
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Ceramic Engineering (AREA)
- Thermistors And Varistors (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| ZA201200771 | 2012-01-30 | ||
| ZA201200771 | 2012-01-30 | ||
| PCT/IB2013/050784 WO2013114293A1 (en) | 2012-01-30 | 2013-01-30 | Large area temperature sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ES2687656T3 true ES2687656T3 (es) | 2018-10-26 |
Family
ID=48904489
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ES13743386.8T Active ES2687656T3 (es) | 2012-01-30 | 2013-01-30 | Sensor de temperatura de área grande |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20150023393A1 (enExample) |
| EP (1) | EP2810033B1 (enExample) |
| JP (1) | JP6258221B2 (enExample) |
| KR (1) | KR20140119795A (enExample) |
| CN (1) | CN104204751B (enExample) |
| ES (1) | ES2687656T3 (enExample) |
| WO (1) | WO2013114293A1 (enExample) |
| ZA (1) | ZA201406075B (enExample) |
Families Citing this family (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI475202B (zh) * | 2013-08-06 | 2015-03-01 | Nat Univ Tsing Hua | 檢測微區域應力之方法與系統 |
| SG11201700395XA (en) | 2014-07-22 | 2017-02-27 | Brewer Science Inc | Thin-film resistive-based sensor |
| JP6504345B2 (ja) * | 2015-02-04 | 2019-04-24 | セイコーエプソン株式会社 | Ｄ／ａ変換回路、発振器、電子機器及び移動体 |
| FR3034256B1 (fr) * | 2015-03-24 | 2017-04-14 | Commissariat Energie Atomique | Dispositif piezoelectrique |
| FR3034248B1 (fr) * | 2015-03-27 | 2017-04-14 | Commissariat Energie Atomique | Dispositif a resistance thermosensible |
| US10034609B2 (en) * | 2015-11-05 | 2018-07-31 | Nano And Advanced Materials Institute Limited | Temperature sensor for tracking body temperature based on printable nanomaterial thermistor |
| WO2017086537A1 (ko) * | 2015-11-17 | 2017-05-26 | 경희대학교산학협력단 | 센서 어레이를 이용한 생체 정보 측정 장치 및 방법 |
| CN105628242A (zh) * | 2015-12-30 | 2016-06-01 | 中国科学院国家天文台南京天文光学技术研究所 | 检测物体表面温度分布和梯度的方法和设备 |
| CN107238446A (zh) * | 2016-03-28 | 2017-10-10 | 新材料与产业技术北京研究院 | 温度检测元件及温度检测器 |
| CN106017714B (zh) * | 2016-06-23 | 2019-10-11 | 南开大学 | 一种准分布式地层温度精细测量系统 |
| US10295489B2 (en) | 2016-09-12 | 2019-05-21 | Ecolab Usa Inc. | Deposit monitor |
| KR101831066B1 (ko) * | 2016-10-06 | 2018-02-22 | 경희대학교 산학협력단 | 센서 어레이를 이용한 온도 모니터링 박스 및 그 방법 |
| US10816285B2 (en) | 2017-02-24 | 2020-10-27 | Ecolab Usa Inc. | Thermoelectric deposit monitor |
| US10794220B2 (en) * | 2017-05-08 | 2020-10-06 | Raytheon Technologies Corporation | Temperature sensor array for a gas turbine engine |
| CN107300426B (zh) * | 2017-06-23 | 2019-06-25 | 北京金风科创风电设备有限公司 | 温度检测系统和温度检测方法 |
| US10663355B2 (en) * | 2017-06-30 | 2020-05-26 | Texas Instruments Incorporated | Thermistor with tunable resistance |
| US11300458B2 (en) | 2017-09-05 | 2022-04-12 | Littelfuse, Inc. | Temperature sensing tape, assembly, and method of temperature control |
| US11231331B2 (en) | 2017-09-05 | 2022-01-25 | Littelfuse, Inc. | Temperature sensing tape |
| US11953458B2 (en) | 2019-03-14 | 2024-04-09 | Ecolab Usa Inc. | Systems and methods utilizing sensor surface functionalization |
| CN109974873B (zh) * | 2019-04-03 | 2020-06-02 | 清华大学 | 一种移动平均的温度监测方法 |
| JP7519043B2 (ja) * | 2020-06-12 | 2024-07-19 | Ｔｉａｎｍａ Ｊａｐａｎ株式会社 | 熱電変換素子及び熱電変換モジュール |
