Classifications

• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/46—Manufacturing multilayer circuits
  • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
  • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/0213—Electrical arrangements not otherwise provided for
  • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
  • H05K1/0265—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/04—Assemblies of printed circuits
  • H05K2201/046—Planar parts of folded PCBs making an angle relative to each other
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
  • H05K2201/10227—Other objects, e.g. metallic pieces
  • H05K2201/10272—Busbars, i.e. thick metal bars mounted on the PCB as high-current conductors

Definitions

• the present invention relates to the general field of electronic circuits and more particularly to the field of electronic turbomachine circuits.
• the power electronics must be able to operate with high currents, which can go beyond 400Arms to approach aircraft demands.
• this filtering may have a size and a greater weight than the power part: that of the functions to be filtered
• the disturbances generated are as follows:
• the invention aims to provide an electronic circuit that can be pressed against a circular electric motor, occupying a small volume, combining both weak signals and power electronics.
• the invention proposes an electronic circuit comprising a plurality of printed circuits connected by at least one bus bar, each printed circuit comprising at least two superimposed layers enclosing at least a portion of said at least one bus bar, so as to bury said at least one bus bar.
• the electronic circuit can have inter-printed circuit spaces which only include said at least one bus bar.
• Said at least one bus bar in each inter-circuit space may be foldable, so that two adjacent printed circuits are located in two intersecting planes.
• Said at least one bus bar can be bent between two printed circuits so that all the printed circuits define facets of a substantially hemispherical envelope.
• At least one of the printed circuits may include at least two electrically separate bus bars.
• Said at least two bus bars can have distinct electrical and / or mechanical properties.
• At least one of the printed circuits can have a connector making it possible to connect at least two elements among the two layers and the at least one bus bar. At least one of the printed circuits can have, on a first of its two layers, a high power electronic network, and can present on a second of its two layers, a low power electronic network.
• the invention relates to a method of manufacturing an electronic circuit of the invention, comprising the following steps:
• Step (c) may include the following steps:
• the invention relates to a turbomachine comprising a circular electric motor having an outer casing and an electronic circuit according to the invention, fixed against said casing.
• the invention relates to an aircraft comprising at least one turbomachine according to the invention.
• Figure 1 is a perspective representation of an electronic circuit according to the invention positioned around a circular electric motor.
• Figure 2 is a representation of an electronic circuit according to the invention before bending.
• FIG. 3 is a partial sectional representation of a printed circuit according to the invention.
• Figure 4 is a representation of a bus bar.
• Figure 5 is a representation of the positioning of the bus bar on a first layer of a printed circuit.
• FIG. 6 is a representation of the folding of the bus bars between two printed circuits.
• the invention provides an electronic circuit 1 comprising a plurality of printed circuits 2 connected by at least one bus bar, each printed circuit comprising at least two superimposed layers enclosing at least a portion of said at least one bar. bus 4, so as to bury said at least one bus bar 4.
• This electronic circuit 1 is for example a flex-rigid electronic card.
• flex-rigid electronic card is understood an electronic card which has at least a first part which is more rigid than at least a second part. The first part is called the rigid part and the second part is called the flexible part.
• Printed circuits form the first parts and are therefore the rigid parts of the electronic circuit.
• the bus bars form the second parts and are therefore the flexible parts of the electronic circuit.
• Busbars 4 are well-known elements in the field of electrical energy distribution.
• a bus bar 4 can be a metal strip (or a bar) making it possible to distribute high currents.
• the bus bars 4 are made of solid metal such as copper.
• each bus bar 4 is defined as a function of the electric current which must circulate therein.
• the bus bar 4 according to the invention can be covered with an insulating resin.
• each bus bar 4 can have ramifications and bores.
• the holes 41 can receive a connector making it possible to electrically connect the bus bar 4 to another element.
• bus bars are electronically separated and can be stacked one above the other. Thus each bus bar has a separate position in the stack of layers of the printed circuit.
• each printed circuit comprises a plurality of layers.
• printed circuits 2 include at least three layers: two outer layers 21 and at least one spacer layer 22.
• the layers can be made of electrically insulating resin.
