ES2143655T3 - Procedimiento para el recubrimiento de superficies electricamente no conductoras mediante estructuras metalicas conectadas. - Google Patents

Procedimiento para el recubrimiento de superficies electricamente no conductoras mediante estructuras metalicas conectadas.

Info

Publication number
ES2143655T3
ES2143655T3 ES95935819T ES95935819T ES2143655T3 ES 2143655 T3 ES2143655 T3 ES 2143655T3 ES 95935819 T ES95935819 T ES 95935819T ES 95935819 T ES95935819 T ES 95935819T ES 2143655 T3 ES2143655 T3 ES 2143655T3
Authority
ES
Spain
Prior art keywords
electrically non
metal layer
deposition
structures
procedure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES95935819T
Other languages
English (en)
Inventor
Hermann-Josef Dr Middeke
Detlef Tenbrink
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Atotech Deutschland GmbH and Co KG
Original Assignee
Atotech Deutschland GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland GmbH and Co KG filed Critical Atotech Deutschland GmbH and Co KG
Application granted granted Critical
Publication of ES2143655T3 publication Critical patent/ES2143655T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1605—Process or apparatus coating on selected surface areas by masking
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/285—Sensitising or activating with tin based compound or composition
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • H05K3/242—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus characterised by using temporary conductors on the printed circuit for electrically connecting areas which are to be electroplated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1115—Resistance heating, e.g. by current through the PCB conductors or through a metallic mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/175—Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Theoretical Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Electrochemistry (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Laminated Bodies (AREA)
  • Insulated Conductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

DE ACUERDO CON LA PRESENTE INVENCION, LAS ESTRUCTURAS METALICAS DEFINIDAS DE FORMA AGUDA PUEDEN SER ELABORADAS SOBRE SUPERFICIES NO CONDUCTORAS ELECTRICAMENTE SIN LA UTILIZACION DE PROCESOS DE ATAQUE AL ACIDO UTILIZANDO UN PROCESO QUE INCLUYE LAS SIGUIENTES ETAPAS DE PROCESO ESENCIALES: APLICACION DE UN CATALIZADOR ADECUADO PARA DEPOSICION METALICA SIN CORRIENTE; FORMACION SUBSECUENTE DE ESTRUCTURAS INTERCONECTADAS SOBRE LAS SUPERFICIES UTILIZANDO TECNOLOGIA DE ENMASCARAMIENTO; DEPOSICION SIN CORRIENTE DE UNA CAPA METALICA DELGADA INICIAL SOBRE REGIONES SUPERFICIALES RECUBIERTAS CATALITICAMENTE QUE HAN SIDO EXPUESTAS SIGUIENDO LA ACCION DE PROCESOS DE ESTRUCTURADO; DEPOSICION ELECTROLITICA DE UNA CAPA METALICA SECUNDARIA SOBRE LA CAPA METALICA PRIMARIA QUE FORMA ESTRUCTURAS INTERCONECTADAS.
ES95935819T 1994-10-18 1995-10-18 Procedimiento para el recubrimiento de superficies electricamente no conductoras mediante estructuras metalicas conectadas. Expired - Lifetime ES2143655T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4438799A DE4438799A1 (de) 1994-10-18 1994-10-18 Verfahren zum Beschichten elektrisch nichtleitender Oberflächen mit Metallstrukturen

Publications (1)

Publication Number Publication Date
ES2143655T3 true ES2143655T3 (es) 2000-05-16

Family

ID=6532087

Family Applications (1)

Application Number Title Priority Date Filing Date
ES95935819T Expired - Lifetime ES2143655T3 (es) 1994-10-18 1995-10-18 Procedimiento para el recubrimiento de superficies electricamente no conductoras mediante estructuras metalicas conectadas.

