JP6258221B2 - 広域温度センサ - Google Patents

広域温度センサ Download PDF

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Publication number
JP6258221B2
JP6258221B2 JP2014553854A JP2014553854A JP6258221B2 JP 6258221 B2 JP6258221 B2 JP 6258221B2 JP 2014553854 A JP2014553854 A JP 2014553854A JP 2014553854 A JP2014553854 A JP 2014553854A JP 6258221 B2 JP6258221 B2 JP 6258221B2
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JP
Japan
Prior art keywords
temperature
metal contacts
continuous layer
network
array
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Expired - Fee Related
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JP2014553854A
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English (en)
Japanese (ja)
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JP2015506479A5 (enExample
JP2015506479A (ja
Inventor
デイビッド・トーマス・ブリットン
マルギット・ハルティング
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PST Sensors Pty Ltd
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PST Sensors Pty Ltd
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Publication date
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Publication of JP2015506479A5 publication Critical patent/JP2015506479A5/ja
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
    • G01K7/22—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor
    • G01K7/24—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor in a specially-adapted circuit, e.g. bridge circuit
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K3/00—Thermometers giving results other than momentary value of temperature
    • G01K3/02—Thermometers giving results other than momentary value of temperature giving means values; giving integrated values
    • G01K3/06—Thermometers giving results other than momentary value of temperature giving means values; giving integrated values in respect of space
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/16—Resistor networks not otherwise provided for
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C13/00—Resistors not provided for elsewhere
    • H01C13/02—Structural combinations of resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/008—Thermistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/04—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K2213/00—Temperature mapping

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Ceramic Engineering (AREA)
  • Thermistors And Varistors (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
JP2014553854A 2012-01-30 2013-01-30 広域温度センサ Expired - Fee Related JP6258221B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
ZA201200771 2012-01-30
ZA2012/00771 2012-01-30
PCT/IB2013/050784 WO2013114293A1 (en) 2012-01-30 2013-01-30 Large area temperature sensor

Publications (3)

Publication Number Publication Date
JP2015506479A JP2015506479A (ja) 2015-03-02
JP2015506479A5 JP2015506479A5 (enExample) 2015-09-03
JP6258221B2 true JP6258221B2 (ja) 2018-01-10

Family

ID=48904489

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014553854A Expired - Fee Related JP6258221B2 (ja) 2012-01-30 2013-01-30 広域温度センサ

Country Status (8)

Country Link
US (1) US20150023393A1 (enExample)
EP (1) EP2810033B1 (enExample)
JP (1) JP6258221B2 (enExample)
KR (1) KR20140119795A (enExample)
CN (1) CN104204751B (enExample)
ES (1) ES2687656T3 (enExample)
WO (1) WO2013114293A1 (enExample)
ZA (1) ZA201406075B (enExample)

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TWI475202B (zh) * 2013-08-06 2015-03-01 Nat Univ Tsing Hua 檢測微區域應力之方法與系統
SG11201700395XA (en) 2014-07-22 2017-02-27 Brewer Science Inc Thin-film resistive-based sensor
JP6504345B2 (ja) * 2015-02-04 2019-04-24 セイコーエプソン株式会社 Ｄ／ａ変換回路、発振器、電子機器及び移動体
FR3034256B1 (fr) * 2015-03-24 2017-04-14 Commissariat Energie Atomique Dispositif piezoelectrique
FR3034248B1 (fr) * 2015-03-27 2017-04-14 Commissariat Energie Atomique Dispositif a resistance thermosensible
US10034609B2 (en) * 2015-11-05 2018-07-31 Nano And Advanced Materials Institute Limited Temperature sensor for tracking body temperature based on printable nanomaterial thermistor
WO2017086537A1 (ko) * 2015-11-17 2017-05-26 경희대학교산학협력단 센서 어레이를 이용한 생체 정보 측정 장치 및 방법
CN105628242A (zh) * 2015-12-30 2016-06-01 中国科学院国家天文台南京天文光学技术研究所 检测物体表面温度分布和梯度的方法和设备
CN107238446A (zh) * 2016-03-28 2017-10-10 新材料与产业技术北京研究院 温度检测元件及温度检测器
CN106017714B (zh) * 2016-06-23 2019-10-11 南开大学 一种准分布式地层温度精细测量系统
US10295489B2 (en) 2016-09-12 2019-05-21 Ecolab Usa Inc. Deposit monitor
KR101831066B1 (ko) * 2016-10-06 2018-02-22 경희대학교 산학협력단 센서 어레이를 이용한 온도 모니터링 박스 및 그 방법
US10816285B2 (en) 2017-02-24 2020-10-27 Ecolab Usa Inc. Thermoelectric deposit monitor
US10794220B2 (en) * 2017-05-08 2020-10-06 Raytheon Technologies Corporation Temperature sensor array for a gas turbine engine
CN107300426B (zh) * 2017-06-23 2019-06-25 北京金风科创风电设备有限公司 温度检测系统和温度检测方法
US10663355B2 (en) * 2017-06-30 2020-05-26 Texas Instruments Incorporated Thermistor with tunable resistance
US11300458B2 (en) 2017-09-05 2022-04-12 Littelfuse, Inc. Temperature sensing tape, assembly, and method of temperature control
US11231331B2 (en) 2017-09-05 2022-01-25 Littelfuse, Inc. Temperature sensing tape
US11953458B2 (en) 2019-03-14 2024-04-09 Ecolab Usa Inc. Systems and methods utilizing sensor surface functionalization
CN109974873B (zh) * 2019-04-03 2020-06-02 清华大学 一种移动平均的温度监测方法
JP7519043B2 (ja) * 2020-06-12 2024-07-19 Ｔｉａｎｍａ Ｊａｐａｎ株式会社 熱電変換素子及び熱電変換モジュール
WO2022040492A1 (en) * 2020-08-21 2022-02-24 Board Of Regents, The University Of Texas System Two-dimensional resistance temperature detectors and related methods for determining average temperature over a surface
CN114242916A (zh) * 2021-12-17 2022-03-25 固安翌光科技有限公司 有机电致发光器件及其制备方法、发光屏体和电子设备
CN115717945A (zh) * 2022-11-14 2023-02-28 北京航空航天大学 一种基于mems工艺的微尺度二维阵列式集成测温方法
CN120403796B (zh) * 2025-07-04 2025-10-21 上海芯龙半导体技术股份有限公司 进风量监测系统

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Also Published As

Publication number Publication date
WO2013114293A1 (en) 2013-08-08
EP2810033A1 (en) 2014-12-10
EP2810033B1 (en) 2018-06-20
ES2687656T3 (es) 2018-10-26
KR20140119795A (ko) 2014-10-10
US20150023393A1 (en) 2015-01-22
CN104204751A (zh) 2014-12-10
CN104204751B (zh) 2018-05-01
JP2015506479A (ja) 2015-03-02
ZA201406075B (en) 2015-11-25
EP2810033A4 (en) 2015-09-30

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