Classifications

• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
  • C23F1/00—Etching metallic material by chemical means
  • C23F1/10—Etching compositions
  • C23F1/14—Aqueous compositions
  • C23F1/16—Acidic compositions
  • C23F1/28—Acidic compositions for etching iron group metals
• • C—CHEMISTRY; METALLURGY
  • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
  • C22C—ALLOYS
  • C22C38/00—Ferrous alloys, e.g. steel alloys
• • C—CHEMISTRY; METALLURGY
  • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
  • C22C—ALLOYS
  • C22C38/00—Ferrous alloys, e.g. steel alloys
  • C22C38/18—Ferrous alloys, e.g. steel alloys containing chromium
  • C22C38/40—Ferrous alloys, e.g. steel alloys containing chromium with nickel

Definitions

• stainless steel Because of its properties excellent in durability and weather resistance, stainless steel has recently been considered for application in various fields. For example, stainless steel is coming into widespread use in electronic components, battery current collector foils and automotive component housings.
• stainless steel is known to be treated to increase its surface area (e.g., Patent Literature 1) and/or treated to form asperities on the surface of stainless steel (e.g., Patent Literature 2), etc.
• Halide ions to be contained in the aqueous composition may be of any type, and examples include fluoride ions, chloride ions, bromide ions and iodide ions, with chloride ions being more preferred in terms of easy handling and cost effectiveness.
• Halogen compounds supplying halide ions are not limited in any way, and examples include hydrochloric acid, alkali metal halides (e.g., sodium halides and potassium halides), alkaline earth metal halides (e.g., calcium halides), ammonium halides, copper halides, and hydrogen halides.
• alkali metal halides e.g., sodium halides and potassium halides
• alkaline earth metal halides e.g., calcium halides
• ammonium halides copper halides
• hydrogen halides e.g., sodium halides and potassium halides
• preferred are hydrochloric acid, alkali metal halides or hydrogen halides in terms of more effectively and reliably providing the effect of the present invention, and more preferred is hydrochloric acid or sodium chloride.
• halogen compounds are used either alone or in combination. It should be noted that halogen compounds may overlap with copper compounds described later. For example, when a copper halide is used as a source of halide ions, this copper halide also falls within copper compounds described later, which serve as a copper ion source. Copper chloride is preferred as a copper halide. Halogen compounds (halide ions) are deemed to cause pitting corrosion on the passive film during the thinning treatment of the stainless steel surface.
• the lower limit of the concentration of halide ions in the aqueous composition may be any of 8% by mass, 10% by mass, 12% by mass, 14% by mass, 15% by mass, 16% by mass, 17% by mass, 18% by mass, 19% by mass and 20% by mass, based on the total amount (total mass) of the aqueous composition
• the upper limit of the concentration of halide ions may be any of 30% by mass, 29% by mass, 28% by mass, 27% by mass, 26% by mass and 25% by mass, based on the total amount of the aqueous composition.
• concentration range of halide ions may be selected as appropriate from the above lower and upper limits combined as appropriate.
• the effect of the present invention tends to be achieved in a more preferred manner.
• thinning is attempted while preventing the progression of pitting corrosion reaction on stainless steel, and the decomposition reaction of hydrogen peroxide can also be prevented to ensure safety.
• the concentration range of copper ions may be selected as appropriate from the above lower and upper limits combined as appropriate, for example, 0.0001% to 3% by mass, 0.001% to 3% by mass, 0.01% to 2% by mass, 0.01% to 1.7% by mass, 0.01% to 1.5% by mass, 0.02% to 1% by mass, 0.03% to 0.25% by mass, 0.03% to 0.20% by mass, 0.05% to 0.15% by mass, 0.05% to 0.12% by mass, etc.
• the aqueous composition of the present invention may comprise additives as components other than hydrogen peroxide, copper ions and halide ions mentioned above, as long as the effect of the present invention is exerted.
