EP4351291A1 - Agencement de composants pour une électronique de puissance et procédé de fourniture d'un agencement de composants pour une électronique de puissance - Google Patents

Agencement de composants pour une électronique de puissance et procédé de fourniture d'un agencement de composants pour une électronique de puissance Download PDF

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Publication number
EP4351291A1
EP4351291A1 EP23198666.2A EP23198666A EP4351291A1 EP 4351291 A1 EP4351291 A1 EP 4351291A1 EP 23198666 A EP23198666 A EP 23198666A EP 4351291 A1 EP4351291 A1 EP 4351291A1
Authority
EP
European Patent Office
Prior art keywords
control circuit
circuit carrier
signal lines
electrical signal
component arrangement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP23198666.2A
Other languages
German (de)
English (en)
Inventor
Samy Arnaout
Jan SCHMÄLING
Oliver RANG
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Volkswagen AG
Original Assignee
Volkswagen AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Volkswagen AG filed Critical Volkswagen AG
Publication of EP4351291A1 publication Critical patent/EP4351291A1/fr
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
    • B60R16/00—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
    • B60R16/02—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements
    • B60R16/03—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements for supply of electrical power to vehicle subsystems or for
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • H05K7/1432—Housings specially adapted for power drive units or power converters
    • H05K7/14322—Housings specially adapted for power drive units or power converters wherein the control and power circuits of a power converter are arranged within the same casing
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections

