ES2146989T3 - PROCEDURE AND DEVICE FOR THE CONTACT OF A WIRE CONDUCTOR. - Google Patents
PROCEDURE AND DEVICE FOR THE CONTACT OF A WIRE CONDUCTOR.Info
- Publication number
- ES2146989T3 ES2146989T3 ES97914139T ES97914139T ES2146989T3 ES 2146989 T3 ES2146989 T3 ES 2146989T3 ES 97914139 T ES97914139 T ES 97914139T ES 97914139 T ES97914139 T ES 97914139T ES 2146989 T3 ES2146989 T3 ES 2146989T3
- Authority
- ES
- Spain
- Prior art keywords
- wire conductor
- terminal area
- procedure
- contact
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
- G06K19/07781—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being fabricated in a winding process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01068—Erbium [Er]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49016—Antenna or wave energy "plumbing" making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49121—Beam lead frame or beam lead device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49147—Assembling terminal to base
- Y10T29/49149—Assembling terminal to base by metal fusion bonding
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Near-Field Transmission Systems (AREA)
- Wire Bonding (AREA)
- Credit Cards Or The Like (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
- Coating With Molten Metal (AREA)
Abstract
Process and device for the contacting of a wire conductor (113) in the course of the manufacture of a transponder unit arranged on a substrate (111) and comprising a wire coil (112) and a chip unit (115), wherein in a first phase the wire conductor (113) is guided away via the terminal area (118, 119) or a region accepting the terminal area and is fixed on the substrate (111) relative to the terminal area (118, 119) or the region assigned to the terminal area, and in a second phase the connection of the wire conductor (113) to the terminal area (118,119) is effected by means of a connecting instrument (125).
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19604840 | 1996-02-12 | ||
DE19619771A DE19619771A1 (en) | 1996-02-12 | 1996-05-17 | Ultrasonic bonding method e.g. for mounting wire conductor on substrate surface |
DE1996120242 DE19620242C2 (en) | 1996-05-20 | 1996-05-20 | Method and device for contacting a wire conductor in the manufacture of a transponder unit |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2146989T3 true ES2146989T3 (en) | 2000-08-16 |
Family
ID=27215898
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES97914139T Expired - Lifetime ES2146989T3 (en) | 1996-02-12 | 1997-02-12 | PROCEDURE AND DEVICE FOR THE CONTACT OF A WIRE CONDUCTOR. |
Country Status (9)
Country | Link |
---|---|
US (1) | US6233818B1 (en) |
EP (1) | EP0880754B1 (en) |
JP (1) | JP3721520B2 (en) |
CN (1) | CN1119768C (en) |
AT (1) | ATE193136T1 (en) |
AU (1) | AU709049B2 (en) |
CA (1) | CA2245775C (en) |
ES (1) | ES2146989T3 (en) |
WO (1) | WO1997030418A2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8028923B2 (en) | 2007-11-14 | 2011-10-04 | Smartrac Ip B.V. | Electronic inlay structure and method of manufacture thereof |
US8090407B2 (en) | 2007-06-27 | 2012-01-03 | On Track Innovations Ltd. | Contactless smart SIM |
Families Citing this family (138)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2769390B1 (en) | 1997-10-08 | 2003-02-14 | Gemplus Card Int | METHOD FOR MANUFACTURING CHIP CARDS SUITABLE FOR PROVIDING CONTACT AND NON-CONTACT OPERATION, AND CONTACTLESS CHIP CARDS |
US20110043430A1 (en) * | 1997-10-16 | 2011-02-24 | Oded Bashan | Manufacture of a smart card |
DE19844089C2 (en) * | 1998-06-25 | 2001-04-05 | Pav Card Gmbh | Process for the production of transponder arrangements |
AU769796B2 (en) * | 1998-12-14 | 2004-02-05 | Advanced Interconnection Technology, Inc. | Improved methods for wire-scribing filament circuit patterns with planar and non-planar portions; improved wire-scribed boards, interconnection cards, and smart cards made by these methods |
US6883714B2 (en) | 1998-12-14 | 2005-04-26 | Stratos Lightwave, Inc. | Methods of optical filament scribing of circuit patterns with planar and non-planar portions |