| WO2022040492A1 (en) * | 2020-08-21 | 2022-02-24 | Board Of Regents, The University Of Texas System | Two-dimensional resistance temperature detectors and related methods for determining average temperature over a surface |
| CN114242916A (zh) * | 2021-12-17 | 2022-03-25 | 固安翌光科技有限公司 | 有机电致发光器件及其制备方法、发光屏体和电子设备 |
| CN115717945A (zh) * | 2022-11-14 | 2023-02-28 | 北京航空航天大学 | 一种基于mems工艺的微尺度二维阵列式集成测温方法 |
| CN120403796B (zh) * | 2025-07-04 | 2025-10-21 | 上海芯龙半导体技术股份有限公司 | 进风量监测系统 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4363556A (en) * | 1980-01-14 | 1982-12-14 | Walter Kidde & Co. | Continuous strip cold detector |
| DE4022845A1 (de) * | 1990-07-18 | 1992-01-23 | Schott Glaswerke | Temperatursensor oder -sensoranordnung aus glaskeramik und kontaktierenden filmwiderstaenden |
| US5793276A (en) * | 1995-07-25 | 1998-08-11 | Tdk Corporation | Organic PTC thermistor |
| JPH09326303A (ja) * | 1996-06-03 | 1997-12-16 | Soshin Denki Kk | チップ部品 |
| JPH10260086A (ja) * | 1997-03-14 | 1998-09-29 | Toyo Electric Mfg Co Ltd | 温度検出器付き電気機器 |
| JPH10318852A (ja) * | 1997-05-20 | 1998-12-04 | Mikuni Corp | ヒューズ機能付き過熱検知用温度センサ |
| US6137669A (en) * | 1998-10-28 | 2000-10-24 | Chiang; Justin N. | Sensor |
| US6592254B2 (en) * | 2001-06-26 | 2003-07-15 | Mamac Systems, Inc. | Multiple point averaging duct temperature sensor |
| DE10222616A1 (de) * | 2002-05-17 | 2003-12-04 | Univ Albert Ludwigs Freiburg | Fingerabdruck-Verifikationsmodul |
| JP4230799B2 (ja) * | 2003-03-20 | 2009-02-25 | 株式会社小松製作所 | 平均温度測定センサならびにこれを用いたダミーウェハ及び温調装置 |
| EP1618573A2 (en) * | 2003-04-25 | 2006-01-25 | Key Safety Systems, Inc. | Thick film thermistor |
| DE102006033710B4 (de) * | 2006-07-20 | 2013-04-11 | Epcos Ag | Verfahren zur Herstellung einer Widerstandsanordnung |
| US7563024B2 (en) * | 2006-09-28 | 2009-07-21 | Intel Corporation | Method and apparatus for measurement of electronics device skin temperature |
| JP5092873B2 (ja) * | 2008-04-23 | 2012-12-05 | 株式会社村田製作所 | 面状温度検出センサ |
| CN102322974B (zh) * | 2011-06-03 | 2013-01-30 | 东南大学 | 一种阵列式温度触觉传感装置 |
| US8828570B2 (en) * | 2011-06-29 | 2014-09-09 | Hewlett-Packard Development Company, L.P. | Battery temperature sensor |
-
2013
- 2013-01-30 CN CN201380014964.5A patent/CN104204751B/zh not_active Expired - Fee Related
- 2013-01-30 ES ES13743386.8T patent/ES2687656T3/es active Active
- 2013-01-30 US US14/375,467 patent/US20150023393A1/en not_active Abandoned
- 2013-01-30 KR KR1020147024371A patent/KR20140119795A/ko not_active Ceased
- 2013-01-30 JP JP2014553854A patent/JP6258221B2/ja not_active Expired - Fee Related
- 2013-01-30 EP EP13743386.8A patent/EP2810033B1/en not_active Not-in-force
- 2013-01-30 WO PCT/IB2013/050784 patent/WO2013114293A1/en not_active Ceased
-
2014
- 2014-08-19 ZA ZA2014/06075A patent/ZA201406075B/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2013114293A1 (en) | 2013-08-08 |
| EP2810033A1 (en) | 2014-12-10 |
| EP2810033B1 (en) | 2018-06-20 |
| KR20140119795A (ko) | 2014-10-10 |
| US20150023393A1 (en) | 2015-01-22 |
| CN104204751A (zh) | 2014-12-10 |
| CN104204751B (zh) | 2018-05-01 |
| JP6258221B2 (ja) | 2018-01-10 |
| JP2015506479A (ja) | 2015-03-02 |
| ZA201406075B (en) | 2015-11-25 |
| EP2810033A4 (en) | 2015-09-30 |
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