ES2101710T3 - Procedimiento fotolitografico. - Google Patents

Procedimiento fotolitografico.

Info

Publication number
ES2101710T3
ES2101710T3 ES91121084T ES91121084T ES2101710T3 ES 2101710 T3 ES2101710 T3 ES 2101710T3 ES 91121084 T ES91121084 T ES 91121084T ES 91121084 T ES91121084 T ES 91121084T ES 2101710 T3 ES2101710 T3 ES 2101710T3
Authority
ES
Spain
Prior art keywords
photoresistent
primary
layer
field
procedure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES91121084T
Other languages
English (en)
Inventor
Michael Dr Sebald
Jurgen Dipl-Chem Beck
Rainer Dr Leuschner
Recai Dr Sezi
Siegfried Dr Birkle
Hellmut Dr Ahne
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Application granted granted Critical
Publication of ES2101710T3 publication Critical patent/ES2101710T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • G03F7/405—Treatment with inorganic or organometallic reagents after imagewise removal

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Investigating Or Analysing Biological Materials (AREA)
  • Medicinal Preparation (AREA)

Abstract

UN PROCEDIMIENTO PARA ESTRUCTURACION EN EL CAMPO SUBMICRON ESTA CARACTERIZADO POR LOS SIGUIENTES PASOS: SE REUNE UNA CAPA FOTORESISTENTE DE UN COMPONENTE DE POLIMERO CON GRUPOS FUNCIONALES QUE ESTAN CAPACITADOS PARA UNA REACCION CON AMINAS PRIMARIAS O SECUNDARIAS Y GRUPOS IMIDOS QUE BLOQUEAN EL NITROGENO, DE UN FOTOINICIADOR LIBERADO POR LA EXPOSICION DE UN ACIDO Y DE UN DISOLVENTE APROPIADO; ENTE SE SECA; LA CAPA FOTORESISTENTE EXPUESTA SE SOMETE A UN TRATAMIENTO DE TEMPERATURA ; ESTRUCTURA FOTORESISTENTE; RATA CON UN AGENTE QUIMICO QUE CONTENGA UN AMINO PRIMARIO O SECUNDARIO; EN EL REVELADO SE GRADUA UN NIVEL DE OSCURIDAD DEFINITIVO EN UN CAMPO ENTRE 20 Y 100 NM.
ES91121084T 1990-12-20 1991-12-09 Procedimiento fotolitografico. Expired - Lifetime ES2101710T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4040998 1990-12-20

Publications (1)

Publication Number Publication Date
ES2101710T3 true ES2101710T3 (es) 1997-07-16

Family

ID=6420918

Family Applications (1)

Application Number Title Priority Date Filing Date
ES91121084T Expired - Lifetime ES2101710T3 (es) 1990-12-20 1991-12-09 Procedimiento fotolitografico.

Country Status (5)

