US6369345B1 - Method and apparatus for reflowing solder paste using a light source - Google Patents
Method and apparatus for reflowing solder paste using a light source Download PDFInfo
- Publication number
- US6369345B1 US6369345B1 US09/641,665 US64166500A US6369345B1 US 6369345 B1 US6369345 B1 US 6369345B1 US 64166500 A US64166500 A US 64166500A US 6369345 B1 US6369345 B1 US 6369345B1
- Authority
- US
- United States
- Prior art keywords
- leads
- solder paste
- light source
- wiring board
- continuous bead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/005—Soldering by means of radiant energy
- B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0545—Pattern for applying drops or paste; Applying a pattern made of drops or paste
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3405—Edge mounted components, e.g. terminals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Definitions
- the present invention relates, generally, to methods and apparatus for reflowing solder paste using a light source and, more particularly, to a movable head having a solder paste dispenser and a heat lamp mounted thereto for simultaneously applying a bead of solder paste to the leads of a microelectronic component mounted on a printed wiring board and heating the applied solder paste.
- soldering high pin count, fine pitch surface mounted connectors to corresponding electrically conductive pads on a printed circuit board
- soldering techniques generally provide good electrical contact between the component leads and the circuit board, these techniques are time consuming and cumbersome which tend to limit throughput.
- soldering techniques employ a stencil having cutouts located at the contacts of the printed circuit board, with the stencil being overlaid on to the circuit board.
- a dollop of solder paste is then applied to the stencil at one end of the circuit board, and thereafter, “squeegeed” to ensure that solder paste is applied to all of the electrical contacts (also referred to herein as “pads”) to the cutouts in the stencil.
- solder paste covers all of the contacts on the circuit board.
- the microelectronic components are then placed on the circuit board with the leads extending from the components placed in contact with the pre-soldered pads on the circuit board.
- drawing figure is a schematic perspective diagram illustrating a printed wiring board and a microelectronic component having leads extending therefrom in contact with corresponding paths on the wiring board, and further illustrating a light source and a solder paste dispenser configured to be moved over the leads.
- a light source 102 and a solder paste dispenser 108 are suitably mounted to a movable head (the movable head is omitted from the drawing figure for clarity).
- a Panasonic model no. YB-04FH1 soft-beam spot solder machine was retrofitted to configure it for use with the present invention.
- the soldering system includes a light beam heating system, model no. YB-02AC2 and an industrial robot model no. YB-04FJ1 for soldiering the microelectronic components onto the wiring board, all available from Panasonic Corporation.
- the solder wire dispenser of the machine was removed and replaced with a solder paste dispenser.
- a connector 114 is mounted to a printed wiring board 112 in accordance with the present invention.
- printed wiring board 112 is also referred to as a printed circuit board.
- Connector 114 may comprise virtually any desired microelectronic component such as an integrated circuit chip.
- Connector 114 includes a plurality of electrically conductive leads 116 extending therefrom.
- Wiring board 112 includes a mounting surface 120 , comprising a plurality of electrical contacts 118 , referred to as “pads.”
- connector 114 is connected to wiring board 112 in a straddle mount configuration, in which a first series of leads 116 are connected to top surface 120 , and a second set of leads (not shown) are similarly connected to a similar pattern of pads on the bottom surface (not shown) of wiring board 112 .
- connector 114 may be surface mounted to surface 120 of wiring board 112 wherein a plurality of leads 116 extend from 1, 2, 3, or 4 sides of connector 114 .
- connector 114 is soldered to wiring board 112 in accordance with the present invention.
- connector 114 is placed on wiring board 112 before the solder is applied.
- connector 114 is placed on wiring board 112 such that each of the leads 116 extending from connector 114 are placed in contact with a respective one of pads 118 .
- a bead 110 of solder paste is applied to leads 116 in the vicinity of the pads 118 .
- bead 110 is thereafter heated to reflow the solder paste.
- each pad 118 is suitably on the order of 0.110 inches, and the width of each pad 118 is on the order of 0.016 inches.
- the soldering techniques of the present invention are particularly well suited for use with high-pin count, fine pitch microelectronic components, for example, components having leads with a pitch on the order of 0.025 inches.