JP4494558B2 (en) * | 1999-09-13 | 2010-06-30 | 古河電気工業株式会社 | IC card manufacturing method |
WO2000069234A1 (en) * | 1999-05-07 | 2000-11-16 | The Furukawa Electric Co., Ltd. | Wiring method and wiring device |
US20020099473A1 (en) * | 2000-11-08 | 2002-07-25 | Paul Amadeo | Integrated computer-aided design (CAD) and robotic systems for rapid prototyping and manufacture of smart cards |
US7108546B2 (en) * | 2001-06-20 | 2006-09-19 | Formfactor, Inc. | High density planar electrical interface |
US20030060842A1 (en) * | 2001-09-27 | 2003-03-27 | Yem Chin | Method and apparatus for measuring and controlling blade depth of a tissue cutting apparatus in an endoscopic catheter |
US6604686B1 (en) * | 2001-10-09 | 2003-08-12 | Vahid Taban | High speed system for embedding wire antennas in an array of smart cards |
FR2868987B1 (en) * | 2004-04-14 | 2007-02-16 | Arjo Wiggins Secutity Sas Soc | STRUCTURE COMPRISING AN ELECTRONIC DEVICE, IN PARTICULAR FOR THE MANUFACTURE OF A SECURITY OR VALUE DOCUMENT |
WO2006000068A1 (en) * | 2004-06-23 | 2006-01-05 | Global ID South América Ltda. | Process to manufacture transponder and the corresponding production equipment |
JP4363647B2 (en) * | 2004-09-09 | 2009-11-11 | 株式会社小糸製作所 | VEHICLE LIGHT AND METHOD FOR PRODUCING VEHICLE LIGHT |
FR2877462B1 (en) * | 2004-10-29 | 2007-01-26 | Arjowiggins Security Soc Par A | STRUCTURE COMPRISING AN ELECTRONIC DEVICE FOR THE MANUFACTURE OF A SAFETY DOCUMENT. |
CA2585168C (en) * | 2004-11-02 | 2014-09-09 | Imasys Ag | Laying device, contacting device, advancing system, laying and contacting unit, production system, method for the production and a transponder unit |
FR2892842B1 (en) * | 2005-10-28 | 2008-02-15 | Oberthur Card Syst Sa | PROCESS FOR MANUFACTURING A PLURALITY OF MICROCIRCUIT CARDS |
US20070176007A1 (en) * | 2006-01-31 | 2007-08-02 | Priya Suresh C | Variably sized mini card |
JP5167264B2 (en) * | 2006-09-26 | 2013-03-21 | エイチアイディー グローバル ジーエムビーエイチ | Method and apparatus for making a radio frequency inlay |
US7979975B2 (en) * | 2007-04-10 | 2011-07-19 | Feinics Amatech Teavanta | Methods of connecting an antenna to a transponder chip |
US8286332B2 (en) | 2006-09-26 | 2012-10-16 | Hid Global Gmbh | Method and apparatus for making a radio frequency inlay |
US7546671B2 (en) * | 2006-09-26 | 2009-06-16 | Micromechanic And Automation Technology Ltd. | Method of forming an inlay substrate having an antenna wire |
US8322624B2 (en) * | 2007-04-10 | 2012-12-04 | Feinics Amatech Teoranta | Smart card with switchable matching antenna |
US20080179404A1 (en) * | 2006-09-26 | 2008-07-31 | Advanced Microelectronic And Automation Technology Ltd. | Methods and apparatuses to produce inlays with transponders |
US7971339B2 (en) * | 2006-09-26 | 2011-07-05 | Hid Global Gmbh | Method and apparatus for making a radio frequency inlay |
US7581308B2 (en) * | 2007-01-01 | 2009-09-01 | Advanced Microelectronic And Automation Technology Ltd. | Methods of connecting an antenna to a transponder chip |
US8608080B2 (en) | 2006-09-26 | 2013-12-17 | Feinics Amatech Teoranta | Inlays for security documents |
AU2007349611C1 (en) * | 2006-09-26 | 2015-08-06 | Hid Global Gmbh | Method of connecting an antenna to a transponder chip and corresponding inlay substrate |
EP2070017B2 (en) | 2006-09-26 | 2014-09-24 | Féinics AmaTech Teoranta | Method of connecting an antenna to a transponder chip and corresponding transponder inlay |
US8240022B2 (en) * | 2006-09-26 | 2012-08-14 | Feinics Amatech Teorowita | Methods of connecting an antenna to a transponder chip |
EP1914671B1 (en) | 2006-10-12 | 2011-11-23 | HID Global GmbH | Transponder embedded in a flexible multi-layer support |
DE102006053823B4 (en) * | 2006-11-14 | 2009-02-05 | Bundesdruckerei Gmbh | Method for laying a wire |
US7980477B2 (en) * | 2007-05-17 | 2011-07-19 | Féinics Amatech Teoranta | Dual interface inlays |
EP2001077A1 (en) | 2007-05-21 | 2008-12-10 | Gemplus | Method of manufacturing a device comprising a transponder antenna connected to connecting pads and device obtained |
