FI89752C - Method for connecting a microcircuit to an inductive coil in a smart card and device on an inductive smart card - Google Patents
Method for connecting a microcircuit to an inductive coil in a smart card and device on an inductive smart card Download PDFInfo
- Publication number
- FI89752C FI89752C FI921420A FI921420A FI89752C FI 89752 C FI89752 C FI 89752C FI 921420 A FI921420 A FI 921420A FI 921420 A FI921420 A FI 921420A FI 89752 C FI89752 C FI 89752C
- Authority
- FI
- Finland
- Prior art keywords
- coil
- microcircuit
- smart card
- holder
- inductive
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
- G06K19/07781—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being fabricated in a winding process
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Credit Cards Or The Like (AREA)
Description
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Menetelmä mikropiirin liittämiseksi älykortin induktiiviseen kelaan sekä sovitelma induktiivisessa älykortissaMethod for connecting a microcircuit to an inductive coil of a smart card and an arrangement in an inductive smart card
Keksinnön kohteena on patenttivaatimuksen 1 johdannon mukainen menetelmä 5 mikropiirin liittämiseksi älykortin induktiiviseen kelaan.The invention relates to a method according to the preamble of claim 1 for connecting a microcircuit 5 to an inductive coil of a smart card.
Keksinnön kohteena on myös sovitelma induktiivisessa älykortissa.The invention also relates to an arrangement in an inductive smart card.
Induktiivisia älykortteja käytetään esimerkiksi linja-autoliikenteessä maksuvälineinä. 10 jolloin luottokortin kokoiseen korttiin varastoidaan maksukkeita. jotka puretaan linja-autojen lukulaitteissa. Kortti kommunikoi ulkomaailman kanssa muistilla varustettuun mikropiiriin yhdistetyn kelan avulla, jolloin kortti ei tarvitse mekaanista kontaktia lukulaitteeseen kuten perinteiset magneettinauhakortit. Herkkyyden maksimoimiseksi pyritään kela muodostamaan halkaisijaltaan mahdollisimman 15 suureksi ja käytännössä kela mvötäileekin kortin ulkomittoja.Inductive smart cards are used, for example, in bus transport as a means of payment. 10 in which case payments are stored on a credit card-sized card. which are dismantled in bus readers. The card communicates with the outside world via a coil connected to a microcircuit with memory, so that the card does not need mechanical contact with the reader like traditional magnetic tape cards. In order to maximize the sensitivity, the aim is to make the coil as large as possible in diameter, and in practice the coil conforms to the outer dimensions of the card.
Tällaisia keloja valmistetaan koneellisesti ja kaupallisesti onkin saatavilla halutun muotoisia keloja, joissa on tilaajan vaatima määrä kierroksia toivotusta johdinmate-riaalista. Tällaiset kelat toimitetaan muodossa, jossa johdinten päät ovat vapaana.Such coils are manufactured mechanically and coils of the desired shape are commercially available with the number of turns of the desired conductor material required by the customer. Such coils are supplied in a form where the ends of the conductors are free.
20 WO-julkaisusta 01/16718 tunnetaan menetelmä edellä kuvatun mukaisen kelan yhdistämiseksi painetulle piirille, johon muistin ja ohjauspiirin sisältävä integroitu mikropiiri on yhdistetty. Julkaisun mukaisessa ratkaisussa tarvitaan useita aikaa vieviä työvaiheita: painetun piirin valmistus, mikropiirin asemoiminen painetulle 25 piirille, piipiirin kontaktien muodostus painettuun piiriin ja lopuksi painetun piirin yhdistäminen kelaan. Vaikka kaikki nämä toimenpiteet ovat sinänsä automatisoitavissa. aiheuttaa toimenpiteiden suuri lukumäärä pitkän tuotekohtaisen läpi-: . menoajan tuotantoprosessissa.WO 01/16718 discloses a method for connecting a coil as described above to a printed circuit to which an integrated circuit comprising a memory and a control circuit is connected. The solution according to the publication requires several time-consuming work steps: manufacturing the printed circuit, positioning the microcircuit on the printed circuit, forming the contacts of the circuit on the printed circuit and finally connecting the printed circuit to the coil. Although all these measures are in themselves automated. causes a large number of measures over a long product-specific review:. time in the production process.
