CN206127466U - Thin printed circuit board is clamping jig and clamping sets for gilding - Google Patents
Thin printed circuit board is clamping jig and clamping sets for gilding Download PDFInfo
- Publication number
- CN206127466U CN206127466U CN201621039722.9U CN201621039722U CN206127466U CN 206127466 U CN206127466 U CN 206127466U CN 201621039722 U CN201621039722 U CN 201621039722U CN 206127466 U CN206127466 U CN 206127466U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- printed circuit
- pcb
- thin printed
- gold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
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- 239000002184 metal Substances 0.000 claims description 43
- 229910052751 metal Inorganic materials 0.000 claims description 43
- 239000010931 gold Substances 0.000 claims description 26
- 229910052737 gold Inorganic materials 0.000 claims description 25
- 238000007747 plating Methods 0.000 claims description 24
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 17
- 238000001179 sorption measurement Methods 0.000 claims description 17
- 229910052793 cadmium Inorganic materials 0.000 claims description 16
- 229910052804 chromium Inorganic materials 0.000 claims description 16
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- 229910052742 iron Inorganic materials 0.000 claims description 13
- 229910052709 silver Inorganic materials 0.000 claims description 13
- 229910052725 zinc Inorganic materials 0.000 claims description 13
- 229910052802 copper Inorganic materials 0.000 claims description 11
- 238000007639 printing Methods 0.000 claims description 10
- 229910052716 thallium Inorganic materials 0.000 claims description 9
- 229910052718 tin Inorganic materials 0.000 claims description 8
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- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
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- 238000002203 pretreatment Methods 0.000 description 2
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- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/005—Contacting devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/007—Current directing devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
Abstract
The utility model relates to a thin printed circuit board is clamping jig and clamping sets for gilding, according to the utility model discloses a thin printed circuit board is clamping jig and clamping sets for gilding includes: prop up supporting bench, the opening configuration of exposing thin printed circuit board's gilding field is in central authorities, and the formation support the frame portion of the framework shape of thin printed circuit board frame, and fixed part, it is fixed thin printed circuit board with frame portion, just it includes by insulating nature resin formation's equipment and the free accommodation that is formed by the electric conductivity material to prop up supporting bench the conducting layer on equipment surface. Provide the deformation that prevents thin printed circuit board, increase of service life promptly also can reduce manufacturing cost's thin printed circuit board is clamping jig and clamping sets for gilding from this.
Description
Technical field
This utility model is related to the gold-plated use clamping device of thin printed circuit board (PCB) and clamping platform, more particularly, to will support
Platform makes of the remarkable material of recuperability, maintains flatness, and the thin printed circuit board (PCB) of thin printed circuit plate benging can be prevented gold-plated
With clamping device and clamping platform.
Technical background
Usually, printed circuit board (PCB) (Printed Circuit Board；PCB effect) is, by multiple electronic products unit
Part simply connects according to certain framework, and is, from the household appliances of digital TV to sophisticated communication instrument, widely to be made
Used in the part of all electronic products, and universal PC B, module PCB, encapsulation PCB etc. are divided into according to purposes.
That is, printed circuit board (PCB) is, in the side of phenolic resin insulation board or epoxy resins insulation plate etc., to paste the thin plates such as copper
Afterwards, it is etched (only stay the circuit on line, corrode and remove) with ray mode according to circuit, the circuit needed for constituting, and
Punch and be formed in the hole that part is used to paste carrying, make to be categorized as single sided board, two panels, multilamellar according to the number on wired electric road surface
Plate etc., and the more multipart thread tension of the number of plies is more outstanding, is employed in high-accuracy product, also, in recent years by electronic industry
Development, thin printed circuit board (PCB) (thickness is 0.0125mm～0.05mm) is widely used.
Usually, there is → is used for the embodiment copper thickness of fine circuits in PCB → compact/bendability requirement → FPCB
Reduction → use of the thin FCCL or sputtering FCCL of the thickness (hundreds of nm～several μm) of Copper Foil recently is increased.
These printed circuit board (PCB)s implement gold-plated by known electric plating apparatus, and at this moment the plating apparatus will be gold-plated
After metal (for example, copper) puts into the electrolyte of electrolysis bath, powered by conducting parts, to wanting gold-plated plate to carry out metal-plated
Gold.
That is, described common electric plating apparatus substantially through the engineering of 3 steps, want gold-plated by cleaning and rinsing first
The pre-treatment step of plate, and it is gold-plated will complete the gold-plated step of pre-treatment step plate, and post processing is gold-plated the step of complete plate shape
Into.In this case, the suspension (suspended) according to the movement of the guide rail of plating apparatus is installed in described each step
Retain the carrier for supporting the plate for wanting gold-plated, and in the fixture with corner frame image of this critical coated plate of carrier installation folder.
Fig. 1 is the perspective view for illustrating the gold-plated use fixture of plate according to prior art, is so shown, the gold-plated use fixture 10 of plate by
Across the horizontal pane 11 that big upper and lower interval configures to horizontal direction, 12, and the two ends of these upper and lower horizontal panes 11,12 are hung down
Directly connect, constitute a pair of the vertical frames 13,14 with corner framework form.
The frame of thin printed circuit board (PCB) P is close in the state of the fixture, is fixed on by the fixed component 20 of such as folder
Fixture.
By the common engineering of the plating gold of these existing gold-plated use fixtures by being dehydrated, grind, defat, dipping, plating gold,
Post processing, the order of drying are carried out, and dipping engineering at this moment is in the state of plate is fixed on fixture, are immersed in collecting gold-plated
The plating bath of liquid.
