US2433384A - Method of manufacturing unitary multiple connections - Google Patents

Method of manufacturing unitary multiple connections Download PDF

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US2433384A
US2433384A US464618A US46461842A US2433384A US 2433384 A US2433384 A US 2433384A US 464618 A US464618 A US 464618A US 46461842 A US46461842 A US 46461842A US 2433384 A US2433384 A US 2433384A
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Prior art keywords
connections
sheet
card
multiple connections
plating
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US464618A
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Ernest S Mclarn
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International Standard Electric Corp
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International Standard Electric Corp
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • H05K3/242—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus characterised by using temporary conductors on the printed circuit for electrically connecting areas which are to be electroplated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/175—Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/005—Punching of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections

Definitions

  • This invention relates to methods for the manufacture of unitary multiple connections for use in connector blocks for telephone subsets and the like.
  • Sub-panels for telephone equipment and other electrical devices often comprise a considerable number of terminal studs between which the required connections are made by soldered wire.
  • soldered wire When many units of the same kind are manufactured, it has been found that the many soldered connections required slow up production and are unnecessarily expensive.
  • the present invention has for its object the provision of a novel interconnecting arrangement by which a number of terminals may be quickly and cheaply interconnected.
  • Another object is the provision of a connector sheet by which multiple connections can be made quickly with no chance of error.
  • Still another object is the provision of a connector sheet which can be manufactured at low cost by an electro-plating operation.
  • Fig. 1 shows a plan view of the invention while Figs. 2, 3, 4, and show edge views of difierent modifications of the invention partly in section, Fig. 2 being taken through 2--2 of Fig. 1.
  • a rubber stamp, printing plate, or the like is made conforming to the configuration of the desired connections.
  • a suitable conducting ink is used with the stamp so that when the stamp is printed on paper card or the like, the card will receive a conducting coating of ink which is a facsimile of the desired connections. It will be understood that the card is treated 50 that it will not absorb or be affected by an electro-plating solution.
  • a further inked strip for the purpose of connecting all of the inked areas to each other, so that all will be included in a circuit whereby all inked areas may receive together a metal coating in an electroplating process.
  • inked areas which are undesired in the final product consist of inked sections extending from the inked configuration of the connections to the edge of the card. These sections are der signed to be gripped by suitable clips or other connecting means associated with a source of electro-plating potential.
  • the card is then immersed in a plating bath in which the inked areas receive a deposit of the plating metal of a few mills or more thick which will constitute the connections for the finished product.
  • the sheet of plated material is then removed from the bath and washed thoroughly with water or some other cleaning agent and is then put into a suitable apparatus where holes are punched out of the plated connections for receiving eyelets, binding screws, terminal lugs or the like and preferably during the same operation, the undesired interconnections between normally independent circuits are severed by being punched out, as are the circuits leading to the edge of the sheet, thus leaving only desired conducting strips on the card.
  • the sheet of insulating material with the independent conducting strips thereon is preferably used as a unit and positioned on a connecting block with the terminals extending through the punched holes.
  • Connection may be made in any suitable manner, for example by a simultaneous welding process. such as the shot process in which a condenser discharge is used for the welding operation. or by soldering. or eyelets may be inserted in desired locations and connection established by screws and nuts.
  • FIG. 1 of the drawing which shows in plan view a multiple terminal connection in simplified form according to present invention:
  • a card 9 of water proof insulating material is shown with two conducting strips [9 and H formed thereon by a plating process.
  • the strips have enlarged end sections [2, I3 and M, I5 and are connected by a short connecting member l6 which will be severed after the plating operation by a hole I! punched through the card.
  • On two ed es of the card are plated areas I8 and [9 which before the plating operation were inked to provide a connection to an electro-plating circuit not shown.
  • the connections between l2 and I8 and I5 and I! are severed during the punching operation by perforations 20 and 2 i.
  • members ll and I2 are perforated for terminal lugs after the plating operation by a punching device wh ch produces serrated openings 22 preferably of such size that the teeth are bent upwards by the insertion of a terminal lug into an opening to provide greater contact area.