Definitions

  • the invention relates to a component arrangement for power electronics and a method for providing a component arrangement for power electronics.
  • Power modules are used in power electronics. Currently, these are electrically connected directly to a control circuit carrier (control board) using press-fit pins, solder pins, plug contacts or screw contacts and, in particular, plugged onto it. In pulse inverters, power modules are usually connected using press-fit pins.
  • the power module In the development phase of the power modules, interfaces between the power modules and the control circuit carrier must be defined at a very early stage, as the power modules usually have long tool creation and release times, which dominate the development time of pulse inverters. As a result, the power module already specifies a space allocation and a design of the power electronics, in particular the pulse inverter, at an early stage of development and limits flexibility.
  • the invention is based on the object of providing a solution to the aforementioned problem, wherein the solution is intended in particular to achieve greater flexibility during the development phase of the power electronics.
  • a component arrangement for power electronics comprising at least one power module, at least one connection module separate therefrom, a control circuit carrier separate therefrom, and a housing, wherein the at least one power module, the at least one connection module and the control circuit carrier separate therefrom are arranged in a predetermined manner (ie in particular at predetermined spatial positions) in the housing, wherein the at least one power module is connected to the at least one connection module by means of first electrical signal lines, and wherein the at least one connection module is connected to the control circuit carrier by means of second electrical signal lines.
  • a method for providing a component arrangement for power electronics, wherein at least one power module, at least one connection module separate therefrom, and a control circuit carrier separate therefrom are arranged in a housing in a predetermined manner and in a predetermined order and are electrically connected to one another, wherein for this purpose the at least one power module is connected to the at least one connection module by means of first electrical signal lines and the at least one connection module is connected to the control circuit carrier by means of second electrical signal lines.
  • connection module is created that is (mechanically) separate from the power module and the control circuit carrier, via which the electrical connections are each formed.
  • electrical connections between the at least one power module and the control circuit carrier are formed exclusively via the at least one connection module.
  • the at least one power module is not or will not be electrically connected directly to the control circuit carrier.
  • the electrical connections are formed by means of respective signal lines.
  • the modules and the control circuit carrier are arranged in the housing in a predetermined manner.
  • the predetermined manner relates in particular to a two-dimensional and/or three-dimensional position within the housing and/or a relative arrangement of the modules and/or the control circuit carrier to one another.
  • the modules and the control circuit carrier are in particular each independent component, which are arranged in particular in different spatial positions.
  • an electrical connection between the power modules and the control circuit carrier can be designed to be more flexible with regard to interconnection and/or spatial arrangement.
  • an electrical connection can in particular also be formed over several levels and/or the connection module can electrically connect two levels to one another.
  • the modules and the circuit carrier layer are in particular individual, i.e. separate, components.
  • the modules and the circuit carrier layer are not in (direct) mechanical contact with each other.
  • a power module is in particular a power component of a power converter, in particular a pulse inverter.
  • the power module comprises a half-bridge circuit, which is in particular applied to a ceramic substrate and in particular is molded.
  • the component arrangement can comprise several such power modules, in particular three such power modules. These several power modules can be arranged or arranged, for example, on a (common) heat sink.
  • a control circuit carrier is in particular a control board, in particular for a power converter, in particular a pulse inverter.
  • the control circuit carrier in particular comprises components for controlling and monitoring the at least one power module and/or the power converter, in particular the pulse inverter.
  • the control circuit carrier can, for example, comprise at least one of the following components: microcontroller, gate driver, ASIC and/or a communication interface (e.g. CAN).
  • connection module can in particular comprise additional active and/or passive electrical components in addition to (pure) electrical connections. It can in particular be provided that electrical connections to several power modules and the control circuit carrier are or will be formed via a single connection module with the signal lines.
  • the connection module has dimensions in the centimeter range, in particular in the range of a few centimeters, for example with a width in the range of 2 to 5 cm and a length in the range of 8 to 15 cm, for example 3 ⁇ 9 cm 2 or 3 ⁇ 15 cm 2 .
  • the electrical signal lines are designed in particular for a current in the range up to 1 A, in particular up to 10 A, further in particular up to 20 A.
  • the electrical signal lines are designed in particular for a current in the range from ⁇ A to mA.
  • a power module has dimensions in the centimeter range, especially in the range of a few centimeters, for example with side lengths of a width and length of between 3 cm and 15 cm, for example 5 ⁇ 4 cm 2 . Depending on the power requirement, the values can generally also be smaller or larger.
  • connection area (which can also be referred to as a connection pad), to which the electrical signal lines are or will be connected to the modules or the control circuit carrier, has in particular a side length in the range of 0.2 to 0.5 cm.
  • the at least one connection module has a predetermined electrical line layout which electrically connects connection areas of the first electrical signal lines in a predetermined manner (i.e. in particular according to a predetermined circuit diagram) to connection areas of the second electrical signal lines.
  • a predetermined electrical line layout which electrically connects connection areas of the first electrical signal lines in a predetermined manner (i.e. in particular according to a predetermined circuit diagram) to connection areas of the second electrical signal lines.
  • the electrical line layout can in particular comprise electrical conductor tracks, for example in the form of punched metal sheets.
  • connection areas at which the electrical signal lines are each connected to the modules and/or the control circuit carrier, are at least partially surrounded by a molding compound.
  • the molding compound is in particular electrically non-conductive.
  • the molding compound is or comprises, for example, an epoxy resin.
  • an area in which the electrical signal lines are connected to the modules and/or the control circuit carrier is completely surrounded with a molding compound across all signal lines.
  • a surface area of the at least one connection module and/or the at least one power module and/or the control circuit carrier is completely covered with the molding compound.
  • a surface of the connection module can be completely covered with a molding compound.
  • modules and/or the control circuit carrier are or will be fixed mechanically, in particular to the housing, by means of the molding compound.
  • the at least one power module and/or the at least one connection module and/or the control circuit carrier are arranged in different levels with respect to a level of the control circuit carrier.
  • this can save installation space, since the components can be arranged in different levels, in particular at least partially on top of one another.
  • this can also make an arrangement and a manufacturing process more flexible.
  • the electrical connections can thus be formed on different levels with respect to the respective connection areas at their respective ends.
  • the connection module advantageously allows in particular the bridging of different levels.
  • the at least one power module, the at least one connection module and the control circuit carrier are mechanically connected to the housing.
  • the components can each be firmly connected to the housing or can be connected.