But, extension is fixed on the described thin printed circuit board (PCB) P of the fixture 10 because of thickness of thin, so, it is susceptible to distortion
Or bending etc. deformation.Therefore, in order to normal condition (the non-distorted or state for bending or the shape for being tightly held in fixture
State) clamp, the longer activity duration is needed, and can occur bad by what is taken.
The fixture that in addition, there will be is formed by metal material, so, when Jing external environment conditions are distorted when repeatedly using,
Weaken with recuperability, it is impossible to maintain the problem of thin printed circuit board (PCB) flatness.
The bending of these thin printed circuit board (PCB) P is not tightly held in the phenomenon of fixture, becomes and crimps
And rise and fall (Curl/Wave) it is bad the reason for, and not only form the bad of current on time, and when being immersed in plating bath, induce institute
The phenomenon that thin printed circuit board (PCB) P easily shakes to left and right is stated, when making to ultimately result in gold-plated completing, gold-plated inhomogeneities is induced
With the gold-plated bad problem laid particular stress on because of gold-plated amount.
Additionally, the thin printed circuit board (PCB) of thickness of thin is had plate by when tightly stationary state is not clamped in gold plating liquid
Move up and down, or during air stirring, because of the obstruction of gold plating liquid, the problem that plate is torn.Additionally, thin printed circuit
Plate is because being easily bent and distorts, inconvenient with operation, and in cramp assembling and disassembling, not only needs long time, and is difficult
It is tightly held in fixture so that hardly result in the problem of the gold-plated film of uniform thickness.
Look-ahead technique document Prior Art
Patent documentation
Patent documentation 1：Korean utility model registration the 20-0180025th (on 04 15th, 2000)
Utility model content
Technical task
Therefore, it, in order to solve existing issue described above, is to provide to be suitable for by recuperability that the purpose of this utility model is
The supporting table of outstanding material can prevent the thin printed circuit board (PCB) of thin printed circuit plate benging gold-plated with clamping maintaining flatness
Fixture.
Additionally, being during offer removal is applied to supporting table plated surface golden film, can to prevent supporting table conductive layer from damaging
The thin printed circuit board (PCB) of wound is gold-plated to use clamping device.
Additionally, being the recuperability for providing increase supporting table, the deformation for bending or distorting is prevented, while bootable fixed part
The thin printed circuit board (PCB) of the fixed position of part is gold-plated to use clamping device.
Of the present utility model and another purpose be offer can simply combine fixed component while, in supporting table
During the thin printed circuit board (PCB) of fixation, the gold-plated clamping of thin printed circuit board (PCB) that thin printed circuit board (PCB) central part sinks can be prevented
Platform.
It is that fixation is provided additionally, making thin printed circuit board (PCB) be adsorbed onto the frame portion of operation platen supporting part and supporting table
In part engaging process, can prevent thin printed circuit board (PCB) from using clamping platform to the thin printed circuit board (PCB) that arbitrary position is moved is gold-plated.
Additionally, be that number or the fixed position according to fixed component is provided, the guiding groove location of movable operation platform
Thin printed circuit board (PCB) is gold-plated to use clamping platform.
Technical scheme
By being reached according to the gold-plated clamping device of thin printed circuit board (PCB) of the present utility model, it includes the purpose：Support
Platform, the peristome for exposing the gold-plated field of thin printed circuit board (PCB) is configured in central authorities, and forms the support thin printed circuit edges of boards
The frame portion of the frame shape of frame；And fixed component, the fixed thin printed circuit board (PCB) and the frame portion, and the supporting table
The conductive layer for encasing the device surface formed including the equipment formed by insulative resin and by conductive material.
Wherein it is preferred to, the conductive layer is by any in Cu, Ag, Au, Tl, Zn, Cd, Ti, Ni, Cr, Mn, Fe, Pd, Sn
One metal is formed, or is formed by more than one alloy for obtaining in the metal is added.
Moreover it is preferred that the supporting table also includes：Electric conductivity armour layer, by leading with the conductive layer different material
Conductive metal is formed, and encases the surface of the conductive layer.
Moreover it is preferred that when the conductive layer is formed by Cu, the electric conductivity armour layer by Ag, Au, Tl, Zn, Cd, Ti,
Any one metal is formed in Ni, Cr, Mn, Fe, Pd, Sn, or is formed by more than one alloy for obtaining in the metal is added.
Moreover it is preferred that in the frame portion of the supporting table, except the fixed component combines the other field in field,
Formation is extended from frame portion outer surface, expands the rib of frame portion width.
Moreover it is preferred that in the rib, the rib for being configured in supporting table upper end is extended by length direction, with
To make the supporting table be immersed in the fixing means connection of the plating apparatus of gold plating liquid, anchor portion is formed.
Moreover it is preferred that in the anchor portion, fixing hole is formed through.
Moreover it is preferred that the equipment by epoxy resin, FR4, FR5 for preventing supporting table plastic deformation any one
Formed.
Moreover it is preferred that the frame portion in the supporting table configures multiple through holes.
