JP4494558B2 - IC card manufacturing method - Google Patents

IC card manufacturing method Download PDF

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Publication number
JP4494558B2
JP4494558B2 JP25906999A JP25906999A JP4494558B2 JP 4494558 B2 JP4494558 B2 JP 4494558B2 JP 25906999 A JP25906999 A JP 25906999A JP 25906999 A JP25906999 A JP 25906999A JP 4494558 B2 JP4494558 B2 JP 4494558B2
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Japan
Prior art keywords
adhesive sheet
card
chip
wiring
linear conductor
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JP25906999A
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JP2001084351A (en
Inventor
繁男 山口
雅明 荒堀
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THE FURUKAW ELECTRIC CO., LTD.
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THE FURUKAW ELECTRIC CO., LTD.
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Priority to JP25906999A priority Critical patent/JP4494558B2/en
Application filed by THE FURUKAW ELECTRIC CO., LTD. filed Critical THE FURUKAW ELECTRIC CO., LTD.
Priority to PCT/JP2000/002880 priority patent/WO2000069234A1/en
Priority to KR1020017000112A priority patent/KR100713319B1/en
Priority to CNB008007802A priority patent/CN1178564C/en
Priority to EP20000922938 priority patent/EP1100296A4/en
Priority to TW89108646A priority patent/TW451453B/en
Priority to US09/755,749 priority patent/US6665931B2/en
Publication of JP2001084351A publication Critical patent/JP2001084351A/en
Priority to US10/685,844 priority patent/US6810580B2/en
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Publication of JP4494558B2 publication Critical patent/JP4494558B2/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/4554—Coating
    • H01L2224/45599—Material
    • H01L2224/4569—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/4813—Connecting within a semiconductor or solid-state body, i.e. fly wire, bridge wire
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]

Description

【０００１】
【発明の属する技術分野】
本発明は、半導体チップ部品および抵抗やコンデンサからなるチップ状電子部品を搭載したＩＣカード、特にアンテナコイルを備えたＩＣカードを簡易に製造することのできるＩＣカードの製造方法に関する。
【０００２】
【関連する背景技術】
近時、情報処理機能を有するＩＣカードの普及が目覚ましく、中でもアンテナコイルを内蔵して各種情報処理機器との間で非接触の情報通信を行うようにしたＩＣカードの利用が注目されている。この種のＩＣカードは、一般的には銅箔をラミネートした配線板をエッチング処理する等してアンテナコイルを成型し、その表面を保護基板にて覆った構造を有している。
【０００３】
尚、カード基板に装着するアンテナコイルをメッキ法や印刷法を用いて形成したり、或いはカード基板に熱風を吹き付けて熱軟化させながら線状導体を所定のパターン形状をなして埋め込むことで、更には線状導体に超音波振動を与えながら基板表面に順次埋め込んで行くことでアンテナコイルを形成することも提唱されている。
【０００４】
【発明が解決しようとする課題】
しかしながら銅箔をエッチング処理してアンテナコイルを形成することは、その製造工程が複雑であることのみならず、アンテナコイルとしての導体密度を十分に高くすることができない。これ故、アンテナ特性やその製造コストの点で問題がある。またメッキ法や印刷法にてアンテナコイルを製作する場合、一般的にはその導体膜厚を厚くすることが困難であり、曲げ応力や引っ張り応力に対する強度、ひいてはＩＣカードへの実装後の強度や信頼性に問題がある。
