ES2187790T3 - Blancos de pulverizacion ionica de aluminio o de aleaciones de aluminio. - Google Patents

Blancos de pulverizacion ionica de aluminio o de aleaciones de aluminio.

Info

Publication number
ES2187790T3
ES2187790T3 ES97929495T ES97929495T ES2187790T3 ES 2187790 T3 ES2187790 T3 ES 2187790T3 ES 97929495 T ES97929495 T ES 97929495T ES 97929495 T ES97929495 T ES 97929495T ES 2187790 T3 ES2187790 T3 ES 2187790T3
Authority
ES
Spain
Prior art keywords
aluminum
whites
white
ionic
spraying
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES97929495T
Other languages
English (en)
Inventor
Hideaki Japan Energy Co Fukuyo
Ichiroh Japan Energy Sawamura
Takeo Japan Energy Corp Okabe
Tateo Japan Energy Cor Ohhashi
Masaru Japan Energy C Nagasawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Eneos Corp
Original Assignee
Japan Energy Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Energy Corp filed Critical Japan Energy Corp
Application granted granted Critical
Publication of ES2187790T3 publication Critical patent/ES2187790T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/34Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411Constructional aspects of the reactor
    • H01J37/3414Targets
    • H01J37/3426Material
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • C23C14/3407Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C21/00Alloys based on aluminium
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N35/00Automatic analysis not limited to methods or materials provided for in any single one of groups G01N1/00 - G01N33/00; Handling materials therefor
    • G01N2035/00465Separating and mixing arrangements
    • G01N2035/00534Mixing by a special element, e.g. stirrer
    • G01N2035/00554Mixing by a special element, e.g. stirrer using ultrasound

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)

Abstract

A FIN DE PROPORCIONAR BLANCOS DE SPUTTERING DE ALUMINIO O ALEACION DE ALUMINIO DE ALTA PUREZA CON CONTROL DE LA GENERACION REPENTINA DE PARTICULAS, EN BASE AL DESCUBRIMIENTO DE QUE LAS INCLUSIONES, ESPECIALMENTE DE OXIDOS, EN BLANCOS DE SPUTTERING DE (ALEACION DE) ALUMINIO SON PRINCIPALMENTE RESPONSABLES DE LA GENERACION DE PARTICULAS, Y MAS AUN, INCLUSIONES COMPOSITES DE GRAFITO-ALUMINA CON UNA DISTRIBUCION RELATIVAMENTE GROSERA EN LOS BLANCOS OCASIONAN UN AUMENTO REPENTINO EN EL NUMERO DE PARTICULAS FORMADAS, EL CONTENIDO EN OXIGENO DE TAL BLANCO SE LIMITA A MENOS DE 5 PPM Y EL NUMERO INDICATIVO CORRESPONDIENTE A AGUJEROS DE FONDO PLANO DE 0,5 MM O MAS DE DIAMETRO EN DETECCION DE DEFECTOS POR ULTRASONIDOS REALIZADA EN LA SUPERFICIE DEL BLANCO ANTERIOR SE FIJA EN MENOR DE 0,014/CM 2 .
ES97929495T 1996-07-05 1997-07-02 Blancos de pulverizacion ionica de aluminio o de aleaciones de aluminio. Expired - Lifetime ES2187790T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19415296A JP3755552B2 (ja) 1996-07-05 1996-07-05 アルミニウムまたはアルミニウム合金スパッタリングターゲット

Publications (1)

Publication Number Publication Date
ES2187790T3 true ES2187790T3 (es) 2003-06-16

Family

ID=16319792

Family Applications (1)

Application Number Title Priority Date Filing Date
ES97929495T Expired - Lifetime ES2187790T3 (es) 1996-07-05 1997-07-02 Blancos de pulverizacion ionica de aluminio o de aleaciones de aluminio.

Country Status (8)

Country Link
EP (1) EP0853136B1 (es)
JP (1) JP3755552B2 (es)
KR (1) KR100288323B1 (es)
CN (1) CN1138871C (es)
DE (1) DE69719007T2 (es)
ES (1) ES2187790T3 (es)
TW (1) TW425434B (es)
WO (1) WO1998001598A1 (es)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020184970A1 (en) 2001-12-13 2002-12-12 Wickersham Charles E. Sptutter targets and methods of manufacturing same to reduce particulate emission during sputtering
JP5368663B2 (ja) * 2000-04-14 2013-12-18 トーソー エスエムディー,インク. スパッターリング時の粒子状放出物を少なくするためのスパッターターゲットとそれを製造する方法
US6439054B1 (en) * 2000-05-31 2002-08-27 Honeywell International Inc. Methods of testing sputtering target materials
WO2006117884A1 (ja) * 2005-04-26 2006-11-09 Mitsui Mining & Smelting Co., Ltd. Al-Ni-B合金配線材料及びそれを用いた素子構造
KR100959579B1 (ko) 2005-04-26 2010-05-27 미쓰이 긴조꾸 고교 가부시키가이샤 Al-Ni-B 합금 배선 재료 및 그것을 사용한 소자 구조
JP5069051B2 (ja) * 2007-07-13 2012-11-07 Jx日鉱日石金属株式会社 ニッケル合金スパッタリングターゲット
KR101124831B1 (ko) * 2008-03-31 2012-03-26 가부시키가이샤 고베 세이코쇼 표시 장치, 그 제조 방법 및 스퍼터링 타깃
CN101639462B (zh) * 2009-06-16 2011-12-21 宁波江丰电子材料有限公司 靶材的检测方法
CN105154799A (zh) * 2015-09-07 2015-12-16 基迈克材料科技(苏州)有限公司 用于tft平板显示器的超高纯铝板细晶靶材的制备方法
CN107841643A (zh) * 2017-12-11 2018-03-27 基迈克材料科技(苏州)有限公司 铝钪合金靶坯及其制备方法及应用
CN107841639A (zh) * 2017-12-11 2018-03-27 基迈克材料科技(苏州)有限公司 铝钪合金靶坯及其制备方法及应用

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0499269A (ja) * 1990-08-08 1992-03-31 Mitsubishi Kasei Corp スパッタリングターゲット
JP2757705B2 (ja) * 1992-09-11 1998-05-25 日本電気株式会社 半導体装置の製造方法
JPH06280005A (ja) * 1993-03-23 1994-10-04 Mitsubishi Kasei Corp スパッタリングターゲット及びその製造方法
JPH0813141A (ja) * 1994-06-28 1996-01-16 Riyouka Massey Kk スパッタリングターゲット及びその製造方法

Also Published As

Publication number Publication date
JPH1018028A (ja) 1998-01-20
TW425434B (en) 2001-03-11
DE69719007D1 (de) 2003-03-20
EP0853136A4 (en) 1999-04-21
WO1998001598A1 (fr) 1998-01-15
EP0853136B1 (en) 2003-02-12
JP3755552B2 (ja) 2006-03-15
KR19990044398A (ko) 1999-06-25
CN1196759A (zh) 1998-10-21
CN1138871C (zh) 2004-02-18
EP0853136A1 (en) 1998-07-15
KR100288323B1 (ko) 2001-05-02
DE69719007T2 (de) 2003-09-25

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