JP5862284B2 - Module substrate manufacturing method and manufacturing apparatus thereof - Google Patents

Description

  The present invention relates to a module substrate used for a non-contact type IC card or booklet, and in particular, an opening is provided in a paper base material in which a wire conductor is laid in a coil shape at the peripheral portion thereof, and a resin substrate for IC mounting is fitted. The present invention relates to a method of connecting an end portion of a wire conductor to an electrode pad on a resin substrate and an apparatus therefor.

  A non-contact IC card is basically a card in which a transmitting / receiving antenna and an information recording IC chip are electrically connected and embedded in a paper base or plastic base. In general, as shown in FIG. 2, an opening having a predetermined size is provided in a paper base material 1 having a thickness of about 0.2 mm, in which a wire conductor 4 having a diameter of about 0.1 mm is laid in a coil shape. The module substrate 10 in which the IC mounting resin substrate 2 of about 0.17 mm is fitted in the opening is further laminated from both sides with a plastic base material to provide design.

  As shown in FIG. 1, the paper base 1 constituting the module substrate 10 includes an antenna (not shown in FIG. 1) in which wire conductors 4 are laid in a coil shape and an opening 3 for accommodating an IC mounting resin substrate 2. However, in order to lay the wire conductor in the form of a coil on the periphery of the paper substrate 1, the wire conductor 4 is placed on the thermoplastic resin 6 (adhesive layer) applied to the antenna laying position on the substrate surface. The wire conductor is fixed to the peripheral edge portion of the paper base 2 excluding the opening 3 by feeding out the resin and melting the thermoplastic resin 6 by the laying head.

  The IC mounting resin substrate 2 is such that the IC chip 5 is mounted on the substrate so as to straddle the slit between the pair of electrode pads 7A and 7B, and further, the IC chip is covered with a molding resin and molded into a predetermined shape. It is. The completed IC mounting resin substrate (hereinafter also referred to as “resin substrate”) may be electrically connected to the wire conductor end 4 ′ after being accommodated in the opening 3 of the paper base, or the resin substrate 2. In some cases, only the IC chip 5 is mounted and the wire conductor 4 is connected after being accommodated in the opening 3 of the paper substrate 1 and then covered with a mold resin. In the latter case, the thickness of the resin substrate 2 is set to be smaller than the thickness of the paper base material 1 in consideration of the thickness of the wire conductor so that the mold layer does not protrude greatly from the surface of the paper base material 1. It is normal (see FIG. 1C).

  The connection between the electrode pads 7A and 7B formed on the resin substrate 2 and the wire conductor terminal 4 ′ on the paper base is performed by connecting the wire conductor terminal 4 ′ to the electrode pad of the resin substrate 2 as shown in FIG. 7A and 7B, the wire conductor 4 'is pressed against the electrodes 7A and 7B of the resin substrate 2 by a thermocompression bonding head, and the wire conductor 4' is used as an electrode pad. It is fixed by thermocompression bonding.

  At this time, as described above, if the thickness of the resin substrate 2 for mounting IC is smaller than the thickness of the paper base material, the resin substrate 2 sinks into the opening 3 in processing on a normal flat stage. The conductor needs to be loosened and brought into contact with the electrode surface 7. When loosened, there is a problem that a portion of the wire conductor straddling on the electrode is displaced or meanders.

Further, since the opening 3 is generally set larger than the IC mounting resin substrate 2 (clearance), the resin substrate 2 is not fixed and has a margin to move slightly. In this case, for example, if the size of the thermocompression bonding head is not appropriate, an error occurs in the alignment between the electrode pads 7A and 7B and the wire conductor 4 ′, and the wire conductor 4 ′ is distorted or curved so that the thermocompression bonding cannot be performed well. There is a problem that the occupied position in the opening 3 of the resin substrate 2 hanging on 4 ′ is not stable. If the position of the resin substrate 2 is not stable, there is also a problem that the chip cannot be mounted in the subsequent mounting process of the IC chip 5.

