JP2015506479A - 広域温度センサ - Google Patents
広域温度センサ Download PDFInfo
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- JP2015506479A JP2015506479A JP2014553854A JP2014553854A JP2015506479A JP 2015506479 A JP2015506479 A JP 2015506479A JP 2014553854 A JP2014553854 A JP 2014553854A JP 2014553854 A JP2014553854 A JP 2014553854A JP 2015506479 A JP2015506479 A JP 2015506479A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
- G01K7/22—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor
- G01K7/24—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor in a specially-adapted circuit, e.g. bridge circuit
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K3/00—Thermometers giving results other than momentary value of temperature
- G01K3/02—Thermometers giving results other than momentary value of temperature giving means values; giving integrated values
- G01K3/06—Thermometers giving results other than momentary value of temperature giving means values; giving integrated values in respect of space
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/16—Resistor networks not otherwise provided for
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C13/00—Resistors not provided for elsewhere
- H01C13/02—Structural combinations of resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/008—Thermistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/04—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K2213/00—Temperature mapping
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Ceramic Engineering (AREA)
- Thermistors And Varistors (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
Abstract
Description
Claims (16)
- 互いに直列及び並列に接続された複数の温度依存抵抗器を含み、正方形の抵抗ネットワークとトポロジー的に等しいネットワークを形成する検出デバイスであって、
前記検出デバイスは、平均抵抗値を測定可能な端子を有し、
前記複数の抵抗器は、前記平均抵抗値を実質的に変更することなく初期のサイズから小型化することが可能な基板上に支持される検出デバイス。 - 前記ネットワークは、実質的に同一の温度依存抵抗器の正方形ネットワークである、請求項1に記載の検出デバイス。
- 前記ネットワークは、実質的に同一の温度依存抵抗器の六角形ネットワークである、請求項1に記載の検出デバイス。
- 前記ネットワークの隣接するノード間の抵抗の温度依存性は、個々の抵抗器の温度依存性と同じであり、前記デバイスの領域上に温度勾配があるとき、前記測定された抵抗が、抵抗器の前記ネットワークによって覆われた領域の温度の空間平均に対応する、請求項1に記載の検出デバイス。
- 前記温度依存抵抗器は、負温度係数サーミスタである、請求項1に記載の検出デバイス。
- 導電性コンタクトの規則的パターンを備えると共に、前記コンタクトと接触する、温度依存抵抗を有する材料の相補的パターンを有し、それによって前記規則的パターンに対応するサーミスタ素子のネットワークを定義する、請求項1に記載の検出デバイス。
- 基板上に堆積された導電性接続トラックによって接続された導電性コンタクトのペアのネットワークを備え、温度依存抵抗を有する前記材料は、前記デバイスの前記サーミスタ素子を定義するために前記コンタクトのペア上に選択的に堆積される、請求項6に記載の検出デバイス。
- 温度依存抵抗を有する前記材料は、前記基板上に堆積され、導電性接続トラックによって接続される導電性コンタクトのペアのネットワークがその上に堆積される、請求項6に記載の検出デバイス。
- 前記基板は、フレキシブルシート材料を備える、請求項7または8に記載の検出デバイス。
- 前記基板は、紙シート、ポリマーフィルム、ファブリック、又は絶縁金属箔である、請求項9に記載の検出デバイス。
- 前記基板は、硬質材料を備える、請求項7または8に記載の検出デバイス。
- 前記硬質材料は、硬いプラスチックシート材料、板紙、複合材料又はコーティングされた金属板である、請求項11に記載の検出デバイス。
- 前記導電性コンタクト及びトラックと、温度依存抵抗を有する材料の相補的パターンとは、導電性インク又はペーストのスクリーン印刷によって形成される、請求項6〜12のいずれか一項に記載の検出デバイス。
- コンタクトの前記セット間を延びる導電性トラックによって接続された導電性コンタクトのセットのネットワークを備え、前記コンタクトのセットと前記導電性トラックとは、基板上に堆積され、温度依存抵抗を有する材料の層は、相互接続されたサーミスタのネットワークを定義するためにコンタクトのセットのそれぞれに適用される、請求項1に記載の検出デバイス。
- コンタクトのセットのそれぞれは、互いに隣接して延び、互いに入り込むフィンガーの2つのセットを備え、一方のフィンガーセットのフィンガーは、ネットワークの第1のノードに接続され、他方のフィンガーセットのフィンガーは、前記ネットワークの隣接する第2のノードに接続される、請求項14に記載の検出デバイス。