By being reached according to the gold-plated clamping platform of thin printed circuit board (PCB) of the present utility model, it includes described and other purposes：
Supporting table, the peristome for exposing the gold-plated field of thin printed circuit board (PCB) is configured in central authorities, and forms the support thin printed circuit
The frame portion of the frame shape of edges of boards frame；Multiple fixed components, isolator configure according to the frame portion, the fixation thin printing
Circuit board and the frame portion；And operation post, the placement section that the frame portion with the supporting table is placed, and be inserted into described
The peristome of supporting table, supports the plate supporting part of thin printed circuit board (PCB) bottom surface, and the placement section includes multiple support blocks, its
Support other field in addition to fixed component binding site.
Wherein it is preferred to, the plate supporting part is set by the height corresponding to supporting table thickness.
Moreover it is preferred that above the plate supporting part relative with the bottom surface of the thin printed circuit board (PCB), configuring many
The adsorption hole of individual suction function.
Moreover it is preferred that above the support block relative with the supporting table bottom surface, configuring multiple suction functions
Adsorption hole.
Moreover it is preferred that the frame portion in the supporting table configures multiple through holes connected with the adsorption hole.
Moreover it is preferred that the support block is on operation post, with the length direction of the frame portion it is portable matched somebody with somebody
Put.
Technique effect
According to this utility model, there is provided be suitable for the supporting table of the outstanding material of recuperability to maintain flatness, can prevent thin
The thin printed circuit board (PCB) of printed circuit plate benging is gold-plated to use clamping device.
During offer removing is applied to supporting table plated surface golden film, the thin printing of supporting table damaging conducting layer can be prevented
Circuit board is gold-plated to use clamping device.
Further it is provided that while increasing the mechanicalness recuperability of supporting table, the thin print of bootable fixed component fixed position
Printed circuit board is gold-plated to use clamping device.
Additionally, according to this utility model, there is provided while simply can combining fixed component, in supporting table thin printing is fixed
During circuit board, can prevent that thin printed circuit board (PCB) that thin printed circuit board (PCB) central part sinks is gold-plated to use clamping platform.
Additionally, making thin printed circuit board (PCB) be adsorbed onto the frame portion of operation platen supporting part and supporting table, there is provided fixed component
In engaging process, can prevent thin printed circuit board (PCB) from using clamping platform to the thin printed circuit board (PCB) that arbitrary position is moved is gold-plated.
Further it is provided that the number or fixed position according to fixed component, the thin print of the guiding groove location of movable operation platform
Printed circuit board is gold-plated to use clamping platform.
Description of the drawings
Fig. 1 is the perspective view for illustrating the gold-plated use fixture of plate according to prior art.
Fig. 2 is the perspective view for illustrating the gold-plated use clamping device of thin printed circuit board (PCB) of the present utility model.
Fig. 3 is the decomposition diagram for illustrating the gold-plated use clamping device of thin printed circuit board (PCB) of the present utility model.
Fig. 4 is the amplification profile diagram for illustrating Fig. 2 " A " part.
Fig. 5 is the perspective view for illustrating the gold-plated use clamping platform of thin printed circuit board (PCB) of the present utility model.
Fig. 6 is the decomposition diagram for illustrating the gold-plated use clamping platform of thin printed circuit board (PCB) of the present utility model.
Fig. 7 to Fig. 9 is illustrated using the gold-plated use clamping platform of thin printed circuit board (PCB) of the present utility model, fixes thin in supporting table
The process of printed circuit board (PCB).
Figure 10 is the variation for illustrating the gold-plated use clamping platform of thin printed circuit board (PCB) of the present utility model.
Figure 11 is illustrate the gold-plated use clamping device of thin printed circuit board (PCB) according to other embodiment of the present utility model saturating
View.
Figure 12 is the sectional drawing for illustrating Figure 11 " C " part.
Specific embodiment
Before explanation, in multiple embodiments, for the element with identical composition, using identical symbol, generation
Illustrating in first embodiment for table, in the embodiment outside it, illustrates to first embodiment and other compositions.
Hereinafter, refer to the attached drawing is carried out to the gold-plated clamping device of thin printed circuit board (PCB) of first embodiment of the present utility model
Explain.
In accompanying drawing, Fig. 2 is the perspective view for illustrating the gold-plated use clamping device of thin printed circuit board (PCB) of the present utility model, and Fig. 3
It is the decomposition diagram for illustrating the gold-plated use clamping device of thin printed circuit board (PCB) of the present utility model, and Fig. 4 illustrates Fig. 2
The amplification profile diagram of " A " part.
Illustrate Ru described, the gold-plated use clamping device of thin printed circuit board (PCB) of the present utility model, including supporting table 110 and solid
Determine part 120.
The supporting table 110 includes that the peristome 111 in the gold-plated field for exposing thin printed circuit board (PCB) P is configured in central authorities, and
The frame portion 112 of the frame shape of the thin printed circuit board (PCB) P frames is supported, and in the frame portion 112, except the fixation
Part 120 is combined in the other field in field, is extended from the outer surface of frame portion 112, expands the rib of the width of frame portion 112
113。
Usually, supporting table 110 is during electrolytic gold plating, and using making firmly to support, thin printed circuit board (PCB) P's is logical
Chang Tie (Fe) material, but, ferrum has resistance little, rigidly outstanding advantage while making conductivity outstanding, on the contrary, because multiple
Former power is little to be susceptible to plastic deformation, is not only difficult to maintain flatness, and needs to replace when deforming, with short life
Shortcoming.
Therefore, the supporting table 110 of the present embodiment is to improve existing shortcoming, by by such as the PCB of epoxy, FR4, FR5
The surface of the equipment 110a that plate insulative resin is formed, may be configured as by Cu, Ag, Au, Tl, Zn, Cd, Ti, Ni, Cr, Mn,
Any one, or is encased by the conductive layer 110b that more than one alloy for obtaining is constituted in the metal is added in Fe, Pd, Sn
Form.