【０００５】
また前述した超音波振動を与えながら線状導体を布設するものにあっては、超音波振動による線状導体の疲労断線の問題がある。更にはこの手法にあっては、超音波振動による摩擦熱を利用して基板表面を軟化させて線状導体を埋設するので、その埋設条件の最適設定が非常に難しいと言う問題がある。しかも高価な超音波振動装置を必要とし、設備コストが掛かると言う問題もある。
【０００６】
本発明はこのような事情を考慮してなされたもので、その目的は、例えばアンテナコイルを備えたＩＣカードを簡易に信頼性良く、しかも安価に製造することのできるＩＣカードの製造方法を提供することにある。
【０００７】
【課題を解決するための手段】
上述した目的を達成するべく本発明に係るＩＣカードの製造方法は、粘着シートの表面に沿って相対的に移動可能に設けられた布線ヘッドを該粘着シートの表面に間欠的に点接触させながら線状導体を繰り出すことで、前記粘着シートの表面に前記線状導体を順次貼付していくと言う、本発明者等が先に特願平１１−１２６９８８号にて提唱した布線技術を用いて実現されるもので、粘着シート上の所定の位置にチップ部品または端子部をなすランド体を貼付した後（第１の工程）、布線ヘッドを下降させることで前記布線ヘッドのノズル先端より導出される線状導体を前記粘着シート上に点接触させ、次に前記布線ヘッドを上昇させることで前記線状導体を前記ノズル先端から引出し、次に前記布線ヘッドを所定の布線パターンより定まる方向に所定量だけ移動させる、といった前記布線ヘッドの下降、上昇、及び移動を繰り返すことで、前記線状導体を前記粘着シート上に間欠的に点接触させながら前記布線パターン形状に布線してアンテナコイルを形成し（第２の工程）、前記線状導体の端末を前記チップ部品またはランド体に電気的接続する（第３の工程）。その後、前記線状導体が布線された粘着シートと所定のカード基板とを相互に貼り合わせる（第４の工程）ことを特徴としている。
【０００８】
好ましくは前記粘着シートの線状導体が布線された表面にカード基板を貼付し、或いはカード基板の表面に前記粘着シートを貼付することで、粘着シートとカード基板とを相互に貼り合わせる。より好ましくは請求項２に記載するように一対のカード基板にて前記粘着シートを挟み込むことを特徴としている。この際、請求項３に記載するように前記粘着シートとしては、絶縁性の両面粘着シートを用いることが好ましい。
【０００９】
尚、前記チップ部品は、請求項４に記載するように半導体集積回路素子等の半導体チップ部品、チップ状の抵抗、及びチップ状のコンデンサのいずれか１つ以上を含むチップ状電子部品からなり、また所定のパターン形状をなして布線される線状導体にて前記チップ部品を相互に電気的接続する配線パターンを形成したり、更にはアンテナコイルを形成することを特徴としている。
【００１０】
【発明の実施の形態】
以下、図面を参照して本発明の一実施形態に係るＩＣカードの製造方法について説明する。
このＩＣカードの製造方法は、図１にその製造工程を分解して段階的に示すように、先ずその裏面に剥離シート１を備えた両面粘着シート２を準備し、この両面粘着シート２の露出した粘着面（表面）の所定の位置に半導体集積回路素子等の半導体チップ部品（ＩＣチップ）３や、抵抗やコンデンサ等のチップ状電子部品（図示せず）、更には電気的接続端子部をなす円形状の導体パターンからなるランド体（図示せず）を貼付する［第１の工程］。
【００１１】
尚、上記両面粘着シート２としては、例えば熱硬化型ゴム系粘着層やアクリル系粘着層、或いはシリコーン系粘着層等からなる接着剤層（粘着面）を設けたポリエステルやポリイミドをベース（支持体）とするシート状の可撓性フィルムを用いることができる。より薄くしたい場合には、例えば寺岡製作所製のベースレス（無支持体）の両面粘着シート［＃7021］（接着剤層のみを有する粘着シート）を用いることができる。前述した剥離シート１は、上記ベース（支持体）の両面にそれぞれ設けられた接着剤層（粘着面）の一方の面に剥離可能に設けられる。尚、接着剤層だけの粘着シートを用いた場合には、上記剥離シート１はその一方の面に剥離可能に設けられる。
【００１２】
しかる後、上述した如くＩＣチップ３等を所定の位置に貼付した両面粘着シート２の表面に、図１(ａ)に示すように布線ヘッド１１を用いて０.１４ｍｍ径のポリウレタン線等の線状導体４を布線し、所定のパターン形状をなすアンテナコイル５を形成する［第２の工程］。
この布線ヘッド１１を用いた線状導体４の両面粘着シート２上への布線は、例えば図２に示すように構成された布線装置を用いて行われる。
【００１３】
この布線装置について簡単に説明すると、布線装置はテーブル（コンベア機構）１２上に載置された両面粘着シート２に対して、前記布線ヘッド１１を移動機構（ＸＹテーブル）１３に支持して平面移動可能に設けて構成される。移動機構１３は、マイクロプロセッサ等からなる制御部１４の制御の下で前記布線ヘッド１１を粘着シート２の表面に沿わせて、予め設定されたパターンを描きながら２次元的（平面的）に移動させる役割を担う。また布線ヘッド１１は、この平面移動に関連して上下動して、そのノズル先端を粘着シート２の表面に間欠的に点接触させながら、ボビン２５から巻き戻されてテンショナ２６やガイドシープ２７等を介して供給される線状導体４を前記粘着シート２の表面に順次布設する。
【００１４】
即ち、布線ヘッド１１は、その下降に伴ってそのノズル先端より導出される線状導体４を粘着シート２の表面に瞬時的に点接触させ、該粘着シート２の表面（粘着面）にピンポイントで貼付する。その後、布線ヘッド１１は、その上昇により線状導体４をノズル先端から引き出し（繰り出し）、前記移動機構１３により布線パターンにより定まる方向に所定量だけ移動された後に再び下降して前記線状導体４を粘着シート２の表面（粘着面）に貼付する。このようにして平面移動しながら上下に駆動される布線ヘッド１１により、図３に示すように布線ヘッド１１のノズル先端から導出した線状導体４が粘着シート２に間欠的に点接触し、その接触点Ｐ1,Ｐ2,Ｐ3,…間に該線状導体４が順次に布設される。換言すれば、恰もミシンで糸を縫い付けるように粘着シート２の表面に線状導体４が所定のパターンを形成して布設されていくことになる。