30 Tämän keksinnön tarkoituksena on poistaa edellä kuvatun tekniikan puutteellisuudet ja aikaansaada aivan uudentyyppinen menetelmä mikropiirin liittämiseksi älykortin induktiiviseen kelaan.The object of the present invention is to eliminate the shortcomings of the above-described technique and to provide a completely new type of method for connecting a microcircuit to an inductive coil of a smart card.
Keksintö perustuu siihen, että jo kelan valmistusvaiheessa tähän yhdistetään pidike '.?7E2 o mikropiiriä varten ja kelan johtimen päät kiinnitetään pidäkkeeseen ennalta määrätyille kohdille. Lisäksi pidike sisältää mikropiiriä varten asemointisyvennyk-sen, jonka avulla mikropiiri on suoraan yhdistettävissä kontaktialueistaan pidäkkeeseen ennalta määritellyillä kohdilla oleviin kelan johtimen päihin.The invention is based on the fact that already at the stage of manufacturing the coil, a holder for the microcircuit is connected to this and the ends of the conductor of the coil are fixed to the detent at predetermined points. In addition, the holder includes a positioning recess for the microcircuit, by means of which the microcircuit can be directly connected from its contact areas to the detent at the ends of the coil conductor at predetermined points.
5 Täsmällisemmin sanottuna keksinnön mukaiselle menetelmälle on tunnusomaista se, mikä on esitetty patenttivaatimuksen 1 tunnusmerkkiosassa.More specifically, the method according to the invention is characterized by what is set forth in the characterizing part of claim 1.
Keksinnön mukaiselle sovitelmalle puolestaan on tunnusomaista se, mikä on 10 esitetty patenttivaatimuksen 2 tunnusmerkkiosassa.The arrangement according to the invention, in turn, is characterized by what is set forth in the characterizing part of claim 2.
Keksinnön avulla saavutetaan huomattavia etuja.The invention provides considerable advantages.
Pidikkeen kiinnitys kelaan tapahtuu samassa työvaiheessa kuin kelan valmistus ja 15 pidikkeen ansiosta mikropiirin asemointi on yksinkertainen toimenpide, joten tunnetun tekniikan mukaiseen ratkaisuun verrattu säästetään useita työvaiheita. Työvaiheiden vähenemisellä saavutetaan selviä etuja valmistusajan lyhenemisenä ja myös laaduntarkkailu tehostuu, koska tarkastettavia työvaiheita on vähemmän. Koska keksinnön kohteena oleva tuote, älykortti, tulee olemaan yleisyydeltään 20 luottokortteihin/pankkikortteihin verrattavissa oleva massatuote, jonka yksikköhinta on alhainen, ovat tuotteen valmistusnopeuteen liittyvät parannukset taloudellisesti erittäin merkittäviä.The attachment of the holder to the coil takes place in the same work step as the manufacture of the coil, and thanks to the holder 15, the positioning of the microcircuit is a simple operation, so that several work steps are saved compared to the solution according to the prior art. By reducing the number of work steps, clear benefits are achieved in terms of shortening the production time, and quality control is also made more efficient because there are fewer work steps to be inspected. Since the product of the invention, the smart card, will be a mass product comparable in frequency to credit / debit cards with a low unit price, the improvements in product manufacturing speed are economically very significant.
Keksintöä ryhdytään seuraavassa lähemmin tarkastelemaan oheisten kuvioiden 25 mukaisten suoritusesimerkkien avulla.The invention will now be examined in more detail by means of the exemplary embodiments according to the accompanying Figures 25.
Kuvio 1 esittää yläkuvantona yhtä keksinnön mukaista induktiivista älykorttirat-kaisua.Figure 1 shows a top view of one inductive smart card solution according to the invention.
30 Kuvio 2 esittää yläkuvantona toista keksinnön mukaista älykorttiratkaisua.Figure 2 shows a top view of another smart card solution according to the invention.