That is, according to the supporting table 110 of the present embodiment, while guaranteeing the recuperability of supporting table 110 by equipment 110a, prevent
The only deformation of supporting table 110, can maintain the flatness of thin printed circuit board (PCB) P.Therefore, equipment 110a by insulative resin by shape
Into, so, even if bending or the deformation such as distorting, can also return to original state, and increase the width of supporting table 110, no
Can only prevent the deformation of thin printed circuit board (PCB) P, and prevented also from supporting table 110 electrical property it is low.
On the one hand, when the conductive layer 110b is formed by Cu, the copper for being applied to the surface of supporting table 110 is removed using etching solution
During gold-plated film, conductive layer 110b can be damaged.That is, described conductive layer 110b is when stripper is used to peel off electrolytic gold plating
During the metal of the Gold plated Layer reaction of formation, on the surface of conductive layer 110b electric conductivity armour layer 110c can be formed, and preferably, this
A little electric conductivity armour layer 110c can be formed by the material of etching or the corrosion of suppression conductive layer 110b.For example, electric conductivity mask
Layer 110c can by Ag, Au, Tl, Zn, Cd, Ti, Ni, Cr, Mn, Fe, Pd, the Sn except Cu any one, or by addition institute
State more than one alloy for obtaining in metal to be formed.Particularly as electric conductivity armour layer 110c most preferably use from Au,
The metal selected in Tl, Cd, Ti, Ni, Cr, Mn, Pd.So by Ag, Au, Tl, Zn, Cd, Ti, Ni, Cr, Mn, Fe, Pd, Sn
Any one metal, or add in the alloy that more than one is obtained in the metal, the metal or metal alloy of selection is formed
During conductive layer 110b, can be by the metal or metal alloy except forming conductive layer 110b, other metal or metal alloy are formed
Electric conductivity armour layer 110c.That is, conductive layer 110b and electric conductivity armour layer 110c can be formed by different metal or metal alloy.
When on conductive layer 110b without electric conductivity armour layer 110c, conductive layer 110b is damaged when can etch, and can not make again
Situation, when there is electric conductivity armour layer 110c on conductive layer 110b, even if the electric conductivity armour layer in etching process
110c is etched, and is not etched by with conductive layer 110b, and can again apply flexibly the advantage of supporting table 110 by protection.
On the one hand, in the frame portion 112 of the supporting table 110, it is configurable to multiple the passing through of thin printed circuit board (PCB) P absorption
Through hole 114.
The fixed component 120 is configured multiple according to the frame portion 112, and in the frame portion 112 thin printing is fixed
Circuit board P, can make the metal pan-like of plate shape becomes tortuous folder form.The fixed component 120 of these folder forms can be in institute
The lap position of supporting table 110 and thin printed circuit board (PCB) P is stated, repeatedly handling are combined, and using the manual type paper of configuration in addition
Folder screwdriver or self-reacting device, can combine or separation.
The as constituted above gold-plated use clamping device of thin printed circuit board (PCB) of the present utility model, thin printed circuit board (PCB) P's
Frame is close to and is supported in the state of the upper side of 110 frame portion of supporting table 112, is consolidated using the fixed component 120 of folder form
The lap of fixed thin printed circuit board (PCB) P and frame portion 112, can be fixed on supporting table 110 by thin printed circuit board (PCB) P.
Especially, the supporting table 110 is combining the other field in field except fixed component 120, forms expansion frame
The rib 113 of the width of portion 112.
That is, the basal area of the reinforced supporting table 110 of portion 113 is increased, and makes opposing of the increase to bending or distort, so,
Thickness is made into thinner compared with existing supporting table, it is possible to increase elastic force and recuperability.Therefore, thin printed circuit board (PCB) P is fixed
In the state of supporting table 110, be immersed in plating bath carry out it is gold-plated during, can prevent from being fixed on the thin printing of supporting table 110
Circuit board P is gold-plated with the state for deforming.
Hereinafter, according to this utility model, clamping platform gold-plated to thin printed circuit board (PCB) is illustrated.
In accompanying drawing, Fig. 5 is the perspective view for illustrating the gold-plated use clamping platform of thin printed circuit board (PCB) of the present utility model, and Fig. 6 is
The decomposition diagram of the gold-plated use clamping platform of thin printed circuit board (PCB) of the present utility model is shown, and Fig. 7 is the amplification of Fig. 6 " b " part
Figure, and Fig. 8 to Fig. 9 is illustrated using the gold-plated use clamping platform of thin printed circuit board (PCB) of the present utility model, and in supporting table thin print is fixed
The process of printed circuit board.
The gold-plated clamping platform of of the present utility model thin printed circuit board (PCB) as shown in Fig. 5 to Fig. 7 is for thin printing is electric
Road plate P is placed in the state of supporting table 110, and the thin printed circuit board (PCB) P is fixed on into supporting table using fixed component 120
110, its composition includes supporting table 110 and fixed component 120 and operation post 130.
The supporting table 110 exposes the peristome 111 in the gold-plated fields of thin printed circuit board (PCB) P, and formation in central authorities' configuration
The frame portion 112 of the frame shape of thin printed circuit board (PCB) P frames is supportted, except the fixed component 120 in the frame portion 112
With reference to the other field in field, formed from the outer surface of frame portion 112 and be extended, expand the rib of the width of frame portion 112
113, and the multiple through holes 114 that will be connected with the adsorption hole H of support block 131a described later in the configuration of the frame portion 112.