  • connection device If the connection device is to be placed over terminal lugs with the plated surface on the upper side of the card as shown in Fig. 2, the edges of card 9 in the area adjacent to the teeth, unless first cut away will be in contact with the surface of the connecting lug.
  • solder may be used for connecting the metal surface to the terminal lugs, suflicient solder being used to bridge the space occupied by the paper backing of the teeth. If the paper is removed near the points of the teeth permitting a metal to metal contact,
  • connection may be made by welding or soldering.
  • the metal coated surface When the metal coated surface is placed adjacent to the surface from which the terminal lugs protrude, and only one side is coated, the metal surface of the serrations make contact with the surface of the terminal lugs and may be soldered or welded thereto, any suitable means being provided to connect the welding current to the connecting strips, and a suitable fixture is preferably provided for connecting the opposite pole of the welding current to the terminal lugs.
  • the serrated openings may be punched through the card prior to the inking operation, in which case sufficient ink is used so that a certain amount of the ink flows downward over the teeth and openings 22, with the result that the edges as well as the surface adjacent to the teeth is completely inked.
  • This arrangement is shown in Figs. 3 and 4 in which the electro-plated coating 25 is shown in Fig. 3, deposited on a card 26 and at 27 the metal coating is shown formed on the edge portion of the teeth of opening 22.
  • the metal coating 39 is shown deposited on the under surface of a card 3
  • the terminalstrip maybe connected to the terminal lug by soldering or welding.
  • Fig. an embodiment of the invention is shown in which inked impressions of the multiple connection are made on opposite sides of card 40 in register with each other and in which holes 4
  • two separate stamps or printing plates will be requiredsince one stamp must make an impression which is the reverse or a mirror image of the other.
  • an upper plated surface 42 and a lower plated surface 43 are formed. This arrangement may be connected to terminals by welding or soldering.
  • the method of manufacturing unitary mule tiple connections comprising the steps of printing with a conducting ink on a noneconducting sheet of a facsimile consisting of areas presenting the multiple connections and of areas presenting interconnections between each pair of connections and between at least one of said connections and the edge of the non-conducting sheet, then electr -p at the inked areas of said sheet, the second mentioned areasbeing adapted to provide electrical series connection for all of said multiple connections during the electro-plating step, severing said inter-connections thereby disconnect,- ing electrically each of said multiple connections from the other connections, and punching holes in the said first-mentionedareas to receive terminals external to the sheet.
  • 2,- e m od of nu ac r n unitarymu tiple connections comprising the steps of prints ing with a conducting ink on a non-conducting sheet a facsimile consisting of areas presenting the multiple connections and of areas presenting interconnections between each pair of connecinked impressions on opposite surtions and between at least one of said connections and the edge of the non-conducting sheet, then electro-plating the inked areas of said sheet, the second mentioned areas being adapted to provide electrical series connection for all of said multi- :ple connections during the electro-plating step,
  • a method of manufacturing unitary multiple connections according to claim 1 in which holes positioned to receive terminals are punched in said sheet before the printing operation, and in which facsimiles in register with each other are printed on opposite surfaces of said sheet, whereby the inked areas on the opposite surfaces of said sheet are interconnected by ink flowing over the edges of said holes and receive a metallic coating during the electro-plating process.
  • a method according to claim 1 in which serrated holes positioned to receive terminals external to said sheet are punched in said sheet prior to said printing operation whereby the edges of said serrations are inked by excess ink flowing thereover when the printing operation takes place, said edges thus receiving a metallic coating during the plating operation, and wherein the opening between the points of said teeth is less than the diameter of connecting lugs to be inserted therein whereby said teeth of the respective holes are bent from the plane of said sheet when the connecting lugs are inserted therein.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Electrical Connectors (AREA)

Description

Dec. 30, 1947. E. s. MCLARN; 2,433,334
METHOD OF MANUFACTURING UNITARY MULTIPLE CONNECTIONS Filed Nov. 5, 1942 Y INVENTOR. ERNEST 5. v smR/v ATTORNEY Patented Dec. 30, 1947 METHOD OF MANUFACTURING UNITARY MULTIPLE CONNECTIONS Ernest S. McLarn, Manhasset, N. Y., assignor to Internat onal Standard El ctric Corporation, New York, N. Y., a corporation of Delaware Application November 5, 1942, Serial No. 464,618
6 Claims.
This invention relates to methods for the manufacture of unitary multiple connections for use in connector blocks for telephone subsets and the like.
