JP3227562B2 - Solder ball connector - Google Patents
Solder ball connectorInfo
- Publication number
- JP3227562B2 JP3227562B2 JP14547797A JP14547797A JP3227562B2 JP 3227562 B2 JP3227562 B2 JP 3227562B2 JP 14547797 A JP14547797 A JP 14547797A JP 14547797 A JP14547797 A JP 14547797A JP 3227562 B2 JP3227562 B2 JP 3227562B2
- Authority
- JP
- Japan
- Prior art keywords
- solder ball
- connector
- ball connector
- insulator
- pin contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
Landscapes
- Connecting Device With Holders (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、半田ボールを電極
としたコネクタにおいて、半田ボールとコンタクトとを
接続する技術に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a technique for connecting a solder ball and a contact in a connector using a solder ball as an electrode.
【０００２】[0002]
【従来の技術】従来のＱＦＰ（ＱＵＡＤ ＦＬＡＴ Ｐ
ＡＣＫＡＧＥ）タイプのＳＭＴ（ＳＵＲＦＡＣＥ ＭＯ
ＵＮＴ ＴＥＣＨＮＯＬＯＧＹ）コネクタでは、最近コ
ンタクトの狭ピッチ化が限界に近づいている。そこで、
半田ボール電極をインシュレータの底面に格子状に配置
させたＢＧＡタイプのリードレスコネクタが、提案され
ている。2. Description of the Related Art Conventional QFP (QUAD FLAT P)
ACKAGE) type SMT (SURFACE MO)
(UNT TECHNOLOGY) connectors, the narrowing of the contact pitch has recently reached the limit. Therefore,
A BGA type leadless connector in which solder ball electrodes are arranged in a grid on the bottom surface of an insulator has been proposed.
【０００３】表面実装型パッケージの一種であるＢＧＡ
（ＢＡＬＬ ＧＲＩＤ ＡＲＲＡＹ）では、半田ボール
の接合方法として、プリント配線基板の裏面の銅箔部分
（パッド電極）にフラックスを塗布後、半田ボールを搭
載し、リフローを行うことにより半田ボール端子を形成
している。パッド電極は、スルーホールを経てプリント
配線基板の表面に配置されたＩＣにワイヤボンディング
により電気的に接続されている。BGA, a type of surface mount package
In (BALL GRID ARRAY), as a method of joining solder balls, a solder ball terminal is formed by applying a flux to a copper foil portion (pad electrode) on the back surface of a printed wiring board, mounting the solder ball, and performing reflow. ing. The pad electrode is electrically connected to an IC disposed on the surface of the printed wiring board via a through hole by wire bonding.
【０００４】[0004]
【発明が解決しようとする課題】そこで、本発明は、前
記従来のＢＧＡタイプのリードレスコネクタの構造の簡
素化を図るものである。SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to simplify the structure of the conventional BGA type leadless connector.
【０００５】[0005]
【課題を解決するための手段】本発明は、前記課題を解
決するため、次の手段を採用する。The present invention employs the following means to solve the above-mentioned problems.
【０００６】（１）インシュレータとコンタクトと半田
ボールから構成され、前記コンタクトの一端面部と接続
する電極部を前記インシュレータにめっきにより形成
し、前記半田ボールを前記電極部に融着させ、前記半田
ボールを前記電極部と前記コンタクトの一端面部との両
方に接続する半田ボールコネクタ。(1) Consisting of an insulator, a contact and a solder ball , connected to one end of the contact.
Electrode part to be formed on the insulator by plating
Melting the solder ball to the electrode portion;
Connect the ball to both the electrode and one end of the contact.
Ball connector to be connected to the other side .
【０００７】（２）前記インシュレータの底面の四隅に
半田ボールつぶれ防止台を設けた前記（１）記載の半田
ボールコネクタ。(2) The solder ball connector according to (1), wherein solder ball crush prevention tables are provided at four corners of the bottom surface of the insulator.
【０００８】[0008]
【発明の実施の形態】本発明の一実施の形態例について
図１〜図４を参照して説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described with reference to FIGS.
【０００９】図１は、本発明の一実施の形態例の半田ボ
ールコネクタにおけるピンコンタクト側の諸図である。
図２は、同ピンコンタクト側の半田ボールをピンコンタ
クトに接続する前の状態を示す。図３は、同コネクタが
嵌合した状態を示す。図４は、同コネクタをプリント配
線基板に実装した状態を示す。FIG. 1 is a diagram showing a pin contact side of a solder ball connector according to an embodiment of the present invention.
