EP4200371A1 - Matériau composite d'agent de couplage, procédé de production d'un matériau composite d'agent de couplage, dispositif électrique et procédé de production d'un dispositif électrique - Google Patents

Matériau composite d'agent de couplage, procédé de production d'un matériau composite d'agent de couplage, dispositif électrique et procédé de production d'un dispositif électrique

Info

Publication number
EP4200371A1
EP4200371A1 EP21766599.1A EP21766599A EP4200371A1 EP 4200371 A1 EP4200371 A1 EP 4200371A1 EP 21766599 A EP21766599 A EP 21766599A EP 4200371 A1 EP4200371 A1 EP 4200371A1
Authority
EP
European Patent Office
Prior art keywords
adhesion
composite material
inorganic
hybrid polymer
organic hybrid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP21766599.1A
Other languages
German (de)
English (en)
Inventor
Tobias Kohler
Erhard Hirth
Klaus Rose
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV
Robert Bosch GmbH
Original Assignee
Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV, Robert Bosch GmbH filed Critical Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV
Publication of EP4200371A1 publication Critical patent/EP4200371A1/fr
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/14—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C08G77/58—Metal-containing linkages
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
    • C08L75/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend

Definitions

  • Adhesion Promoting Composite Method of Making an Adhesion Promoting Composite, Electrical Device, Method of Making an Electrical Device
  • the invention relates to an adhesion-promoting composite material.
  • the invention also relates to a method for producing an adhesion-promoting composite material.
  • the invention relates to an electrical device which has a coating with such an adhesion-promoting composite material.
  • the invention relates to a method for producing such an electrical device.
  • Electrical components are often encapsulated with a castable encapsulant.
  • the adhesion of the encapsulating compound on the electrical component is advantageous for the longevity of the component or the longevity of an electrical device having the component.
  • An encapsulating compound made from a silicone material or an epoxy resin material is often used in this case. In these cases, sufficient adhesion of the encapsulating compound on the electrical component is usually given.
  • published application DE 102015223 466 A1 discloses an electrical device with an electrical component that is encased in sections with a ceramic encapsulating compound. When using a ceramic With the encapsulating compound, however, the adhesion on the electrical component is generally lower than with an encapsulating compound made from a silicone material or an epoxy resin material.
  • inorganic-organic hybrid polymers are known from the prior art.
  • patent specification AU 2006 274207 B2 discloses a plastic bottle coated with an inorganic-organic hybrid polymer.
  • Such inorganic-organic hybrid polymers are also referred to as heteropoly(organo)siloxanes and are sold, for example, under the name “Ormocer”.
  • the inorganic-organic hybrid polymer is composed or built up from a plurality of monomers that differ from one another.
  • the adhesion-promoting composite material according to the invention with the features of claim 1 is particularly suitable for increasing the adhesion of a ceramic encapsulating compound on an electrical component as an adhesion-promoting layer.
  • the adhesion-promoting composite material has at least one inorganic-organic hybrid polymer and at least one epoxy-polyurethane. Because of the composition according to the invention, the adhesion promoter composite adheres particularly well to polar surfaces such as glass, ceramic or metal surfaces. In particular, even a reactive connection of the adhesion-promoting composite material to such surfaces is achieved. Accordingly, a good adhesive effect is achieved on ceramic encapsulating materials and on metallic components of electrical components.
  • the adhesion-promoting composite material according to the invention is also advantageously suitable as an adhesion promoter for other applications, ie for connecting other elements to one another.
  • the adhesion-promoting composite material according to the invention can be used as a lacquer, paint or other coating.
  • the good adhesive effect or the reactive connection is provided in particular by silanol groups of the inorganic-organic hybrid polymer.
  • the adhesion-promoting composite material according to the invention has an essentially constant adhesion effect at temperatures of up to 250°C.
  • the adhesion-promoting material preferably has the Sika Primer-3N epoxy-polyurethane as the epoxy-polyurethane.
  • the adhesion-promoting material has at least one solvent in addition to the inorganic-organic hybrid polymer and the epoxy-polyurethane.
  • the adhesion-promoting composite material is a solution of the inorganic-organic hybrid polymer and the epoxy-polyurethane in at least one solvent. Such a solution can easily be applied by spraying, by a printing process or by dip coating. Following application, at least a portion of the solvent evaporates or evaporates, thereby increasing the viscosity of the bond coat composite. The adhesion-promoting composite material is then present, for example, as a gel, so that it has a gel-like consistency, or as a solid.