  • a mechanical connection to the housing can also be a mechanical connection to a heat sink of the housing.
  • the power module can be mechanically connected to a heat sink of the housing.
  • the at least one power module, the at least one connection module and the control circuit carrier are each mechanically connected separately to the housing. This allows the individual mechanical connections to the housing to be selected to suit the respective component. This can further increase flexibility in the development process.
  • the at least one power module is arranged at least partially between the control circuit carrier and the housing, wherein the at least one connection module is arranged next to the control circuit carrier with respect to an extension direction of a plane of the control circuit carrier.
  • the arrangement in the housing can be more flexible, since a larger number of arrangement options can be selected.
  • the at least one power module and the at least one connection module are arranged first, and then (at least partially above) the control circuit carrier.
  • the first electrical signal lines are also formed between the at least one power module and the at least one connection module, in particular if these components are already arranged in the housing.
  • the second electrical signal lines are then formed between the at least one connection module and the control circuit carrier.
  • first electrical signal lines and/or the second electrical signal lines are designed as bond connections.
  • the bond connections are designed in particular as thick wire bond connections (wire thickness in the range of 125 ⁇ m).
  • the bond connections can in particular be designed as double stitch bond connections, thick wire bond connections, aluminum-copper bond connections, aluminum bond connections and/or aluminum-gold bond connections.
  • the first electrical signal lines and/or the second electrical signal lines are designed in the form of electrically conductive metal sheets.
  • the metal sheets can in particular be punched.
  • the metal sheets can in particular be mechanically reinforced by additional elements, for example by electrically non-conductive carrier elements. In this way, in particular finger-like connections can be formed which form the electrical signal lines.
  • a vehicle comprising at least one component arrangement according to one of the described embodiments.
  • a vehicle is in particular a motor vehicle.
  • the vehicle can also be another land, rail, water, air or space vehicle, for example an air taxi or a drone.
  • the Fig.1 shows a schematic representation of embodiments of the component arrangement 1 for power electronics as a side view.
  • the component arrangement 1 is arranged, for example, in a vehicle 50, in particular a motor vehicle.
  • the component arrangement 1 is, for example, part of the power electronics of a pulse inverter.
  • the component arrangement 1 comprises a power module 2, a separate connection module 3, a separate control circuit carrier 4 and a housing 5.
  • the housing 5 is shown as a closed housing. In principle, however, the housing 5 can also have an opening on at least one side.
  • the power module 2, the separate connection module 3 and the separate control circuit carrier 4 are arranged in a predetermined manner (i.e. in particular at predetermined spatial positions) in the housing 5.
  • the power module 2 is connected to the connection module 3 by means of first electrical signal lines 6.
  • the connection module 3 is also connected to the control circuit carrier 4 by means of second electrical signal lines 7.
  • the electrical signal lines 6, 7 are designed in particular as bond connections, in particular as thick wire bond connections.
  • the power module 2 and the connection module 3 are arranged on a (particularly step-shaped) heat sink 9 of the housing 5.
  • the heat sink 9 has stages 10-1, 10-2, with the power module 2 being arranged on a lower stage 10-1 and the connection module 10-2 being arranged on an upper stage 10-2. If further modules are present, further stages can be provided.
  • connection module 3 has a predetermined electrical line layout 11 ( Fig.2 ) which electrically connects connection areas 12 of the first electrical signal lines 6 in a predetermined manner to connection areas 13 of the second electrical signal lines 7.
  • a predetermined electrical line layout 11 Fig.2
  • Electrical connections of the line layout 11 are designed in particular as conductor tracks and the connection areas 12, 13 are designed in particular as bond pads.
  • connection areas 12, 13, at which the electrical signal lines 6, 7 are respectively connected to the modules 2, 3 and/or the control circuit carrier 4, are at least partially surrounded by a molding compound 14.
  • the molding compound 14 can be an epoxy resin, for example, or comprise such a resin.
  • the power module 2 and/or the connection module 3 and/or the control circuit carrier 4 are arranged in different levels 21, 22 with respect to a level 20 of the control circuit carrier 4 ( Fig.1 ).
  • the power module 2, the connection module 3 and the control circuit carrier 4 are mechanically connected to the housing 5. In the case of the power module 2 and the connection module 3, this takes place, as already described above, in particular via the heat sink 9.
  • the control circuit carrier 4 can be arranged on the housing 5, for example, by means of cylindrical threaded screws 15 and can be held by these in particular at a distance from the housing 5.
  • the power module 2, the connection module 3 and the control circuit carrier 4 are each mechanically connected separately to the housing 5.
  • the power module 2 is arranged at least partially between the control circuit carrier 4 and the housing 5, wherein the connection module 3 with respect to an extension direction of a plane 20 of the control circuit carrier 4 is arranged next to the control circuit carrier 4.
  • the connection module 3 is arranged at some distance from the control circuit carrier 4.
  • first electrical signal lines 6 and/or the second electrical signal lines 7 are designed as bond connections.
  • other types of connection can also be used, for example press fit pins.
  • first electrical signal lines 6 and/or the second electrical signal lines 7 are in the form of electrically conductive sheets 16 (for example in Fig.2 shown).
  • the Fig.3 shows a schematic flow diagram of an embodiment of the method for providing a component arrangement for power electronics.
  • a power module and a connection module are arranged in a housing, for example a pulse inverter.
  • the power module and the connection module are arranged next to each other on a heat sink of the housing, for example on different levels of the heat sink (see. Fig.1 ).
  • the modules are mechanically connected to the housing, for example by means of suitable cylindrical threaded screws and/or spacers made of iron and/or plastic and/or by other means of fixing them to the heat sink. Fixing can also be carried out using a suitable adhesive, for example.
  • the arranged power module and the arranged connection module are electrically connected to one another via first signal lines.
  • first signal lines for example, bond connections and/or connections made of conductive sheets can be formed.
  • a control circuit carrier separate from the power module and the connection module is arranged in the housing.
  • the control circuit carrier is mechanically connected to the housing, for example by means of suitable cylindrical threaded screws and/or spacers made of iron and/or plastic.
  • the control circuit carrier is arranged in the housing in such a way that the power module is at least partially between the Control circuit carrier and the housing, as shown for example in the Figures 1 and 2 is shown.
  • connection module is electrically connected to the control circuit carrier by means of second electrical signal lines.
  • second electrical signal lines for example, bond connections and/or connections made of conductive sheets can be formed.
  • connection areas at which the electrical signal lines are each connected to the modules and/or the control circuit carrier, are at least partially surrounded with a molding compound.
  • the connection areas are molded with the molding compound, for example with an epoxy resin.
EP23198666.2A 2022-10-07 2023-09-20 Agencement de composants pour une électronique de puissance et procédé de fourniture d'un agencement de composants pour une électronique de puissance Pending EP4351291A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102022210631.8A DE102022210631A1 (de) 2022-10-07 2022-10-07 Komponentenanordnung für eine Leistungselektronik und Verfahren zum Bereitstellen einer Komponentenanordnung für eine Leistungselektronik

