EP4141397C0 - Struktur zur erfassung der temperatur einer elektronischen vorrichtung - Google Patents

Struktur zur erfassung der temperatur einer elektronischen vorrichtung

Info

Publication number
EP4141397C0
EP4141397C0 EP22202218.8A EP22202218A EP4141397C0 EP 4141397 C0 EP4141397 C0 EP 4141397C0 EP 22202218 A EP22202218 A EP 22202218A EP 4141397 C0 EP4141397 C0 EP 4141397C0
Authority
EP
European Patent Office
Prior art keywords
sensing
temperature
electronic device
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP22202218.8A
Other languages
English (en)
French (fr)
Other versions
EP4141397A1 (de
EP4141397B1 (de
Inventor
Wanjae Ju
Hyoseok Na
Chanho Park
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Priority to EP25217793.6A priority Critical patent/EP4675244A1/de
Publication of EP4141397A1 publication Critical patent/EP4141397A1/de
Application granted granted Critical
Publication of EP4141397C0 publication Critical patent/EP4141397C0/de
Publication of EP4141397B1 publication Critical patent/EP4141397B1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0277—Details of the structure or mounting of specific components for a printed circuit board assembly
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/16—Special arrangements for conducting heat from the object to the sensitive element
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
    • G01K7/22—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1626—Constructional details or arrangements for portable computers with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/206—Cooling means comprising thermal management
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
    • H01M10/425—Structural combination with electronic components, e.g. electronic circuits integrated to the outside of the casing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
    • H01M10/48—Accumulators combined with arrangements for measuring, testing or indicating the condition of cells, e.g. the level or density of the electrolyte
    • H01M10/486—Accumulators combined with arrangements for measuring, testing or indicating the condition of cells, e.g. the level or density of the electrolyte for measuring temperature
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0262—Details of the structure or mounting of specific components for a battery compartment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M2220/00—Batteries for particular applications
    • H01M2220/30—Batteries in portable systems, e.g. mobile phone, laptop
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M2201/00—Electronic components, circuits, software, systems or apparatus used in telephone systems
    • H04M2201/34—Microprocessors
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M2250/00—Details of telephonic subscriber devices
    • H04M2250/12—Details of telephonic subscriber devices including a sensor for measuring a physical value, e.g. temperature or motion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0311—Metallic part with specific elastic properties, e.g. bent piece of metal as electrical contact
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10265—Metallic coils or springs, e.g. as part of a connection element
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Nonlinear Science (AREA)
  • Signal Processing (AREA)
  • Telephone Set Structure (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Battery Mounting, Suspending (AREA)
  • Measuring Fluid Pressure (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
EP22202218.8A 2017-07-18 2018-07-18 Struktur zur erfassung der temperatur einer elektronischen vorrichtung Active EP4141397B1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP25217793.6A EP4675244A1 (de) 2017-07-18 2018-07-18 Struktur zur erfassung der temperatur einer elektronischen vorrichtung

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR1020170091170A KR102416320B1 (ko) 2017-07-18 2017-07-18 전자 장치의 온도 관측을 위한 구조
EP21200268.7A EP3951340B1 (de) 2017-07-18 2018-07-18 Struktur zur detektion der temperatur eines elektronikgeräts
EP18835653.9A EP3643053B1 (de) 2017-07-18 2018-07-18 Struktur zur erfassung der temperatur einer elektronischen vorrichtung
PCT/KR2018/008108 WO2019017684A1 (en) 2017-07-18 2018-07-18 STRUCTURE FOR DETECTING THE TEMPERATURE OF AN ELECTRONIC DEVICE

Related Parent Applications (2)

Application Number Title Priority Date Filing Date
EP21200268.7A Division EP3951340B1 (de) 2017-07-18 2018-07-18 Struktur zur detektion der temperatur eines elektronikgeräts
EP18835653.9A Division EP3643053B1 (de) 2017-07-18 2018-07-18 Struktur zur erfassung der temperatur einer elektronischen vorrichtung

Related Child Applications (1)

Application Number Title Priority Date Filing Date
EP25217793.6A Division EP4675244A1 (de) 2017-07-18 2018-07-18 Struktur zur erfassung der temperatur einer elektronischen vorrichtung

Publications (3)

Publication Number Publication Date
EP4141397A1 EP4141397A1 (de) 2023-03-01
EP4141397C0 true EP4141397C0 (de) 2025-12-17
EP4141397B1 EP4141397B1 (de) 2025-12-17

Family

ID=65016031

Family Applications (4)

Application Number Title Priority Date Filing Date
EP25217793.6A Pending EP4675244A1 (de) 2017-07-18 2018-07-18 Struktur zur erfassung der temperatur einer elektronischen vorrichtung
EP22202218.8A Active EP4141397B1 (de) 2017-07-18 2018-07-18 Struktur zur erfassung der temperatur einer elektronischen vorrichtung
EP18835653.9A Active EP3643053B1 (de) 2017-07-18 2018-07-18 Struktur zur erfassung der temperatur einer elektronischen vorrichtung
EP21200268.7A Active EP3951340B1 (de) 2017-07-18 2018-07-18 Struktur zur detektion der temperatur eines elektronikgeräts