Usually, supporting table 110 is during electrolytic gold plating, and using making firmly to support, thin printed circuit board (PCB) P's is logical
Chang Tie (Fe) material, but, ferrum has resistance little, and conductivity is outstanding, and rigid outstanding advantage, on the contrary, because restoring
Power is little to be susceptible to plastic deformation, is not only difficult to maintain flatness, and needs to replace when deforming, lacking with short life
Point.
Therefore, the supporting table 110 of the present embodiment is to improve existing shortcoming, by by such as the PCB of epoxy, FR4, FR5
The surface of the equipment 110a that plate insulative resin is formed, may be configured as by Cu, Ag, Au, Tl, Zn, Cd, Ti, Ni, Cr, Mn,
Any one, or is encased by the conductive layer 110b that more than one alloy for obtaining is constituted in the metal is added in Fe, Pd, Sn
Form.
That is, according to the supporting table 110 of the present embodiment, while guaranteeing the recuperability of supporting table 110 by equipment 110a, prevent
The only deformation of supporting table 110, can maintain the flatness of thin printed circuit board (PCB) P.Therefore, equipment 110a by insulative resin by shape
Into, so, even if bending or the deformation such as distorting, can also return to original state, and increase the width of supporting table 110, no
Can only prevent the deformation of thin printed circuit board (PCB) P, and prevented also from supporting table 110 electrical property it is low.
On the one hand, when the conductive layer 110b is formed by Cu, the copper for being applied to the surface of supporting table 110 is removed using etching solution
During gold-plated film, conductive layer 110b can be damaged.That is, described conductive layer 110b is when stripper is used to peel off electrolytic gold plating
During the metal of the Gold plated Layer reaction of formation, on the surface of conductive layer 110b electric conductivity armour layer 110c can be formed, and preferably, this
A little electric conductivity armour layer 110c can be formed by the material of etching or the corrosion of suppression conductive layer 110b.For example, electric conductivity mask
Layer 110c can by Ag, Au, Tl, Zn, Cd, Ti, Ni, Cr, Mn, Fe, Pd, the Sn except Cu any one, it is or described by addition
More than one alloy for obtaining is formed in metal.Particularly as electric conductivity armour layer 110c most preferably use from Au, Tl,
The metal selected in Cd, Ti, Ni, Cr, Mn, Pd.So by any in Ag, Au, Tl, Zn, Cd, Ti, Ni, Cr, Mn, Fe, Pd, Sn
One metal, or add in the alloy that more than one is obtained in the metal, the metal or metal alloy of selection forms conduction
During layer 110b, can be by the metal or metal alloy except forming conductive layer 110b, other metal or metal alloy form conduction
Property armour layer 110c.That is, conductive layer 110b and electric conductivity armour layer 110c can be formed by different metal or metal alloy.Leading
When in electric layer 110b without electric conductivity armour layer 110c, conductive layer 110b is damaged when can etch, not reusable
Situation, when there is electric conductivity armour layer 110c on conductive layer 110b, even if in etching process, electric conductivity armour layer 110c quilts
Etching, it may have conductive layer 110b is not etched by, and the advantage of supporting table 110 can again be applied flexibly by protection.
The fixed component 120 is configured multiple according to the frame portion 112, and in the frame portion 112 thin printing is fixed
Circuit board P, can make the metal pan-like of plate shape becomes tortuous folder form.The fixed component 120 of these folder forms can be in institute
The lap position of supporting table 110 and thin printed circuit board (PCB) P is stated, repeatedly handling are combined, and using the manual type paper of configuration in addition
Folder screwdriver or self-reacting device, can combine or separation.
The operation post 130 includes the He of placement section 131 that the frame portion of the supporting table 110 is placed, and is inserted in described
The peristome 111 of supporting table 110, the plate supporting part 132 for supporting thin printed circuit board (PCB) P bottom surfaces is configured.
The placement section 131 includes making support other field in addition to the binding site of the fixed component 120, is configured
Multiple support blocks 131a, and insulating space between multiple support blocks 131a is configured in, expose the guiding of the bottom surface of the supporting table 110
Groove 131b.Additionally, above support block 131a relative with the bottom surface of supporting table 110, being connected to other vacuum line, form negative
Multiple adsorption hole H of the gar shape of pressure effect.
The plate supporting part 132 is in order to prevent the central part of thin printed circuit board (PCB) P from sinking, with corresponding to the support
The height of the thickness of platform 110.That is, above plate supporting part 132 compared with placement section 131 above, such as the thickness of supporting table 110 is to upside
Direction is highlighted, in the state of the placement section 131 places supporting table 110, with plate supporting part 132 above supporting table 110
Identical level is formed above.Additionally, above the plate supporting part 132 relative with the bottom surface of thin printed circuit board (PCB) P, connection
To other vacuum line, multiple adsorption hole H of suction function are formed.
It is connected to the vacuum line of the gar shape adsorption hole H of support block 131a and is connected to plate supporting part 132 and adsorbs
The vacuum line of hole H is individually separated, and can control to independence, and also can simultaneously be controlled by a line connection.It is connected to the support block
The vacuum line of the gar shape adsorption hole H of 131a, the frame field for making thin printed circuit board (PCB) P does not stick up, and at this moment by drawing
Guide groove 131b, when filling in fixed component 120 morphogenetic by folder, the frame portion 112 and thin printed circuit board (PCB) of supporting table 110
The overlap field of P is not tilted, and can well be fixed by fixed component 120.Additionally, being connected to the plate supporting part 132
The effect of the vacuum line of adsorption hole is flatly to be close to thin printed circuit board (PCB) P to be fixed on the plate face of plate supporting part 132.