  Specifically, after the wire end 4 'is thermocompression bonded to the electrode pads 7A and 7B of the IC mounting resin substrate 2, the IC chip 5 is flip-chip mounted so as to bridge the electrode pads. This processing is performed with 2 being fixed to the wire conductor 4 '. Since the thickness of the paper base material 1 is thicker than that of the resin substrate 2, a gap is formed between the resin substrate 2 and the stage on which the substrate is placed, and it becomes difficult to fix to the stage by suction. There is a problem that the IC chip 5 cannot be mounted reliably, such as incomplete bonding.

  Increasing the thickness of the resin substrate for IC mounting improves the above problem, but adjusting the thickness is not easy, and increasing the thickness increases the cost of the substrate, contrary to the demand for cost reduction. is there.

Japanese Patent No. 3721520

  The present invention has been made in view of the above-described problems, and even when the substantial thickness of the resin substrate for mounting an IC is smaller than the thickness of the paper base, the wire conductor laid on the paper base can be accurately used for the resin. An object of the present invention is to provide a method and an apparatus therefor that can reliably define and fix the occupied position of the resin substrate in the paper base opening so that it can be disposed on the electrode of the substrate.

  The invention described in claim 1 for achieving the above object is to form an opening for accommodating an IC chip mounting resin substrate at a predetermined position of a paper base, and apply a thermoplastic resin to the peripheral portion. A step of forming an electrode pattern and one or more notches or through-holes on an IC chip mounting resin substrate, and a stage having an IC chip mounting resin substrate mounting base provided with a predetermined number of protrusions on a flat portion And the step of placing the resin substrate so that the protrusion and the notch or through hole of the resin substrate are inserted, the paper base so that the flat portion of the pedestal is accommodated in the opening of the paper base , A step of laying and fixing the wire conductor in a loop shape on the thermoplastic resin at the periphery of the paper substrate, and linearly traversing the end of the wire conductor through the opening of the paper substrate, And placing on the electrode pattern in a contact manner, Step of the conductor and the electrode to thermocompression bonding by using a thermocompression bonding head is obtained by the IC chip step of mounting a predetermined position on the resin substrate, and a manufacturing method of the module substrate characterized by having a city.

  The invention according to claim 2 is characterized in that the opening provided in the paper base material has a size having a clearance of 0.3 mm or more with respect to the resin substrate for mounting IC chip. This is a manufacturing method of the described module substrate.

  According to a third aspect of the present invention, the clearance is set so that the clearance in the grain direction of the paper substrate when the paper substrate is placed is larger than the clearance in the direction perpendicular thereto. The method for manufacturing a module substrate according to claim 2, wherein:

According to a fourth aspect of the present invention, an IC chip mounting resin substrate is disposed in an opening provided in a paper base so that the IC chip mounting resin substrate is accommodated in parallel with the paper base. A module substrate manufacturing apparatus for thermocompression bonding an end portion and an electrode formed on a resin substrate, comprising at least a thermocompression bonding head and a stage, and the stage compensates for a difference in thickness between the paper base and the resin substrate. Therefore, the module substrate manufacturing apparatus is provided with a base for raising the bottom of the resin substrate that can be inserted into the opening, and the base has one or more tapered or hemispherical protrusions on the flat portion. .

  A fifth aspect of the present invention is the module substrate manufacturing apparatus according to the fourth aspect, wherein the bottom raising base has a vacuum drawing hole for resin substrate adsorption fixing.

  According to a sixth aspect of the present invention, in the manufacturing method of the module substrate according to the fourth or fifth aspect, the stage has a vacuum pulling hole for adsorbing and fixing a paper base material around a base for raising the bottom. It is a device.