- solder paste 110 is applied across leads 116 . Consequently, solder paste is not only applied at each respective pad 118 , but also to the spaces on wiring board 112 between each of pads 118 .
- Solder paste bead 110 may be conveniently applied to leads 116 by passing a moving head (not shown) over leads 116 with solder paste dispenser 108 and light source 102 being mounted to the heads such that the light beam 104 emitted by light source 102 heats solder paste bead 110 as bead 110 is applied to the leads 116 or immediately thereafter.
- light source 102 comprises a Xenon bulb, and a fiber optic cable (not shown) may be employed to direct beam 104 at leads 116 .
- a suitable solder paste is part no. RMA376EH, which suitably comprises 62% tin, 36% lead, and 2% silver.
- This solder paste is available from Alpha Metals Soldercreams of Jersey City, N.J. It will be appreciated, however, that any solder paste may be employed which is dispensable and reflowable.
- Solder paste dispenser 108 may comprise any suitable device, for example, a syringe, capable of dispensing a metered bead of solder paste; in exemplary embodiment, a bead in the range of 0.015 inches in diameter is dispensed onto leads 116 as the moving head passes over leads 116 .
- light beam 104 suitably exhibits a foot print in the range of 0.100 inches, and travels across the leads 116 at speeds ranging from 1 to 10 inches per second, and preferably at 3 to 4 inches per second.
- Light source 102 should thus be configured to apply light energy to leads 116 of sufficient intensity to reflow the solder paste.
- a solder paste should be selected which adheres to itself and which adheres to leads 116 and pads 118 , but which does not adhere to surface 120 .
- the solder paste agglomerates onto pads 118 , for example, in a substantially spherical configuration. In a liquefied or reflow state, the solder paste will tend to remain only on conductive pads 118 and leads 116 and will drawn away from and off of the interstitial spaces of surface 120 between pads 118 .
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/641,665 US6369345B1 (en) | 2000-08-18 | 2000-08-18 | Method and apparatus for reflowing solder paste using a light source |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/641,665 US6369345B1 (en) | 2000-08-18 | 2000-08-18 | Method and apparatus for reflowing solder paste using a light source |
Publications (1)
Publication Number | Publication Date |
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US6369345B1 true US6369345B1 (en) | 2002-04-09 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US09/641,665 Expired - Fee Related US6369345B1 (en) | 2000-08-18 | 2000-08-18 | Method and apparatus for reflowing solder paste using a light source |
Country Status (1)
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US (1) | US6369345B1 (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6513701B2 (en) * | 1999-06-24 | 2003-02-04 | International Business Machines Corporation | Method of making electrically conductive contacts on substrates |
US6833526B2 (en) * | 2001-03-28 | 2004-12-21 | Visteon Global Technologies, Inc. | Flex to flex soldering by diode laser |
WO2009083505A1 (en) * | 2007-12-27 | 2009-07-09 | Robert Bosch Gmbh | Method for producing an electrical conductor by applying at least one paste, in particular thick-film paste |
US20140345123A1 (en) * | 2013-05-22 | 2014-11-27 | International Business Machines Corporation | Manufacturing a product using a soldering process |
EP2953436A3 (en) * | 2014-06-06 | 2016-02-24 | Neuschäfer Elektronik GmbH | Method for manufacturing an electronic connecting element and an electronic connecting element |
US9496188B2 (en) * | 2015-03-30 | 2016-11-15 | International Business Machines Corporation | Soldering three dimensional integrated circuits |
CN109600933A (en) * | 2018-11-28 | 2019-04-09 | 北京遥测技术研究所 | Coaxial electric coupler inner conductor and printed board pad 3 D stereo tin cream coating method |
CN113351954A (en) * | 2021-07-06 | 2021-09-07 | 何海 | Brazing filling device for surface weld joint of sealing steel ring |
