CA2449413A1 - Method and device for bonding a wire conductor - Google Patents

Method and device for bonding a wire conductor Download PDF

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Publication number
CA2449413A1
CA2449413A1 CA002449413A CA2449413A CA2449413A1 CA 2449413 A1 CA2449413 A1 CA 2449413A1 CA 002449413 A CA002449413 A CA 002449413A CA 2449413 A CA2449413 A CA 2449413A CA 2449413 A1 CA2449413 A1 CA 2449413A1
Authority
CA
Canada
Prior art keywords
terminal area
wire conductor
bonding
phase
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA002449413A
Other languages
French (fr)
Other versions
CA2449413C (en
Inventor
David Finn
Manfred Rietzler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Smartrac IP BV
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19619771A external-priority patent/DE19619771A1/en
Priority claimed from DE1996120242 external-priority patent/DE19620242C2/en
Application filed by Individual filed Critical Individual
Priority claimed from CA002245775A external-priority patent/CA2245775C/en
Publication of CA2449413A1 publication Critical patent/CA2449413A1/en
Application granted granted Critical
Publication of CA2449413C publication Critical patent/CA2449413C/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Abstract

Process and device for the contacting of a wire conductor in the course of the manufacture of a transponder unit arranged on a substrate and comprising a wire coil and a chip unit, wherein in a first phase the wire conductor is guided away via the terminal area, or a region accepting the terminal area and is fixed on the substrate relative to the terminal area or the region assigned to the terminal area, and in a second phase the connection of the wire conductor to the terminal area is effected by means of a connecting instrument.
CA002449413A 1996-02-12 1997-02-12 Method and device for bonding a wire conductor Expired - Lifetime CA2449413C (en)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
DE19604840.0 1996-02-12
DE19604840 1996-02-12
DE19619771.6 1996-05-17
DE19619771A DE19619771A1 (en) 1996-02-12 1996-05-17 Ultrasonic bonding method e.g. for mounting wire conductor on substrate surface
DE1996120242 DE19620242C2 (en) 1996-05-20 1996-05-20 Method and device for contacting a wire conductor in the manufacture of a transponder unit
DE19620242.6 1996-05-20
CA002245775A CA2245775C (en) 1996-02-12 1997-02-12 Method and device for bonding a wire conductor

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CA002245775A Division CA2245775C (en) 1996-02-12 1997-02-12 Method and device for bonding a wire conductor

Publications (2)

Publication Number Publication Date
CA2449413A1 true CA2449413A1 (en) 1997-08-21
CA2449413C CA2449413C (en) 2005-10-04

Family

ID=30773556

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002449413A Expired - Lifetime CA2449413C (en) 1996-02-12 1997-02-12 Method and device for bonding a wire conductor

Country Status (1)

Country Link
CA (1) CA2449413C (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8028923B2 (en) 2007-11-14 2011-10-04 Smartrac Ip B.V. Electronic inlay structure and method of manufacture thereof
US8090407B2 (en) 2007-06-27 2012-01-03 On Track Innovations Ltd. Contactless smart SIM

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8090407B2 (en) 2007-06-27 2012-01-03 On Track Innovations Ltd. Contactless smart SIM
US8028923B2 (en) 2007-11-14 2011-10-04 Smartrac Ip B.V. Electronic inlay structure and method of manufacture thereof

Also Published As

Publication number Publication date
CA2449413C (en) 2005-10-04

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Legal Events

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EEER Examination request
MKEX Expiry

Effective date: 20170213