KR20150139299A

KR20150139299A - Electrolytic removing apparatus

Info

Publication number: KR20150139299A
Application number: KR1020140067730A
Authority: KR
Inventors: 선인경
Original assignee: (주)포인텍
Priority date: 2014-06-03
Filing date: 2014-06-03
Publication date: 2015-12-11

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plating electrolytic dissolution apparatus and particularly to a plating electrolytic dissolution apparatus for dissolving and removing a plating film formed on a jig or the like.
The plating electrolytic dissolution apparatus of the present invention comprises: a water tank containing a plating dissolution liquid; A jig that is deposited on the plating detachment solution of the water tank, has a plating film formed thereon, and is connected to positive electrodes; And a peeling portion which is deposited on the plating detachment liquid of the water tank and is disposed on both sides of the jig and connected to the negative electrode, wherein the peeling portion is made of an insulator material and has a front opening; A metal plate disposed inside the housing and connected to the negative electrode; Wherein the plating film formed on the jig when the power is applied is peeled and permeates through the filtering part in an ion state and then precipitates as a metal from the metal plate, And is collected inside the housing.

Description

[0001] Electrolytic removing apparatus [

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plating electrolytic dissolution apparatus and particularly to a plating electrolytic dissolution apparatus for dissolving and removing a plating film formed on a jig or the like.

Generally, a PCB (Printed Circuit Board) refers to a circuit formed by inserting ICs or electronic components to form a single board, wiring on both sides or cross section of the insulating board with a copper wire, and coating with an insulator.

The PCB is classified into a single-sided board, a double-sided board and a multi-layer board according to the number of wiring circuit surfaces. The higher the number of layers, the better the mounting force of components and the higher the precision.

Such a printed circuit board must be electroplated with gold (Au) or copper (Cu). In general, a printed circuit board is immersed in a plating bath in which a plating solution is stored, Plating is used.

In the case of chemical plating, the substrate is immersed in a plating bath, and plating is performed on the surface of the substrate.

At this time, the printed circuit board contained in the plating solution is shaken for the time of plating, or the printed circuit board is fixed to the fixing jig (JIG) so that the printed circuit board does not sink into the bottom surface of the plating bath

When the substrate is plated, the specific position of the jig is also plated together.

Therefore, after the plating of the substrate is finished, the plating film formed on the jig is removed, and then the plating film is used again.

As a method for removing the plating film, there is an electrolytic stripping method disclosed in Japanese Patent Application Laid-Open No. 10-1999-011157.

However, such a conventional electrolytic dissolution apparatus and method are disadvantageous in that since the plating film is peeled and deposited in the form of a metal and then remains in the plating dissolution liquid, the dissolution rate is slow and the plating dissolution liquid needs to be replaced frequently. The cost is increased.

Disclosure of the Invention The present invention has been made in order to solve the above-mentioned problems, and it is an object of the present invention to prevent the metal deposited on the plating peeling liquid from being peeled off from the plating peeling liquid to increase the peeling speed, increase the lifetime of the plating peeling liquid, And a plating electrolytic peeling apparatus capable of reducing costs.

According to an aspect of the present invention, there is provided a plating electrolytic dissolution apparatus comprising: a water tank containing a plating dissolution liquid; A jig that is deposited on the plating detachment solution of the water tank, has a plating film formed thereon, and is connected to positive electrodes; And a peeling portion which is deposited on the plating detachment liquid of the water tank and is disposed on both sides of the jig and connected to the negative electrode, wherein the peeling portion is made of an insulator material and has a front opening; A metal plate disposed inside the housing and connected to the negative electrode; Wherein the plating film formed on the jig when the power is applied is peeled and permeates through the filtering part in an ion state and then precipitates as a metal from the metal plate, And is collected inside the housing.

The filtration unit is made of a material that permeates metal ions and does not permeate the deposited metal.

The metal plate and the filtration part are spaced apart from each other.

