EP4060000A4 - THERMALLY CONDUCTIVE ADDITION CROSS-LINKING SILICONE COMPOSITION AND METHOD FOR PRODUCING THE SAME - Google Patents
THERMALLY CONDUCTIVE ADDITION CROSS-LINKING SILICONE COMPOSITION AND METHOD FOR PRODUCING THE SAME Download PDFInfo
- Publication number
- EP4060000A4 EP4060000A4 EP20886880.2A EP20886880A EP4060000A4 EP 4060000 A4 EP4060000 A4 EP 4060000A4 EP 20886880 A EP20886880 A EP 20886880A EP 4060000 A4 EP4060000 A4 EP 4060000A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- thermally conductive
- silicone composition
- producing same
- curing silicone
- addition curing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000013006 addition curing Methods 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 title 1
- 229920001296 polysiloxane Polymers 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/5403—Silicon-containing compounds containing no other elements than carbon or hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/06—Preparatory processes
- C08G77/08—Preparatory processes characterised by the catalysts used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
- C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/08—Ingredients agglomerated by treatment with a binding agent
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
- C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019207067 | 2019-11-15 | ||
JP2020068492 | 2020-04-06 | ||
PCT/JP2020/040097 WO2021095501A1 (ja) | 2019-11-15 | 2020-10-26 | 熱伝導性付加硬化型シリコーン組成物及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
EP4060000A1 EP4060000A1 (en) | 2022-09-21 |
EP4060000A4 true EP4060000A4 (en) | 2023-12-13 |
Family
ID=75912861
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP20886880.2A Withdrawn EP4060000A4 (en) | 2019-11-15 | 2020-10-26 | THERMALLY CONDUCTIVE ADDITION CROSS-LINKING SILICONE COMPOSITION AND METHOD FOR PRODUCING THE SAME |
Country Status (7)
Country | Link |
---|---|
US (1) | US20220411589A1 (zh) |
EP (1) | EP4060000A4 (zh) |
JP (1) | JP7243857B2 (zh) |
KR (1) | KR20220103982A (zh) |
CN (1) | CN114729194B (zh) |
TW (1) | TW202132468A (zh) |
WO (1) | WO2021095501A1 (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7328184B2 (ja) * | 2020-08-06 | 2023-08-16 | 信越化学工業株式会社 | 熱伝導性2液付加硬化型シリコーン組成物及びその製造方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7166363B2 (en) * | 2003-08-25 | 2007-01-23 | Shin-Etsu Chemical Co., Ltd. | Highly heat conductive silicone rubber composition, fixing roll and fixing belt |
JP2011122084A (ja) * | 2009-12-11 | 2011-06-23 | Shin-Etsu Chemical Co Ltd | 熱伝導性シリコーンゲル組成物、その製造方法及び熱伝導性シリコーンゲル |
JP2019131734A (ja) * | 2018-02-01 | 2019-08-08 | 信越化学工業株式会社 | 2液付加反応硬化型放熱シリコーン組成物及びその製造方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5821160B2 (ja) | 1977-12-29 | 1983-04-27 | 三恵工業株式会社 | 光信号による監視装置 |
JP2741436B2 (ja) | 1991-06-24 | 1998-04-15 | 信越化学工業株式会社 | 表面処理アルミナ及びそれを含有する熱伝導性シリコーン組成物 |
JP3676544B2 (ja) | 1997-08-05 | 2005-07-27 | ジーイー東芝シリコーン株式会社 | 難燃性放熱性シート用シリコーンゲル組成物および難燃性放熱性シリコーンシート |
JP2005344106A (ja) * | 2004-05-07 | 2005-12-15 | Shin Etsu Chem Co Ltd | シリコーンゲル組成物 |
JP2007233084A (ja) * | 2006-03-01 | 2007-09-13 | Fuji Xerox Co Ltd | 定着ロール、定着装置及び画像形成装置 |
JP5539283B2 (ja) * | 2011-09-27 | 2014-07-02 | 信越化学工業株式会社 | 熱伝導性シリコーンゴム組成物 |
JP6481599B2 (ja) * | 2015-12-08 | 2019-03-13 | 信越化学工業株式会社 | 無機粒子−ポリシロキサン複合体、それを含む分散液、固体材料、及び該無機粒子−ポリシロキサン複合体の製造方法 |
JP6705426B2 (ja) * | 2017-05-09 | 2020-06-03 | 信越化学工業株式会社 | 熱伝導性シリコーン組成物 |
-
2020
- 2020-10-26 JP JP2021555983A patent/JP7243857B2/ja active Active
- 2020-10-26 KR KR1020227019464A patent/KR20220103982A/ko unknown
- 2020-10-26 WO PCT/JP2020/040097 patent/WO2021095501A1/ja unknown
- 2020-10-26 EP EP20886880.2A patent/EP4060000A4/en not_active Withdrawn
- 2020-10-26 CN CN202080079164.1A patent/CN114729194B/zh active Active
- 2020-10-26 US US17/775,537 patent/US20220411589A1/en active Pending
- 2020-11-09 TW TW109138974A patent/TW202132468A/zh unknown
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7166363B2 (en) * | 2003-08-25 | 2007-01-23 | Shin-Etsu Chemical Co., Ltd. | Highly heat conductive silicone rubber composition, fixing roll and fixing belt |
JP2011122084A (ja) * | 2009-12-11 | 2011-06-23 | Shin-Etsu Chemical Co Ltd | 熱伝導性シリコーンゲル組成物、その製造方法及び熱伝導性シリコーンゲル |
JP2019131734A (ja) * | 2018-02-01 | 2019-08-08 | 信越化学工業株式会社 | 2液付加反応硬化型放熱シリコーン組成物及びその製造方法 |
Non-Patent Citations (1)
Title |
---|
See also references of WO2021095501A1 * |
Also Published As
Publication number | Publication date |
---|---|
JPWO2021095501A1 (zh) | 2021-05-20 |
CN114729194B (zh) | 2023-10-20 |
WO2021095501A1 (ja) | 2021-05-20 |
EP4060000A1 (en) | 2022-09-21 |
CN114729194A (zh) | 2022-07-08 |
JP7243857B2 (ja) | 2023-03-22 |
US20220411589A1 (en) | 2022-12-29 |
TW202132468A (zh) | 2021-09-01 |
KR20220103982A (ko) | 2022-07-25 |
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Legal Events
Date | Code | Title | Description |
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STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE |
|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
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STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE |
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17P | Request for examination filed |
Effective date: 20220505 |
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AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR |
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DAV | Request for validation of the european patent (deleted) | ||
DAX | Request for extension of the european patent (deleted) | ||
A4 | Supplementary search report drawn up and despatched |
Effective date: 20231110 |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: H01L 23/36 20060101ALI20231106BHEP Ipc: C08K 3/22 20060101ALI20231106BHEP Ipc: C08L 83/07 20060101ALI20231106BHEP Ipc: C08L 83/06 20060101ALI20231106BHEP Ipc: C08L 83/05 20060101ALI20231106BHEP Ipc: C08L 83/04 20060101AFI20231106BHEP |
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STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION HAS BEEN WITHDRAWN |
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18W | Application withdrawn |
Effective date: 20240326 |