Country Link
US (1) US5250375A (es)
EP (1) EP0492253B1 (es)
JP (1) JP3067871B2 (es)
DE (1) DE59108680D1 (es)
ES (1) ES2101710T3 (es)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5366852A (en) * 1992-09-21 1994-11-22 Shipley Company, Inc. Methods for treating photoresists
FR2716547A1 (fr) * 1994-02-24 1995-08-25 Fujitsu Ltd Procédé pour former un motif de résist et pour fabriquer un dispositif à semi-conducteur.
DE19504434C1 (de) * 1995-02-10 1996-05-15 Siemens Ag Verfahren zur Herstellung siliziumhaltiger Masken
US6057084A (en) * 1997-10-03 2000-05-02 Fusion Systems Corporation Controlled amine poisoning for reduced shrinkage of features formed in photoresist
TW449799B (en) * 1998-03-09 2001-08-11 Mitsubishi Electric Corp Method of manufacturing a semiconductor device having a fine pattern, and semiconductor device manufactured thereby
EP0957399B1 (de) * 1998-04-24 2004-02-18 Infineon Technologies AG Strahlungsempfindliches Gemisch und dessen Verwendung
EP1045291A3 (en) * 1999-02-17 2001-01-10 Infineon Technologies North America Corp. Method of improving the etch resistance of photoresists
TW439119B (en) * 2000-03-04 2001-06-07 United Microelectronics Corp Method for forming photoresist pattern
JP2002030116A (ja) 2000-07-14 2002-01-31 Tokyo Ohka Kogyo Co Ltd 新規コポリマー、ホトレジスト組成物、および高アスペクト比のレジストパターン形成方法
JP2002030118A (ja) * 2000-07-14 2002-01-31 Tokyo Ohka Kogyo Co Ltd 新規コポリマー、ホトレジスト組成物、および高アスペクト比のレジストパターン形成方法
US6605519B2 (en) * 2001-05-02 2003-08-12 Unaxis Usa, Inc. Method for thin film lift-off processes using lateral extended etching masks and device
DE10131670A1 (de) 2001-06-29 2003-01-16 Infineon Technologies Ag Fotoresists mit Reaktionsankern für eine chemische Nachverstärkung von Resiststrukturen für Belichtungen bei 157 nm
DE10131667B4 (de) * 2001-06-29 2007-05-31 Infineon Technologies Ag Negativ Resistprozess mit simultaner Entwicklung und Silylierung
DE10142590A1 (de) 2001-08-31 2003-04-03 Infineon Technologies Ag Verfahren zur Seitenwandverstärkung von Resiststrukturen und zur Herstellung von Strukturen mit reduzierter Strukturgröße
DE10142600B4 (de) * 2001-08-31 2007-05-24 Infineon Technologies Ag Siliziumhaltiger Resist für die Fotolithografie bei kurzen Belichtungswellenlängen
DE10147953B4 (de) * 2001-09-28 2007-06-06 Infineon Technologies Ag CARL für Bioelektronik: Substratanbindung über isolierende Schicht
DE10153497B4 (de) * 2001-10-31 2006-04-06 Infineon Technologies Ag Verfahren zur Silylierung von Fotoresists im UV-Bereich
DE10156865A1 (de) * 2001-11-20 2003-05-28 Infineon Technologies Ag Verfahren zum Ausbilden einer Struktur in einem Halbleitersubstrat
DE10208448A1 (de) 2002-02-27 2003-09-11 Infineon Technologies Ag Lithografieverfahren zur Verringerung des lateralen Chromstrukturverlustes bei der Fotomaskenherstellung unter Verwendung chemisch verstärkter Resists
DE10208449A1 (de) 2002-02-27 2003-09-11 Infineon Technologies Ag Verfahren zur Erhöhung der Ätzresistenz und zur Verkleinerung der Loch- oder Grabenbreite einer Fotoresiststruktur unter Verwendung von Lösungsmittelsystemen geringer Polarität
DE102004025202B4 (de) * 2004-05-22 2008-04-10 Infineon Technologies Ag Fotolackverarbeitungsverfahren
KR100712999B1 (ko) * 2006-03-29 2007-05-02 주식회사 하이닉스반도체 유기 반사 방지막 중합체, 이를 포함하는 유기 반사 방지막조성물 및 이를 이용한 포토레지스트의 패턴 형성 방법
US8530148B2 (en) * 2006-12-25 2013-09-10 Fujifilm Corporation Pattern forming method, resist composition for multiple development used in the pattern forming method, developer for negative development used in the pattern forming method, and rinsing solution for negative development used in the pattern forming method
JP4554665B2 (ja) 2006-12-25 2010-09-29 富士フイルム株式会社 パターン形成方法、該パターン形成方法に用いられる多重現像用ポジ型レジスト組成物、該パターン形成方法に用いられるネガ現像用現像液及び該パターン形成方法に用いられるネガ現像用リンス液
US8637229B2 (en) * 2006-12-25 2014-01-28 Fujifilm Corporation Pattern forming method, resist composition for multiple development used in the pattern forming method, developer for negative development used in the pattern forming method, and rinsing solution for negative development used in the pattern forming method
US8034547B2 (en) * 2007-04-13 2011-10-11 Fujifilm Corporation Pattern forming method, resist composition to be used in the pattern forming method, negative developing solution to be used in the pattern forming method and rinsing solution for negative development to be used in the pattern forming method
EP1980911A3 (en) * 2007-04-13 2009-06-24 FUJIFILM Corporation Pattern forming method, resist composition to be used in the pattern forming method, negative developing solution to be used in the pattern forming method and rinsing solution for negative development to be used in the pattern forming method
KR100990106B1 (ko) 2007-04-13 2010-10-29 후지필름 가부시키가이샤 패턴형성방법, 이 패턴형성방법에 사용되는 레지스트 조성물, 현상액 및 린스액
US8603733B2 (en) 2007-04-13 2013-12-10 Fujifilm Corporation Pattern forming method, and resist composition, developer and rinsing solution used in the pattern forming method
US8476001B2 (en) 2007-05-15 2013-07-02 Fujifilm Corporation Pattern forming method
US7985534B2 (en) * 2007-05-15 2011-07-26 Fujifilm Corporation Pattern forming method
KR101452229B1 (ko) * 2007-06-12 2014-10-22 후지필름 가부시키가이샤 네가티브 톤 현상용 레지스트 조성물 및 이것을 사용한 패턴형성방법
US8632942B2 (en) 2007-06-12 2014-01-21 Fujifilm Corporation Method of forming patterns
JP4617337B2 (ja) * 2007-06-12 2011-01-26 富士フイルム株式会社 パターン形成方法
US8617794B2 (en) 2007-06-12 2013-12-31 Fujifilm Corporation Method of forming patterns
JP4590431B2 (ja) 2007-06-12 2010-12-01 富士フイルム株式会社 パターン形成方法
US8703401B2 (en) * 2011-06-01 2014-04-22 Jsr Corporation Method for forming pattern and developer

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4491628A (en) * 1982-08-23 1985-01-01 International Business Machines Corporation Positive- and negative-working resist compositions with acid generating photoinitiator and polymer with acid labile groups pendant from polymer backbone
US4837124A (en) * 1986-02-24 1989-06-06 Hoechst Celanese Corporation High resolution photoresist of imide containing polymers
US4912018A (en) * 1986-02-24 1990-03-27 Hoechst Celanese Corporation High resolution photoresist based on imide containing polymers
DE58908411D1 (de) * 1989-03-20 1994-10-27 Siemens Ag Hochauflösender Photoresist.
DE3913434A1 (de) * 1989-04-24 1990-10-25 Siemens Ag Trockenwickelbares resistsystem
DE59010729D1 (de) * 1989-04-24 1997-07-31 Siemens Ag Photostrukturierungsverfahren

Also Published As

Publication number Publication date
DE59108680D1 (de) 1997-05-28
JP3067871B2 (ja) 2000-07-24
EP0492253A1 (de) 1992-07-01
US5250375A (en) 1993-10-05
EP0492253B1 (de) 1997-04-23
JPH0511456A (ja) 1993-01-22

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