- 基板上に堆積された個別の導電性コンタクトのアレイを備え、温度依存抵抗を有する材料の層は、相互接続されたサーミスタのネットワークを定義するために前記コンタクトの上に適用される、請求項1に記載の検出デバイス。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ZA201200771 | 2012-01-30 | ||
ZA2012/00771 | 2012-01-30 | ||
PCT/IB2013/050784 WO2013114293A1 (en) | 2012-01-30 | 2013-01-30 | Large area temperature sensor |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2015506479A true JP2015506479A (ja) | 2015-03-02 |
JP2015506479A5 JP2015506479A5 (ja) | 2015-09-03 |
JP6258221B2 JP6258221B2 (ja) | 2018-01-10 |
Family
ID=48904489
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014553854A Expired - Fee Related JP6258221B2 (ja) | 2012-01-30 | 2013-01-30 | 広域温度センサ |
Country Status (8)
Country | Link |
---|---|
US (1) | US20150023393A1 (ja) |
EP (1) | EP2810033B1 (ja) |
JP (1) | JP6258221B2 (ja) |
KR (1) | KR20140119795A (ja) |
CN (1) | CN104204751B (ja) |
ES (1) | ES2687656T3 (ja) |
WO (1) | WO2013114293A1 (ja) |
ZA (1) | ZA201406075B (ja) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI475202B (zh) * | 2013-08-06 | 2015-03-01 | Nat Univ Tsing Hua | 檢測微區域應力之方法與系統 |
KR20170033865A (ko) | 2014-07-22 | 2017-03-27 | 브레우어 사이언스 인코포레이션 | 박막형 저항방식 센서 |
JP6504345B2 (ja) * | 2015-02-04 | 2019-04-24 | セイコーエプソン株式会社 | D/a変換回路、発振器、電子機器及び移動体 |
FR3034256B1 (fr) * | 2015-03-24 | 2017-04-14 | Commissariat Energie Atomique | Dispositif piezoelectrique |
FR3034248B1 (fr) * | 2015-03-27 | 2017-04-14 | Commissariat Energie Atomique | Dispositif a resistance thermosensible |
US10034609B2 (en) * | 2015-11-05 | 2018-07-31 | Nano And Advanced Materials Institute Limited | Temperature sensor for tracking body temperature based on printable nanomaterial thermistor |
CN108770336B (zh) | 2015-11-17 | 2021-08-24 | 庆熙大学校产学协力团 | 利用传感器阵列的生物信息测定装置及方法 |
CN105628242A (zh) * | 2015-12-30 | 2016-06-01 | 中国科学院国家天文台南京天文光学技术研究所 | 检测物体表面温度分布和梯度的方法和设备 |
CN107238446A (zh) * | 2016-03-28 | 2017-10-10 | 新材料与产业技术北京研究院 | 温度检测元件及温度检测器 |
CN106017714B (zh) * | 2016-06-23 | 2019-10-11 | 南开大学 | 一种准分布式地层温度精细测量系统 |
US10295489B2 (en) | 2016-09-12 | 2019-05-21 | Ecolab Usa Inc. | Deposit monitor |
KR101831066B1 (ko) * | 2016-10-06 | 2018-02-22 | 경희대학교 산학협력단 | 센서 어레이를 이용한 온도 모니터링 박스 및 그 방법 |
US10816285B2 (en) | 2017-02-24 | 2020-10-27 | Ecolab Usa Inc. | Thermoelectric deposit monitor |
US10794220B2 (en) * | 2017-05-08 | 2020-10-06 | Raytheon Technologies Corporation | Temperature sensor array for a gas turbine engine |
CN107300426B (zh) * | 2017-06-23 | 2019-06-25 | 北京金风科创风电设备有限公司 | 温度检测系统和温度检测方法 |
US10663355B2 (en) * | 2017-06-30 | 2020-05-26 | Texas Instruments Incorporated | Thermistor with tunable resistance |
US11300458B2 (en) | 2017-09-05 | 2022-04-12 | Littelfuse, Inc. | Temperature sensing tape, assembly, and method of temperature control |
TW201930837A (zh) * | 2017-09-05 | 2019-08-01 | 美商力特福斯股份有限公司 | 溫度感應膠帶 |
US11953458B2 (en) | 2019-03-14 | 2024-04-09 | Ecolab Usa Inc. | Systems and methods utilizing sensor surface functionalization |
CN109974873B (zh) * | 2019-04-03 | 2020-06-02 | 清华大学 | 一种移动平均的温度监测方法 |
JP2021197433A (ja) * | 2020-06-12 | 2021-12-27 | Tianma Japan株式会社 | 熱電変換素子及び熱電変換モジュール |
CN114242916A (zh) * | 2021-12-17 | 2022-03-25 | 固安翌光科技有限公司 | 有机电致发光器件及其制备方法、发光屏体和电子设备 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10260086A (ja) * | 1997-03-14 | 1998-09-29 | Toyo Electric Mfg Co Ltd | 温度検出器付き電気機器 |