US7707706B2 (en) | 2007-06-29 | 2010-05-04 | Ruhlamat Gmbh | Method and arrangement for producing a smart card |
DE102007030650B4 (en) * | 2007-07-02 | 2011-05-05 | Ruhlamat Automatisierungstechnik Gmbh | Method for producing a chip card |
CA2699552C (en) * | 2007-09-14 | 2013-05-28 | Junsuke Tanaka | Antenna sheet, transponder, and booklet |
ATE488816T1 (en) | 2007-09-18 | 2010-12-15 | Hid Global Ireland Teoranta | METHOD FOR CONTACTING A WIRE CONDUCTOR PLACED ON A SUBSTRATE |
US20090123743A1 (en) * | 2007-11-14 | 2009-05-14 | Guy Shafran | Method of manufacture of wire imbedded inlay |
US20110247197A1 (en) | 2008-01-09 | 2011-10-13 | Feinics Amatech Teoranta | Forming channels for an antenna wire of a transponder |
US8522431B2 (en) * | 2008-01-09 | 2013-09-03 | Féines Amatech Teoranta | Mounting and connecting an antenna wire in a transponder |
KR101286871B1 (en) * | 2008-01-23 | 2013-07-16 | 스마트랙 아이피 비.브이. | Manufacture of a smart card |
CA2712602C (en) | 2008-02-22 | 2014-08-05 | Toppan Printing Co., Ltd. | Transponder and booklet |
EP2138963A1 (en) | 2008-06-27 | 2009-12-30 | Gemplus | Method of manufacturing a device with adjustable thickness comprising a radio frequency transponder antenna and device obtained |
US20100090008A1 (en) * | 2008-10-13 | 2010-04-15 | Oded Bashan | Authentication seal |
DE102009003312A1 (en) * | 2008-10-14 | 2010-04-15 | Hesse & Knipps Gmbh | Bonding device, ultrasonic transducer and bonding method |
US9082438B2 (en) | 2008-12-02 | 2015-07-14 | Panasonic Corporation | Three-dimensional structure for wiring formation |
FR2939935B1 (en) | 2008-12-11 | 2010-12-17 | Oberthur Technologies | METHOD FOR MANUFACTURING MASS OF PORTABLE ELECTRONIC DEVICES FOR CONTACTLESS COMMUNICATIONS. |
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US9070393B2 (en) | 2009-01-27 | 2015-06-30 | Panasonic Corporation | Three-dimensional structure in which wiring is provided on its surface |
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US9622359B2 (en) | 2011-08-08 | 2017-04-11 | Féinics Amatech Teoranta | RFID transponder chip modules |
MX336040B (en) | 2011-09-11 | 2016-01-07 | Feinics Amatech Teoranta | Rfid antenna modules and methods of making. |
US20130075476A1 (en) | 2011-09-23 | 2013-03-28 | Hid Global Ireland Teoranta | Secure rfid device and method of production |
JP5884471B2 (en) * | 2011-12-26 | 2016-03-15 | 凸版印刷株式会社 | Module substrate manufacturing method and manufacturing apparatus thereof |
JP5862284B2 (en) * | 2011-12-27 | 2016-02-16 | 凸版印刷株式会社 | Module substrate manufacturing method and manufacturing apparatus thereof |
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- 1997-02-12 ES ES97914139T patent/ES2146989T3/en not_active Expired - Lifetime
- 1997-02-12 AU AU28463/97A patent/AU709049B2/en not_active Expired
- 1997-02-12 US US09/117,970 patent/US6233818B1/en not_active Expired - Lifetime
- 1997-02-12 AT AT97914139T patent/ATE193136T1/en active
- 1997-02-12 JP JP52888497A patent/JP3721520B2/en not_active Expired - Lifetime
- 1997-02-12 CA CA002245775A patent/CA2245775C/en not_active Expired - Lifetime
- 1997-02-12 EP EP97914139A patent/EP0880754B1/en not_active Expired - Lifetime
- 1997-02-12 WO PCT/DE1997/000261 patent/WO1997030418A2/en active IP Right Grant
- 1997-02-12 CN CN97192030A patent/CN1119768C/en not_active Expired - Lifetime
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US8028923B2 (en) | 2007-11-14 | 2011-10-04 | Smartrac Ip B.V. | Electronic inlay structure and method of manufacture thereof |
Also Published As
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US6233818B1 (en) | 2001-05-22 |
CN1210602A (en) | 1999-03-10 |
ATE193136T1 (en) | 2000-06-15 |
JP2000502477A (en) | 2000-02-29 |
EP0880754A2 (en) | 1998-12-02 |
AU2846397A (en) | 1997-09-02 |
JP3721520B2 (en) | 2005-11-30 |
WO1997030418A3 (en) | 1997-10-02 |
AU709049B2 (en) | 1999-08-19 |
EP0880754B1 (en) | 2000-05-17 |
WO1997030418A2 (en) | 1997-08-21 |
CN1119768C (en) | 2003-08-27 |
CA2245775A1 (en) | 1997-08-21 |
CA2245775C (en) | 2004-04-06 |
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