【００１５】
このような布線装置を用いて前記両面粘着シート２上に線状導体４を布線して所定のパターン形状をなすアンテナコイル５を形成したならば、次に図１(ｂ)に示すように、前記線状導体４の端末（アンテナコイル５）を前記ＩＣチップ３の所定の端子部に半田付けする等して電気的に接続する［第３の工程］。尚、両面粘着シート２上に貼付されたＩＣチップ３や、抵抗やコンデンサ等のチップ状電子部品との間の配線が必要な場合には、前述したアンテナコイル５の布設形成時にその配線パターンの布設形成も行い、これらの各端末の所定部位への電気的接続がそれぞれ行われる。
【００１６】
但し、アンテナコイル５の形成に用いられる線状導体４と、チップ部品間の配線に用いられる線状導体４とが異なるような場合に、例えばアンテナコイル５の布設形成とその半田付け処理を行った後、前記線状導体４を配線用のものに変更し、同様にしてその線状導体４の布線と、ＩＣチップ３等の端子部やランド体への半田付けを行うようにすれば良い。つまり線状導体４の種別を変更して、上述した第２工程と第３工程とを繰り返し実行するようにすれば良い。
【００１７】
以上のようにして両面粘着シート２の表面にＩＣチップ３等を配置し、またアンテナコイル５を布設形成して図１(ｂ)に示すように所定の機能回路（ＩＣカードの本体部）を形成したならば、次に図１(ｃ)に示すように上記両面粘着シート２の上面から所定のカード基板６を貼り合わせる［第４の工程］。しかる後、図１(ｃ)に示すように上記両面粘着シート２の裏面に設けられた剥離シート１を剥離し、これによって露出した裏面側の粘着面に上記カード基板６と対をなす下面側のカード基板７を貼り合わせる［第４の工程］。
【００１８】
これらのカード基板６,７は、ＰＶＣ（ポリ塩化ビニル）やＰＥＴ（ポリエチレンテフタレート）等からなる。またこの際、カード基板６,７を両面粘着シート２の外形寸法よりも若干大きめのものとし、両面粘着シート２をその内側に位置付けてカード基板６,７の外周縁部が直接接触するようにする。そして直接接触したカード基板６,７の外周縁部を、スポット溶接して両者を一体化し、図１(ｅ)に示すように一対のカード基板６,７の間に両面粘着シート２を挟み込んでＩＣカードを完成させる。
【００１９】
尚、カード基板６,７と両面粘着シート２との外形寸法が同じであるならば、カード基板６,７の間に両面粘着シート２を挟み込んでこれらを接合一体化した後、その端面を全周に亘って樹脂コートしたり、その全体をラミネートする等して両面粘着シート２を保護することが好ましい。
かくして上述した如くして製造されるＩＣカードによれば、特に両面粘着シート２上に線状導体４を布線して所定のパターン形状をなすアンテナコイル５を形成し、また粘着シート２上に貼付されたチップ部品間の配線を施すので、その製造工程の単純化を図ることができ、製造コストの低減に大きく寄与し得る。しかも所定の線状導体４を両面粘着シート２上に直接布設するので、アンテナコイル５としての導体密度を十分に高くすることも容易であり、特に線状導体４として絶縁被覆銅線を用いた場合には、アンテナコイルパターンを密着させて形成することもできるので、そのアンテナ特性を十分に高いものとすることができる。更にはメッキ法や印刷法にてアンテナコイル５を製作する場合のように曲げ応力や引っ張り応力に対する強度の問題を招来することがなく、また超音波振動を用いて布線する場合のような疲労断線の虞もない。従って簡易にして安定に、信頼性の高いＩＣカードを安価に製造し得ると言う効果が奏せられる。
【００２０】
またカード基板６,７への接合についても、両面粘着シート２が有する粘着機能をそのまま利用することができるので、その接合作業が容易であり、この点でも製造工程の簡素化を図ることができる等の効果が奏せられる。
尚、本発明は上述した実施形態に限定されるものではない。例えばこの実施形態においては、両面粘着シート２の両面に一対のカード基板６,７を接合したが、その一面、具体的にはチップ部品を貼付し、アンテナコイル５を形成した粘着面にのみカード基板６を貼付した構造のＩＣカードとすることも可能である。また両面粘着シート２の裏面側に予めカード基板７を接合した後、該両面粘着シート２の上面にチップ部品を配置し、またアンテナコイル５を布設形成するようにしても良い。
【００２１】
またここではアンテナコイル５を備えたＩＣカードの製造を例に説明したが、アンテナコイル５を備えることのないＩＣカードの製造にも同様に適用することができる。この場合には、粘着シート２の上に配置されたチップ部品間を線状導体４を用いて順次電気的に配線していくようにすれば良い。その他、本発明はその要旨を逸脱しない範囲で種々し変形して実施することができる。
【００２２】
【発明の効果】
以上説明したように本発明によれば粘着シート上にチップ部品を貼付した後、該粘着シート上に線状導体を布設して上記チップ部品に対する配線を施したり、更には所定パターン形状のアンテナコイルを形成し、その後、この粘着シートを所定のカード基板に貼り付けるので、ＩＣカードを容易に、且つ信頼性良く安価に製造することができる。しかも特性に優れ、強度的に安定したアンテナコイルを容易に形成することができるので、信頼性の高いＩＣカードを安価に製造し得る等の実用上多大なる効果が奏せられる。
【図面の簡単な説明】
【図１】本発明の一実施形態に係るＩＣカードの製造方法を、その製造工程を分解して段階的に示す図。
【図２】ＩＣカードの製造に用いられる布線装置の概略構成図。
【図３】図２に示す布線装置の布線作用を示す図。
【符号の説明】
１ 剥離シート
２ 両面粘着シート
３ ＩＣチップ（チップ部品）
４ 線状導体
５ アンテナコイル
６,７ カード基板