  According to the first and fourth aspects of the invention, it becomes easy to accurately fix the relative positional relationship between the resin substrate, the wire conductor, and the paper base material, and the wire is bonded when the wire conductor and the resin substrate are thermocompression bonded. It is possible to stabilize the positional relationship between the resin substrate after thermocompression bonding and the paper base material (substrate insertion hole) because the conductor is almost free of tension and the wire conductor is hardly loosened after crimping. This makes it possible to reduce the improper fixing position of the resin substrate, such as the resin substrate getting on the paper base material or being submerged.

  According to the invention described in claim 2 and claim 3, when the paper base material absorbs moisture or dries and expands and contracts in a direction perpendicular to the paper grain, the board insertion hole of the paper base material is formed in the stage protrusion. It becomes possible to reduce the case where it does not fit.

  According to the invention described in claim 5, it is possible to securely fix and adsorb the paper base and the resin substrate on the stage, thermocompression bonding between the wire conductor and the substrate, and mounting of the IC chip on the resin substrate. Can be reliably performed.

  According to the invention described in claim 6, when the wire conductor is thermocompression bonded to the resin substrate, the thermocompression bonding head is provided on the stage protrusion when the thermocompression bonding head is pressed against the wire conductor and the substrate in the vicinity of the bonding pad to be thermocompression bonded It is possible to solve the problem that the applied pressure of the crimping decreases due to the effect that the resin substrate is distorted and sinks into the hole side, and it is possible to reliably perform the thermocompression bonding of the wire conductor to the resin substrate. .

It is the perspective view (a), (b) explaining the structure of a module substrate, and the figure (c) of a sectional view. (A) A state in which an IC mounting resin substrate is set on the paper base material opening. (B) A state in which a resin substrate is fitted into the opening. It is a figure of the sectional view in the AA 'line of (b). It is a top view figure explaining the relative arrangement | positioning of the wire conductor on a module board | substrate, and an IC chip. It is a figure of the sectional view explaining the composition and operation of the module substrate manufacturing device concerning the present invention typically. (A) At the time of thermocompression bonding, (b) It is the figure which removed the module board | substrate from the thermocompression bonding apparatus. (A), (b) is a perspective view which illustrates typically a part of manufacturing process of the module substrate which becomes this invention. It is a top view explaining an example of the position of the clearance and the resin substrate suction hole when the module substrate is placed on the module substrate manufacturing apparatus according to the present invention.

  The form of the module substrate that is the subject of the present invention is the same as that of the conventional configuration shown in FIG. 1 or FIG. 2, but a predetermined IC mounting resin substrate 2 is provided in the opening 3 of the paper base 1. It is limited to those manufactured by connecting the wire conductor (antenna wire) end 4 'and the IC chip 5 to the electrode pads 7A and 7B formed in advance on the resin substrate after being fitted.

  In this case, the substantial thickness of the resin substrate 2 is usually set to be thinner than the substantial thickness of the paper base 1. In that case, various disadvantages occur when the wire conductor end 4 'and the IC chip 5 are connected to the electrode pads 7A and 7B of the substrate, respectively.

  Specifically, the wire end 4 laid on the paper base material 2 is securely crimped to the electrode 7 so that the resin substrate 2 stays at a predetermined position in the opening 3 at a predetermined height and orientation. In order to achieve this, as shown in FIG. 3B, the surface of the paper substrate 2 and the surface of the resin 2 must be flush with each other. In order to make it flush, it is necessary to lift the thinner resin substrate 2 from the bottom by the thickness difference. That is, as shown in FIG. 3 (a), it is necessary to provide a pedestal 14 for putting clogs on the stage 13 and press-bond on the pedestal.

  If the wire end 4 'is connected to the electrode pads 7A and 7B in this manner, the resin substrate 2 is suspended from the wire end and floats and stays on the stage. Chip connection is not possible. Therefore, also in this case, the suspended resin 2 is supported by a flat base from below.

  Use the same pedestal (working stage) for the same purpose of lifting and supporting from below. This is because the device 12 (TCB) for pressing the wire conductor 4 ′ against the electrode 7 is different from the device for connecting the IC chip 5 between the electrodes (ultrasonic mounting head; not shown). If the TCB and the ultrasonic mounting head can be interchanged while fixing the base material side, the stage can be made common.