Country Status (10)

Country Link
EP (1) EP0788728B1 (es)
JP (1) JPH10507229A (es)
AT (1) ATE189762T1 (es)
AU (1) AU3800495A (es)
BR (1) BR9509376A (es)
CA (1) CA2203171A1 (es)
DE (3) DE4438799A1 (es)
ES (1) ES2143655T3 (es)
PT (1) PT788728E (es)
WO (1) WO1996012393A1 (es)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19641219C1 (de) * 1996-09-27 1998-02-12 Atotech Deutschland Gmbh Datenträger zur Speicherung von Daten und Verfahren zur Herstellung des Datenträgers
EP0841839A1 (de) * 1996-11-06 1998-05-13 ATOTECH Deutschland GmbH Verfahren zum Strukturieren von Kunststoffoberflächen, insbesondere zur Herstellung von Mitteln zur irreversiblen Informationsspeicherung
DE19841900A1 (de) * 1998-09-11 2000-03-30 Schott Glas Verfahren zum Aufbringen von metallischen Leiterbahnen als Elektroden auf eine Kanalplatte für großflächige Flachbildschirme
DE10011455B4 (de) * 2000-03-10 2005-12-08 Schott Ag Verfahren zum Aufbringen von metallischen Leiterbahnen als Elektroden auf eine Kanalplatte aus Glas für großflächige Flachbildschirme
JP2003060341A (ja) * 2001-08-08 2003-02-28 Mitsubishi Gas Chem Co Inc 細密パターンを有するプリント配線板の製造方法。
JP2003069218A (ja) * 2001-08-23 2003-03-07 Mitsubishi Gas Chem Co Inc 極細線パターンを有するプリント配線板の製造方法
US20040082859A1 (en) 2002-07-01 2004-04-29 Alan Schaer Method and apparatus employing ultrasound energy to treat body sphincters
DE10254927B4 (de) * 2002-11-25 2012-11-22 Infineon Technologies Ag Verfahren zur Herstellung von leitfähigen Strukturen auf einem Träger und Verwendung des Verfahrens
DE102004001107B4 (de) * 2004-01-05 2005-12-29 Siemens Ag Strukturierung auf Oberflächen mittels Folie
US7524775B2 (en) 2006-07-13 2009-04-28 Infineon Technologies Ag Method for producing a dielectric layer for an electronic component
EP3132828B1 (en) 2009-10-30 2017-10-11 ReCor Medical, Inc. Apparatus for treatment of hypertension through percutaneous ultrasound renal denervation
CN101706703B (zh) * 2009-11-24 2011-06-22 无锡阿尔法电子科技有限公司 一种电容式触摸屏四边边缘金属膜的制作方法
WO2014159273A1 (en) * 2013-03-14 2014-10-02 Recor Medical, Inc. Methods of plating or coating ultrasound transducers
WO2014159276A1 (en) 2013-03-14 2014-10-02 Recor Medical, Inc. Ultrasound-based neuromodulation system
EP3235399B1 (de) * 2016-04-11 2020-07-01 Bolta Werke GmbH Verfahren und vorrichtung zum selektiven auftragen eines abdecklackes

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US2433384A (en) * 1942-11-05 1947-12-30 Int Standard Electric Corp Method of manufacturing unitary multiple connections
US3573973A (en) * 1967-11-13 1971-04-06 Ibm High speed additive circuit process
US3907621A (en) * 1971-07-29 1975-09-23 Photocircuits Corp Method of sensitizing substrates for chemical metallization
US3772161A (en) * 1972-01-03 1973-11-13 Borg Warner Method of selectively electroplating thermoplastic substrates using a strippable coating mask
JPS58193390A (ja) * 1982-05-06 1983-11-11 Mitsubishi Rayon Co Ltd プラスチツクの部分メツキ法
US4431685A (en) * 1982-07-02 1984-02-14 International Business Machines Corporation Decreasing plated metal defects
DE3407114A1 (de) * 1984-02-28 1985-09-05 Bayer Ag, 5090 Leverkusen Verfahren zur herstellung von leiterplatten
DE3430290A1 (de) * 1984-08-17 1986-02-27 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Verfahren zur selektiven metallisierung
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US4748104A (en) * 1986-11-10 1988-05-31 Macdermid, Incorporated Selective metallization process and additive method for manufactured printed circuit boards
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Also Published As

Publication number Publication date
WO1996012393A1 (de) 1996-04-25
AU3800495A (en) 1996-05-06
BR9509376A (pt) 1997-11-18
DE19581160D2 (de) 1997-07-31
ATE189762T1 (de) 2000-02-15
DE4438799A1 (de) 1996-04-25
JPH10507229A (ja) 1998-07-14
EP0788728A1 (de) 1997-08-13
EP0788728B1 (de) 2000-02-09
CA2203171A1 (en) 1996-04-25
PT788728E (pt) 2000-07-31
DE59507798D1 (de) 2000-03-16

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