JPH10318852A (ja) * | 1997-05-20 | 1998-12-04 | Mikuni Corp | ヒューズ機能付き過熱検知用温度センサ |
JP2004286593A (ja) * | 2003-03-20 | 2004-10-14 | Komatsu Ltd | 平均温度測定センサならびにこれを用いたダミーウェハ及び温調装置 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4363556A (en) * | 1980-01-14 | 1982-12-14 | Walter Kidde & Co. | Continuous strip cold detector |
DE4022845A1 (de) * | 1990-07-18 | 1992-01-23 | Schott Glaswerke | Temperatursensor oder -sensoranordnung aus glaskeramik und kontaktierenden filmwiderstaenden |
US5793276A (en) * | 1995-07-25 | 1998-08-11 | Tdk Corporation | Organic PTC thermistor |
JPH09326303A (ja) * | 1996-06-03 | 1997-12-16 | Soshin Denki Kk | チップ部品 |
US6137669A (en) * | 1998-10-28 | 2000-10-24 | Chiang; Justin N. | Sensor |
US6592254B2 (en) | 2001-06-26 | 2003-07-15 | Mamac Systems, Inc. | Multiple point averaging duct temperature sensor |
DE10222616A1 (de) * | 2002-05-17 | 2003-12-04 | Univ Albert Ludwigs Freiburg | Fingerabdruck-Verifikationsmodul |
US20040217844A1 (en) * | 2003-04-25 | 2004-11-04 | Robert Podoloff | Thick film thermistor and method of manufacture |
DE102006033710B4 (de) * | 2006-07-20 | 2013-04-11 | Epcos Ag | Verfahren zur Herstellung einer Widerstandsanordnung |
US7563024B2 (en) * | 2006-09-28 | 2009-07-21 | Intel Corporation | Method and apparatus for measurement of electronics device skin temperature |
JP5092873B2 (ja) * | 2008-04-23 | 2012-12-05 | 株式会社村田製作所 | 面状温度検出センサ |
CN102322974B (zh) * | 2011-06-03 | 2013-01-30 | 东南大学 | 一种阵列式温度触觉传感装置 |
US8828570B2 (en) * | 2011-06-29 | 2014-09-09 | Hewlett-Packard Development Company, L.P. | Battery temperature sensor |
-
2013
- 2013-01-30 US US14/375,467 patent/US20150023393A1/en not_active Abandoned
- 2013-01-30 WO PCT/IB2013/050784 patent/WO2013114293A1/en active Application Filing
- 2013-01-30 KR KR1020147024371A patent/KR20140119795A/ko not_active Application Discontinuation
- 2013-01-30 ES ES13743386.8T patent/ES2687656T3/es active Active
- 2013-01-30 CN CN201380014964.5A patent/CN104204751B/zh not_active Expired - Fee Related
- 2013-01-30 EP EP13743386.8A patent/EP2810033B1/en not_active Not-in-force
- 2013-01-30 JP JP2014553854A patent/JP6258221B2/ja not_active Expired - Fee Related
-
2014
- 2014-08-19 ZA ZA2014/06075A patent/ZA201406075B/en unknown
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10260086A (ja) * | 1997-03-14 | 1998-09-29 | Toyo Electric Mfg Co Ltd | 温度検出器付き電気機器 |
JPH10318852A (ja) * | 1997-05-20 | 1998-12-04 | Mikuni Corp | ヒューズ機能付き過熱検知用温度センサ |
JP2004286593A (ja) * | 2003-03-20 | 2004-10-14 | Komatsu Ltd | 平均温度測定センサならびにこれを用いたダミーウェハ及び温調装置 |
Also Published As
Publication number | Publication date |
---|---|
US20150023393A1 (en) | 2015-01-22 |
ES2687656T3 (es) | 2018-10-26 |
CN104204751A (zh) | 2014-12-10 |
EP2810033B1 (en) | 2018-06-20 |
EP2810033A1 (en) | 2014-12-10 |
EP2810033A4 (en) | 2015-09-30 |
WO2013114293A1 (en) | 2013-08-08 |
JP6258221B2 (ja) | 2018-01-10 |
KR20140119795A (ko) | 2014-10-10 |
ZA201406075B (en) | 2015-11-25 |
CN104204751B (zh) | 2018-05-01 |
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