Hereinafter, with reference to Fig. 8 to Fig. 9, illustrate in turn to configure supporting table 110 and thin printing electricity in the upside of operation post 130
Base board P, and the process of thin printed circuit board (PCB) P is fixed in supporting table 110 using fixed component 120.
Fig. 8 is to show that supporting table 110 is placed on the state of the placement section 131 of operation post 130, as illustrated, in operation post 130
Placement section 131 place the frame portion 112 of supporting table 110, and be formed in the plate supporting part 132 of the upper central of operation post 130, quilt
It is inserted into the peristome 111 of supporting table 110.
Especially, the plate supporting part 132 is highlighted from above the placement section 131 with the thickness of supporting table 110,
So, in the state of the frame portion 112 of the supporting table 110 of placement section 131 of operation post 130 is placed, the upside of supporting table 110
Face and the upper side of plate supporting part 132, form identical plane.
That is, such as Fig. 9, the thin printed circuit board (PCB) P of the upside of supporting table 110 is configured in, in frame by the upper side of supporting table 110
In the state of support, middle body is supported on and the plate supporting part 132 of the upper side formation same level of the supporting table 110
Upper side.Therefore, during thin printed circuit board (PCB) P being fixed on into supporting table 10, the central part of thin printed circuit board (PCB) P can be prevented
Divide the phenomenon of sinking.
Additionally, in the upper side of the plate supporting part 132, multiple adsorption hole H are formed, so, it can be ensured that thin printed circuit
The flatness and stationarity of plate P, and can prevent from wanting in the cohesive process of fixed component described later 120, the position of thin printed circuit board (PCB) P
It is arbitrarily mobile.
Additionally, the frame portion 112 in the supporting table 110 forms the through hole that connects with the adsorption hole H of support block 131a
114, so, the frame that can maintain thin printed circuit board (PCB) P is close to the state of the frame 112 of supporting table 110.On the one hand, such as Fig. 7 and
Fig. 8, the adsorption hole H for being formed in support block 131a is formed by gar shape, and is formed in the through hole 114 of supporting table 110
Formed by pore morphology, so, during supporting table 110 is placed on into placement section 131, without other position alignment processes,
The adsorption hole H of support block 131a can be made to connect with the through hole 114 of supporting table 110.
Support block 131a of the operation post 130 be configured to it is multiple isolator configured by predetermined interval, and in isolation
Between space form guiding groove 131b, and the frame portion 112 of the supporting table 110 being placed by support block 131a upper side passes through
Guiding groove 131b is exposed.Therefore, fill in when being formed as the fixed component 120 of folder form by the guiding groove 131b,
The frame portion 112 of support platform 110 and the overlap field of thin printed circuit board (PCB) P, can be fixed by fixed component 120.
Hereinafter, the variation of clamping platform gold-plated to thin printed circuit board (PCB) of the present utility model is illustrated.
In accompanying drawing, Figure 10 is the variation for illustrating the gold-plated use clamping platform of thin printed circuit board (PCB) of the present utility model, is shown respectively
Show the plane of supporting table and the plane of placement section.
The variation of the gold-plated use clamping platform of thin printed circuit board (PCB) of the present utility model, in the support block for constituting placement section 131
131a may move the aspect being configured according to the length direction of the frame portion 112 of supporting table 110, have with the above embodiments
Difference.Specifically, not shown, but Jing such as LM are guided, and guide the guide member of rectilinear movement, can be moved by length direction
Dynamic configuration.On the one hand, except other compositions of support block 131a are identical with the above embodiments, so, to phase isomorphism
Into illustrate to give and omit.
Supporting table 110 is necessary thickness or species according to thin printed circuit board (PCB) P, changes the fixed bit of fixed component 120
Put or change the fixed number of fixed component 120.It can thus be appreciated that, it is necessary to the position of the guiding groove 131b of change operation platform 130,
But according to variation described above, according to the binding site of fixed component 120, change is configured the position of multiple support blocks 131a
Put, the position of mobile guiding groove 131b.Therefore, even if the binding site of change fixed component 120, placement section can not also be replaced
131 carry out operation, so, can provide effectively appropriate corresponding benefit to various working environment.
In accompanying drawing, Figure 11 is to illustrate the gold-plated clamping folder of thin printed circuit board (PCB) according to other embodiment of the present utility model
The perspective view of tool, and Figure 12 is the sectional drawing for illustrating Figure 11 " C " part.
As shown in figure 11, the gold-plated use clamping device of the thin printed circuit board (PCB) of other embodiment, in the upper end of supporting table 110 '
The anchor portion 115 that supporting table 110 ' is tied up to plating apparatus that formation extends from the end of rib 113 to length direction, and
The aspect of the insertion fixing hole 116 fixed for anchor portion 115 is formed in the terminal part of anchor portion 115, with above-mentioned reality
Apply example and there is difference.
