ES2191398T3 - Metodo para soldar componentes electronicos tipo d-pak a placas de circuito. - Google Patents
Metodo para soldar componentes electronicos tipo d-pak a placas de circuito.Info
- Publication number
- ES2191398T3 ES2191398T3 ES99307378T ES99307378T ES2191398T3 ES 2191398 T3 ES2191398 T3 ES 2191398T3 ES 99307378 T ES99307378 T ES 99307378T ES 99307378 T ES99307378 T ES 99307378T ES 2191398 T3 ES2191398 T3 ES 2191398T3
- Authority
- ES
- Spain
- Prior art keywords
- disseminator
- heat
- mounting pad
- pad
- terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05553—Shape in top view being rectangular
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10166—Transistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10969—Metallic case or integral heatsink of component electrically connected to a pad on PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/0405—Solder foil, tape or wire
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Se describe en este documento un procedimiento para soldar un componente electrónico 10 que tiene un diseminador de calor 14 sobre una superficie de fondo del mismo y al menos un terminal 18 (por ejemplo, un componente del tipo DPAK) a un placa de circuito 30 que tiene una almohadilla de montaje del diseminador de calor 32 y al menos una almohadilla de montaje del terminal 34, comprendiendo los pasos de: (a) depositar la pasta de soldadura 36 en la almohadilla de montaje del diseminador de calor 32 y en cada una de al menos una almohadilla de montaje de terminal 34; (b) poner el componente electrónico 10 en el placa de circuito 30 de forma que el diseminador de calor 14 descanse encima de la almohadilla de montaje del diseminador de calor 32 y cada terminal 18 descanse encima de una almohadilla respectivo al menos una almohadilla de montaje de terminal 34; (c) dirigir la energía de un haz láser 42 desde un diodo láser 40 al diseminador de calor 14 y/o a la almohadilla de montaje del diseminador de calor 32 durante una primera longitud predeterminada de tiempo, calentando la pasta de soldadura 36 en la almohadilla 32; y (d) continuar dirigiendo la energía del haz láser 42 en el diseminador de calor /almohadilla 14/32 durante una segunda longitud de tiempo predeterminada mientras se alimenta simultáneamente la soldadura 50 una cantidad predeterminada de soldadura de hilos de núcleo-flujo dentro del haz de energía láser 42 próximo al diseminador de calor 14, de forma que la soldadura del hilo 50 funda y fluya hacia al menos uno del diseminador de calor 14 y la almohadilla de montaje del diseminador de calor 32.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/172,047 US6168070B1 (en) | 1998-10-14 | 1998-10-14 | Method for soldering DPAK-type electronic components to circuit boards |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2191398T3 true ES2191398T3 (es) | 2003-09-01 |
Family
ID=22626145
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES99307378T Expired - Lifetime ES2191398T3 (es) | 1998-10-14 | 1999-09-17 | Metodo para soldar componentes electronicos tipo d-pak a placas de circuito. |
Country Status (5)
Country | Link |
---|---|
US (1) | US6168070B1 (es) |
EP (1) | EP0998175B1 (es) |
CA (1) | CA2286231A1 (es) |
DE (1) | DE69905229T2 (es) |
ES (1) | ES2191398T3 (es) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6369345B1 (en) * | 2000-08-18 | 2002-04-09 | Motorola, Inc. | Method and apparatus for reflowing solder paste using a light source |
ITBS20010004A1 (it) * | 2001-01-22 | 2002-07-22 | Massimo Grisoni | Sistema di distribuzione statico di corrente in impianti elettrici atensione continua |
US6833526B2 (en) * | 2001-03-28 | 2004-12-21 | Visteon Global Technologies, Inc. | Flex to flex soldering by diode laser |
US6583385B1 (en) * | 2001-12-19 | 2003-06-24 | Visteon Global Technologies, Inc. | Method for soldering surface mount components to a substrate using a laser |
US6680457B2 (en) * | 2002-01-15 | 2004-01-20 | Agilent Technologies, Inc. | Reflowing of solder joints |
US7170151B2 (en) * | 2003-01-16 | 2007-01-30 | Philips Lumileds Lighting Company, Llc | Accurate alignment of an LED assembly |
JP2005064206A (ja) * | 2003-08-11 | 2005-03-10 | Niigata Seimitsu Kk | 半導体部品の半田付け方法および半導体部品の実装構造 |