１１ 布線ヘッド[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method of manufacturing an IC card capable of easily manufacturing an IC card equipped with a semiconductor chip component and a chip-shaped electronic component composed of a resistor and a capacitor, particularly an IC card having an antenna coil.
[0002]
[Related background]
Recently, IC cards having an information processing function have been widely used, and in particular, the use of IC cards with built-in antenna coils to perform non-contact information communication with various information processing devices has attracted attention. This type of IC card generally has a structure in which an antenna coil is formed by etching a wiring board laminated with a copper foil and the surface thereof is covered with a protective substrate.
[0003]
In addition, by forming the antenna coil to be mounted on the card substrate using a plating method or a printing method, or by embedding the linear conductor in a predetermined pattern shape while blowing the hot air on the card substrate and thermally softening it, It is also proposed to form an antenna coil by sequentially embedding it on the substrate surface while applying ultrasonic vibration to the linear conductor.
[0004]
[Problems to be solved by the invention]
However, forming the antenna coil by etching the copper foil not only makes the manufacturing process complicated, but also cannot sufficiently increase the conductor density as the antenna coil. Therefore, there are problems in terms of antenna characteristics and manufacturing costs. In addition, when an antenna coil is manufactured by plating or printing, it is generally difficult to increase the conductor film thickness. The strength against bending stress or tensile stress, and the strength after mounting on an IC card, There is a problem with reliability.
[0005]
Further, in the case where the linear conductor is laid while applying the ultrasonic vibration described above, there is a problem of fatigue breakage of the linear conductor due to the ultrasonic vibration. Further, this method has a problem that it is very difficult to optimally set the embedding condition because the linear conductor is embedded by softening the substrate surface using frictional heat generated by ultrasonic vibration. In addition, there is a problem that an expensive ultrasonic vibration device is required and equipment costs are increased.
[0006]
The present invention has been made in view of such circumstances, and an object of the present invention is to provide an IC card manufacturing method capable of easily and reliably manufacturing an IC card having an antenna coil, for example, at low cost. There is to do.