Kuvion 1 mukaisesti kelan 1 ulkomuoto vastaa oleellisesti luottokortin ulkomittoja.According to Figure 1, the appearance of the coil 1 substantially corresponds to the external dimensions of the credit card.
i :< 07ΓΊ - > S / wi: <07ΓΊ -> S / w
Kelan I vasen alakulma on kuitenkin tässä tapauksessa vedetty kohti kelan 1 sisäosaa mikropiirin 2 asennusta varten. Tähän sisäänvedettyyn osaan on sijoitettu esimerkiksi muovinen pidike 3. joka on päällystetty' sopivasti lämpökiinnittyvällä liimalla kuten myös kelan johdin. Kelan 1 valmistusvaiheessa yhdistetään kelan 5 johtimen ensimmäinen pää 7 pidikkeeseen 3 ja kelausta jatketaan kunnes haluttu kierroslukumäärä on tullut täyteen ja kelan 1 johtimen toinen pää 4 yhdistetään pidikkeeseen 3. Koska sekä kelan 1 johdinmateriaali että pidike 3 ovat päällystetyt lämpökiinnittyvällä materiaalilla, tarttuvat nämä komponentit tukevasti toisiinsa lämmitysvaiheen yhteydessä. Lämmitys toteutetaan kelan ulkoisella lämmityksellä 10 tai tuomalla kelaan 1 virtapulssi tai näiden toimenpiteiden yhdistelmällä. Kelauksen loputtua on siis saatu aikaan välituote, joka käsittää kelan 1 sekä tähän kiinnitetyn pidikkeen 3, johon kelan 1 johtimen päät on kiinnitetty. Pidike 3 on muotoiltu siten, että johtimen päät 4 ja 7 kulkevat vapaan tilan 15 yli. jolloin mikropiiri 2 on asennettavissa pidikkeeseen 3 siten, että mikropiirin 2 kontaktialueet 5 sattuvat 15 suoraan johtimen päiden 4 ja 5 kohdalle tässä vapaassa tilassa 15. Kuvion ratkaisussa tämä ajatus on toteutettu muodostamalla pidikkeeseen 3 aukko 15. jonka yli johtimet 4 ja 7 vedetään. Aukko 15 on keksinnön mukaisesti sellainen, että se asemoi mikropiirin 2 kohdalleen siten, että mikropiirin 2 kontaktialueet 5 sattuvat johtimen päiden 4 ja 7 kohdalle. Asemoinnin onnistumiseksi aukon 15 mitat 20 vastaavat oleellisesti mikropiirin 2 ulkomittoja. Langan päät 4 ja 7 yhdistetään kontaktialueisiin 5 juottamalla tai hitsaamalla. Kontaktoinnin jälkeen ylimääräinen osa pidikkeestä 3 ja johtimen päistä 4 ja 7 katkaistaan linjaa 9 pitkin.However, in this case the lower left corner of the coil I is drawn towards the inside of the coil 1 for mounting the microcircuit 2. In this retracted part, for example, a plastic holder 3 is placed, which is suitably coated with a heat-adhesive adhesive as well as the conductor of the coil. In the manufacturing step of the coil 1, the first end 7 of the coil 5 is connected to the holder 3 and winding is continued until the desired speed is reached and the second end 4 of the coil 1 is connected to the holder 3. Since both the coil 1 conductor material and during the heating phase. The heating is carried out by external heating of the coil 10 or by introducing a current pulse into the coil 1 or a combination of these measures. Thus, at the end of the winding, an intermediate product is provided, comprising a coil 1 and a holder 3 attached thereto, to which the ends of the conductor of the coil 1 are attached. The holder 3 is shaped so that the ends 4 and 7 of the conductor pass over the free space 15. wherein the microcircuit 2 can be mounted on the holder 3 so that the contact areas 5 of the microcircuit 2 occur directly at the conductor ends 4 and 5 in this free space 15. In the solution of the figure, this idea is realized by forming an opening 15 in the holder 3. According to the invention, the opening 15 is such that it positions the microcircuit 2 in such a way that the contact areas 5 of the microcircuit 2 coincide at the ends 4 and 7 of the conductor. For successful positioning, the dimensions 20 of the opening 15 substantially correspond to the outer dimensions of the microcircuit 2. The ends 4 and 7 of the wire are connected to the contact areas 5 by soldering or welding. After contacting, the excess part of the holder 3 and the conductor ends 4 and 7 are cut along the line 9.