Family Applications Before (1)

Application Number Title Priority Date Filing Date
EP25217793.6A Pending EP4675244A1 (de) 2017-07-18 2018-07-18 Struktur zur erfassung der temperatur einer elektronischen vorrichtung

Family Applications After (2)

Application Number Title Priority Date Filing Date
EP18835653.9A Active EP3643053B1 (de) 2017-07-18 2018-07-18 Struktur zur erfassung der temperatur einer elektronischen vorrichtung
EP21200268.7A Active EP3951340B1 (de) 2017-07-18 2018-07-18 Struktur zur detektion der temperatur eines elektronikgeräts

Country Status (8)

Country Link
US (6) US10557757B2 (de)
EP (4) EP4675244A1 (de)
KR (4) KR102416320B1 (de)
CN (3) CN113946182B (de)
ES (3) ES3057397T3 (de)
HU (2) HUE060633T2 (de)
PL (3) PL3643053T3 (de)
WO (1) WO2019017684A1 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102753394B1 (ko) * 2017-02-02 2025-01-10 삼성전자주식회사 온도 감지 장치 및 이를 구비한 전자 장치
KR102416320B1 (ko) * 2017-07-18 2022-07-04 삼성전자 주식회사 전자 장치의 온도 관측을 위한 구조
CN109616065A (zh) * 2018-12-29 2019-04-12 武汉华星光电技术有限公司 显示面板的显示方法
JP2021083482A (ja) * 2019-11-25 2021-06-03 株式会社村田製作所 口腔内測定装置及び口腔内測定システム
JP7475238B2 (ja) * 2020-08-06 2024-04-26 日本メクトロン株式会社 温度測定用装置
US12117351B2 (en) * 2021-05-21 2024-10-15 Quanta Computer Inc. Computing systems with power protection using infrared sensors
CN114739518A (zh) * 2022-03-30 2022-07-12 深圳市耐德半导体科技有限公司 红外温度传感器封装结构
CN115915692A (zh) * 2022-11-04 2023-04-04 珠海市运泰利自动化设备有限公司 一种用于检测电子产品温度检测精度的测试装置
WO2026059349A1 (ko) * 2024-09-13 2026-03-19 삼성전자주식회사 전력 라인의 단락에 의한 화재 방지 구조를 포함하는 전자 장치