Publications (1)

Publication Number Publication Date
EP4351291A1 true EP4351291A1 (fr) 2024-04-10

Family

ID=88146541

Family Applications (1)

Application Number Title Priority Date Filing Date
EP23198666.2A Pending EP4351291A1 (fr) 2022-10-07 2023-09-20 Agencement de composants pour une électronique de puissance et procédé de fourniture d'un agencement de composants pour une électronique de puissance

Country Status (4)

Country Link
US (1) US20240116468A1 (fr)
EP (1) EP4351291A1 (fr)
CN (1) CN117858437A (fr)
DE (1) DE102022210631A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2023473A2 (fr) * 2007-08-09 2009-02-11 Hitachi, Ltd. Onduleur de puissance
JP2012191766A (ja) * 2011-03-11 2012-10-04 Denso Corp 電力変換装置
US20140198454A1 (en) * 2013-01-17 2014-07-17 Delta Electronics, Inc. Integrated power module packaging structure
US20190353686A1 (en) * 2018-05-18 2019-11-21 Honda Motor Co., Ltd. Electric power conversion device
EP3934087A1 (fr) * 2019-02-25 2022-01-05 LS Electric Co., Ltd. Dispositif d'entraînement de moteur électrique

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10129840B4 (de) 2001-06-21 2020-10-08 Robert Bosch Gmbh Elektrisches Gerät
CN202085082U (zh) 2011-06-14 2011-12-21 株洲南车时代电气股份有限公司 一种牵引变流器
DE102018220415A1 (de) 2018-11-28 2020-05-28 Zf Friedrichshafen Ag Transformator, Gleichspannungswandler und elektrischer Kraftwagen

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2023473A2 (fr) * 2007-08-09 2009-02-11 Hitachi, Ltd. Onduleur de puissance
JP2012191766A (ja) * 2011-03-11 2012-10-04 Denso Corp 電力変換装置
US20140198454A1 (en) * 2013-01-17 2014-07-17 Delta Electronics, Inc. Integrated power module packaging structure
US20190353686A1 (en) * 2018-05-18 2019-11-21 Honda Motor Co., Ltd. Electric power conversion device
EP3934087A1 (fr) * 2019-02-25 2022-01-05 LS Electric Co., Ltd. Dispositif d'entraînement de moteur électrique

Also Published As

Publication number Publication date
DE102022210631A1 (de) 2024-04-18
US20240116468A1 (en) 2024-04-11
CN117858437A (zh) 2024-04-09

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