Sub-panels for telephone equipment and other electrical devices often comprise a considerable number of terminal studs between which the required connections are made by soldered wire. When many units of the same kind are manufactured, it has been found that the many soldered connections required slow up production and are unnecessarily expensive.
Accordingly, the present invention has for its object the provision of a novel interconnecting arrangement by which a number of terminals may be quickly and cheaply interconnected.
Another object is the provision of a connector sheet by which multiple connections can be made quickly with no chance of error.
Still another object is the provision of a connector sheet which can be manufactured at low cost by an electro-plating operation.
Other objects of the invention will appear in the following description given with the aid of the accompanying drawings in which:
Fig. 1 shows a plan view of the invention while Figs. 2, 3, 4, and show edge views of difierent modifications of the invention partly in section, Fig. 2 being taken through 2--2 of Fig. 1.
In carrying out the invention, a rubber stamp, printing plate, or the like is made conforming to the configuration of the desired connections. A suitable conducting ink is used with the stamp so that when the stamp is printed on paper card or the like, the card will receive a conducting coating of ink which is a facsimile of the desired connections. It will be understood that the card is treated 50 that it will not absorb or be affected by an electro-plating solution. Between each of the respective inked areas which are subsequently to form connections, there is made a further inked strip for the purpose of connecting all of the inked areas to each other, so that all will be included in a circuit whereby all inked areas may receive together a metal coating in an electroplating process.
Other inked areas which are undesired in the final product consist of inked sections extending from the inked configuration of the connections to the edge of the card. These sections are der signed to be gripped by suitable clips or other connecting means associated with a source of electro-plating potential.
The card is then immersed in a plating bath in which the inked areas receive a deposit of the plating metal of a few mills or more thick which will constitute the connections for the finished product. The sheet of plated material is then removed from the bath and washed thoroughly with water or some other cleaning agent and is then put into a suitable apparatus where holes are punched out of the plated connections for receiving eyelets, binding screws, terminal lugs or the like and preferably during the same operation, the undesired interconnections between normally independent circuits are severed by being punched out, as are the circuits leading to the edge of the sheet, thus leaving only desired conducting strips on the card. The sheet of insulating material with the independent conducting strips thereon is preferably used as a unit and positioned on a connecting block with the terminals extending through the punched holes. Connection may be made in any suitable manner, for example by a simultaneous welding process. such as the shot process in which a condenser discharge is used for the welding operation. or by soldering. or eyelets may be inserted in desired locations and connection established by screws and nuts.
Referring now to Fig. 1 of the drawing which shows in plan view a multiple terminal connection in simplified form according to present invention: A card 9 of water proof insulating material is shown with two conducting strips [9 and H formed thereon by a plating process. The strips have enlarged end sections [2, I3 and M, I5 and are connected by a short connecting member l6 which will be severed after the plating operation by a hole I! punched through the card. On two ed es of the card are plated areas I8 and [9 which before the plating operation were inked to provide a connection to an electro-plating circuit not shown. The connections between l2 and I8 and I5 and I!) are severed during the punching operation by perforations 20 and 2 i.
In one modification of the invention members ll and I2 are perforated for terminal lugs after the plating operation by a punching device wh ch produces serrated openings 22 preferably of such size that the teeth are bent upwards by the insertion of a terminal lug into an opening to provide greater contact area.
If the connection device is to be placed over terminal lugs with the plated surface on the upper side of the card as shown in Fig. 2, the edges of card 9 in the area adjacent to the teeth, unless first cut away will be in contact with the surface of the connecting lug. In case the paper edges adjacent to the teeth are not removed solder may be used for connecting the metal surface to the terminal lugs, suflicient solder being used to bridge the space occupied by the paper backing of the teeth. If the paper is removed near the points of the teeth permitting a metal to metal contact,
then connection may be made by welding or soldering.