Family Cites Families (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6697645B1 (en) * 2000-08-17 2004-02-24 Motorola, Inc. Phone with ambient temperature sensor and display
US6819083B1 (en) 2003-04-25 2004-11-16 Motorola, Inc. Dual use thermistor for battery cell thermal protection and battery pack overcharge/undercharge protection
KR100599756B1 (ko) 2004-06-29 2006-07-12 삼성에스디아이 주식회사 액정표시장치 및 그의 구동방법
US20110106614A1 (en) * 2005-11-01 2011-05-05 Jumptap, Inc. Mobile User Characteristics Influenced Search Results
US8522584B2 (en) * 2006-06-14 2013-09-03 Moshe Dolev High-security rotating bolt lock
JP5196366B2 (ja) 2007-11-09 2013-05-15 ソニーモバイルコミュニケーションズ株式会社 携帯端末および充電システム
CN101609978A (zh) * 2008-06-20 2009-12-23 鸿富锦精密工业（深圳）有限公司 电池过热保护装置和方法
KR101249840B1 (ko) * 2008-07-31 2013-04-05 삼성전자주식회사 배터리팩이 장착 가능한 컴퓨터시스템 및 그 시스템본체
JP2011133613A (ja) 2009-12-24 2011-07-07 Brother Industries Ltd 表示装置
JP5244854B2 (ja) 2010-05-14 2013-07-24 株式会社バッファロー 無線通信装置
US8768530B2 (en) * 2010-06-04 2014-07-01 Apple Inc. Thermal zone monitoring in an electronic device
KR101133312B1 (ko) * 2010-08-13 2012-04-04 삼성전기주식회사 전송 선로 패턴이 케이스에 매립되는 전자장치 및 그 제조방법
US8595517B2 (en) 2010-09-01 2013-11-26 Symbol Technologies, Inc. Thermal management of a mobile device with ventless housing
KR101840852B1 (ko) * 2011-10-10 2018-03-22 삼성전자주식회사 모바일 장치의 표면 온도 관리 방법 및 멀티칩 패키지의 메모리 열관리 방법
KR102078093B1 (ko) 2011-11-10 2020-02-18 삼성전자 주식회사 휴대단말기의 온도 제어장치 및 방법
US8804331B2 (en) * 2011-12-02 2014-08-12 Ati Technologies Ulc Portable computing device with thermal management
KR20130066313A (ko) 2011-12-12 2013-06-20 서울반도체 주식회사 보정된 색좌표를 갖는 발광 소자 및 그것을 제조하는 방법
US8970808B2 (en) 2012-09-11 2015-03-03 Apple Inc. Display with temperature sensors
KR101993374B1 (ko) * 2012-10-16 2019-06-26 삼성전자주식회사 휴대용 단말기의 전자 부품 접속 장치
US9804003B2 (en) 2012-10-23 2017-10-31 Apple Inc. Electronic devices with environmental sensors
US9217675B2 (en) 2012-10-23 2015-12-22 Apple Inc. Electronic devices with temperature sensors
JP5996371B2 (ja) 2012-10-29 2016-09-21 株式会社東芝 電子機器
US20140262161A1 (en) * 2013-03-12 2014-09-18 David Lind Weigand Method and apparatus for dynamically cooling electronic devices
KR101985836B1 (ko) * 2013-03-25 2019-06-04 삼성에스디아이 주식회사 배터리팩
US9213361B1 (en) * 2013-09-18 2015-12-15 Amazon Technologies, Inc. Temperature sensor in flex circuit
US9641014B2 (en) * 2014-02-12 2017-05-02 Qualcomm Incorporated Circuits and methods for controlling skin temperature of an electronic device
US20150241285A1 (en) * 2014-02-27 2015-08-27 Amphenol Thermometrics, Inc. Systems and methods for a temperature monitoring device
KR101717144B1 (ko) 2014-03-03 2017-03-16 주식회사 엘지화학 온도 센싱 부재를 포함하고 있는 보호회로 모듈 및 이를 포함하는 전지팩
CN105282272A (zh) * 2014-06-30 2016-01-27 宇龙计算机通信科技(深圳)有限公司 一种温度调节装置、方法和移动终端
CN106574875B (zh) * 2014-07-31 2019-11-05 株式会社村田制作所 温度检测装置以及电子设备
KR101687209B1 (ko) 2014-12-04 2016-12-19 인텍엘앤이 주식회사 서미스터 내장형 엘이디 패키지 및 그 제조방법
JP2016139297A (ja) * 2015-01-28 2016-08-04 富士通株式会社 携帯端末
KR20170000261A (ko) 2015-06-23 2017-01-02 삼성전자주식회사 전자 장치 및 전자 장치에서의 온도 판단 방법
KR102335421B1 (ko) * 2015-07-03 2021-12-06 삼성전자주식회사 휴대용 전자 장치 및 그의 내부 구조
KR102389704B1 (ko) * 2015-08-12 2022-04-25 삼성전자주식회사 무선 전력 송수신 도전성 패턴을 구비한 전자 장치
KR102046000B1 (ko) 2015-08-24 2019-11-18 주식회사 엘지화학 온도 센싱 기능이 향상된 전지팩
JP2017059731A (ja) * 2015-09-18 2017-03-23 株式会社村田製作所 サーミスタ及び電子機器
KR102452781B1 (ko) 2015-12-15 2022-10-12 삼성전자주식회사 차폐 구조를 포함하는 전자 장치
CN105703037B (zh) * 2016-04-08 2018-08-17 努比亚技术有限公司 一种电池散热系统和方法
KR102416320B1 (ko) * 2017-07-18 2022-07-04 삼성전자 주식회사 전자 장치의 온도 관측을 위한 구조

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EP4675244A1 (de) 2026-01-07
KR102593811B1 (ko) 2023-10-25
CN113934603A (zh) 2022-01-14
WO2019017684A1 (en) 2019-01-24
HUE057811T2 (hu) 2022-06-28
EP3951340B1 (de) 2022-10-19
EP3643053A1 (de) 2020-04-29
CN110945857A (zh) 2020-03-31
US12455197B2 (en) 2025-10-28
CN110945857B (zh) 2021-11-16
ES3057397T3 (en) 2026-03-02
EP4141397A1 (de) 2023-03-01
EP3643053B1 (de) 2021-12-15
US20230266177A1 (en) 2023-08-24
KR102469470B1 (ko) 2022-11-22
KR102416320B1 (ko) 2022-07-04
KR102800455B1 (ko) 2025-04-25
PL3643053T3 (pl) 2022-02-21
US20210208009A1 (en) 2021-07-08
ES2904774T3 (es) 2022-04-06
US20200173865A1 (en) 2020-06-04
US20210208008A1 (en) 2021-07-08
KR20220099522A (ko) 2022-07-13
EP4141397B1 (de) 2025-12-17
US11668610B2 (en) 2023-06-06
US10557757B2 (en) 2020-02-11
CN113946182B (zh) 2022-09-23
EP3951340A1 (de) 2022-02-09
HUE060633T2 (hu) 2023-04-28
KR20230152615A (ko) 2023-11-03
US11585704B2 (en) 2023-02-21
PL4141397T3 (pl) 2026-03-09
US20190025134A1 (en) 2019-01-24
PL3951340T3 (pl) 2023-01-02
KR20190009205A (ko) 2019-01-28
US20260049874A1 (en) 2026-02-19
CN113946182A (zh) 2022-01-18
KR20220098703A (ko) 2022-07-12
US10955298B2 (en) 2021-03-23
EP3643053A4 (de) 2020-05-27
ES2930053T3 (es) 2022-12-05

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