ES2149927T3 - Metodo para interconectar un dispositivo electronico utilizando un medio portador de soldadura, retirable. - Google Patents

Metodo para interconectar un dispositivo electronico utilizando un medio portador de soldadura, retirable.

Info

Publication number
ES2149927T3
ES2149927T3 ES95303496T ES95303496T ES2149927T3 ES 2149927 T3 ES2149927 T3 ES 2149927T3 ES 95303496 T ES95303496 T ES 95303496T ES 95303496 T ES95303496 T ES 95303496T ES 2149927 T3 ES2149927 T3 ES 2149927T3
Authority
ES
Spain
Prior art keywords
welding
electronic device
interconnect
particles
contact pads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES95303496T
Other languages
English (en)
Spanish (es)
Inventor
Sungho Jin
Mark Thomas Mccormack
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
AT&T Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AT&T Corp filed Critical AT&T Corp
Application granted granted Critical
Publication of ES2149927T3 publication Critical patent/ES2149927T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H10P72/74—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • H10W70/093—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0218—Composite particles, i.e. first metal coated with second metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08—Magnetic details
    • H05K2201/083—Magnetic materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10424—Frame holders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0425—Solder powder or solder coated metal powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0528—Patterning during transfer, i.e. without preformed pattern, e.g. by using a die, a programmed tool or a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0769—Dissolving insulating materials, e.g. coatings, not used for developing resist after exposure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/104—Using magnetic force, e.g. to align particles or for a temporary connection during processing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
    • H10W72/01204—
    • H10W72/01212—
    • H10W72/01225—
    • H10W72/07236—
    • H10W72/252—

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Adhesives Or Adhesive Processes (AREA)
ES95303496T 1994-05-31 1995-05-24 Metodo para interconectar un dispositivo electronico utilizando un medio portador de soldadura, retirable. Expired - Lifetime ES2149927T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/251,547 US5591037A (en) 1994-05-31 1994-05-31 Method for interconnecting an electronic device using a removable solder carrying medium

Publications (1)

Publication Number Publication Date
ES2149927T3 true ES2149927T3 (es) 2000-11-16

Family

ID=22952433

Family Applications (1)

Application Number Title Priority Date Filing Date
ES95303496T Expired - Lifetime ES2149927T3 (es) 1994-05-31 1995-05-24 Metodo para interconectar un dispositivo electronico utilizando un medio portador de soldadura, retirable.

Country Status (7)