  In the present invention, in order to more reliably define the residence position of the resin substrate at the paper base material opening in the vertical direction and the horizontal direction, the height and parallelism are adjusted, and the resin base material 2 has a peripheral edge. 4A is provided with a notch 9 as shown in the interruption diagram, and the notch 9 is inserted into the protrusion 11 provided on the base (FIG. 4B). . This further increases the certainty of the lateral position, and suppresses the movement of the resin substrate during pressure bonding.

  The outer shape of the protrusion 11 may be a post having a taper or a hemispherical shape, but the height is set so as not to protrude as the thickness of the resin substrate. Although the notch 9 is formed by punching a resin substrate, it has a hole shape in the surface of the base material, but has a hole in the periphery. By engaging the protrusion 11 and the notch 9, the horizontal position of the resin substrate in the opening is stabilized.

  Hereinafter, the present invention will be briefly described based on examples.

  As shown in FIG. 4, the module substrate according to the present embodiment includes at least a paper base 1, wire conductors 4 and 4 ′, an IC mounting resin substrate 2, and an IC chip mounted on the substrate, as shown in FIG. 4. ing. However, in FIG. 4, the wire conductor 4 laid on the periphery of the paper base material is omitted, and only the end 4 'is shown. Eventually, the module substrate is covered with an overcoat material and becomes a booklet such as a non-contact IC card or a passbook.

(Paper substrate)
The paper base material 1 (hereinafter also simply referred to as a base material) is a high-quality flat paper or resin having a thickness of about 0.20 mm, and at least the surface layer is made of a non-conductive material. At the position where the wire conductor 4 on the surface of the paper base material is laid as an antenna, the paper base material 1 in which the thermoplastic resin layer 6 is previously provided as an adhesive layer by coating or the like is used. Further, the paper base 1 is formed with an opening 3 having substantially the same shape as an IC mounting resin substrate 2 (hereinafter also simply referred to as a resin substrate) as shown in FIG. 4 so as to maintain a predetermined clearance. Thus, the resin substrate 2 is fitted into the opening 3.

(Resin substrate for IC mounting)
The IC mounting resin substrate 2 is formed in a plate shape from a nonconductive material such as resin represented by FR-4, polyimide, PET, and PEN. A pair of electrodes 7A and 7B is formed on at least the front surface (upper surface) and back surface (lower surface) of the substrate 2 as shown in FIG. 4 (a) or FIG. The electrode 7 is made of a conductive material such as Cu or Al. In FIG. 5, the IC chip 5 is illustrated as being mounted, but at this time, the chip mounting position is shown.

  As shown in FIGS. 4 and 5, the electrodes each include bonding pad portions 7 </ b> A and 7 </ b> B and an IC chip mounting portion 8. The electrode pads 7A and 7B are portions for connecting the wire conductors 4. The mounting part 8 is a part for mounting the IC chip 5 so as to straddle the slits of the electrodes. As shown in FIGS. 4 and 5, the electrodes 7 forming a pair of the present embodiment are formed symmetrically in a plan view, and the mounting portions 8 are opposed to each other across a predetermined slit, and rectangular on each of the left and right sides. Shaped bonding pad portions 7A and 7B are formed. The electrode pad is arranged with the long side facing in the same direction as the slit. However, the shape of the electrode itself is not limited to that shown in the figure, and it is sufficient that the pair of electrodes are within a range that can be connected to the IC chip.

  And in this embodiment, as shown in FIG.3 (b), the total thickness a of the resin substrate 2 containing the electrode 7 is made from the thickness b of the paper base material 1 (except the thickness of the thermoplastic resin layer 8). It is adjusted to be thinner. In the case of manufacturing an IC card, the difference between the total thickness a and the thickness b of the base material 2 is preferably within 0.2 mm.