Kontaktoinnin jälkeen kela 1 ja mikropiiri 2 suojataan sopivalla suojarakenteella. 25 esimerkiksi laminoimalla rakenteen molemmin puolin muovimateriaalia. Suojarakenne voidaan muodostaa myös valamalla muovi kelan 1 ja mikropiirin 2 ympärille.After contact, the coil 1 and the microcircuit 2 are protected by a suitable protective structure. 25 for example by laminating a plastic material on both sides of the structure. The protective structure can also be formed by molding plastic around the coil 1 and the microcircuit 2.
Kuvion 2 mukaisesti kela 11 on tässä ulkomuodoltaan lähellä kortin ulkomuotoa ja pidike 10 on U-muotoinen. Johdinten 4 ja 7 kiinnitettävyys on varmistettu tässä 30 tapauksessa vetämällä johtimen päät U-uran yli. jolloin mikropiiri 2 ja erityisesti sen kontaktialueet 5 ovat sijoitettavissa suoraan johtimen päiden 4 ja 7 alle. Asemoinnin varmistamiseksi U-ura 13 on mikropiirin 2 levyinen. U-uran 13 tapauk- 4 m r“ ,*> [. C* / W /* -J ; i L· sessa oikea asemointi varmistetaan työntämällä mikropiiri 2 uran pohjaan saakka. Myös painovoimaa voidaan käyttää hyväksi kallistamalla kela 11/pidikerakennetta 10 siten, että mikropiiri laskeutuu kohdalleen. Ylimääräisen materiaalin poisto tehdään kuvion 1 tapaan linjaa 9 pitkin kontaktoinnin jälkeen.According to Figure 2, the coil 11 is here close in appearance to the appearance of the card and the holder 10 is U-shaped. The attachment of the conductors 4 and 7 is ensured in this case 30 by pulling the ends of the conductor over the U-groove. wherein the microcircuit 2 and in particular its contact areas 5 can be placed directly below the conductor ends 4 and 7. To ensure positioning, the U-groove 13 is the width of the microcircuit 2. U-career 13 cases- 4 m r “, *> [. C * / W / * -J; In L ·, the correct positioning is ensured by pushing the microcircuit 2 to the bottom of the groove. Gravity can also be utilized by tilting the coil 11 / holder structure 10 so that the microcircuit lowers into place. Excess material is removed as in Figure 1 along line 9 after contact.
55
Mikropiiri 2 asetetaan pidikkeeseen 3 tai 10 esimerkiksi kantonauhasta tai vaihtoehtoisesti hahmon tunnistavan robotin avulla.The microcircuit 2 is placed in the holder 3 or 10, for example from a carrier tape or alternatively by means of a character recognition robot.
Olennaista keksinnölle on myös se. että aukko/urasovitelman 15. 13 ainakin yksi 10 ulottuvuus vastaa oleellisesti mikropiirin 2 ulkomittaa.It is also essential to the invention. that the at least one dimension 10 of the aperture / groove arrangement 15 13 substantially corresponds to the outer dimension of the microcircuit 2.