  • the mass of the inorganic-organic hybrid polymer preferably corresponds to a mass fraction of 25% to 40%, based on the total mass of solids in the adhesion-promoting composite material.
  • the mass of the inorganic-organic hybrid polymer preferably corresponds to a mass fraction of 32% to 38%, particularly preferably a mass fraction of 35%.
  • the mass of the epoxy-polyurethane preferably corresponds to a mass fraction of 45% to 70%, based on the total mass of solids in the adhesion-promoting composite material.
  • the mass of the epoxy-polyurethane preferably corresponds to a mass fraction of 52% to 62%, particularly preferably a mass fraction of 57%.
  • Solids are substances which remain as an evaporation residue when the adhesion-promoting composite material is heated to, for example, 200° C. for 1 hour.
  • the adhesion-promoting composite material has at least one bisphenol-based epoxy resin.
  • An advantageous mixture of the epoxy-polyurethane with the inorganic-organic hybrid polymer is achieved by the bisphenol-based epoxy resin in the production of the adhesion-promoting composite material.
  • a chemical bond between the epoxy polyurethane and the inorganic-organic hybrid polymer is formed by means of the bisphenol-based epoxy resin.
  • the mass of the bisphenol-based epoxy resin preferably corresponds to a mass fraction of 8% to 9%, particularly preferably a mass fraction of 8.5%.
  • the hybrid inorganic-organic polymer comprises a metal alkoxide monomer.
  • the inorganic-organic hybrid polymer is thus made from different monomers, at least one of which is a metal alkoxide monomer. Due to the metal alkoxide monomers built into the inorganic-organic hybrid polymer, a high strength of the adhesion-promoting composite material is achieved.
  • the metal alkoxide monomer is a main or subgroup metal alkoxide monomer.
  • the metal of the metal alkoxide monomer is titanium, aluminum or zirconium. More preferably, the metal alkoxide monomer is Al(OBu)sEAA.
  • the molar amount of the metal alkoxide monomer preferably corresponds to a molar fraction of 15% to 25% based on the total molar amount of the monomers used for the preparation of the inorganic-organic hybrid polymer. More preferably, the mole fraction of the metal alkoxide monomer is 20% mole fraction.
  • the inorganic-organic hybrid polymer preferably has an epoxysilane monomer.
  • the inorganic-organic hybrid polymer is thus made from different monomers, at least one of which is an epoxysilane monomer. Due to the epoxy silane monomer, the inorganic-organic hybrid polymer can be easily cured at low temperatures or under UV radiation.
  • the epoxy silane monomer is 3-glycidyloxypropyltrimethoxysilane (GLYMO).
  • GLYMO 3-glycidyloxypropyltrimethoxysilane
  • the molar amount of the epoxysilane monomer preferably corresponds to a molar proportion of 40% to 50% based on the total molar amount of the monomers used for the preparation of the inorganic-organic hybrid polymer.
  • the mole fraction of the epoxysilane monomer is 45% mole fraction.
  • the inorganic-organic hybrid polymer has an alkyl silane monomer.
  • the inorganic-organic hybrid polymer is thus made from different monomers, at least one of which is an alkylsilane monomer.
  • the required properties of the adhesion-promoting composite material with regard to a desired chemical connection and a desired adhesive effect can be provided by the alkylsilane monomer.
  • the alkyl silane monomer is propyltrimethoxysilane (PTMO).
  • the molar amount of the alkylsilane monomer preferably corresponds to a molar proportion of 25% to 35% based on the total molar amount of the monomers used for the production of the inorganic-organic hybrid polymer.
  • the mole fraction of the alkylsilane monomer particularly preferably corresponds to a mole fraction of 30%.
  • the inorganic-organic hybrid polymer has an aminoalkylsilane monomer.
  • the inorganic-organic hybrid polymer is thus made from different monomers, at least one of which is an aminoalkylsilane monomer.
  • the required properties of the adhesion-promoting composite material with regard to a desired chemical connection and a desired adhesive effect can also be provided by the aminoalkylsilane monomer.
  • the aminoalkyl monomer is 3-aminopropyltriethoxysilane (AMEO).
  • the molar amount of the aminoalkyl monomer preferably corresponds to a molar proportion of 3% to 8%, based on the total molar amount of the monomers used for the preparation of the inorganic-organic hybrid polymer. More preferably, the mole fraction of the aminoalkyl monomer is 5% mole fraction.
  • the method according to the invention for producing an adhesion-promoting composite material is characterized by the features of claim 7 in that an inorganic-organic hybrid polymer and an epoxy-polyurethane are provided and that the epoxy-polyurethane is mixed with the inorganic-organic hybrid polymer.
  • the inorganic-organic hybrid polymer is provided by means of a sol-gel synthesis from different monomers.
  • the various monomers are thus first dissolved or dispersed in a solvent, preferably water.