Citations (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3592992A (en) * | 1969-03-13 | 1971-07-13 | Argus Eng Co | Soldering method and apparatus |
US3717742A (en) * | 1970-06-26 | 1973-02-20 | Circa Tran Inc | Method and apparatus for forming printed circuit boards with infrared radiation |
US4697061A (en) * | 1985-09-19 | 1987-09-29 | Siemens Aktiengesellschaft | Method for welding by means of laser light |
US5484979A (en) * | 1993-10-22 | 1996-01-16 | Ford Motor Company | Laser soldering process employing an energy absorptive coating |
US5509597A (en) * | 1994-10-17 | 1996-04-23 | Panasonic Technologies, Inc. | Apparatus and method for automatic monitoring and control of a soldering process |
US5551628A (en) * | 1993-11-02 | 1996-09-03 | U.S. Philips Corporation | Solder-coating method, and solder paste suitable for use therein |
US5574629A (en) * | 1989-06-09 | 1996-11-12 | Sullivan; Kenneth W. | Solderless printed wiring devices |
US5899737A (en) * | 1996-09-20 | 1999-05-04 | Lsi Logic Corporation | Fluxless solder ball attachment process |
US5964395A (en) * | 1997-06-09 | 1999-10-12 | Ford Motor Company | Predeposited transient phase electronic interconnect media |
US6041994A (en) * | 1994-06-07 | 2000-03-28 | Texas Instruments Incorporated | Rapid and selective heating method in integrated circuit package assembly by means of tungsten halogen light source |
US6043454A (en) * | 1998-05-27 | 2000-03-28 | Beamworks Ltd. | Apparatus and method for in-line soldering |
US6053398A (en) * | 1996-12-06 | 2000-04-25 | The Furukawa Electric Co., Ltd. | Solder bump forming method, solder bump forming apparatus, head unit for use therein and soldering method using the head unit |
US6168070B1 (en) * | 1998-10-14 | 2001-01-02 | Visteon Global Technologies, Inc. | Method for soldering DPAK-type electronic components to circuit boards |
US6173887B1 (en) * | 1999-06-24 | 2001-01-16 | International Business Machines Corporation | Method of making electrically conductive contacts on substrates |
US6234374B1 (en) * | 1994-06-07 | 2001-05-22 | Texas Instruments Incorporated | Rapid and selective heating method in integrated circuit package assembly by means of tungsten halogen light source |
-
2000
- 2000-08-18 US US09/641,665 patent/US6369345B1/en not_active Expired - Fee Related
Patent Citations (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3592992A (en) * | 1969-03-13 | 1971-07-13 | Argus Eng Co | Soldering method and apparatus |
US3717742A (en) * | 1970-06-26 | 1973-02-20 | Circa Tran Inc | Method and apparatus for forming printed circuit boards with infrared radiation |
US4697061A (en) * | 1985-09-19 | 1987-09-29 | Siemens Aktiengesellschaft | Method for welding by means of laser light |
US5574629A (en) * | 1989-06-09 | 1996-11-12 | Sullivan; Kenneth W. | Solderless printed wiring devices |
US5484979A (en) * | 1993-10-22 | 1996-01-16 | Ford Motor Company | Laser soldering process employing an energy absorptive coating |
US5551628A (en) * | 1993-11-02 | 1996-09-03 | U.S. Philips Corporation | Solder-coating method, and solder paste suitable for use therein |
US6041994A (en) * | 1994-06-07 | 2000-03-28 | Texas Instruments Incorporated | Rapid and selective heating method in integrated circuit package assembly by means of tungsten halogen light source |
US6234374B1 (en) * | 1994-06-07 | 2001-05-22 | Texas Instruments Incorporated | Rapid and selective heating method in integrated circuit package assembly by means of tungsten halogen light source |
US5509597A (en) * | 1994-10-17 | 1996-04-23 | Panasonic Technologies, Inc. | Apparatus and method for automatic monitoring and control of a soldering process |
US5899737A (en) * | 1996-09-20 | 1999-05-04 | Lsi Logic Corporation | Fluxless solder ball attachment process |
US6053398A (en) * | 1996-12-06 | 2000-04-25 | The Furukawa Electric Co., Ltd. | Solder bump forming method, solder bump forming apparatus, head unit for use therein and soldering method using the head unit |
US5964395A (en) * | 1997-06-09 | 1999-10-12 | Ford Motor Company | Predeposited transient phase electronic interconnect media |