FIG. 2 shows a state before the solder ball on the pin contact side is connected to the pin contact. FIG. 3 shows a state where the connector is fitted. FIG. 4 shows a state where the connector is mounted on a printed wiring board.
【００１０】ピンコンタクト側の半田ボールコネクタ２
の製造工程について説明する。まず、多数本のピンコン
タクト３０をインシュレータ２０に圧入する。次に、図
２に示されるように、ピンコンタクト３０の平面（下端
面）部とインシュレータ２０の平面を一致させる。続い
て、ピンコンタクト３０の平面部及びその周辺部に一例
の手段としてＭＩＤ（後述する。）により電極部４０を
形成する。[0010] Solder ball connector 2 on the pin contact side
Will be described. First, many pin contacts 30 are pressed into the insulator 20. Next, as shown in FIG. 2, the plane (lower end surface) of the pin contact 30 is made to coincide with the plane of the insulator 20. Subsequently, an electrode section 40 is formed on the plane portion of the pin contact 30 and its peripheral portion by MID (described later) as an example.
【００１１】ＭＩＤ（ＭＯＬＤ ＩＮＴＥＲＣＯＮＮＥ
ＣＴＥＤ ＤＥＶＩＣＥ）とは、射出成形体表面に無電
解めっきを施す技術であり、種々の方法があるが、ここ
ではサブトラクティブ法を採用する。サブトラクティブ
法では、薬品で表面を粗化した後、触媒剤を付与して無
電解銅めっきを施す。レジスト膜とレジストマスクを施
し、ＵＶ露光後、露出した銅をエッチングする。そして
レジストマスクとレジスト膜を除去することにより銅パ
ターンを形成する。[0011] MID (MOLD INTERCONNE
CED DEVICE) is a technique for applying electroless plating to the surface of an injection molded body, and there are various methods. Here, a subtractive method is employed. In the subtractive method, after roughening the surface with a chemical, a catalyst is applied and electroless copper plating is performed. A resist film and a resist mask are applied, and after the UV exposure, the exposed copper is etched. Then, a copper pattern is formed by removing the resist mask and the resist film.
【００１２】続いて、電極部４０にフラックスを塗布
後、又は、フラックスを半田ボール１０に直接塗布後、
半田ボール１０を電極部４０に搭載し、リフローを行う
ことにより半田ボール１０を電極部４０に融着すると同
時にピンコンタクト３０に接続させる。Subsequently, after a flux is applied to the electrode portion 40, or after the flux is applied directly to the solder ball 10,
The solder ball 10 is mounted on the electrode portion 40 and reflowed so that the solder ball 10 is fused to the electrode portion 40 and simultaneously connected to the pin contact 30.
【００１３】以上は、ピンコクタクト側の半田ボールコ
ネクタ２についての説明であるが、ソケットコンタクト
側の半田ボールコネクタ３についても同様である。While the above description has been given of the solder ball connector 2 on the pin contact side, the same applies to the solder ball connector 3 on the socket contact side.
【００１４】図３にピンコンタクト側の半田ボールコネ
クタ２とソケットコンタクト側の半田ボールコネクタ３
とが嵌合した状態を示す。FIG. 3 shows a solder ball connector 2 on the pin contact side and a solder ball connector 3 on the socket contact side.
Shows a state in which is fitted.
【００１５】半田ボールコネクタ１を図４に示されるよ
うにプリント配線基板４に実装するときには、プリント
配線基板４の電極部に予備半田を設け、半田ボールコネ
クタ１の搭載後にリフローを行う。When the solder ball connector 1 is mounted on the printed wiring board 4 as shown in FIG. 4, spare solder is provided on the electrode portion of the printed wiring board 4 and reflow is performed after the solder ball connector 1 is mounted.
【００１６】また、ピンコンタクト側の半田ボールコネ
クタ２のインシュレータ２０とソケットコンタクト側の
半田ボールコネクタ３のインシュレータ２０の各底面の
四隅には、図１（ｂ），（ｃ）及び（ｄ）並びに図３に
示されるように、半田ボールつぶれ防止台５０を設け
る。半田ボールコネクタが、事故等による外力を及ぼさ
れたとき、半田ボールつぶれ防止台５０は、半田ボール
１０がつぶれるのを防止する。FIGS. 1 (b), 1 (c) and 1 (d) show four corners of each bottom surface of the insulator 20 of the solder ball connector 2 on the pin contact side and the insulator 20 of the solder ball connector 3 on the socket contact side. As shown in FIG. 3, a solder ball crush prevention base 50 is provided. When an external force is applied to the solder ball connector due to an accident or the like, the solder ball crush prevention base 50 prevents the solder ball 10 from being crushed.