  • the inorganic-organic hybrid polymer is then obtained as a gel or as a substance with a gel-like consistency by means of sol-gel synthesis.
  • the hybrid inorganic-organic polymer is mixed with a bisphenol-based epoxy resin before the hybrid inorganic-organic polymer is mixed with the epoxy-polyurethane in step c).
  • the mixture of the epoxy polyurethane with the inorganic-organic hybrid polymer is improved by the bisphenol-based epoxy resin, as already mentioned above.
  • the inorganic-organic hybrid polymer is mixed with a protic organic solvent before mixing with the bisphenol-based epoxy resin.
  • Mixing the inorganic-organic hybrid polymer with the solvent simplifies subsequent mixing with the bisphenol-based epoxy resin.
  • the inorganic-organic hybrid polymer is a gel
  • mixing with the solvent reduces the viscosity of the inorganic-organic hybrid polymer.
  • An alcohol particularly preferably 2-butoxyethanol, is preferably used as the protic organic solvent.
  • a solution of the epoxy polyurethane in an organic solvent is preferably provided as the epoxy polyurethane.
  • the solution of the epoxy-polyurethane can be mixed particularly easily and homogeneously with the inorganic-organic hybrid polymer.
  • the adhesion-promoting composite material is then at least initially obtained as a solution, as a result of which the adhesion-promoting composite material can be simply applied can.
  • the organic solvent is particularly preferably ethyl acetate.
  • the electrical device according to the invention has an electrical component and is characterized by a coating which covers at least one section of the electrical component and has the adhesion-promoting composite material according to the invention.
  • the covered section is protected by the coating, which increases the longevity of the component or the device. Further preferred features and combinations of features emerge from what has been described above and from the claims.
  • the electrical component is, for example, an active electrical component or a passive electrical component such as a transformer.
  • the device preferably has an encapsulating compound, in particular a ceramic one, which encapsulates the electrical component at least in sections in such a way that the coating is arranged between the component and the encapsulating compound. Due to the advantageous adhesive effect of the adhesion-promoting composite material of the coating, strong adhesion of the encapsulating compound on the component is achieved. In this respect, the coating forms an adhesion-promoting layer.
  • the method according to the invention for producing an electrical device is characterized by the features of claim 14 in that an electrical component is provided and that the adhesion-promoting composite material according to the invention is applied to the component in such a way that the adhesion-promoting composite material as a coating covers at least one section of the component covered.
  • the component is preferably encased at least in sections with an encapsulating compound in such a way that the coating is arranged between the component and the encapsulating compound.
  • the adhesion-promoting composite material is preferably initially provided in the form of a solution and applied to the electrical component.
  • the electrical component is then preferably dried after drying or drying the adhesion-promoting composite material with the encapsulating compound.
  • the adhesion-promoting composite material is applied to the component by spraying, by a printing process or by dip coating. If the adhesion-promoting composite material is at least initially in the form of a solution, this is advantageously possible due to its low viscosity. A homogeneous application of the adhesion-promoting composite material in a small layer thickness can be achieved by spraying, by the printing process or by dip-coating.
  • Figure 1 an electrical device
  • Figure 2 shows another electrical device
  • FIG. 3 shows a method for producing the electrical device or the further electrical device
  • FIG. 5 shows a section of a structure of the inorganic-organic hybrid polymer.
  • FIG. 1 shows an electrical device 1 in a schematic representation.
  • the electrical device 1 has an electrical component 2 which is an active electrical component 2 .
  • the electrical component 2 has a substrate 3 which is, for example, a DBC substrate 3 or an AMB substrate 3 .
  • a chip 4 is arranged on the substrate 3 and is, for example, a Si chip 4 , a SiC chip 4 or a GaN chip 4 .
  • a non-illustrated electrical conductor track of the substrate 3 is electrically connected to a conductor track (not shown) of the chip 4 by a bonding wire 5 of the electrical component 2 .
  • the electrical device 1 also has a ceramic encapsulant 6 which encapsulates a section of the electrical component 2 .
  • the electrical device 1 has a coating 7 or adhesion-promoting layer 7 which is arranged between the electrical component 2 and the encapsulating compound 6 .
  • the adhesion-promoting layer 7 is formed in such a way that the encapsulating compound 6 is separated from the electrical component 2 by the adhesion-promoting layer 7 . There is therefore no direct physical contact between the electrical component 2 and the encapsulating compound 6.