• the outer layers 21 can be made with a rigid material, and the or each spacer layer 22 (inner layer) can be made with a softer material. Likewise, the layers can have different expansion coefficients.
• Each outer layer can have conductive tracks and accommodate electronic components.
• the components can be inserted into holes. These bores are preferably made in conductive tracks for electrically connecting the components, according to a chosen architecture. Additionally, electronic components can be soldered or soldered to the outer layers.
• One or more bus bars 4 can be buried in the spacer layer or layers 22.
• the printed circuits 2 can comprise at least two superimposed layers on either side of each bus bar so as to bury the buses. bars 4.
• the bus bars 4 can be juxtaposed or stacked.
• the spacer layer or layers 22 make it possible to isolate the bus bars 4 from each other, and also to isolate them from the components of the outer layers 21.
• the latter may have a first electronic network structured on a first outer layer 21, then one or more bus bars 4 embedded in the layer of spacer 22, and a second electronic network structured on the second outer layer 21.
• this architecture is just one example. It is thus possible to have only one electronic network on a single outer layer 21, the other outer layer 21 being left blank.
• the printed circuit 2 can include connectors (also called vias) making it possible to make an electrical connection between several layers.
• a connector can for example make it possible to electrically connect an electronic network of an outer layer 21 with a bus bar 4, or to electrically connect two outer layers 21 with a bus bar, or to connect two superimposed bus bars 4, etc. .
• the multilayer structure of the printed circuits 2, incorporating a spacer layer 22 in which the bus bars 4 are buried makes it possible in particular to have - for example - a high power circuit on an external face and a low power circuit on another external face.
• This also makes it possible to have high electrical powers circulating in the bus bars 4 and low powers in the electronic networks of the external faces.
• the structure according to the invention makes it possible to have high and low electrical power in the same printed circuit 2.
• the electronic circuit 1 can comprise a plurality of printed circuits 2.
• the printed circuits 2 are physically linked and electrically connected by the bus bars 4.
• the printed circuits 2 are spaced and separated by an inter-circuit space comprising only the bus bars 4. In other words, the printed circuits 2 do not touch each other, so that between each circuit printed circuit 2 is left an empty space (ie a space not including printed circuit 2).
• the printed circuits 2 are aligned in an axial direction A, so that the electronic circuit 1 has the appearance of a strip oriented along the axis A.
• the bus bars 4 are foldable, and more particularly, each portion of the bus bar 4 present in an inter-circuit space 6 is foldable.
• the bus bars are folded so that two adjacent printed circuits 2 are situated in two intersecting planes.
• the electronic circuit 1 is adapted to be positioned around a circular electric motor.
• the bus bars 4, in the inter-circuit spaces 6, are bent so that all the printed circuits 2 define facets of a substantially hemispherical envelope.
• the invention relates to a method of manufacturing the electronic circuit 1.
• the manufacturing process comprises in particular the following steps:
• step (c) may include the following steps:
• step (c1) can be carried out using a machine for force-assembling electronic components, called a press-fit machine.
• a press-fit machine This type of machine has the advantage of developing sufficient force for bending the bus bars 4 while having a precision suitable for handling electronic components.
• any type of machine can be used to bend the bus bars 4, as long as the bending can be carried out without damaging the printed circuits 2.
• the piling is carried out after having implanted all the electronic components on the printed circuits 2.
• step (c2) provision can be made to redeposit the insulating coating on the bent bus bars, to ensure good electrical insulation of electronic circuit 1.
• the invention relates to a turbomachine comprising at least one electronic circuit 1 according to the invention.
• the electronic circuit 1 is bent to form a faceted hemispherical envelope and is pressed onto a stator of a circular electric motor.
• the invention relates to an aircraft comprising at least one turbomachine according to the invention.

Landscapes

• Engineering & Computer Science (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Manufacturing & Machinery (AREA)
• Structure Of Printed Boards (AREA)

Applications Claiming Priority (2)

Publications (1)

Family

ID=72356048

Family Applications (1)

Country Status (6)

Family Cites Families (4)

• 2020
  • 2020-04-03 FR FR2003364A patent/FR3109051A1/fr active Pending
• 2021
  • 2021-04-01 CA CA3173655A patent/CA3173655A1/fr active Pending
  • 2021-04-01 EP EP21723324.6A patent/EP4129021A1/de active Pending
  • 2021-04-01 WO PCT/FR2021/050582 patent/WO2021198625A1/fr active Application Filing
  • 2021-04-01 CN CN202180027134.0A patent/CN115918267A/zh active Pending
  • 2021-04-01 US US17/916,372 patent/US20230156929A1/en active Pending

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