US6043454A (en) * | 1998-05-27 | 2000-03-28 | Beamworks Ltd. | Apparatus and method for in-line soldering |
US6168070B1 (en) * | 1998-10-14 | 2001-01-02 | Visteon Global Technologies, Inc. | Method for soldering DPAK-type electronic components to circuit boards |
US6173887B1 (en) * | 1999-06-24 | 2001-01-16 | International Business Machines Corporation | Method of making electrically conductive contacts on substrates |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6513701B2 (en) * | 1999-06-24 | 2003-02-04 | International Business Machines Corporation | Method of making electrically conductive contacts on substrates |
US6833526B2 (en) * | 2001-03-28 | 2004-12-21 | Visteon Global Technologies, Inc. | Flex to flex soldering by diode laser |
WO2009083505A1 (en) * | 2007-12-27 | 2009-07-09 | Robert Bosch Gmbh | Method for producing an electrical conductor by applying at least one paste, in particular thick-film paste |
US20110100684A1 (en) * | 2007-12-27 | 2011-05-05 | Peter Hornig | Method for manufacturing an electrical conductor by applying at least one paste, in particular a thick-film paste |
US20140345123A1 (en) * | 2013-05-22 | 2014-11-27 | International Business Machines Corporation | Manufacturing a product using a soldering process |
US9398702B2 (en) * | 2013-05-22 | 2016-07-19 | International Business Machines Corporation | Manufacturing a product using a soldering process |
US10010000B2 (en) | 2013-05-22 | 2018-06-26 | International Business Machines Corporation | Manufacturing a product using a soldering process |
US10959339B2 (en) | 2013-05-22 | 2021-03-23 | International Business Machines Corporation | Manufacturing a product using a soldering process |
EP2953436A3 (en) * | 2014-06-06 | 2016-02-24 | Neuschäfer Elektronik GmbH | Method for manufacturing an electronic connecting element and an electronic connecting element |
US9496188B2 (en) * | 2015-03-30 | 2016-11-15 | International Business Machines Corporation | Soldering three dimensional integrated circuits |
CN109600933A (en) * | 2018-11-28 | 2019-04-09 | 北京遥测技术研究所 | Coaxial electric coupler inner conductor and printed board pad 3 D stereo tin cream coating method |
CN113351954A (en) * | 2021-07-06 | 2021-09-07 | 何海 | Brazing filling device for surface weld joint of sealing steel ring |
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AS | Assignment |
Owner name: MOTOROLA, INC., ILLINOIS Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:ZALOGA, ANDREW W.;STOKMAN, CAROLYN M.;KOKOVITCH, JEFFREY J.;REEL/FRAME:011152/0742 Effective date: 20000817 |
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Owner name: FREESCALE SEMICONDUCTOR, INC., TEXAS Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:MOTOROLA, INC.;REEL/FRAME:015698/0657 Effective date: 20040404 Owner name: FREESCALE SEMICONDUCTOR, INC.,TEXAS Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:MOTOROLA, INC.;REEL/FRAME:015698/0657 Effective date: 20040404 |
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Owner name: CITIBANK, N.A. AS COLLATERAL AGENT, NEW YORK Free format text: SECURITY AGREEMENT;ASSIGNORS:FREESCALE SEMICONDUCTOR, INC.;FREESCALE ACQUISITION CORPORATION;FREESCALE ACQUISITION HOLDINGS CORP.;AND OTHERS;REEL/FRAME:018855/0129 Effective date: 20061201 Owner name: CITIBANK, N.A. AS COLLATERAL AGENT,NEW YORK Free format text: SECURITY AGREEMENT;ASSIGNORS:FREESCALE SEMICONDUCTOR, INC.;FREESCALE ACQUISITION CORPORATION;FREESCALE ACQUISITION HOLDINGS CORP.;AND OTHERS;REEL/FRAME:018855/0129 Effective date: 20061201 |
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LAPS | Lapse for failure to pay maintenance fees | ||
STCH | Information on status: patent discontinuation |
Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362 |
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FP | Lapsed due to failure to pay maintenance fee |
Effective date: 20100409 |
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Owner name: FREESCALE SEMICONDUCTOR, INC., TEXAS Free format text: PATENT RELEASE;ASSIGNOR:CITIBANK, N.A., AS COLLATERAL AGENT;REEL/FRAME:037354/0225 Effective date: 20151207 |