  • FIG. 2 shows a further electrical device 11 in a schematic representation.
  • the further electrical device 11 has an electrical component 12 which is a passive electrical component 12, in this case a transformer 12.
  • the electrical component 12 has a copper pot 13 with a receptacle.
  • a transformer core 14 around which an electrical conductor 15 is wound is arranged in the receptacle.
  • the further electrical device 11 also has a ceramic encapsulating compound 16 which encapsulates a section of the electrical component 12 .
  • a coating 17 or adhesion-promoting layer 17 is also provided in the case of the further electrical device 11 shown in FIG.
  • FIG. 3 shows the method using a flowchart.
  • the method steps S1 to S5 describe a method for producing an adhesion-promoting composite material for the adhesion-promoting layer 7 or 17.
  • an inorganic-organic hybrid polymer is provided by means of a sol-gel synthesis.
  • monomers namely a metal alkoxide monomer, an epoxysilane monomer, an alkylsilane monomer and an aminoalkylsilane monomer, are dissolved or dispersed in distilled water and the solution or dispersion is stirred to obtain the inorganic-organic hybrid polymer as a gel .
  • the monomers 3-glycidyloxypropyltrimethoxysilane (GLYMO), propyltrimethoxysilane (PTMO), 3-aminopropyltriethoxysilane (AMEO) and AI(OBu)sEAA shown in FIG. 4 are used as monomers.
  • the masses and amounts of substance of the monomers used are listed in the table below by way of example.
  • a second step S2 the inorganic-organic hybrid polymer obtained in step S1 is mixed with a protic organic solvent.
  • a protic organic solvent for example, 2-butoxy-ethanol is used as the solvent.
  • the 292.46 g of the gel obtained in step S1 are mixed with 48.74 g of 2-butoxyethanol.
  • a third step S3 the inorganic-organic hybrid polymer is mixed with a bisphenol-based epoxy resin.
  • the bisphenol-based epoxy resin Araldit GY 260 shown below is used as an example.
  • cross-linking of the inorganic-organic hybrid polymer is achieved by the bisphenol-based epoxy resin.
  • 200 g of the mixture obtained in step S2 are mixed with 34.29 g Araldit GY 260.
  • the structure of the inorganic-organic hybrid polymer thus obtained is shown in FIG.
  • the letter M denotes the metal ions of the metal alkoxide monomer.
  • the alkyl or aminoalkyl radicals of the alkylsilane monomer or aminoalkylsilane monomer are denoted by the letter R.
  • the inorganic-organic hybrid polymer has a Si-O network which is obtained by condensation reactions between the different monomers.
  • the wavy lines W represent chemical bonds between Si atoms obtained by reacting the reactive groups of the epoxysilane monomers with the reactive groups of the bisphenol-based epoxy resin.
  • a fourth step S4 the mixture obtained in step S3 is mixed with an organic solvent.
  • n-Propanol is used as an example.
  • the mixture is preferably diluted to such an extent that the mass fraction of solids in the mixture is 30%.
  • 17.54 g of the mixture obtained in step S3 are mixed with 12.46 g of n-propanol.
  • a fifth step S5 the mixture obtained in step S4 is mixed with a solution of an epoxy-polyurethane in an organic solvent.
  • a 40 percent solution of a Sika 3N epoxy polyurethane in ethyl acetate is used.
  • 30 g of the mixture obtained in step S4 are mixed with 30 g of the 40 percent solution of the Sika 3N epoxy polyurethane.
  • the adhesion-promoting composite material is produced or provided as a solution by mixing the mixture obtained in step S4 with the solution of the epoxy-polyurethane.
  • an electrical component is provided. If the electrical device 1 is to be produced by means of the method, then the component 2 is provided. However, if the further electrical device 11 is to be produced, the component 12 is provided.
  • the adhesion-promoting composite material present as a solution is applied to at least one section of the electrical component. For example, the application takes place by means of spraying, by means of a printing process or by means of dip coating.
  • the applied adhesion-promoting composite material is dried or partially dried. This increases the viscosity of the adhesion promoter composite.
  • the adhesion-promoting composite material is present as a gel after drying or initial drying.
  • the adhesion-promoting composite material is heated in step S8 for drying or initial drying, for example at 100-140° C. for 1-10 minutes.
  • heating is dispensed with, so that the adhesion-promoting composite material is dried or partially dried by evaporation of the solvent.
  • the adhesion-promoting composite material then forms the coating 7 or 17, which covers at least a section of the component 2 or 12, respectively.
  • a castable ceramic encapsulant is provided.
  • a tenth step S10 the electrical component 2 or 12 is encased using a casting process with the ceramic encapsulant 6 or 16 in such a way that the adhesion-promoting composite material is arranged as an adhesion-promoting layer 7 or 17 between the component 2 or 12 and the encapsulating compound 6 or 16.
  • the device 1 shown in FIG. 1 or the device 11 shown in FIG. 2 is obtained.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Epoxy Resins (AREA)
  • Paints Or Removers (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

