ES2191398T3 - Metodo para soldar componentes electronicos tipo d-pak a placas de circuito. - Google Patents

Metodo para soldar componentes electronicos tipo d-pak a placas de circuito.

Info

Publication number
ES2191398T3
ES2191398T3 ES99307378T ES99307378T ES2191398T3 ES 2191398 T3 ES2191398 T3 ES 2191398T3 ES 99307378 T ES99307378 T ES 99307378T ES 99307378 T ES99307378 T ES 99307378T ES 2191398 T3 ES2191398 T3 ES 2191398T3
Authority
ES
Spain
Prior art keywords
disseminator
heat
mounting pad
pad
terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES99307378T
Other languages
English (en)
Inventor
Peter Joseph Sinkunas
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ford Motor Co
Original Assignee
Ford Motor Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ford Motor Co filed Critical Ford Motor Co
Application granted granted Critical
Publication of ES2191398T3 publication Critical patent/ES2191398T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494Heating methods for reflowing of solder
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02Bonding areas; Manufacturing methods related thereto
    • H01L2224/04Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554External layer
    • H01L2224/0555Shape
    • H01L2224/05552Shape in top view
    • H01L2224/05553Shape in top view being rectangular
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484Connecting portions
    • H01L2224/4847Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10166Transistor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954Other details of electrical connections
    • H05K2201/10969Metallic case or integral heatsink of component electrically connected to a pad on PCB
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04Soldering or other types of metallurgic bonding
    • H05K2203/0405Solder foil, tape or wire
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107Using laser light
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

Se describe en este documento un procedimiento para soldar un componente electrónico 10 que tiene un diseminador de calor 14 sobre una superficie de fondo del mismo y al menos un terminal 18 (por ejemplo, un componente del tipo DPAK) a un placa de circuito 30 que tiene una almohadilla de montaje del diseminador de calor 32 y al menos una almohadilla de montaje del terminal 34, comprendiendo los pasos de: (a) depositar la pasta de soldadura 36 en la almohadilla de montaje del diseminador de calor 32 y en cada una de al menos una almohadilla de montaje de terminal 34; (b) poner el componente electrónico 10 en el placa de circuito 30 de forma que el diseminador de calor 14 descanse encima de la almohadilla de montaje del diseminador de calor 32 y cada terminal 18 descanse encima de una almohadilla respectivo al menos una almohadilla de montaje de terminal 34; (c) dirigir la energía de un haz láser 42 desde un diodo láser 40 al diseminador de calor 14 y/o a la almohadilla de montaje del diseminador de calor 32 durante una primera longitud predeterminada de tiempo, calentando la pasta de soldadura 36 en la almohadilla 32; y (d) continuar dirigiendo la energía del haz láser 42 en el diseminador de calor /almohadilla 14/32 durante una segunda longitud de tiempo predeterminada mientras se alimenta simultáneamente la soldadura 50 una cantidad predeterminada de soldadura de hilos de núcleo-flujo dentro del haz de energía láser 42 próximo al diseminador de calor 14, de forma que la soldadura del hilo 50 funda y fluya hacia al menos uno del diseminador de calor 14 y la almohadilla de montaje del diseminador de calor 32.
ES99307378T 1998-10-14 1999-09-17 Metodo para soldar componentes electronicos tipo d-pak a placas de circuito. Expired - Lifetime ES2191398T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/172,047 US6168070B1 (en) 1998-10-14 1998-10-14 Method for soldering DPAK-type electronic components to circuit boards

Publications (1)

Publication Number Publication Date
ES2191398T3 true ES2191398T3 (es) 2003-09-01

Family

ID=22626145

Family Applications (1)

Application Number Title Priority Date Filing Date
ES99307378T Expired - Lifetime ES2191398T3 (es) 1998-10-14 1999-09-17 Metodo para soldar componentes electronicos tipo d-pak a placas de circuito.

Country Status (5)

Country Link
US (1) US6168070B1 (es)
EP (1) EP0998175B1 (es)
CA (1) CA2286231A1 (es)
DE (1) DE69905229T2 (es)
ES (1) ES2191398T3 (es)

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US6369345B1 (en) * 2000-08-18 2002-04-09 Motorola, Inc. Method and apparatus for reflowing solder paste using a light source
ITBS20010004A1 (it) * 2001-01-22 2002-07-22 Massimo Grisoni Sistema di distribuzione statico di corrente in impianti elettrici atensione continua
US6833526B2 (en) * 2001-03-28 2004-12-21 Visteon Global Technologies, Inc. Flex to flex soldering by diode laser
US6583385B1 (en) * 2001-12-19 2003-06-24 Visteon Global Technologies, Inc. Method for soldering surface mount components to a substrate using a laser
US6680457B2 (en) * 2002-01-15 2004-01-20 Agilent Technologies, Inc. Reflowing of solder joints
US7170151B2 (en) * 2003-01-16 2007-01-30 Philips Lumileds Lighting Company, Llc Accurate alignment of an LED assembly
JP2005064206A (ja) * 2003-08-11 2005-03-10 Niigata Seimitsu Kk 半導体部品の半田付け方法および半導体部品の実装構造
JP2006156446A (ja) * 2004-11-25 2006-06-15 Shinka Jitsugyo Kk 半田付け方法及び装置
JP2007118072A (ja) * 2005-10-31 2007-05-17 Shinka Jitsugyo Kk 半田付け方法及び装置
JP5043764B2 (ja) * 2008-06-30 2012-10-10 株式会社ジャパンユニックス レーザー式はんだ付け方法及び装置
US9125301B2 (en) * 2011-10-18 2015-09-01 Integrated Microwave Corporation Integral heater assembly and method for carrier or host board of electronic package assembly
US10631409B2 (en) * 2016-08-08 2020-04-21 Baker Hughes, A Ge Company, Llc Electrical assemblies for downhole use
WO2024012807A1 (de) * 2022-07-12 2024-01-18 Icu-Tech - Anlagenbau Gmbh Verfahren zur herstellung eines smd-leistungshalbleiterbauelementmoduls sowie smd-leistungshalbleiterbauelementmodul

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JPS59150665A (ja) * 1983-02-03 1984-08-28 Toshiba Corp はんだ付け方法
US4963714A (en) 1988-10-24 1990-10-16 Raytheon Company Diode laser soldering system
JP2718169B2 (ja) * 1989-04-24 1998-02-25 松下電器産業株式会社 安全保障機能付サージ吸収器
US4926022A (en) 1989-06-20 1990-05-15 Digital Equipment Corporation Laser reflow soldering process and bonded assembly formed thereby
US4961125A (en) * 1989-08-18 1990-10-02 Thermalloy Incorporated Apparatus and method of attaching an electronic device package and a heat sink to a circuit board
DE3939812C2 (de) 1989-12-01 1993-11-11 Deutsche Aerospace Laserlötsystem für SMD-Elemente
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Also Published As

Publication number Publication date
CA2286231A1 (en) 2000-04-14
DE69905229T2 (de) 2003-12-24
EP0998175A1 (en) 2000-05-03
US6168070B1 (en) 2001-01-02
DE69905229D1 (de) 2003-03-13
EP0998175B1 (en) 2003-02-05

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