"Manufacturing method of module board"
The paper substrate 1 is set on a stage 13 having a TCB 12 on the top. At the same time, it is sucked and fixed from a suction hole 20 provided around the base 14 of the stage 13 (see FIG. 5). The stage 13 has a cross section shown in FIG. 3A, and a pedestal 14 that protrudes from the stage 13 is provided at the center. The size of the pedestal flat end is slightly smaller than the opening 3 of the paper substrate 1 and the pedestal 14 penetrates the opening 3 slightly from the bottom of the substrate with a certain clearance. The protruding height of the pedestal 14 is about the difference between the thickness of the paper base 1 and the thickness of the substrate 2 accommodated in the opening 13, and the upper surface of the paper base 1 and the surface of the substrate 2 are just flush with each other. Is the height. Although the thickness of the thermoplastic resin 6 applied to the paper substrate 1 is not taken into consideration, the electrode 7 on the resin substrate 2 is included in the thickness of the substrate.

  Next, the IC mounting resin substrate 2 on which the pair of electrodes 7 are formed is fitted into the opening 3 formed in the base material 1. The fitting is performed so that the protrusion 11 of the base is inserted into the notch 9 of the resin substrate 2. At the same time as the fitting, the suction hole 21 provided in the base 14 is sucked and fixed (see FIG. 4B and FIG. 5). The order in which the paper base 1 and the resin substrate 2 are placed on the stage is not limited to the order described above, and may be changed as appropriate.

  Next, the thermoplastic resin layer 6 applied to the upper surface of the base material 1 is melted by the laying head while the wire conductor 4 is sent out from the laying head (not shown) to the surface of the base material 1. Then, the wire conductor 4 is laid and fixed to the loop antenna shape. At this time, even on the resin substrate 2 arranged in the opening 3 of the base material 1, the wire conductor 4 is sent out from the laying head and passes through the pad portions 7A and 7B of the electrodes 7 so as to pass through the wire end 4 ′. Is laid (FIG. 4B). Then, the wire conductor 4 is fixed to the electrode 7 by pressing the wire conductor 4 against the electrode 7 with the thermocompression bonding head 12 and thermocompression bonding.

  At this time, when the paper base 1 is placed at a predetermined position of the flat stage 13 without a pedestal, the total thickness a of the IC mounting resin substrate 2 including the electrodes 6 is thinner than the thickness b of the base 1. The electrode 7 of the resin substrate 2 is recessed downward from the upper surface of the substrate 1 (excluding the thickness of the thermoplastic resin layer 8). In this state, when the wire conductor 4 is sent and laid so as to cross the opening 3, the wire conductor 4 may be laid in a relaxed state, and the retained form in the opening 3 of the resin substrate 2 after the pressure bonding is provided. And the position is not stable. Providing the protruding pedestal 14 and further providing the protrusion 11 eliminates such instability.

  Next, the paper substrate is moved to another stage having an ultrasonic mounting head (not shown). Then, the IC chip 5 is disposed so as to straddle the mounting portion 8 of the paired electrodes 7A and 7B. Further, the base 11 and the IC mounting resin substrate 2 are sucked and fixed to the pedestal and the stage by evacuating from the pedestal 11 and the suction holes 20 and 21 formed in the periphery thereof. In this state, an ultrasonic mounting head (not shown) is brought into contact with the IC chip 5 from the upper side to apply ultrasonic waves, so that the IC chip 5 is bonded and fixed to the pair of mounting portions 8. The height of the base 14 in this case is the same as that in the case where the wire 4 is thermocompression bonded.

  If the paper base is lifted and supported in this way, and the protrusion is inserted into the notch, the IC mounting resin substrate can be adsorbed and fixed at a predetermined position, and when the IC chip is ultrasonically mounted, Ultrasonic energy can be used effectively. That is, the IC chip can be reliably mounted in a state where the back surface (lower surface) of the IC mounting resin substrate 2 is adsorbed so as to be in close contact with the pedestal 14.