L'invention concerne un matériau composite d'agent de couplage. Selon l'invention, le matériau composite d'agent de couplage comprend au moins un polymère hybride inorganique-organique et au moins un polyuréthane époxyde.
EP21766599.1A 2020-08-21 2021-08-20 Matériau composite d'agent de couplage, procédé de production d'un matériau composite d'agent de couplage, dispositif électrique et procédé de production d'un dispositif électrique Pending EP4200371A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102020210680.0A DE102020210680A1 (de) 2020-08-21 2020-08-21 Haftvermittlungs-Verbundwerkstoff, Verfahren zum Herstellen eines Haftvermittlungs-Verbundwerkstoffs, Elektrische Vorrichtung, Verfahren zum Herstellen einer elektrischen Vorrichtung
PCT/EP2021/073155 WO2022038271A1 (fr) 2020-08-21 2021-08-20 Matériau composite d'agent de couplage, procédé de production d'un matériau composite d'agent de couplage, dispositif électrique et procédé de production d'un dispositif électrique

Publications (1)

Publication Number Publication Date
EP4200371A1 true EP4200371A1 (fr) 2023-06-28

Family

ID=77693493

Family Applications (1)

Application Number Title Priority Date Filing Date
EP21766599.1A Pending EP4200371A1 (fr) 2020-08-21 2021-08-20 Matériau composite d'agent de couplage, procédé de production d'un matériau composite d'agent de couplage, dispositif électrique et procédé de production d'un dispositif électrique

Country Status (5)

Country Link
EP (1) EP4200371A1 (fr)
KR (1) KR20230051575A (fr)
CN (1) CN115956099A (fr)
DE (1) DE102020210680A1 (fr)
WO (1) WO2022038271A1 (fr)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5023140A (en) * 1988-06-20 1991-06-11 Armstrong World Industries, Inc. Floor covering having a modified glass wear layer
US20020123592A1 (en) * 2001-03-02 2002-09-05 Zenastra Photonics Inc. Organic-inorganic hybrids surface adhesion promoter
KR101001441B1 (ko) * 2004-08-17 2010-12-14 삼성전자주식회사 유무기 금속 하이브리드 물질 및 이를 포함하는 유기절연체 조성물
DE102005034892A1 (de) 2005-07-26 2007-02-08 Hexal Ag Cycloolefin-Copolymer-Flasche mit einem kratzfesten Überzug
US8592042B2 (en) * 2006-11-09 2013-11-26 The Boeing Company Sol-gel coating method and composition
KR101270932B1 (ko) * 2010-08-05 2013-06-11 한화케미칼 주식회사 탄소소재를 이용한 고효율 방열도료 조성물
CN103946280A (zh) * 2011-11-17 2014-07-23 道康宁公司 包含金属硅氧烷的硅酮树脂
DE102015223466A1 (de) 2015-11-26 2017-06-01 Robert Bosch Gmbh Elektrische Vorrichtung mit einer Umhüllmasse

Also Published As

Publication number Publication date
DE102020210680A1 (de) 2022-02-24
CN115956099A (zh) 2023-04-11
WO2022038271A1 (fr) 2022-02-24
KR20230051575A (ko) 2023-04-18

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