JP2006156446A (ja) * | 2004-11-25 | 2006-06-15 | Shinka Jitsugyo Kk | 半田付け方法及び装置 |
JP2007118072A (ja) * | 2005-10-31 | 2007-05-17 | Shinka Jitsugyo Kk | 半田付け方法及び装置 |
JP5043764B2 (ja) * | 2008-06-30 | 2012-10-10 | 株式会社ジャパンユニックス | レーザー式はんだ付け方法及び装置 |
US9125301B2 (en) * | 2011-10-18 | 2015-09-01 | Integrated Microwave Corporation | Integral heater assembly and method for carrier or host board of electronic package assembly |
US10631409B2 (en) * | 2016-08-08 | 2020-04-21 | Baker Hughes, A Ge Company, Llc | Electrical assemblies for downhole use |
WO2024012807A1 (de) * | 2022-07-12 | 2024-01-18 | Icu-Tech - Anlagenbau Gmbh | Verfahren zur herstellung eines smd-leistungshalbleiterbauelementmoduls sowie smd-leistungshalbleiterbauelementmodul |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4453662A (en) * | 1982-02-10 | 1984-06-12 | Technical Materials, Inc. | Solder handling |
JPS59150665A (ja) * | 1983-02-03 | 1984-08-28 | Toshiba Corp | はんだ付け方法 |
US4963714A (en) | 1988-10-24 | 1990-10-16 | Raytheon Company | Diode laser soldering system |
JP2718169B2 (ja) * | 1989-04-24 | 1998-02-25 | 松下電器産業株式会社 | 安全保障機能付サージ吸収器 |
US4926022A (en) | 1989-06-20 | 1990-05-15 | Digital Equipment Corporation | Laser reflow soldering process and bonded assembly formed thereby |
US4961125A (en) * | 1989-08-18 | 1990-10-02 | Thermalloy Incorporated | Apparatus and method of attaching an electronic device package and a heat sink to a circuit board |
DE3939812C2 (de) | 1989-12-01 | 1993-11-11 | Deutsche Aerospace | Laserlötsystem für SMD-Elemente |
US5124175A (en) * | 1990-11-15 | 1992-06-23 | Microelectronics And Computer Technology Corporation | Method of patterned metal reflow on interconnect substrates |
US5112635A (en) * | 1990-12-03 | 1992-05-12 | Beltec International | Method of safe high speed slicing/shaving of a food product |
GB9126530D0 (en) * | 1991-12-13 | 1992-02-12 | Spirig Ernest | Soldering device |
US5298715A (en) | 1992-04-27 | 1994-03-29 | International Business Machines Corporation | Lasersonic soldering of fine insulated wires to heat-sensitive substrates |
US5236117A (en) * | 1992-06-22 | 1993-08-17 | Staktek Corporation | Impact solder method and apparatus |
US5604831A (en) * | 1992-11-16 | 1997-02-18 | International Business Machines Corporation | Optical module with fluxless laser reflow soldered joints |
US5495089A (en) | 1993-06-04 | 1996-02-27 | Digital Equipment Corporation | Laser soldering surface mount components of a printed circuit board |
DE4320055A1 (de) * | 1993-06-17 | 1994-12-22 | Ghassem Dipl Ing Azdasht | Belötungsvorrichtung |
US5484979A (en) * | 1993-10-22 | 1996-01-16 | Ford Motor Company | Laser soldering process employing an energy absorptive coating |
US5525777A (en) * | 1994-08-19 | 1996-06-11 | Allen-Bradley Company, Inc. | Apparatus and method for flexible point-to-point soldering |
US5614113A (en) | 1995-05-05 | 1997-03-25 | Texas Instruments Incorporated | Method and apparatus for performing microelectronic bonding using a laser |
US5821494A (en) * | 1996-09-27 | 1998-10-13 | International Business Machines Corporation | Method of electrical connection between head transducer and suspension by solder wire bumping at slider level and laser reflow |
US5917704A (en) * | 1997-10-06 | 1999-06-29 | Ford Motor Company | Laser-solderable electronic component |
US5920462A (en) * | 1998-04-10 | 1999-07-06 | Ford Motor Company | Heat spreader mounting pad configurations for laser soldering |
-
1998
- 1998-10-14 US US09/172,047 patent/US6168070B1/en not_active Expired - Fee Related
-
1999
- 1999-09-17 EP EP99307378A patent/EP0998175B1/en not_active Expired - Lifetime
- 1999-09-17 ES ES99307378T patent/ES2191398T3/es not_active Expired - Lifetime
- 1999-09-17 DE DE69905229T patent/DE69905229T2/de not_active Expired - Fee Related
- 1999-10-13 CA CA002286231A patent/CA2286231A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
CA2286231A1 (en) | 2000-04-14 |
DE69905229T2 (de) | 2003-12-24 |
EP0998175A1 (en) | 2000-05-03 |
US6168070B1 (en) | 2001-01-02 |
DE69905229D1 (de) | 2003-03-13 |
EP0998175B1 (en) | 2003-02-05 |
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