When the metal coated surface is placed adjacent to the surface from which the terminal lugs protrude, and only one side is coated, the metal surface of the serrations make contact with the surface of the terminal lugs and may be soldered or welded thereto, any suitable means being provided to connect the welding current to the connecting strips, and a suitable fixture is preferably provided for connecting the opposite pole of the welding current to the terminal lugs.
The serrated openings may be punched through the card prior to the inking operation, in which case sufficient ink is used so that a certain amount of the ink flows downward over the teeth and openings 22, with the result that the edges as well as the surface adjacent to the teeth is completely inked. This arrangement is shown in Figs. 3 and 4 in which the electro-plated coating 25 is shown in Fig. 3, deposited on a card 26 and at 27 the metal coating is shown formed on the edge portion of the teeth of opening 22. In Fig. 4, the metal coating 39 is shown deposited on the under surface of a card 3| in which the hole 22 was pro-punched so that a metal covering is formed on the edges '32 of the teeth which are shown bent up in contact with a terminal lug 33. Here also the terminalstrip maybe connected to the terminal lug by soldering or welding. In Fig. an embodiment of the invention is shown in which inked impressions of the multiple connection are made on opposite sides of card 40 in register with each other and in which holes 4| are prepunched before the inking operation thus connecting the faces of the card by excess ink which flows over the edges of the serrations in hole 4|. It will be understood that two separate stamps or printing plates will be requiredsince one stamp must make an impression which is the reverse or a mirror image of the other. 'In this embodiment, an upper plated surface 42 and a lower plated surface 43 are formed. This arrangement may be connected to terminals by welding or soldering.
It will be understood that the holes punched through the connecting strips for connecting pm: poses may be round or of any other confi uration depending on requirements, and if preferred pro" porticned so that theopenings are not distorted but remain fiat when a terminal member is inserted therein, and that any suitable connecting arrangement other than those mentioned in the above description may be used.
What I claim is:
1. The method of manufacturing unitary mule tiple connections comprising the steps of printing with a conducting ink on a noneconducting sheet of a facsimile consisting of areas presenting the multiple connections and of areas presenting interconnections between each pair of connections and between at least one of said connections and the edge of the non-conducting sheet, then electr -p at the inked areas of said sheet, the second mentioned areasbeing adapted to provide electrical series connection for all of said multiple connections during the electro-plating step, severing said inter-connections thereby disconnect,- ing electrically each of said multiple connections from the other connections, and punching holes in the said first-mentionedareas to receive terminals external to the sheet.
2,- e m od of nu ac r n unitarymu tiple connections comprising the steps of prints ing with a conducting ink on a non-conducting sheet a facsimile consisting of areas presenting the multiple connections and of areas presenting interconnections between each pair of connecinked impressions on opposite surtions and between at least one of said connections and the edge of the non-conducting sheet, then electro-plating the inked areas of said sheet, the second mentioned areas being adapted to provide electrical series connection for all of said multi- :ple connections during the electro-plating step,
severing said inter-connections thereb disconnecting electrically each of the said multiple connections from the other connections, and punching holes in the connections formed on the sheet positioned to receive terminals external to the sheet.
3. The method of manufacturing unitary multiple connections according to claim 2 in which the severing of the interconnections and the punching of the holes for terminals are performed during the same operation/ 4. The method of manufacturing unitary multiple connections as set forth in claim 1, comprising punching said holes in the sheet positioned to receive terminals before the printing step, whereby ink flows over the edges of said holes during the printing operation thus causing a deposit of metal around the inner surface of said holes during the electro-plating operation.
5. A method of manufacturing unitary multiple connections according to claim 1 in which holes positioned to receive terminals are punched in said sheet before the printing operation, and in which facsimiles in register with each other are printed on opposite surfaces of said sheet, whereby the inked areas on the opposite surfaces of said sheet are interconnected by ink flowing over the edges of said holes and receive a metallic coating during the electro-plating process.
