MX336040B - Rfid antenna modules and methods of making. - Google Patents

Rfid antenna modules and methods of making.

Info

Publication number
MX336040B
MX336040B MX2014002897A MX2014002897A MX336040B MX 336040 B MX336040 B MX 336040B MX 2014002897 A MX2014002897 A MX 2014002897A MX 2014002897 A MX2014002897 A MX 2014002897A MX 336040 B MX336040 B MX 336040B
Authority
MX
Mexico
Prior art keywords
winding core
making
methods
rfid antenna
antenna modules
Prior art date
Application number
MX2014002897A
Other languages
Spanish (es)
Other versions
MX2014002897A (en
Inventor
David Finn
Lionel Carré
Original Assignee
Feinics Amatech Teoranta
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US13/294,578 external-priority patent/US20120055013A1/en
Priority claimed from US13/310,718 external-priority patent/US8366009B2/en
Application filed by Feinics Amatech Teoranta filed Critical Feinics Amatech Teoranta
Publication of MX2014002897A publication Critical patent/MX2014002897A/en
Publication of MX336040B publication Critical patent/MX336040B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Abstract

A winding core (WC) having a tubular body portion (B) and two ends is mounted by one of its ends to a module tape (MT), a module antenna (MA) is wound around the winding core (WC), a chip (CM) is disposed on the module tape (MT) within the winding core (WC). Connections (wb) are made, and glob-top (GT) is applied over the chip (CM), substantially filling the interior area of the winding core (WC). The module antenna (MA), winding core (WC) and chip (CM) may subsequently be overmolded with a mold mass (MM). The winding core (WC) may have a flange (F) at one end.
MX2014002897A 2011-09-11 2012-08-20 Rfid antenna modules and methods of making. MX336040B (en)

Applications Claiming Priority (12)

Application Number Priority Date Filing Date Title
US201161533228P 2011-09-11 2011-09-11
US13/294,578 US20120055013A1 (en) 2010-07-13 2011-11-11 Forming microstructures and antennas for transponders
US201161561938P 2011-11-21 2011-11-21
US13/310,718 US8366009B2 (en) 2010-08-12 2011-12-03 Coupling in and to RFID smart cards
US201161569317P 2011-12-12 2011-12-12
US201261586781P 2012-01-14 2012-01-14
US201261595088P 2012-02-05 2012-02-05
US201261624384P 2012-04-15 2012-04-15
US201261624412P 2012-04-16 2012-04-16
US201261646369P 2012-05-14 2012-05-14
US201261660668P 2012-06-15 2012-06-15
PCT/EP2012/066183 WO2013034426A1 (en) 2011-09-11 2012-08-20 Rfid antenna modules and methods of making

Publications (2)

Publication Number Publication Date
MX2014002897A MX2014002897A (en) 2014-10-14
MX336040B true MX336040B (en) 2016-01-07

Family

ID=46763058

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2014002897A MX336040B (en) 2011-09-11 2012-08-20 Rfid antenna modules and methods of making.

Country Status (8)

Country Link
EP (1) EP2754204A1 (en)
KR (1) KR20140071423A (en)
CN (1) CN103891045B (en)
AU (1) AU2012306568A1 (en)
BR (1) BR112014005507A2 (en)
CA (1) CA2847968A1 (en)
MX (1) MX336040B (en)
WO (1) WO2013034426A1 (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9112272B2 (en) 2010-08-12 2015-08-18 Feinics Amatech Teoranta Antenna modules for dual interface smart cards, booster antenna configurations, and methods
US10518518B2 (en) 2013-01-18 2019-12-31 Féinics Amatech Teoranta Smart cards with metal layer(s) and methods of manufacture
US10733494B2 (en) 2014-08-10 2020-08-04 Féinics Amatech Teoranta Contactless metal card constructions
US10824931B2 (en) 2012-08-30 2020-11-03 Féinics Amatech Teoranta Contactless smartcards with multiple coupling frames
US10552722B2 (en) 2014-08-10 2020-02-04 Féinics Amatech Teoranta Smartcard with coupling frame antenna
US10599972B2 (en) 2013-01-18 2020-03-24 Féinics Amatech Teoranta Smartcard constructions and methods
US10977542B2 (en) 2013-01-18 2021-04-13 Amtech Group Limited Industrial Estate Smart cards with metal layer(s) and methods of manufacture
US11354558B2 (en) 2013-01-18 2022-06-07 Amatech Group Limited Contactless smartcards with coupling frames
US11551051B2 (en) 2013-01-18 2023-01-10 Amatech Group Limiied Coupling frames for smartcards with various module opening shapes
US11354560B2 (en) 2013-01-18 2022-06-07 Amatech Group Limited Smartcards with multiple coupling frames
EP3005242A1 (en) * 2013-05-28 2016-04-13 Féinics AmaTech Teoranta Antenna modules for dual interface smartcards, booster antenna configurations, and methods
CN103730733B (en) * 2013-09-09 2019-03-22 胜美达集团株式会社 Electronic module
KR102085105B1 (en) * 2019-05-20 2020-03-05 주식회사 엔에이블 Smart card for electronics passport capable of thinner

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US5261615A (en) 1989-07-03 1993-11-16 Sokymat Sa Process for manufacturing electronic components comprising a fine-wire winding, and device for holding the winding wire permitting manufacture according to this process
DE3935364C1 (en) 1989-10-24 1990-08-23 Angewandte Digital Elektronik Gmbh, 2051 Brunstorf, De
WO1991016718A1 (en) 1990-04-19 1991-10-31 Ake Gustafson Method for assembling a coil on a printed circuit
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US5572410A (en) 1991-02-25 1996-11-05 Gustafson; Ake Integrated circuit device having a winding connected to an integrated circuit solely by a wire
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FR2919409B1 (en) 2007-07-26 2009-09-04 Smart Packaging Solutions Sps SECURE DOCUMENT WITH NON-CONTACT CHIP WITH DATA PROTECTION AGAINST UNAUTHORIZED READING.
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FR2932910B1 (en) 2008-06-20 2011-02-11 Smart Packaging Solutions Sps CARD WITHOUT CONTACT WITH SECURITY LOGO
US8474726B2 (en) 2010-08-12 2013-07-02 Feinics Amatech Teoranta RFID antenna modules and increasing coupling

Also Published As

Publication number Publication date
AU2012306568A1 (en) 2014-03-20
CN103891045B (en) 2016-08-17
WO2013034426A1 (en) 2013-03-14
BR112014005507A2 (en) 2017-06-13
KR20140071423A (en) 2014-06-11
MX2014002897A (en) 2014-10-14
CN103891045A (en) 2014-06-25
CA2847968A1 (en) 2013-03-14
EP2754204A1 (en) 2014-07-16

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