• additives include heterocyclic nitrogen compounds (azole compounds), organic solvents and so on. These additives are used either alone or in combination.
• additives also include a surfactant, a pH adjuster and so on, but they are preferably not contained in the aqueous composition of the present invention.
• the concentration of additives which may be contained in the aqueous composition is preferably 10% by mass or less, more preferably 5.0% by mass or less, even more preferably 2.0% by mass or less, and particularly preferably 1.0% by mass or less.
• the aqueous composition of the present invention may comprise water, and preferably comprises water.
• the water intended here is not limited in any way, but it is preferably water which has been treated to remove metal ions, organic impurities, particles and so on by distillation, ion exchange treatment, filter treatment, various adsorption treatments, etc., and it is more preferably pure water, and particularly preferably ultrapure water.
• aqueous composition of the present invention is preferably in the form of a solution, and is preferably free from components which are non-soluble in the composition in the form of a solution, as exemplified by solid particles such as abrasive particles.
• the aqueous composition comprising the above individual components is considered to efficiently pursue thinning while preventing an extreme increase in roughness on the surface of stainless steel, i.e., the occurrence of a significantly uneven pattern, as shown below.
• the properties of the aqueous composition are not limited in any way, but its pH value is preferably -1.0 to 4.0, more preferably -0.5 to 3.0, even more preferably - 0.25 to 2.5, and particularly preferably -0.1 to 2.0, 0.0 to 1.5, 0.005 to 1.0, or 0.01 to 0.5.
• the pH value may be measured by the method described in the Example section.
• the lower limit of arithmetical mean roughness (Ra) on the surface of stainless steel after the thinning treatment is not limited in any way, but it is for example 0.03 ⁇ m or more, and may be 0.05 ⁇ m or more, or 0.07 ⁇ m or more.
• an increment in the value Z 1 of maximum height (Rz) on the surface of stainless steel after the thinning treatment relative to the value Z 2 of maximum height (Rz) on the flat surface of untreated stainless steel, i.e., Z 1 -Z 2 ( ⁇ m) can be 2.2 ⁇ m or less.
• the increment of Rz is 1.8 ⁇ m or less or 1.7 ⁇ m or less. More preferably, the increment of Rz is 1.6 ⁇ m or less or 1.5 ⁇ m or less.
• the increment of Rz is 1.4 ⁇ m or less, 1.3 ⁇ m or less, 1.2 ⁇ m or less, 1.1 ⁇ m or less or 1.0 ⁇ m or less.
• the surface of stainless steel after the thinning treatment on which deposits have been generated after the thinning treatment may be treated with a physical means (e.g., an adhesive tape) to remove the deposits, prior to the measurement of the arithmetical mean roughness (Ra) and maximum height (Rz) after the thinning treatment step.
• a physical means e.g., an adhesive tape
• such a physical means is not always practical as a part of the manufacturing process.

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• Chemical & Material Sciences (AREA)
• Engineering & Computer Science (AREA)
• Materials Engineering (AREA)
• Mechanical Engineering (AREA)
• Metallurgy (AREA)
• Organic Chemistry (AREA)
• Chemical Kinetics & Catalysis (AREA)
• General Chemical & Material Sciences (AREA)
• Chemical Treatment Of Metals (AREA)
• ing And Chemical Polishing (AREA)

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• 2023
  • 2023-09-14 KR KR1020257011476A patent/KR20250068678A/ko active Pending
  • 2023-09-14 TW TW112134984A patent/TW202424268A/zh unknown
  • 2023-09-14 US US19/110,470 patent/US20260085429A1/en active Pending
  • 2023-09-14 EP EP23865599.7A patent/EP4589050A1/en active Pending
  • 2023-09-14 WO PCT/JP2023/033576 patent/WO2024058250A1/ja not_active Ceased
  • 2023-09-14 JP JP2024547371A patent/JPWO2024058250A1/ja active Pending
  • 2023-09-14 CN CN202380065153.1A patent/CN119866393A/zh active Pending

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