[0007]
[Means for Solving the Problems]
In order to achieve the above-described object, the IC card manufacturing method according to the present invention includes a wiring head that is relatively movable along the surface of the pressure-sensitive adhesive sheet and intermittently makes point contact with the surface of the pressure-sensitive adhesive sheet. However, the present inventors have previously proposed the wiring technique proposed in Japanese Patent Application No. 11-126988, in which the linear conductors are successively applied to the surface of the pressure-sensitive adhesive sheet by drawing out the linear conductors. This is realized by using a nozzle of the wiring head by lowering the wiring head after affixing a land part forming a chip part or a terminal part at a predetermined position on the adhesive sheet (first step). The linear conductor led out from the tip is brought into point contact with the pressure-sensitive adhesive sheet , and then the wiring head is lifted to draw out the linear conductor from the tip of the nozzle, and then the wiring head is connected to a predetermined cloth. Determined from line pattern It is moved by a predetermined amount in direction, such as downward movement of the wiring head, rise, and by repeating the movement, wiring to the wiring pattern while intermittently by point contact with the linear conductor on said adhesive sheet Then, an antenna coil is formed (second step), and the end of the linear conductor is electrically connected to the chip part or the land body (third step). Then, the adhesive sheet in which the linear conductor is wired and a predetermined card substrate are bonded to each other (fourth step).
[0008]
Preferably, the pressure-sensitive adhesive sheet and the card substrate are bonded to each other by affixing the card substrate to the surface of the pressure-sensitive adhesive sheet on which the linear conductor is wired, or by sticking the pressure-sensitive adhesive sheet to the surface of the card substrate. More preferably, as described in claim 2, the adhesive sheet is sandwiched between a pair of card substrates. Under the present circumstances, as described in Claim 3, it is preferable to use an insulating double-sided pressure-sensitive adhesive sheet as the pressure-sensitive adhesive sheet.
[0009]
The chip component includes a chip-shaped electronic component including any one or more of a semiconductor chip component such as a semiconductor integrated circuit element, a chip-shaped resistor , and a chip-shaped capacitor as described in claim 4. Further, the present invention is characterized in that a wiring pattern for electrically connecting the chip components to each other is formed by a linear conductor that is wired in a predetermined pattern shape, and further an antenna coil is formed.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an IC card manufacturing method according to an embodiment of the present invention will be described with reference to the drawings.
In this IC card manufacturing method, as shown in FIG. 1 in a step-by-step manner, the double-sided pressure-sensitive adhesive sheet 2 provided with the release sheet 1 is first prepared on the back surface, and the double-sided pressure-sensitive adhesive sheet 2 is exposed. A semiconductor chip component (IC chip) 3 such as a semiconductor integrated circuit element, a chip-shaped electronic component (not shown) such as a resistor or a capacitor, or an electrical connection terminal portion is provided at a predetermined position on the adhesive surface (surface). A land body (not shown) made of a circular conductor pattern is pasted [first step].
[0011]
The double-sided pressure-sensitive adhesive sheet 2 is made of, for example, a polyester or polyimide base (support) provided with an adhesive layer (adhesive surface) composed of a thermosetting rubber-based adhesive layer, an acrylic adhesive layer, or a silicone-based adhesive layer. A sheet-like flexible film can be used. In order to make it thinner, for example, a baseless (non-supporting) double-sided pressure-sensitive adhesive sheet [# 7021] (pressure-sensitive adhesive sheet having only an adhesive layer) manufactured by Teraoka Seisakusho can be used. The release sheet 1 described above is detachably provided on one surface of an adhesive layer (adhesive surface) provided on both surfaces of the base (support). In addition, when the adhesive sheet only of an adhesive bond layer is used, the said peeling sheet 1 is provided in the one surface so that peeling is possible.
[0012]
Thereafter, a 0.14 mm diameter polyurethane wire or the like is used on the surface of the double-sided pressure-sensitive adhesive sheet 2 to which the IC chip 3 or the like is stuck at a predetermined position as described above, using the wiring head 11 as shown in FIG. The wire conductor 4 is wired and the antenna coil 5 having a predetermined pattern shape is formed [second step].
The wiring of the linear conductor 4 on the double-sided pressure-sensitive adhesive sheet 2 using the wiring head 11 is performed using, for example, a wiring device configured as shown in FIG.