  Finally, the arrangement and clearance of suction holes for tightly fixing the paper base and the IC mounting resin substrate to the stage will be described. FIG. 5 illustrates an example of the arrangement of the suction holes on and near the pedestal 14 protruding from the stage in a top view. At least suction holes 20 for sucking the paper substrate 1 need to be arranged around the base 11. About a position, it arrange | positions suitably according to the magnitude | size of a paper base material single-piece | unit.

  The suction hole 21 for sucking the resin substrate is disposed on the base 11. With respect to this position, a position away from the position immediately below the position where the IC chip 5 is mounted (FIG. 5) and also from the position immediately below where the wire ends 4A and 4B run is preferable. This is because the temperature directly above the suction hole may cause the temperature of the substrate to be lowered or the distortion of the substrate at the time of pressurization to reliably prevent thermocompression bonding and ultrasonic mounting.

  About the clearance of the opening part 3 of the paper base material 1 and the resin substrate 2 accommodated therein, as shown in FIG. 5, the clearance a between sides substantially parallel to the paper pattern (flow line) of the paper base material. In comparison, it is preferable that the clearance b between the substantially orthogonal sides is large. In particular, it is preferable to satisfy the relationship of b> a ≧ 0.3 mm.

1, paper base 2, resin substrate (for IC mounting)
3, opening 4, wire conductor (antenna)
4 ', 4A, 4B, wire conductor end 5, IC chip 6, thermoplastic resin 7, (for connection) electrodes 7A, 7B, electrode pad 8, IC chip mounting part (inter-electrode slit)
9, clip 10, module substrate 11, protrusion 12, TCB
13, stage 14, pedestal 20, suction hole (for paper base material)
21, suction hole (for board)

Claims (6)

Forming an opening for accommodating an IC chip mounting resin substrate at a predetermined position of the paper base material, and applying a thermoplastic resin to the peripheral edge;
Forming an electrode pattern and one or more cutouts or through-holes on an IC chip mounting resin substrate;
Place the resin substrate on the stage with the IC chip mounting resin substrate mounting base having a predetermined number of protrusions on the flat part so that the protrusion and the notch or through hole of the resin substrate are inserted. The process of
Placing the paper base on the stage so that the flat part of the pedestal is accommodated in the opening of the paper base,
A step of laying and fixing a wire conductor in a loop on the thermoplastic resin at the periphery of the paper substrate;
Placing the end of the wire conductor on the electrode pattern in a manner that linearly traverses and contacts the opening of the paper substrate;
A step of thermocompression bonding the wire conductor and the electrode using a thermocompression bonding head;
And a step of mounting the IC chip at a predetermined position of the resin substrate.   2. The method of manufacturing a module substrate according to claim 1, wherein the opening provided in the paper base has a size having a clearance of 0.3 mm or more with respect to the IC chip mounting resin substrate.   The clearance is set so that a clearance in a grain direction of the paper substrate when the paper substrate is placed is larger than a clearance in a direction perpendicular to the clearance. Manufacturing method of the module substrate.   In the opening provided in the paper base, the IC chip mounting resin substrate is arranged so as to be accommodated in parallel with the paper base, and the end of the wire conductor laid on the paper base and the electrode formed on the resin substrate Is a module substrate manufacturing apparatus that includes at least a thermocompression bonding head and a stage, and the stage is a resin that can be inserted into the opening to compensate for the difference in thickness between the paper base and the resin substrate. An apparatus for manufacturing a module substrate, comprising: a base for raising a substrate bottom, wherein the base has one or more tapered or hemispherical protrusions on a flat portion.   The module substrate manufacturing apparatus according to claim 4, wherein the base for raising the bottom has a vacuum drawing hole for resin substrate adsorption fixing.   6. The module substrate manufacturing apparatus according to claim 4, wherein the stage has a vacuum pulling hole for adsorbing and fixing a paper base material around a base for raising the bottom.