6. A method according to claim 1 in which serrated holes positioned to receive terminals external to said sheet are punched in said sheet prior to said printing operation whereby the edges of said serrations are inked by excess ink flowing thereover when the printing operation takes place, said edges thus receiving a metallic coating during the plating operation, and wherein the opening between the points of said teeth is less than the diameter of connecting lugs to be inserted therein whereby said teeth of the respective holes are bent from the plane of said sheet when the connecting lugs are inserted therein.
ERNEST S. MCLARN.
REFERENCES CITED The following references are of record in the file of this patent:
UNITED STATES PATENTS
US464618A 1942-11-05 1942-11-05 Method of manufacturing unitary multiple connections Expired - Lifetime US2433384A (en)

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Cited By (49)

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US2502291A (en) * 1946-02-27 1950-03-28 Lawrence H Taylor Method for establishing electrical connections in electrical apparatus
US2515105A (en) * 1947-08-08 1950-07-11 Allied Electric Products Inc Method of making an electrical connection to an insulated wire
US2593479A (en) * 1948-07-07 1952-04-22 Motorola Inc Electrical apparatus using metalized circuits and components therefor
US2607821A (en) * 1949-02-05 1952-08-19 Erie Resistor Corp Electric circuit assembly
US2641672A (en) * 1950-05-08 1953-06-09 Northrop Aircraft Inc Electrical conductor
US2683839A (en) * 1950-01-12 1954-07-13 Beck S Inc Electric circuit components and method of preparing same
US2694249A (en) * 1948-04-16 1954-11-16 Kapp Robert Manufacturing method for complex electrical and wireless apparatus
US2699425A (en) * 1952-07-05 1955-01-11 Motorola Inc Electroplating electrical conductors on an insulating panel
US2745170A (en) * 1950-06-30 1956-05-15 Chrysler Corp Process for manufacturing electrical coils
US2762113A (en) * 1950-11-03 1956-09-11 Standard Coil Prod Co Inc Method of making tuner devices
US2783193A (en) * 1952-09-17 1957-02-26 Motorola Inc Electroplating method
US2816252A (en) * 1953-11-12 1957-12-10 Sanders Associates Inc Electronic module device
US2869040A (en) * 1954-01-11 1959-01-13 Sylvania Electric Prod Solder-dipped stamped wiring
US2876390A (en) * 1953-12-09 1959-03-03 Sanders Associates Inc Mounting device for electrical components
US2877389A (en) * 1953-06-25 1959-03-10 Globe Union Inc Printed electronic circuit
US2887952A (en) * 1957-06-06 1959-05-26 Gottscho Inc Adolph Ink rollers
US2888614A (en) * 1955-02-04 1959-05-26 Kelsey Hayes Co Electrical assemblies and apparatus for producing same
US2889532A (en) * 1956-09-04 1959-06-02 Ibm Wiring assembly with stacked conductor cards
US2897409A (en) * 1954-10-06 1959-07-28 Sprague Electric Co Plating process
US2900713A (en) * 1955-05-31 1959-08-25 Harold S Young Method of making reinforced honeycomb structures
US2902629A (en) * 1954-11-22 1959-09-01 Ibm Printed circuit connection and method of making same
US2907925A (en) * 1955-09-29 1959-10-06 Gertrude M Parsons Printed circuit techniques
US2943956A (en) * 1952-12-18 1960-07-05 Automated Circuits Inc Printed electrical circuits and method of making the same
US2955351A (en) * 1954-12-28 1960-10-11 Plast O Fab Circuits Inc Method of making a printed circuit
US2958064A (en) * 1957-11-26 1960-10-25 Amp Inc Circuit board and socket construction
US2985709A (en) * 1957-08-06 1961-05-23 Joseph P Mammola Means and method of mounting electronic components