[0013]
Briefly describing this wiring apparatus, the wiring apparatus supports the wiring head 11 on a moving mechanism (XY table) 13 against a double-sided adhesive sheet 2 placed on a table (conveyor mechanism) 12. It is configured to be movable on the plane. The moving mechanism 13 moves the wiring head 11 along the surface of the pressure-sensitive adhesive sheet 2 under the control of the control unit 14 such as a microprocessor and draws a preset pattern in a two-dimensional (planar) manner. Take the role of moving. In addition, the wiring head 11 moves up and down in relation to this plane movement, and is unwound from the bobbin 25 while intermittently making point contact with the surface of the pressure-sensitive adhesive sheet 2, so that the tensioner 26 and the guide sheep 27 are wound. The linear conductors 4 supplied through the like are sequentially laid on the surface of the pressure-sensitive adhesive sheet 2.
[0014]
That is, as the wiring head 11 descends, the wire conductor 4 led out from the nozzle tip is instantaneously brought into point contact with the surface of the pressure-sensitive adhesive sheet 2, and the surface of the pressure-sensitive adhesive sheet 2 (adhesive surface) is pinned. Affix with points. Thereafter, the wiring head 11 pulls out (draws) the linear conductor 4 from the tip of the nozzle by its ascent, and is moved down by a predetermined amount in the direction determined by the wiring pattern by the moving mechanism 13 and then descends again to form the linear The conductor 4 is attached to the surface (adhesive surface) of the adhesive sheet 2. By the wiring head 11 that is driven up and down while moving in the plane as described above, the linear conductor 4 led out from the nozzle tip of the wiring head 11 intermittently makes point contact with the adhesive sheet 2 as shown in FIG. The linear conductors 4 are sequentially laid between the contact points P1, P2, P3,. In other words, the linear conductor 4 is laid in a predetermined pattern on the surface of the pressure-sensitive adhesive sheet 2 so that the thread is sewn with a sewing machine.
[0015]
When the antenna coil 5 having a predetermined pattern shape is formed by arranging the linear conductor 4 on the double-sided pressure-sensitive adhesive sheet 2 using such a wiring apparatus, as shown in FIG. Then, the end of the linear conductor 4 (antenna coil 5) is electrically connected to the predetermined terminal portion of the IC chip 3 by soldering or the like [third step]. When wiring between the IC chip 3 affixed on the double-sided pressure-sensitive adhesive sheet 2 and chip-shaped electronic components such as resistors and capacitors is necessary, the wiring pattern of the antenna coil 5 is formed when the antenna coil 5 is laid. The laying is also performed, and electrical connection to predetermined portions of these terminals is performed.
[0016]
However, when the linear conductor 4 used for forming the antenna coil 5 and the linear conductor 4 used for wiring between chip components are different, for example, the antenna coil 5 is laid and soldered. After that, the linear conductor 4 is changed to one for wiring, and similarly, the wiring of the linear conductor 4 and soldering to the terminal portion or land body of the IC chip 3 or the like are performed. good. That is, the type of the linear conductor 4 may be changed and the above-described second process and third process may be repeatedly executed.
[0017]
As described above, the IC chip 3 and the like are arranged on the surface of the double-sided pressure-sensitive adhesive sheet 2, and the antenna coil 5 is laid to form a predetermined functional circuit (IC card main body) as shown in FIG. Once formed, a predetermined card substrate 6 is bonded from the upper surface of the double-sided pressure-sensitive adhesive sheet 2 as shown in FIG. 1 (c) [fourth step]. Thereafter, as shown in FIG. 1 (c), the release sheet 1 provided on the back surface of the double-sided pressure-sensitive adhesive sheet 2 is peeled off, and the bottom surface side that makes a pair with the card substrate 6 on the back-side adhesive surface exposed thereby. The card substrate 7 is bonded together [fourth step].
[0018]
These card substrates 6 and 7 are made of PVC (polyvinyl chloride), PET (polyethylene terephthalate), or the like. At this time, the card substrates 6 and 7 are slightly larger than the external dimensions of the double-sided pressure-sensitive adhesive sheet 2, and the double-sided pressure-sensitive adhesive sheet 2 is positioned on the inner side so that the outer peripheral edges of the card substrates 6 and 7 are in direct contact with each other. To do. Then, the outer peripheral edge portions of the card substrates 6 and 7 that are in direct contact are spot-welded to integrate them, and the double-sided adhesive sheet 2 is sandwiched between the pair of card substrates 6 and 7 as shown in FIG. Complete the IC card.
[0019]
If the external dimensions of the card substrates 6 and 7 and the double-sided pressure-sensitive adhesive sheet 2 are the same, the double-sided pressure-sensitive adhesive sheet 2 is sandwiched between the card substrates 6 and 7 and joined together. It is preferable to protect the double-sided pressure-sensitive adhesive sheet 2 by resin coating over the circumference or laminating the whole.
