CA2449413A1 - Method and device for bonding a wire conductor - Google Patents
Method and device for bonding a wire conductor Download PDFInfo
- Publication number
- CA2449413A1 CA2449413A1 CA002449413A CA2449413A CA2449413A1 CA 2449413 A1 CA2449413 A1 CA 2449413A1 CA 002449413 A CA002449413 A CA 002449413A CA 2449413 A CA2449413 A CA 2449413A CA 2449413 A1 CA2449413 A1 CA 2449413A1
- Authority
- CA
- Canada
- Prior art keywords
- terminal area
- wire conductor
- bonding
- phase
- wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Process and device for the contacting of a wire conductor in the course of the manufacture of a transponder unit arranged on a substrate and comprising a wire coil and a chip unit, wherein in a first phase the wire conductor is guided away via the terminal area, or a region accepting the terminal area and is fixed on the substrate relative to the terminal area or the region assigned to the terminal area, and in a second phase the connection of the wire conductor to the terminal area is effected by means of a connecting instrument.
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19604840.0 | 1996-02-12 | ||
DE19604840 | 1996-02-12 | ||
DE19619771.6 | 1996-05-17 | ||
DE19619771A DE19619771A1 (en) | 1996-02-12 | 1996-05-17 | Ultrasonic bonding method e.g. for mounting wire conductor on substrate surface |
DE1996120242 DE19620242C2 (en) | 1996-05-20 | 1996-05-20 | Method and device for contacting a wire conductor in the manufacture of a transponder unit |
DE19620242.6 | 1996-05-20 | ||
CA002245775A CA2245775C (en) | 1996-02-12 | 1997-02-12 | Method and device for bonding a wire conductor |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA002245775A Division CA2245775C (en) | 1996-02-12 | 1997-02-12 | Method and device for bonding a wire conductor |
Publications (2)
Publication Number | Publication Date |
---|---|
CA2449413A1 true CA2449413A1 (en) | 1997-08-21 |
CA2449413C CA2449413C (en) | 2005-10-04 |
Family
ID=30773556
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA002449413A Expired - Lifetime CA2449413C (en) | 1996-02-12 | 1997-02-12 | Method and device for bonding a wire conductor |
Country Status (1)
Country | Link |
---|---|
CA (1) | CA2449413C (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8028923B2 (en) | 2007-11-14 | 2011-10-04 | Smartrac Ip B.V. | Electronic inlay structure and method of manufacture thereof |
US8090407B2 (en) | 2007-06-27 | 2012-01-03 | On Track Innovations Ltd. | Contactless smart SIM |
-
1997
- 1997-02-12 CA CA002449413A patent/CA2449413C/en not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8090407B2 (en) | 2007-06-27 | 2012-01-03 | On Track Innovations Ltd. | Contactless smart SIM |
US8028923B2 (en) | 2007-11-14 | 2011-10-04 | Smartrac Ip B.V. | Electronic inlay structure and method of manufacture thereof |
Also Published As
Publication number | Publication date |
---|---|
CA2449413C (en) | 2005-10-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CA2245775A1 (en) | Method and device for bonding a wire conductor | |
WO1997011437A8 (en) | Ic board module for producing an ic board and process for producing an ic board | |
EP0773584A3 (en) | Device having resin package and method of producing the same | |
US6088230A (en) | Procedure for producing a chip mounting board and chip-mounting board thus produced | |
EP0737935A3 (en) | Non-contact IC card and process for its production | |
ES2125650T3 (en) | PROCEDURE FOR THE MANUFACTURE OF A MODULE OF CHIP CARDS FOR CHIP CARDS WITHOUT CONTACT. | |
AU8598798A (en) | Conductive epoxy flip-chip on chip | |
IL121087A0 (en) | Method of wire bonding an integrated circuit to an ultraflexible substrate | |
AU2913595A (en) | Microelectronic mounting with multiple lead deformation | |
EP0707316A3 (en) | Semiconducteur device and method for fabricating the same, memory core chip and memory peripheral circuit chip | |
EG21285A (en) | Integrated circuit card secure application module system comprising a secure application module and a terminal and a method for controlling service actions to be carried out by the secure application module on the integrated circuit card | |
AU6812490A (en) | Semiconductor package connecting method, semiconductor package connecting wires and semiconductor devices | |
CA2274785A1 (en) | A chip module and process for the production thereof | |
CA2237819A1 (en) | A micromagnetic device for power processing applications and method of manufacture therefor | |
AU7096696A (en) | Semiconductor device, process for producing the same, and packaged substrate | |
EP0810655A3 (en) | A package for a semiconductor device | |
GB9603568D0 (en) | Method for forming a gold plated electrode a substrate based on the electrode forming method and a wire bonding method utilizing this electrode forming method | |
EP1526476A3 (en) | Mini chip card and method for its production | |
CA2240951A1 (en) | Connecting method of electric wire and terminal | |
CA2058143A1 (en) | Direct microcircuit decoupling | |
AU1391300A (en) | Method for making a contactless chip card | |
WO1995012093A3 (en) | Active metal metallization of mini-igniters by silk screening | |
US20110043430A1 (en) | Manufacture of a smart card | |
MY122332A (en) | Semiconductor device and method of fabricating the same | |
CA2449413A1 (en) | Method and device for bonding a wire conductor |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
EEER | Examination request | ||
MKEX | Expiry |
Effective date: 20170213 |