ES2184410T3 - Aparato de colocacion de componentes. - Google Patents

Aparato de colocacion de componentes.

Info

Publication number
ES2184410T3
ES2184410T3 ES99902694T ES99902694T ES2184410T3 ES 2184410 T3 ES2184410 T3 ES 2184410T3 ES 99902694 T ES99902694 T ES 99902694T ES 99902694 T ES99902694 T ES 99902694T ES 2184410 T3 ES2184410 T3 ES 2184410T3
Authority
ES
Spain
Prior art keywords
pick
component
head
place
component placement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES99902694T
Other languages
English (en)
Inventor
John Michael Lowe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDAO Ltd
Original Assignee
Technology Development Associate Operations Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Technology Development Associate Operations Ltd filed Critical Technology Development Associate Operations Ltd
Application granted granted Critical
Publication of ES2184410T3 publication Critical patent/ES2184410T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0452—Mounting machines or lines comprising a plurality of tools for guiding different components to the same mounting place
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0478—Simultaneously mounting of different components
    • H05K13/0482—Simultaneously mounting of different components using templates; using magazines, the configuration of which corresponds to the sites on the boards where the components have to be attached
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53191—Means to apply vacuum directly to position or hold work part

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Vehicle Body Suspensions (AREA)
  • Vending Machines For Individual Products (AREA)
  • Transition And Organic Metals Composition Catalysts For Addition Polymerization (AREA)
  • Basic Packing Technique (AREA)
  • Feeding Of Articles By Means Other Than Belts Or Rollers (AREA)
  • Supporting Of Heads In Record-Carrier Devices (AREA)
  • Die Bonding (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
  • Supplying Of Containers To The Packaging Station (AREA)
  • Massaging Devices (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

Un aparato de colocación de componentes (1) que comprende: un montaje de cabeza (8) que tiene al menos una cabeza de selección y colocación (9) y que es movible para mover al menos una cabeza de selección y colocación (9) en un solo plano; medio portador de componentes (10); y medio receptor de componentes (7), la al menos una cabeza de selección y colocación (9) estando dispuesta para tomar un componente (11) del medio portador de componentes (10) y colocarlo sobre el medio receptor de componentes (7), donde: el medio portador de componentes (10) es movible en un primer plano transversal al plano de movimiento de la al menos una cabeza de selección y colocación (9) y el plano de movimiento del medio portador de componentes 10 intersecta con el plano de movimiento de la cabeza de selección y colocación (9) en una posición de recogida; el medio receptor de componentes (7) es movible en un segundo plano transversal al plano de movimiento de la al menos una cabeza de selección y colocación (9), el plano de movimiento del medio receptor de componentes (7) intersectando con el plano de movimiento de la cabeza de selección y colocación (9) en una posición de colocación; y el plano de movimiento del medio receptor de componentes (7) siendo paralelo al plano de movimiento del medio portador de componentes (10), con el plano de movimiento del medio portador de componentes (10) o el plano de movimiento del medio receptor de componentes (7) estando entre el plano de movimiento del otro medio portador de componentes (10) y medio receptor de componentes (7) y el montaje de cabeza (8) en la posición de recogida.
ES99902694T 1998-01-29 1999-01-28 Aparato de colocacion de componentes. Expired - Lifetime ES2184410T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB9801875A GB2333904B (en) 1998-01-29 1998-01-29 Component placement apparatus

Publications (1)

Publication Number Publication Date
ES2184410T3 true ES2184410T3 (es) 2003-04-01

Family

ID=10826083

Family Applications (1)

Application Number Title Priority Date Filing Date
ES99902694T Expired - Lifetime ES2184410T3 (es) 1998-01-29 1999-01-28 Aparato de colocacion de componentes.

Country Status (16)

Country Link
US (1) US6557247B1 (es)
EP (1) EP1051893B1 (es)
JP (1) JP2002502136A (es)
KR (1) KR100631222B1 (es)
AT (1) ATE224131T1 (es)
AU (1) AU741235B2 (es)
BR (1) BR9908708A (es)
CA (1) CA2318153A1 (es)
DE (1) DE69902882T2 (es)
DK (1) DK1051893T3 (es)
ES (1) ES2184410T3 (es)
GB (1) GB2333904B (es)
HK (1) HK1032709A1 (es)
PT (1) PT1051893E (es)
RU (1) RU2218682C2 (es)
WO (1) WO1999039559A1 (es)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MXPA02007208A (es) * 2001-07-30 2003-02-06 Esec Trading Sa Dispositivo para el transporte y dotacion de substratos con chips semiconductores.
EP1554917A2 (en) * 2002-10-10 2005-07-20 Ofer Avineri Apparatus and method for assembling arrays of functional elements to substrates
TW200604060A (en) * 2004-06-11 2006-02-01 Assembleon Nv Component placement apparatus, component feeding apparatus and method
KR101070916B1 (ko) * 2006-02-24 2011-10-06 삼성테크윈 주식회사 기판 스트립 및 반도체 패키지 제조방법

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2108015B (en) * 1981-08-24 1985-03-06 Tdk Electronics Co Ltd Apparatus for mounting chip type circuit elements on printed circuit boards
DE3502257A1 (de) * 1985-01-24 1986-07-24 Robert 7992 Tettnang Buck Bestueckungsautomat
EP0190372A1 (en) * 1985-01-29 1986-08-13 TEKMA KINOMAT S.p.A. Process for the automatic positioning of chips on printed circuits and machine for carrying out the same
BE903742A (nl) * 1985-11-29 1986-05-29 Burndy Electra Nv Machine en werkwijze voor het selektief insteken van electrische kontaktpennen in een plaat met gedrukte schakelingen.
DE3623031A1 (de) * 1986-07-09 1988-01-14 Raetz Klaus Montagevorrichtung fuer elektronikleiterplatten der mikroelektronik
JPH01295500A (ja) * 1988-05-24 1989-11-29 Taiyo Yuden Co Ltd チップ状電子部品マウント方法及びその装置
US5042709A (en) * 1990-06-22 1991-08-27 International Business Machines Corporation Methods and apparatus for precise alignment of objects
DE4022316A1 (de) * 1990-07-13 1992-01-16 Neubecker Karl A Verfahren zum herstellen von mit elektronischen baugruppen bestueckten leiterplatten
EP0497129B1 (de) * 1991-01-28 1995-07-26 Siemens Aktiengesellschaft Vorrichtung zum Bestücken von Leiterplatten

Also Published As

Publication number Publication date
DK1051893T3 (da) 2002-10-14
CA2318153A1 (en) 1999-08-05
BR9908708A (pt) 2000-12-05
AU2290699A (en) 1999-08-16
DE69902882T2 (de) 2003-04-30
KR20010040454A (ko) 2001-05-15
DE69902882D1 (de) 2002-10-17
GB2333904A (en) 1999-08-04
EP1051893A1 (en) 2000-11-15
EP1051893B1 (en) 2002-09-11
ATE224131T1 (de) 2002-09-15
US6557247B1 (en) 2003-05-06
HK1032709A1 (en) 2001-07-27
AU741235B2 (en) 2001-11-29
WO1999039559A1 (en) 1999-08-05
KR100631222B1 (ko) 2006-10-02
PT1051893E (pt) 2003-01-31
GB2333904B (en) 2002-07-17
JP2002502136A (ja) 2002-01-22
RU2218682C2 (ru) 2003-12-10
GB9801875D0 (en) 1998-03-25

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