US3007083A (en) * 1957-08-28 1961-10-31 Int Shoe Co Perforated conductive insole
US3049647A (en) * 1958-09-02 1962-08-14 Sylvania Electric Prod Electrical chassis
US3072734A (en) * 1958-08-26 1963-01-08 Eastman Kodak Co Circuit board for mounting and inter-connecting electrical components
US3142112A (en) * 1960-03-30 1964-07-28 Hughes Aircraft Co Method of making an electrical interconnection grid
US3143484A (en) * 1959-12-29 1964-08-04 Gen Electric Method of making plated circuit boards
US3148438A (en) * 1959-05-25 1964-09-15 Vero Prec Engineering Ltd Method of making wiring boards
US3157828A (en) * 1960-08-11 1964-11-17 Gen Motors Corp Encapsulated printed circuit module with heat transfer means
US3159906A (en) * 1957-05-27 1964-12-08 Gen Electric Electric circuit assembly method
US3177463A (en) * 1960-03-14 1965-04-06 Ever Ready Co Electrical socket for dry battery assembly
US3200020A (en) * 1963-12-23 1965-08-10 Gen Precision Inc Method of making a weldable printed circuit
US3209066A (en) * 1961-08-28 1965-09-28 William H Toomey Printed circuit with integral welding tubelets
US3237282A (en) * 1961-01-23 1966-03-01 Packard Bell Electronics Corp Printed board wiring
US3275736A (en) * 1965-04-12 1966-09-27 Gen Dynamics Corp Apparatus for interconnecting elements
US3440716A (en) * 1966-01-25 1969-04-29 Hughes Aircraft Co Miniaturized electrical circuits
US3501831A (en) * 1968-06-17 1970-03-24 Rogers Corp Eyelet
US3882264A (en) * 1967-12-29 1975-05-06 Amp Inc Eyelet in flexible circuitry
US4109298A (en) * 1976-07-26 1978-08-22 Texas Instruments Incorporated Connector with printed wiring board structure
US4109376A (en) * 1977-06-24 1978-08-29 General Motors Corporation Method of manufacturing a circuit breaker assembly or the like
US4157785A (en) * 1977-10-31 1979-06-12 Carrier Corporation Safety connection for a retrofit flue damper
US4897627A (en) * 1985-06-21 1990-01-30 Magnetek Universal Mfg. Corp. Fluorescent ballast assembly including a strip circuit board
WO1996012393A1 (en) * 1994-10-18 1996-04-25 Atotech Deutschland Gmbh Process for coating electrically non-conducting surfaces with connected metal structures
JP6277342B1 (en) * 2016-11-04 2018-02-07 達也 宮崎 Metal foil substrate and pattern forming method for electronic circuit and apparatus using the same

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US2492236A (en) * 1946-07-22 1949-12-27 Motorola Inc Wiring arrangement
US2515105A (en) * 1947-08-08 1950-07-11 Allied Electric Products Inc Method of making an electrical connection to an insulated wire
US2694249A (en) * 1948-04-16 1954-11-16 Kapp Robert Manufacturing method for complex electrical and wireless apparatus
US2593479A (en) * 1948-07-07 1952-04-22 Motorola Inc Electrical apparatus using metalized circuits and components therefor
US2607821A (en) * 1949-02-05 1952-08-19 Erie Resistor Corp Electric circuit assembly
US2683839A (en) * 1950-01-12 1954-07-13 Beck S Inc Electric circuit components and method of preparing same
US2641672A (en) * 1950-05-08 1953-06-09 Northrop Aircraft Inc Electrical conductor
US2745170A (en) * 1950-06-30 1956-05-15 Chrysler Corp Process for manufacturing electrical coils
US2762113A (en) * 1950-11-03 1956-09-11 Standard Coil Prod Co Inc Method of making tuner devices
US2699425A (en) * 1952-07-05 1955-01-11 Motorola Inc Electroplating electrical conductors on an insulating panel
US2783193A (en) * 1952-09-17 1957-02-26 Motorola Inc Electroplating method
US2943956A (en) * 1952-12-18 1960-07-05 Automated Circuits Inc Printed electrical circuits and method of making the same
US2877389A (en) * 1953-06-25 1959-03-10 Globe Union Inc Printed electronic circuit