Country Link
US (1) US5591037A (OSRAM)
EP (1) EP0685880B1 (OSRAM)
JP (2) JP3946786B2 (OSRAM)
KR (1) KR950035551A (OSRAM)
DE (1) DE69518120T2 (OSRAM)
ES (1) ES2149927T3 (OSRAM)
TW (1) TW267251B (OSRAM)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6099935A (en) * 1995-12-15 2000-08-08 International Business Machines Corporation Apparatus for providing solder interconnections to semiconductor and electronic packaging devices
KR100542552B1 (ko) * 2003-08-21 2006-01-11 삼성전자주식회사 인쇄회로기판, 및 이 인쇄회로기판을 갖는 화상기록장치
US20050221635A1 (en) * 2004-03-30 2005-10-06 International Business Machines Corporation Micro-bumps to enhance lga interconnections
DE102004025279B4 (de) * 2004-05-19 2011-04-28 Infineon Technologies Ag Anlage für ein Bestücken von Substraten mit Kugelkontakten und Verfahren zum Bestücken von Substraten mit Kugelkontakten
JP4631851B2 (ja) * 2004-12-20 2011-02-16 千住金属工業株式会社 はんだプリコート方法および電子機器用ワーク
US7875345B1 (en) * 2007-02-06 2011-01-25 World Properties, Inc. Conductive polymer foams, method of manufacture, and uses thereof
US8623265B2 (en) * 2007-02-06 2014-01-07 World Properties, Inc. Conductive polymer foams, method of manufacture, and articles thereof
US20090226696A1 (en) * 2008-02-06 2009-09-10 World Properties, Inc. Conductive Polymer Foams, Method of Manufacture, And Uses Thereof
US7790597B2 (en) * 2007-07-11 2010-09-07 Texas Instruments Incorporated Solder cap application process on copper bump using solder powder film
TWI462676B (zh) * 2009-02-13 2014-11-21 千住金屬工業股份有限公司 The solder bumps for the circuit substrate are formed using the transfer sheet
JP2013515840A (ja) * 2009-12-29 2013-05-09 ロジャース コーポレーション 導電性ポリマーフォーム、その製造方法および使用
DE102010002252A1 (de) * 2010-02-23 2011-08-25 JENOPTIK Laser GmbH, 07745 Verfahren zum Aufbringen von Weichlot auf eine Montagefläche eines Bauelementes
JP2011189390A (ja) * 2010-03-16 2011-09-29 shuan-sheng Wang 鉄粉を含有する錫基の複合はんだ合金ボール、及び、それを利用したフリップチップのバンプ形成方法
WO2012063386A1 (ja) 2010-11-08 2012-05-18 パナソニック株式会社 はんだ転写基材の製造方法、はんだプリコート方法、及びはんだ転写基材
WO2012132175A1 (ja) * 2011-03-29 2012-10-04 パナソニック株式会社 はんだ転写基材、はんだ転写基材の製造方法、及びはんだ転写方法
JP2013093471A (ja) * 2011-10-26 2013-05-16 Hitachi Chemical Co Ltd はんだプリコート及びその形成方法、並びにはんだプリコート付き基板
KR101678749B1 (ko) * 2011-10-26 2016-12-06 히타치가세이가부시끼가이샤 리플로우 필름, 땜납 범프 형성 방법, 땜납 접합의 형성 방법 및 반도체 장치
JP6009350B2 (ja) * 2012-12-28 2016-10-19 花王株式会社 電子部品が接合した回路基板の製造方法
JP2013229635A (ja) * 2013-08-01 2013-11-07 Senju Metal Ind Co Ltd はんだプリコート法
DE102016123180A1 (de) * 2016-11-30 2018-05-30 Gottfried Wilhelm Leibniz Universität Hannover Verfahren zum Verbinden eines Halbleiterbauelements mit einem Gegenstück sowie Anordnung mit einem Halbleiterbauelement
CN113948624B (zh) * 2020-07-16 2023-10-24 重庆康佳光电技术研究院有限公司 Led焊料涂布方法、发光装置和显示装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4655382A (en) * 1985-11-12 1987-04-07 Raychem Corp. Materials for use in forming electronic interconnect
US4737112A (en) * 1986-09-05 1988-04-12 American Telephone And Telegraph Company, At&T Bell Laboratories Anisotropically conductive composite medium
US4820376A (en) * 1987-11-05 1989-04-11 American Telephone And Telegraph Company At&T Bell Laboratories Fabrication of CPI layers
US4902857A (en) * 1988-12-27 1990-02-20 American Telephone And Telegraph Company, At&T Bell Laboratories Polymer interconnect structure
JPH0695462B2 (ja) * 1989-05-19 1994-11-24 シャープ株式会社 電極上への導電性粒子の配置方法
US5323947A (en) * 1993-05-03 1994-06-28 Motorola, Inc. Method and apparatus for use in forming pre-positioned solder bumps on a pad arrangement

Also Published As

Publication number Publication date
JPH07336033A (ja) 1995-12-22
JP2007110158A (ja) 2007-04-26
EP0685880A1 (en) 1995-12-06
EP0685880B1 (en) 2000-07-26
TW267251B (OSRAM) 1996-01-01
US5591037A (en) 1997-01-07
JP4065457B2 (ja) 2008-03-26
DE69518120T2 (de) 2000-12-21
JP3946786B2 (ja) 2007-07-18
DE69518120D1 (de) 2000-08-31
KR950035551A (ko) 1995-12-30

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