Specifically, supporting table 110 ' is configured in central authorities including the peristome 111 for exposing the gold-plated fields of thin printed circuit board (PCB) P,
And the frame portion 112 of the frame shape of the support thin printed circuit board (PCB) P frames, and in the frame portion 112, except described
Fixed component 120 combines the other field in field, is extended from the outer surface of frame portion 112, expands adding for the width of frame portion 112
Strong portion 113, and multiple through holes 114 of frame portion 112 described in insertion, and from being configured in the rib of the upper end of supporting table 110 '
113 end, to the anchor portion 115 that length direction extends, and the fixing hole 116 of anchor portion 115 described in insertion.
That is, described anchor portion 115 is fixed on the fixing means being configured on the upside of plating apparatus electrolytic gold plating groove and (does not show
Go out), and the steady pin (not shown) insertion fixing hole 116 of fixing means side is configured in this process, can prevent from arbitrarily separating.
On the one hand, in the fixing means electrolytic gold plating, it is configured to the gold-plated of power supply license and uses power suppling part (not shown), can
Make to be formed with anchor portion 115 and make electrical contact with.
Additionally, as Figure 12 illustrates that the supporting table 110 ' is included by the plate of such as epoxy, FR4, FR5 insulative resin shape
Into, it is stacked in the conductive layer 110b and electric conductivity armour layer 110c on equipment 110a surfaces.
Specifically, the supporting table 110 ' provide by the surface of equipment 110a by Cu, Ag, Au, Tl, Zn, Cd, Ti, Ni,
In Cr, Mn, Fe, Pd, Sn any one, or by adding the conductive layer that more than one alloy for obtaining is constituted in the metal
The electric conductivity that 110b is surrounded, so, the thin printed circuit board (PCB) for being fixed on supporting table can be with the gold-plated use for being connected to anchor portion 115
Power suppling part (not shown) is powered.
On the one hand, when the conductive layer 110b is formed by Cu, the copper for being applied to the surface of supporting table 110 is removed using etching solution
During gold-plated film, conductive layer 110b can be damaged.That is, described conductive layer 110b is when stripper is used to peel off electrolytic gold plating
During the metal of the Gold plated Layer reaction of formation, on the surface of conductive layer 110b electric conductivity armour layer 110c can be formed, and preferably, this
A little electric conductivity armour layer 110c can be formed by the material of etching or the corrosion of suppression conductive layer 110b.For example, electric conductivity mask
Layer 110c can by Ag, Au, Tl, Zn, Cd, Ti, Ni, Cr, Mn, Fe, Pd, the Sn except Cu any one, it is or described by addition
More than one alloy for obtaining is formed in metal.Particularly as electric conductivity armour layer 110c most preferably use from Au, Tl,
The metal selected in Cd, Ti, Ni, Cr, Mn, Pd.So by any in Ag, Au, Tl, Zn, Cd, Ti, Ni, Cr, Mn, Fe, Pd, Sn
One metal, or add in the alloy that more than one is obtained in the metal, the metal or metal alloy of selection forms conduction
During layer 110b, can be by the metal or metal alloy except forming conductive layer 110b, other metal or metal alloy form conduction
Property armour layer 110c.That is, conductive layer 110b and electric conductivity armour layer 110c can be formed by different metal or metal alloy.Leading
When in electric layer 110b without electric conductivity armour layer 110c, conductive layer 110b is damaged when can etch, not reusable
Situation, when there is electric conductivity armour layer 110c on conductive layer 110b, even if in etching process, electric conductivity armour layer 110c quilts
Etching, is not etched by with conductive layer 110b, and can again apply flexibly the advantage of supporting table 110 by protection.
Additionally, conductive layer 110bs of the electric conductivity armour layer 110c compared with Cu materials, relative with the low material of conductivity
When matter is chosen, Jing electric conductivity armour layer 110c, the conductivity between anchor portion 115 and gold-plated use power suppling part can drop
Low, preferably, therefore, the electric conductivity armour layer 110c is encased except the anchor portion 115 and power suppling part contact site
The other field for dividing.
Interest field of the present utility model is not limited to the above embodiments, can be in additional utility model registration application model
In enclosing, it is embodied as by the embodiment of multiplex form.Will in this utility model without departing from utility model registration application range application
In the case of point, belong to technical staff of the present utility model, deformable diverse range is considered as into right of the present utility model will
Ask within the scope of record.
Symbol description
110：Supporting table, 110a：Equipment, 110b：Conductive layer,
110c：Electric conductivity armour layer, 111：Peristome, 112 frame portions,
113：Rib, 114：Through hole, 115：Anchor portion,
116：Fixing hole, 120：Fixed component, 130：Operation post,
131：Placement section, 131a：Support block, 131b：Guiding groove,
132：Plate supporting part, H：Adsorption hole, B：Thin printed circuit board (PCB).
Claims (15)
1. the gold-plated use clamping device of a kind of thin printed circuit board (PCB), it includes：
Supporting table, the peristome for exposing the gold-plated field of thin printed circuit board (PCB) is configured in central authorities, and forms the support thin printing
The frame portion of the frame shape of circuit board frame；And
Fixed component, the fixed thin printed circuit board (PCB) and the frame portion, and
The supporting table includes the equipment formed by insulative resin and encases the device surface by what conductive material was formed
Conductive layer.
2. the gold-plated use clamping device of thin printed circuit board (PCB) according to claim 1, wherein, the conductive layer by Cu, Ag,
Any one metal is formed in Au, Tl, Zn, Cd, Ti, Ni, Cr, Mn, Fe, Pd, Sn, or by adding more than one in the metal
The alloy of acquisition is formed.