Claims (4)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FI921420A FI89752C (en) | 1992-04-01 | 1992-04-01 | Method for connecting a microcircuit to an inductive coil in a smart card and device on an inductive smart card |
| EP93907879A EP0746826A1 (en) | 1992-04-01 | 1993-04-01 | Method for connecting a microcircuit to the inductive coupling coil of a smart card and assembly for an inductively coupled smart card |
| PCT/FI1993/000138 WO1993020537A1 (en) | 1992-04-01 | 1993-04-01 | Method for connecting a microcircuit to the inductive coupling coil of a smart card and assembly for an inductively coupled smart card |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FI921420A FI89752C (en) | 1992-04-01 | 1992-04-01 | Method for connecting a microcircuit to an inductive coil in a smart card and device on an inductive smart card |
| FI921420 | 1992-04-01 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| FI921420A0 FI921420A0 (en) | 1992-04-01 |
| FI89752B FI89752B (en) | 1993-07-30 |
| FI89752C true FI89752C (en) | 1993-11-10 |
Family
ID=8535015
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FI921420A FI89752C (en) | 1992-04-01 | 1992-04-01 | Method for connecting a microcircuit to an inductive coil in a smart card and device on an inductive smart card |
Country Status (3)
| Country | Link |
|---|---|
| EP (1) | EP0746826A1 (en) |
| FI (1) | FI89752C (en) |
| WO (1) | WO1993020537A1 (en) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE69101436T2 (en) * | 1990-04-19 | 1994-07-21 | Ake Gustafson | METHOD FOR MOUNTING A COIL ON A PCB. |
| FR2716281B1 (en) * | 1994-02-14 | 1996-05-03 | Gemplus Card Int | Method of manufacturing a contactless card. |
| DE4410732C2 (en) * | 1994-03-28 | 1997-05-07 | Amatech Gmbh & Co Kg | Method for arranging a transponder unit having at least one chip and a wire coil on a substrate, as well as chip card with a correspondingly arranged transponder unit |
| FR2721733B1 (en) * | 1994-06-22 | 1996-08-23 | Gemplus Card Int | Method for manufacturing a contactless card by overmolding and contactless card obtained by such a method. |
| DE4431605C2 (en) * | 1994-09-05 | 1998-06-04 | Siemens Ag | Method for producing a chip card module for contactless chip cards |
| KR100355209B1 (en) * | 1994-09-22 | 2003-02-11 | 로무 가부시키가이샤 | Contactless IC card and its manufacturing method |
| DE4437721A1 (en) * | 1994-10-21 | 1996-04-25 | Giesecke & Devrient Gmbh | Contactless electronic module |
| DE19525933C5 (en) * | 1995-07-17 | 2004-02-19 | Finn, David | Method and device for embedding a coil in the carrier substrate of an IC card |
| DE19620242C2 (en) * | 1996-05-20 | 1999-11-04 | David Finn | Method and device for contacting a wire conductor in the manufacture of a transponder unit |
| AU709049B2 (en) | 1996-02-12 | 1999-08-19 | Smartrac Ip B.V. | Process and device for contacting a wire conductor |
| DE19616424A1 (en) * | 1996-04-25 | 1997-10-30 | Manfred Dr Michalk | Electrically isolating material with electronic module |
| CA2604259A1 (en) | 2005-04-12 | 2006-10-19 | Sierra Wireless, Inc. | Dielectric encapsulating antenna |
| IL184260A0 (en) | 2007-06-27 | 2008-03-20 | On Track Innovations Ltd | Mobile telecommunications device having sim/antenna coil interface |
| US8028923B2 (en) | 2007-11-14 | 2011-10-04 | Smartrac Ip B.V. | Electronic inlay structure and method of manufacture thereof |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BR8505681A (en) * | 1985-11-04 | 1987-06-09 | Dalson Artacho | PORTABLE DATA ELEMENT AND DATA READING AND RECORDING DEVICE |
| DE3721822C1 (en) * | 1987-07-02 | 1988-11-10 | Philips Patentverwaltung | Chip card |
| JPH01157896A (en) * | 1987-09-28 | 1989-06-21 | Mitsubishi Electric Corp | Noncontact type ic card and noncontact type card reader writer |
| FR2641102B1 (en) * | 1988-12-27 | 1991-02-22 | Ebauchesfabrik Eta Ag | |
| DE69101436T2 (en) * | 1990-04-19 | 1994-07-21 | Ake Gustafson | METHOD FOR MOUNTING A COIL ON A PCB. |
-
1992
- 1992-04-01 FI FI921420A patent/FI89752C/en not_active IP Right Cessation
-
1993
- 1993-04-01 EP EP93907879A patent/EP0746826A1/en not_active Withdrawn
- 1993-04-01 WO PCT/FI1993/000138 patent/WO1993020537A1/en not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| FI89752B (en) | 1993-07-30 |
| WO1993020537A1 (en) | 1993-10-14 |
| FI921420A0 (en) | 1992-04-01 |
| EP0746826A1 (en) | 1996-12-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| BB | Publication of examined application | ||
| MM | Patent lapsed |