ES1076606Y - Estructura de paquetes de diodo emisor de luz - Google Patents
Estructura de paquetes de diodo emisor de luzInfo
- Publication number
- ES1076606Y ES1076606Y ES201100709U ES201100709U ES1076606Y ES 1076606 Y ES1076606 Y ES 1076606Y ES 201100709 U ES201100709 U ES 201100709U ES 201100709 U ES201100709 U ES 201100709U ES 1076606 Y ES1076606 Y ES 1076606Y
- Authority
- ES
- Spain
- Prior art keywords
- diode packages
- issuer
- light
- light issuer
- packages
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
- H01L33/504—Elements with two or more wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW100203451 | 2011-02-25 | ||
TW100203451U TWM407494U (en) | 2011-02-25 | 2011-02-25 | LED package structure |
Publications (2)
Publication Number | Publication Date |
---|---|
ES1076606U ES1076606U (es) | 2012-03-27 |
ES1076606Y true ES1076606Y (es) | 2012-06-26 |
Family
ID=45081266
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES201100709U Expired - Fee Related ES1076606Y (es) | 2011-02-25 | 2011-08-03 | Estructura de paquetes de diodo emisor de luz |
Country Status (6)
Country | Link |
---|---|
US (1) | US20120217523A1 (es) |
JP (1) | JP3172454U (es) |
CN (1) | CN102651444A (es) |
DE (1) | DE202011050172U1 (es) |
ES (1) | ES1076606Y (es) |
TW (1) | TWM407494U (es) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103247746A (zh) * | 2012-02-01 | 2013-08-14 | 安华高科技通用Ip(新加坡)公司 | 用于光源的方法和设备 |
JP2014175362A (ja) * | 2013-03-06 | 2014-09-22 | Toshiba Corp | 半導体発光素子及びその製造方法 |
CN103337584A (zh) * | 2013-06-06 | 2013-10-02 | 河北神通光电科技有限公司 | 一种白光led及其封装方法 |
US10439111B2 (en) | 2014-05-14 | 2019-10-08 | Genesis Photonics Inc. | Light emitting device and manufacturing method thereof |
JP2016058614A (ja) * | 2014-09-11 | 2016-04-21 | パナソニックIpマネジメント株式会社 | 発光装置、及び照明装置 |
JP6557968B2 (ja) * | 2014-12-25 | 2019-08-14 | 日亜化学工業株式会社 | パッケージ、発光装置及びそれらの製造方法 |
DE102015204057A1 (de) * | 2015-03-06 | 2016-09-08 | Osram Gmbh | Herstellen eines Beleuchtungsmoduls |
KR20170121777A (ko) | 2016-04-25 | 2017-11-03 | 삼성전자주식회사 | 반도체 발광장치 |
CN106356442A (zh) * | 2016-11-21 | 2017-01-25 | 莆田莆阳照明有限公司 | 一种led倒装晶片的全周光led灯 |
DE102017117488A1 (de) * | 2017-08-02 | 2019-02-07 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement |
CN109713112A (zh) * | 2017-10-26 | 2019-05-03 | 深圳市聚飞光电股份有限公司 | 白光led芯片、灯珠及白光led芯片、灯珠制备方法 |
TW202209710A (zh) * | 2020-08-25 | 2022-03-01 | 致伸科技股份有限公司 | 光源模組 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW383508B (en) * | 1996-07-29 | 2000-03-01 | Nichia Kagaku Kogyo Kk | Light emitting device and display |
JP2001144331A (ja) * | 1999-09-02 | 2001-05-25 | Toyoda Gosei Co Ltd | 発光装置 |
US6791116B2 (en) * | 2002-04-30 | 2004-09-14 | Toyoda Gosei Co., Ltd. | Light emitting diode |
CN1684278A (zh) * | 2004-04-15 | 2005-10-19 | 联欣光电股份有限公司 | 一种发光二极管的封装结构及其封装方法 |
TW200739942A (en) * | 2005-06-20 | 2007-10-16 | Rohm Co Ltd | White semiconductor light emitting element and manufacturing method thereof |
US7504272B2 (en) * | 2006-11-06 | 2009-03-17 | Stanley Electric Co., Ltd. | Method for producing color-converting light-emitting device using electrophoresis |
US7781783B2 (en) * | 2007-02-07 | 2010-08-24 | SemiLEDs Optoelectronics Co., Ltd. | White light LED device |
CN101577297A (zh) * | 2008-05-09 | 2009-11-11 | 旭丽电子(广州)有限公司 | 发光封装结构及其制造方法 |
-
2011
- 2011-02-25 TW TW100203451U patent/TWM407494U/zh not_active IP Right Cessation
- 2011-03-11 CN CN2011100584790A patent/CN102651444A/zh active Pending
- 2011-05-18 DE DE202011050172U patent/DE202011050172U1/de not_active Expired - Lifetime
- 2011-07-18 US US13/184,606 patent/US20120217523A1/en not_active Abandoned
- 2011-07-26 JP JP2011004330U patent/JP3172454U/ja not_active Expired - Fee Related
- 2011-08-03 ES ES201100709U patent/ES1076606Y/es not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US20120217523A1 (en) | 2012-08-30 |
JP3172454U (ja) | 2011-12-22 |
CN102651444A (zh) | 2012-08-29 |
DE202011050172U1 (de) | 2011-09-14 |
TWM407494U (en) | 2011-07-11 |
ES1076606U (es) | 2012-03-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG1K | Utility model granted |
Effective date: 20120614 |
|
FD1K | Utility model lapsed |
Effective date: 20191007 |