3. the gold-plated use clamping device of thin printed circuit board (PCB) according to claim 2, wherein, the supporting table also includes：
Electric conductivity armour layer, by being formed with the conductive metal of the different material of the conductive layer, encases the surface of the conductive layer.
4. the gold-plated use clamping device of thin printed circuit board (PCB) according to claim 3, wherein, the conductive layer is formed by Cu
When, the electric conductivity armour layer is formed by any one metal in Ag, Au, Tl, Zn, Cd, Ti, Ni, Cr, Mn, Fe, Pd, Sn, or
Formed by more than one alloy for obtaining in the metal is added.
5. the gold-plated use clamping device of thin printed circuit board (PCB) according to claim 1, wherein, the frame portion of the supporting table
In, except the fixed component combines the other field in field, formation is extended from frame portion outer surface, expands frame portion width
Rib.
6. the gold-plated use clamping device of thin printed circuit board (PCB) according to claim 5, wherein, in the rib, it is configured in
The rib of supporting table upper end is extended by length direction, with consolidating for the plating apparatus for being used for making the supporting table be immersed in gold plating liquid
Determine means connection, form anchor portion.
7. the gold-plated use clamping device of thin printed circuit board (PCB) according to claim 6, wherein, it is fixed in the anchor portion
Hole is formed through.
8. the gold-plated use clamping device of thin printed circuit board (PCB) according to claim 1, wherein, the equipment is by preventing supporting table
Any one formation in epoxy resin, FR4, FR5 of plastic deformation.
9. the gold-plated use clamping device of thin printed circuit board (PCB) according to claim 1, wherein, in the frame portion of the supporting table
Configure multiple through holes.
10. the gold-plated use clamping platform of a kind of thin printed circuit board (PCB), it includes：
Supporting table, the peristome for exposing the gold-plated field of thin printed circuit board (PCB) is configured in central authorities, and forms the support thin printing
The frame portion of the frame shape of circuit board frame；
Multiple fixed components, isolator configure according to the frame portion, fix the thin printed circuit board (PCB) and the frame portion；And
Operation post, the placement section that the frame portion with the supporting table is placed, and the peristome of the supporting table is inserted into,
The plate supporting part of thin printed circuit board (PCB) bottom surface is supportted, and
The placement section includes multiple support blocks, and it supports the other field in addition to fixed component binding site.
The gold-plated use clamping platform of 11. thin printed circuit board (PCB)s according to claim 10, wherein, the plate supporting part is by corresponding to
The height of supporting table thickness is set.
The gold-plated use clamping platform of 12. thin printed circuit board (PCB)s according to claim 11, wherein, with the thin printed circuit board (PCB)
The relative plate supporting part in bottom surface above, configure the adsorption hole of multiple suction functions.
The gold-plated use clamping platform of 13. thin printed circuit board (PCB)s according to claim 10, wherein, with supporting table bottom surface phase
To the support block above, configure the adsorption hole of multiple suction functions.
The gold-plated use clamping platform of 14. thin printed circuit board (PCB)s according to claim 13, wherein, in the frame portion of the supporting table
The multiple through holes connected with the adsorption hole of configuration.
The gold-plated use clamping platform of 15. thin printed circuit board (PCB)s according to claim 10, wherein, the support block is in operation post
On, with the length direction of the frame portion it is portable be configured.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20-2016-0002773 | 2016-05-20 | ||
| KR2020160002773U KR200485343Y1 (en) | 2016-05-20 | 2016-05-20 | Clamping jig and clamping table for thin printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206127466U true CN206127466U (en) | 2017-04-26 |
Family
ID=58568824
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621039722.9U Expired - Fee Related CN206127466U (en) | 2016-05-20 | 2016-09-06 | Thin printed circuit board is clamping jig and clamping sets for gilding |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR200485343Y1 (en) |
| CN (1) | CN206127466U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112609230A (en) * | 2020-12-10 | 2021-04-06 | 天津普林电路股份有限公司 | Electroplating support plate for ultrathin circuit board, electroplating system and electroplating method thereof |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113225927B (en) * | 2021-03-15 | 2024-03-08 | 广州美维电子有限公司 | Device and method for improving edge leakage base material of fine circuit PCB |
| CN115802633B (en) * | 2022-11-28 | 2023-12-26 | 福莱盈电子股份有限公司 | Electroplating uniformity method of circuit board |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000216230A (en) * | 1999-01-27 | 2000-08-04 | Hitachi Ltd | Fixing jig for tft substrate and disconnection detecting device therefor |
| KR200180025Y1 (en) | 1999-09-13 | 2000-04-15 | 김만성 | A thin electric gilding multipurpose rack |
| JP4654065B2 (en) * | 2005-04-27 | 2011-03-16 | 新光電気工業株式会社 | Electrolytic plating jig and electrolytic plating method |
| KR101063135B1 (en) * | 2009-03-12 | 2011-09-07 | 김원영 | Jig device for plating printed circuit board |
-
2016
- 2016-05-20 KR KR2020160002773U patent/KR200485343Y1/en active IP Right Grant
- 2016-09-06 CN CN201621039722.9U patent/CN206127466U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112609230A (en) * | 2020-12-10 | 2021-04-06 | 天津普林电路股份有限公司 | Electroplating support plate for ultrathin circuit board, electroplating system and electroplating method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| KR200485343Y1 (en) | 2017-12-27 |
| KR20170004049U (en) | 2017-11-30 |
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Granted publication date: 20170426 Termination date: 20210906 |