Thus, according to the IC card manufactured as described above, the antenna coil 5 having a predetermined pattern shape is formed by arranging the linear conductor 4 on the double-sided pressure-sensitive adhesive sheet 2, and on the pressure-sensitive adhesive sheet 2. Since wiring between the affixed chip parts is performed, the manufacturing process can be simplified, and the manufacturing cost can be greatly reduced. In addition, since the predetermined linear conductor 4 is directly laid on the double-sided pressure-sensitive adhesive sheet 2, it is easy to sufficiently increase the conductor density as the antenna coil 5. In particular, an insulation-coated copper wire is used as the linear conductor 4. In this case, since the antenna coil pattern can be formed in close contact, the antenna characteristics can be made sufficiently high. Furthermore, there is no problem of strength against bending stress or tensile stress as in the case of manufacturing the antenna coil 5 by plating or printing, and fatigue as in the case of wiring using ultrasonic vibration. There is no risk of disconnection. Therefore, there is an effect that a simple and stable IC card with high reliability can be manufactured at low cost.
[0020]
Also, the bonding function of the double-sided pressure-sensitive adhesive sheet 2 can be used as it is for bonding to the card substrates 6 and 7, so that the bonding operation is easy, and in this respect, the manufacturing process can be simplified. Etc. are produced.
The present invention is not limited to the embodiment described above. For example, in this embodiment, a pair of card substrates 6 and 7 are bonded to both sides of the double-sided pressure-sensitive adhesive sheet 2, but the card is attached only to one side, specifically, the pressure-sensitive adhesive surface on which the chip component is pasted and the antenna coil 5 is formed. An IC card having a structure to which the substrate 6 is attached is also possible. Alternatively, after the card substrate 7 is bonded in advance to the back side of the double-sided pressure-sensitive adhesive sheet 2, chip components may be disposed on the top surface of the double-sided pressure-sensitive adhesive sheet 2, and the antenna coil 5 may be laid.
[0021]
Further, here, the manufacture of the IC card provided with the antenna coil 5 has been described as an example, but the present invention can be similarly applied to the manufacture of an IC card not provided with the antenna coil 5. In this case, the chip parts arranged on the pressure-sensitive adhesive sheet 2 may be sequentially electrically wired using the linear conductors 4. In addition, the present invention can be implemented in various modifications without departing from the spirit of the present invention.
[0022]
【The invention's effect】
As described above, according to the present invention, after a chip component is pasted on an adhesive sheet, a linear conductor is laid on the adhesive sheet to provide wiring to the chip component, or an antenna coil having a predetermined pattern shape. Then, the adhesive sheet is attached to a predetermined card substrate, so that the IC card can be manufactured easily and reliably at low cost. In addition, since an antenna coil having excellent characteristics and stable in strength can be easily formed, a great practical effect is achieved such that a highly reliable IC card can be manufactured at low cost.
[Brief description of the drawings]
FIG. 1 is a diagram showing an IC card manufacturing method according to an embodiment of the present invention stepwise by disassembling the manufacturing process.
FIG. 2 is a schematic configuration diagram of a wiring device used for manufacturing an IC card.