The peeling unit may further include a metal ball accommodated in the housing and in contact with the metal plate, wherein a plating layer is formed on the surface of the metal ball by metal ions moved into the housing when power is applied.

And a control unit for controlling the positive electrode and the negative electrode, wherein the controller applies a constant voltage to the jig and the metal plate to peel the plated coating from the jig.

The controller applies a constant current after applying a constant voltage to peel the plating film from the jig.

According to the plating electrolytic dissolution apparatus of the present invention as described above, the following effects can be obtained.

Since the plating film formed on the jig is peeled off and the metal is deposited on the peeling portion and collected, there is no metal deposited on the plating peeling solution, so that the peeling speed can be increased and the lifetime of the plating peeling solution can be increased.

As a result, environmental pollution can be reduced and costs can be reduced.

1 is a perspective view of a plating electrolytic dissolution apparatus according to an embodiment of the present invention,
Fig. 2 is a sectional structural view taken along the line AA in Fig. 1,
3 is an exploded perspective view of a peeling section of a plating electrolytic peeling apparatus according to an embodiment of the present invention,
FIG. 4 is a flowchart showing the operation of the plating electrolytic dissolution apparatus according to the embodiment of the present invention,
5 is a cross-sectional structural view of a plating electrolytic peeling apparatus according to another embodiment of the present invention.

FIG. 1 is a perspective view of a plating electrolytic dissolution apparatus according to an embodiment of the present invention, FIG. 2 is a cross sectional structural view taken along line AA of FIG. 1, FIG. 4 is a sectional view of a plating electrolytic peeling apparatus according to another embodiment of the present invention, and FIG. 5 is a sectional view of a plating electrolytic peeling apparatus according to another embodiment of the present invention.

1 to 5, the plating electrolytic peeling apparatus of the present invention includes a water tank 10, a jig 20, a peeling unit 30, and a control unit (not shown).

The upper part of the water tank 10 is opened, and the plating removing liquid 11 is accommodated therein.

The jig 20 is deposited on the plating removing solution 11 of the water tank 10 and connected to the positive electrode.

The jig 20 is for supporting a substrate to be plated, and the plated film 21 is formed on the jig 20 when the substrate is plated.

Specifically, the clamp of the jig 20 holding the substrate is plated with the plating film 21 to form the plating film 21.

The present embodiment is for removing the plating film 21 formed on the jig 20 when the jig 20 is plated.

The peeling section 30 is deposited on the plating removing solution 11 of the water tank 10 together with the jig 20 and disposed on both sides of the jig 20 and connected to a negative electrode .

The peeling section 30 includes a housing 31, a metal plate 32, and a filtration section 33.

The housing 31 is made of an insulator material such as synthetic resin, and is open at the front.

In the present embodiment, the housing 31 is formed in a hollow hexahedron shape and has an open front side.

The metal plate 32 is disposed inside the housing 31 and connected to the negative electrode.

The filter unit 33 is mounted in front of the opened housing 31 and disposed between the metal plate 32 and the jig 20. [

The filtration unit 33 is made of an ion exchange resin, a filter cloth or the like, and has the property that the metal ions permeate and the deposited metal does not permeate.

The filtration unit 33 is spaced apart from the metal plate 32.

In this way, the filtration part 33 is separated from the metal plate 32, so that the metal deposited on the metal plate 32 can prevent the filtration part 33 from being attached.

Therefore, when the power is applied, the plating film 21 formed on the jig 20 is electrolytically peeled and permeates through the filtration part 33 in an ion state, and is then precipitated as a metal from the metal plate 32.

The metal deposited on the metal plate 32 can not pass through the sieve filter unit 33 and is collected and present inside the housing 31.

Meanwhile, the peeling unit 30 may further include a metal ball 34.

The metal ball 34 is accommodated in the housing 31 and is in contact with the metal plate 32.