【００１７】[0017]
【発明の効果】以上の説明から明らかなように、本発明
によれば、次の効果を奏することができる。As is apparent from the above description, the present invention has the following advantages.
【００１８】（１）インシュレータとコンタクトと半田
ボールのみで構成された簡素な構造の半田ボールコネク
タを提供することができる。(1) It is possible to provide a solder ball connector having a simple structure including only insulators, contacts, and solder balls.
【００１９】（２）インシュレータの底面の四隅に半田
ボールつぶれ防止台を設けたので、半田ボールのつぶれ
を防止することができる。(2) Since the solder ball crush prevention tables are provided at the four corners of the bottom surface of the insulator, the crush of the solder balls can be prevented.
【図１】本発明の一実施の形態例の半田ボールコネクタ
におけるピンコンタクト側の諸図を示し、（ａ）は正面
図、（ｂ）は（ａ）における線Ａ−Ａによる断面図、
（ｃ）は背面図、（ｄ）は（ａ）における線Ｂ−Ｂによ
る断面図である。FIGS. 1A and 1B show various views on a pin contact side of a solder ball connector according to an embodiment of the present invention, wherein FIG. 1A is a front view, FIG.
(C) is a rear view, and (d) is a cross-sectional view along line BB in (a).
【図２】本発明の一実施の形態例の半田ボールコネクタ
におけるピンコンタクト側の半田ボールをピンコンタク
トに接続する前の状態の断面図である。FIG. 2 is a cross-sectional view of a solder ball connector according to an embodiment of the present invention in a state before a solder ball on a pin contact side is connected to the pin contact;
【図３】本発明の一実施の形態例の半田ボールコネクタ
が嵌合した状態の断面図である。FIG. 3 is a cross-sectional view showing a state where the solder ball connector according to the embodiment of the present invention is fitted.
【図４】本発明の一実施の形態例の半田ボールコネクタ
をプリント配線基板に実装した状態の側面図である。FIG. 4 is a side view showing a state where the solder ball connector according to the embodiment of the present invention is mounted on a printed wiring board.
１ 半田ボールコネクタ ２ ピンコンタクト側の半田ボールコネクタ ３ ソケットコンタクト側の半田ボールコネクタ ４ プリント配線基板 １０ 半田ボール ２０ インシュレータ ３０ ピンコンタクト ４０ 電極部 ５０ 半田ボールつぶれ防止台 DESCRIPTION OF SYMBOLS 1 Solder ball connector 2 Solder ball connector on pin contact side 3 Solder ball connector on socket contact side 4 Printed wiring board 10 Solder ball 20 Insulator 30 Pin contact 40 Electrode part 50 Solder ball crush prevention stand
Claims (2)
ルから構成され、前記コンタクトの一端面部と接続する
電極部を前記インシュレータにめっきにより形成し、前
記半田ボールを前記電極部に融着させ、前記半田ボール
を前記電極部と前記コンタクトの一端面部との両方に接
続することを特徴とする半田ボールコネクタ。An insulator, a contact, and a solder ball are connected to one end of the contact.
An electrode portion is formed on the insulator by plating, and
The solder ball is fused to the electrode portion, and the solder ball is
To both the electrode portion and one end surface of the contact.
A solder ball connector characterized by being connected.
ボールつぶれ防止台を設けたことを特徴とする請求項１
記載の半田ボールコネクタ。2. A solder ball crush prevention table is provided at four corners of a bottom surface of the insulator.
The solder ball connector as described.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14547797A JP3227562B2 (en) | 1997-06-03 | 1997-06-03 | Solder ball connector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14547797A JP3227562B2 (en) | 1997-06-03 | 1997-06-03 | Solder ball connector |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH10335017A JPH10335017A (en) | 1998-12-18 |
| JP3227562B2 true JP3227562B2 (en) | 2001-11-12 |
Family
ID=15386166
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14547797A Expired - Fee Related JP3227562B2 (en) | 1997-06-03 | 1997-06-03 | Solder ball connector |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3227562B2 (en) |
-
1997
- 1997-06-03 JP JP14547797A patent/JP3227562B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH10335017A (en) | 1998-12-18 |
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