FIG. 3 is a diagram showing a wiring action of the wiring device shown in FIG. 2;
[Explanation of symbols]
1 Release sheet 2 Double-sided adhesive sheet 3 IC chip (chip component)
4 Wire conductor 5 Antenna coil 6, 7 Card board 11 Wiring head

Claims (4)

粘着シート上の所定の位置にチップ部品または端子部をなすランド体を貼付する第１の工程と、
布線ヘッドを下降させることで前記布線ヘッドのノズル先端より導出される線状導体を前記粘着シート上に点接触させ、次に前記布線ヘッドを上昇させることで前記線状導体を前記ノズル先端から引出し、次に前記布線ヘッドを所定の布線パターンより定まる方向に所定量だけ移動させる、といった前記布線ヘッドの下降、上昇、及び移動を繰り返すことで、前記線状導体を前記粘着シート上に間欠的に点接触させながら前記布線パターン形状に布線してアンテナコイルを形成する第２の工程と、
前記線状導体の端末を前記チップ部品またはランド体に電気的接続する第３の工程と、
前記線状導体が布線された粘着シートとカード基板とを相互に貼り合わせる第４の工程と、
を備えることを特徴とするＩＣカードの製造方法。A first step of attaching a chip body or a land body forming a terminal portion at a predetermined position on the adhesive sheet;
A linear conductor led out from a nozzle tip of the wiring head is brought into point contact with the adhesive sheet by lowering the wiring head, and then the linear conductor is moved to the nozzle by raising the wiring head. The wire conductor is attached to the adhesive by repeatedly descending, raising, and moving the wire head such that the wire head is pulled out from the tip and then moved by a predetermined amount in a direction determined by a predetermined wire pattern. A second step of forming an antenna coil by wiring in the wiring pattern shape while intermittently making point contact on the sheet;
A third step of electrically connecting the end of the linear conductor to the chip part or land body;
A fourth step in which the adhesive sheet and the card substrate on which the linear conductors are wired are bonded to each other;
An IC card manufacturing method comprising: 前記第４の工程では、前記粘着シートを一対の前記カード基板の間に挟み込んで相互に貼り合わせる
ことを特徴とする請求項１に記載のＩＣカードの製造方法。The method of manufacturing an IC card according to claim 1, wherein in the fourth step, the adhesive sheet is sandwiched between a pair of card substrates and bonded together. 前記粘着シートは、絶縁性の両面粘着シートからなる
ことを特徴とする請求項２に記載のＩＣカードの製造方法。The said adhesive sheet consists of an insulating double-sided adhesive sheet. The manufacturing method of the IC card of Claim 2 characterized by the above-mentioned. 前記チップ部品は、半導体チップ部品、チップ状の抵抗、及びチップ状のコンデンサのいずれか１つ以上を含むチップ状電子部品からなり、
前記線状導体は、前記チップ部品間の配線パターンとして布線されると共に、所定のパターン形状をなして布線されてアンテナコイルを形成する
こととを特徴とする請求項１に記載のＩＣカードの製造方法。The chip component includes a chip-shaped electronic component including one or more of a semiconductor chip component, a chip-shaped resistor, and a chip-shaped capacitor,
2. The IC card according to claim 1, wherein the linear conductor is wired as a wiring pattern between the chip components and is wired in a predetermined pattern shape to form an antenna coil. 3. Manufacturing method.
JP25906999A 1999-05-07 1999-09-13 IC card manufacturing method Expired - Fee Related JP4494558B2 (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP25906999A JP4494558B2 (en) 1999-09-13 1999-09-13 IC card manufacturing method
KR1020017000112A KR100713319B1 (en) 1999-05-07 2000-05-01 Wiring Method and wiring device
CNB008007802A CN1178564C (en) 1999-05-07 2000-05-01 Wiring method and wiring device
EP20000922938 EP1100296A4 (en) 1999-05-07 2000-05-01 Wiring method and wiring device
PCT/JP2000/002880 WO2000069234A1 (en) 1999-05-07 2000-05-01 Wiring method and wiring device
TW89108646A TW451453B (en) 1999-05-07 2000-05-05 Wiring method and wiring device
US09/755,749 US6665931B2 (en) 1999-05-07 2001-01-05 Wiring method for forming conductor wire on a substrate board
US10/685,844 US6810580B2 (en) 1999-05-07 2003-10-14 System for forming conductor wire on a substrate board

Applications Claiming Priority (1)

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JP4753488B2 (en) * 2001-04-03 2011-08-24 株式会社ユポ・コーポレーション IC tag sheet
WO2005112214A1 (en) * 2004-05-13 2005-11-24 Kyung-Chul Jun Wiring branch device
JP5176979B2 (en) * 2009-01-22 2013-04-03 セイコーエプソン株式会社 Surface acoustic wave device and manufacturing method thereof
EP2390825A1 (en) * 2010-05-31 2011-11-30 Gemalto SA Method for manufacturing a device comprising a transponder antenna on a thin core and device obtained

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DE4410732C2 (en) * 1994-03-28 1997-05-07 Amatech Gmbh & Co Kg Method for arranging a transponder unit having at least one chip and a wire coil on a substrate, as well as chip card with a correspondingly arranged transponder unit
US6233818B1 (en) * 1996-02-12 2001-05-22 David Finn Method and device for bonding a wire conductor
JPH10302040A (en) * 1997-04-30 1998-11-13 Toshiba Corp Manufacture of thin type electronic equipment and thin type electronic equipment
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JPH11161761A (en) * 1997-11-27 1999-06-18 Matsushita Electric Ind Co Ltd Non-contact ic card
JPH11204358A (en) * 1998-01-17 1999-07-30 Totoku Electric Co Ltd Sheet coil and its manufacture
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