When the power is applied, the plating layer 35 is formed on the surface of the metal ball 34 by the metal ions moved into the housing 31. The plating film 21 of the jig 20 The plating layer 35 can be formed on the surface of the metal ball 34 at the same time.

The control unit controls a power source applied to the positive electrode and the negative electrode.

The control unit applies a constant voltage to the jig 20 and the metal plate 32 to separate the plating film 21 from the jig 20.

In addition, the controller applies a constant current after applying a constant voltage to completely remove the remaining plating film 21 from the jig 20.

Hereinafter, an operation process of the present invention having the above-described configuration will be described.

The jig 20 on which the plating film 21 is formed and the peeling unit 30 are inserted into the water tank 10 as shown in FIG.

At this time, the plating film 21 is deposited on the plating removing solution 11 existing in the water tank 10.

Then, the peeling section 30 is also deposited on the plating peeling liquid 11.

At this time, the peeling section (30) is not entirely deposited on the plating peeling liquid (11), but the upper part protrudes above the water surface of the plating peeling liquid (11).

In this state, power is applied to the jig 20 and the metal plate 32.

Then, the plating film 21 formed on the jig 20 is electrolytically peeled and converted into a metal ion state.

The metal ions move to the peeling unit 30 where the metal plate 32 is present. The metal ions are transmitted through the filtering unit 33 and then precipitated as a metal while contacting the metal plate 32 .

The metal deposited in the housing 31 of the peeling unit 30 may be moved out of the housing 31 but may not be moved to the outside by the filtering unit 33, .

Meanwhile, when power is applied to the jig 20 and the metal plate 32, the control unit applies a constant voltage first and then a second constant current.

The plating film 21 is peeled off when almost constant voltage is applied, and is completely removed when a constant current is applied.

In particular, when a constant current is applied, the voltage value is increased, and a strong shock is applied to the minute corner so that the fine peeling can be performed.

With the above-described plating electrolytic stripping apparatus of the present invention, the precipitated metal is present only within the stripping section 30, so that the stripping rate of the plating film 21 existing in the jig 20 can be improved, The use amount of the plating removing liquid 11 can be reduced, and the waste liquid can be reduced to obtain an effect of reducing the cost and the cost.

The plating electrolytic dissolution apparatus of the present invention is not limited to the above-described embodiments, but can be variously modified within the scope of the technical idea of the present invention.

10: water tank, 11: plating detachment liquid,
20: jig, 21: plated film,
The present invention relates to a method of manufacturing a metal plate,

Claims

A water tank containing the plating detachment liquid;
A jig that is deposited on the plating detachment solution of the water tank, has a plating film formed thereon, and is connected to positive electrodes;
And a peeling portion which is deposited on the plating detachment solution of the water tank and is disposed on both sides of the jig and connected to the negative electrode,
The peeling section
A housing made of an insulator material and having an open front;
A metal plate disposed inside the housing and connected to the negative electrode;
And a filter unit mounted on the front of the housing and disposed between the metal plate and the jig,
Wherein when the power is applied, the plating film formed on the jig is peeled and permeates through the filtering part in an ion state, and then is precipitated as a metal from the metal plate and is collected inside the housing.

The method according to claim 1,
Wherein the filtration portion is made of a material that permeates metal ions and does not permeate the deposited metal.

The method according to claim 1,
Wherein the metal plate and the filtration portion are spaced apart from each other.

The method according to claim 1,
The peeling section
And a metal ball accommodated in the housing and in contact with the metal plate,
And a plating layer is formed on a surface of the metal ball by metal ions moved to the inside of the housing upon power application.

The method according to claim 1,
And a control unit for controlling the positive electrode and the negative electrode,
Wherein the controller applies a constant voltage to the jig and the metal plate to peel the plating film from the jig.

The method of claim 5,
Wherein the controller applies a constant current after applying a constant voltage to peel the plating film from the jig.