US2816252A (en) * 1953-11-12 1957-12-10 Sanders Associates Inc Electronic module device
US2876390A (en) * 1953-12-09 1959-03-03 Sanders Associates Inc Mounting device for electrical components
US2869040A (en) * 1954-01-11 1959-01-13 Sylvania Electric Prod Solder-dipped stamped wiring
US2897409A (en) * 1954-10-06 1959-07-28 Sprague Electric Co Plating process
US2902629A (en) * 1954-11-22 1959-09-01 Ibm Printed circuit connection and method of making same
US2955351A (en) * 1954-12-28 1960-10-11 Plast O Fab Circuits Inc Method of making a printed circuit
US2888614A (en) * 1955-02-04 1959-05-26 Kelsey Hayes Co Electrical assemblies and apparatus for producing same
US2900713A (en) * 1955-05-31 1959-08-25 Harold S Young Method of making reinforced honeycomb structures
US2907925A (en) * 1955-09-29 1959-10-06 Gertrude M Parsons Printed circuit techniques
US2889532A (en) * 1956-09-04 1959-06-02 Ibm Wiring assembly with stacked conductor cards
US3159906A (en) * 1957-05-27 1964-12-08 Gen Electric Electric circuit assembly method
US2887952A (en) * 1957-06-06 1959-05-26 Gottscho Inc Adolph Ink rollers
US2985709A (en) * 1957-08-06 1961-05-23 Joseph P Mammola Means and method of mounting electronic components
US3007083A (en) * 1957-08-28 1961-10-31 Int Shoe Co Perforated conductive insole
US2958064A (en) * 1957-11-26 1960-10-25 Amp Inc Circuit board and socket construction
US3072734A (en) * 1958-08-26 1963-01-08 Eastman Kodak Co Circuit board for mounting and inter-connecting electrical components
US3049647A (en) * 1958-09-02 1962-08-14 Sylvania Electric Prod Electrical chassis
US3148438A (en) * 1959-05-25 1964-09-15 Vero Prec Engineering Ltd Method of making wiring boards
US3143484A (en) * 1959-12-29 1964-08-04 Gen Electric Method of making plated circuit boards
US3177463A (en) * 1960-03-14 1965-04-06 Ever Ready Co Electrical socket for dry battery assembly
US3142112A (en) * 1960-03-30 1964-07-28 Hughes Aircraft Co Method of making an electrical interconnection grid
US3157828A (en) * 1960-08-11 1964-11-17 Gen Motors Corp Encapsulated printed circuit module with heat transfer means
US3237282A (en) * 1961-01-23 1966-03-01 Packard Bell Electronics Corp Printed board wiring
US3209066A (en) * 1961-08-28 1965-09-28 William H Toomey Printed circuit with integral welding tubelets
US3200020A (en) * 1963-12-23 1965-08-10 Gen Precision Inc Method of making a weldable printed circuit
US3275736A (en) * 1965-04-12 1966-09-27 Gen Dynamics Corp Apparatus for interconnecting elements
US3440716A (en) * 1966-01-25 1969-04-29 Hughes Aircraft Co Miniaturized electrical circuits
US3882264A (en) * 1967-12-29 1975-05-06 Amp Inc Eyelet in flexible circuitry
US3501831A (en) * 1968-06-17 1970-03-24 Rogers Corp Eyelet
US4109298A (en) * 1976-07-26 1978-08-22 Texas Instruments Incorporated Connector with printed wiring board structure
US4109376A (en) * 1977-06-24 1978-08-29 General Motors Corporation Method of manufacturing a circuit breaker assembly or the like
US4157785A (en) * 1977-10-31 1979-06-12 Carrier Corporation Safety connection for a retrofit flue damper
US4897627A (en) * 1985-06-21 1990-01-30 Magnetek Universal Mfg. Corp. Fluorescent ballast assembly including a strip circuit board
WO1996012393A1 (en) * 1994-10-18 1996-04-25 Atotech Deutschland Gmbh Process for coating electrically non-conducting surfaces with connected metal structures
JP6277342B1 (en) * 2016-11-04 2018-02-07 達也 宮崎 Metal foil substrate and pattern forming method for electronic circuit and apparatus using the same

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