ES2002935A6 - Un metodo para hacer un miembro conectivo microelectronico elastico - Google Patents

Un metodo para hacer un miembro conectivo microelectronico elastico

Info

Publication number
ES2002935A6
ES2002935A6 ES8603460A ES8603460A ES2002935A6 ES 2002935 A6 ES2002935 A6 ES 2002935A6 ES 8603460 A ES8603460 A ES 8603460A ES 8603460 A ES8603460 A ES 8603460A ES 2002935 A6 ES2002935 A6 ES 2002935A6
Authority
ES
Spain
Prior art keywords
chip
microelectronic
elastic
make
connective member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES8603460A
Other languages
English (en)
Spanish (es)
Inventor
Nils E Patraw
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raytheon Co
Original Assignee
Hughes Aircraft Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hughes Aircraft Co filed Critical Hughes Aircraft Co
Publication of ES2002935A6 publication Critical patent/ES2002935A6/es
Expired legal-status Critical Current

Links

Classifications

    • H10W70/05—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
    • H10W72/00—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H10W72/0711—
    • H10W72/07141—
    • H10W72/07178—
    • H10W72/07236—
    • H10W72/5524—

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Multi-Conductor Connections (AREA)
ES8603460A 1985-12-20 1986-12-17 Un metodo para hacer un miembro conectivo microelectronico elastico Expired ES2002935A6 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US81156085A 1985-12-20 1985-12-20

Publications (1)

Publication Number Publication Date
ES2002935A6 true ES2002935A6 (es) 1988-10-01

Family

ID=25206887

Family Applications (1)

Application Number Title Priority Date Filing Date
ES8603460A Expired ES2002935A6 (es) 1985-12-20 1986-12-17 Un metodo para hacer un miembro conectivo microelectronico elastico

Country Status (8)

Country Link
EP (1) EP0252115B1 (OSRAM)
JP (1) JPS63501995A (OSRAM)
KR (1) KR900005147B1 (OSRAM)
DE (1) DE3680336D1 (OSRAM)
ES (1) ES2002935A6 (OSRAM)
IL (1) IL80785A (OSRAM)
TR (1) TR22767A (OSRAM)
WO (1) WO1987004009A1 (OSRAM)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5047830A (en) * 1990-05-22 1991-09-10 Amp Incorporated Field emitter array integrated circuit chip interconnection
JP3002512B2 (ja) * 1990-09-10 2000-01-24 株式会社日立製作所 集積回路装置
US5345365A (en) * 1992-05-05 1994-09-06 Massachusetts Institute Of Technology Interconnection system for high performance electronic hybrids
DE4417586A1 (de) * 1993-08-03 1995-02-09 Hewlett Packard Co Familie von demontierbaren Hybridanordnungen unterschiedlicher Größe mit Mikrowellenbandbreitenverbindern
US6840777B2 (en) * 2000-11-30 2005-01-11 Intel Corporation Solderless electronics packaging
US11152707B1 (en) * 2020-07-02 2021-10-19 International Business Machines Corporation Fast radio frequency package
EP4261872A1 (en) * 2022-04-11 2023-10-18 Nexperia B.V. Molded electronic package with an electronic component encapsulated between two substrates with a spring member between the electronic component and one of the substrates and method for manufacturing the same

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1021066A (en) * 1974-10-17 1977-11-15 James B. Morris (Sr.) Semiconductor chip interconnect package
US4070688A (en) * 1976-12-27 1978-01-24 International Rectifier Corporation Flexible lead
FR2471048A1 (fr) * 1979-12-07 1981-06-12 Silicium Semiconducteur Ssc Structure et procede de montage d'un composant semi-conducteur principal et d'un circuit auxiliaire
JPS58110778A (ja) * 1981-12-23 1983-07-01 ワイケイケイ株式会社 自動開閉扉の制御装置

Also Published As

Publication number Publication date
JPH0553301B2 (OSRAM) 1993-08-09
EP0252115A1 (en) 1988-01-13
DE3680336D1 (de) 1991-08-22
IL80785A0 (en) 1987-02-27
EP0252115B1 (en) 1991-07-17
WO1987004009A1 (en) 1987-07-02
KR880701021A (ko) 1988-04-13
IL80785A (en) 1994-05-30
JPS63501995A (ja) 1988-08-04
TR22767A (tr) 1988-07-01
KR900005147B1 (ko) 1990-07-20

Similar Documents

Publication Publication Date Title
IL80875A (en) Inverted chip carrier
FR2492164B1 (fr) Procede de realisation simultanee de liaisons electriques multiples, notamment pour le raccordement electrique d'une micro-plaquette de semiconducteurs
JPS5639075B2 (OSRAM)
IT1182219B (it) Perfezionamento nei moduli di circuiti integrati ad alta densita' e procedimento di fabbricazione
EP0218438A3 (en) Apparatus for mounting a semiconductor chip and making electrical connections thereto
DK0551382T3 (da) Halvlederchipenheder, fremgangsmåder til fremstilling deraf og komponenter dertil
DE3869761D1 (de) Gleichrichtereinrichtung.
SE9604690D0 (sv) A Packaging structure fjor intergrated ciruits
EP0890989A4 (en) SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD
ES2132639T3 (es) Conector electrico de alta frecuencia perfeccionado.
JPS5731166A (en) Semiconductor device
KR910005466A (ko) 전극 단자 상호 접속방법
MY132328A (en) Semiconductor assembly
GB2140205B (en) Integrated circuit module and method of making same
SE8703944L (sv) Kompakt elektrisk kopplingsanordning
GB2289985B (en) Method of connecting the output pads on an integrated circuit chip,and multichip module thus obtained
EP0721209A3 (en) Method of testing semiconductor devices and conductive adhesive thereby used
MY112126A (en) Socket
EP0330372A3 (en) Hybrid ic with heat sink
ES2002935A6 (es) Un metodo para hacer un miembro conectivo microelectronico elastico
US3805123A (en) Arrangement for adhesively joining heat-dissipating circuit components to heat sinks and method of making them
GB2251125B (en) Electronic component and method for its construction
GB2083285A (en) Over/under dual in-line chip package
EP0268111A3 (en) Interposer chip technique for making engineering changes between interconnected semiconductor chips
EP0404008A3 (en) Substrate bias generation circuit used in semiconductor integrated circuit

Legal Events

Date Code Title Description
SA6 Expiration date (snapshot 920101)

Free format text: 2006-12-17

FD1A Patent lapsed

Effective date: 20010402