Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
  • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
  • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
  • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
  • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
  • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
  • H01L25/0655—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next to each other
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
  • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
  • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
  • H01L21/561—Batch processing
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
  • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
  • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
  • H01L21/565—Moulds
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
  • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
  • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
  • H01L21/568—Temporary substrate used as encapsulation process aid
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
  • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
  • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
  • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
  • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
  • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
  • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
  • H01L23/49838—Geometry or layout
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
  • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
  • H01L23/528—Geometry or layout of the interconnection structure
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/0213—Electrical arrangements not otherwise provided for
  • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
  • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
  • H05K1/0231—Capacitors or dielectric substances
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/22—Secondary treatment of printed circuits
  • H05K3/28—Applying non-metallic protective coatings
  • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
  • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
  • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
  • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
  • H05K3/341—Surface mounted components
  • H05K3/3431—Leadless components
  • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
  • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
  • H01G2/02—Mountings
  • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
  • H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
  • H01G4/00—Fixed capacitors; Processes of their manufacture
  • H01G4/38—Multiple capacitors, i.e. structural combinations of fixed capacitors
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/10—Bump connectors; Manufacturing methods related thereto
  • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
  • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
  • H01L2224/161—Disposition
  • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
  • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
  • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
  • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
  • H01L2924/151—Die mounting substrate
  • H01L2924/153—Connection portion
  • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
  • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
  • H01L2924/1901—Structure
  • H01L2924/1904—Component type
  • H01L2924/19041—Component type being a capacitor
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
  • H01L2924/191—Disposition
  • H01L2924/19101—Disposition of discrete passive components
  • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
  • H05K2201/10007—Types of components
  • H05K2201/10015—Non-printed capacitor
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
  • H05K2201/10431—Details of mounted components
  • H05K2201/10507—Involving several components
  • H05K2201/10522—Adjacent components
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
  • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
  • H05K2201/10621—Components characterised by their electrical contacts
  • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
  • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
  • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
  • H05K3/341—Surface mounted components
  • H05K3/3431—Leadless components
  • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
  • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
  • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
  • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

• Conventional packaged integrated circuits typically include a semiconductor chip mounted on a carrier substrate.
• the carrier substrate is configured to mount to a printed circuit board, such as a motherboard or card.
• the typical conventional carrier substrate includes an interconnect system that is made up of multiple layers of conductor planes or traces tied vertically by plural vias.
• Input/output pads on the die side of the carrier substrate connect to the die and input/output pads on the underside of the carrier substrate connect to the printed circuit board.
• a ball grid array, a land grid array or pin grid array is used to electrically connect the underside input/output pads to the printed circuit board.
• decoupling capacitors To address issues associated with power supply noise, conventional semiconductor chip packages use decoupling capacitors. Many of these decoupling capacitors are mounted to the carrier substrate. In one conventional variant, the decoupling capacitors are mounted to the die side of the carrier substrate around the periphery of the die. In another conventional variant, the decoupling capacitors are mounted to the underside of the carrier substrate.
• FIG. 1 is a partially exploded pictorial view of an exemplary conventional semiconductor chip package
• FIG. 2 is a plan view of the exemplary semiconductor chip package substrate
• FIG. 3 is a portion of FIG. 2 shown at greater magnification
• FIG. 4 is a portion of FIG. 2 shown at greater magnification
• FIG. 5 is a plan view of an exemplary semiconductor package arrangement with exemplary molded passive component groups
• FIG. 6 is a portion of FIG. 5 shown at greater magnification
• FIG. 7 is a sectional view of FIG. 6 taken at section 7-7;
• FIG. 8 is the portion depicted in FIG. 6 with a portion of the molding cut away;
• FIG. 9 is a plan view of an alternate exemplary semiconductor package arrangement with exemplary molded passive component groups
• FIG. 10 is a plan view of an alternate exemplary semiconductor package arrangement with exemplary molded passive component groups
• FIG. 11 is a sectional view depicting an exemplary arrangement of passive component groups on a carrier substrate
• FIG. 12 is a sectional view like FIG. 11, but depicting exemplary molding to at least partially encapsulate the passive components;
• FIG. 13 is a sectional view like FIG. 12, but depicting removal of the carrier substrate
• FIG. 14 is a sectional view like FIG. 13, but depicting exemplary singulation of molded passive component groups
• FIG. 15 is a sectional view depicting exemplary mounting of a molded passive component group on a circuit board.
• FIG. 16 is a plan view of an alternate exemplary molding passive component group. DETAILED DESCRIPTION
• Decoupling capacitors are conventionally mounted one at a time to the surface of a
• Each capacitor is positioned with electrodes vertically aligned with an underlying solder structure of the package substrate.
• a reflow is performed to temporarily liquify the solder structures.
• a cool down solidifies the solder structures and makes the electrical and mechanical connections between the capacitors and the package substrate.
• the mounting process involves a pick and place operation. There is the chance that imperfections in the pick and place operation and/or variations in the size, height and position of the solder structures can cause the capacitors to wobble, rotate or otherwise move during the reflow. If the movement is too great, one capacitor can short to another. To avoid this pitfall, conventional capacitor mounting technique follow design rules for minimum spacing of pick and placed capacitors. This places a significant constraint on package substrate design and size. Many package substrates utilize memory interface areas where large numbers of closely spaced conductor traces fan out from a chip mounting areas. Due to packing constraints of conventionally placed capacitors, such memory interface areas typically have overlying capacitors, which makes the task of routing conductor traces challenging.
• the disclosed arrangements utilize molded passive component groups.
• the molded passive component groups can be molded together with much tighter minimum spacing. As a result, for the same size package substrate, more passive components can be mounted and/or mounted outside memory interface areas, or mounted in such a way so that more chips can be mounted than is conventionally possible.
• a method of manufacturing includes at least partially encapsulating a first plurality of capacitors in a molding material to create a first molded passive component group.
• the first molded passive component group is mounted on a surface of a circuit board.
• the first plurality of capacitors are electrically connected to the circuit board.
• a method of manufacturing includes fabricating plural molded passive component groups by at least partially encapsulating plural groups of capacitors in a molding material and singulating the molded passive component groups.
• the molded passive component groups are mounted on a surface of a semiconductor chip package substrate.
• the capacitors are electrically connected to the semiconductor chip package substrate.
• an apparatus includes a circuit board that has a surface, and at least one molded passive component group mounted on the surface of and electrically connected to the circuit board.
• the at least one molded passive component group includes a first plurality of capacitors each having an upper surface and a molding material joining together and covering the upper surfaces of the first plurality of capacitors.
• FIG. 1 therein is depicted a partially exploded pictorial view of an exemplary conventional semiconductor chip package 100 that includes a semiconductor chip 105 mounted on a package substrate 110.
• a lid 115 is mounted on the package substrate 110 to serve as a heat spreader and is in thermal contact with the semiconductor chip 105 by way of a thermal interface material 120.
• the package substrate 110 is a pin grid array package that includes plural conductor pins 125 that are designed to insert into a pin grid array socket (not shown).
• the upper surface 130 of the package substrate 120 is populated with plural surface components 135, which are typically capacitors in this conventional arrangement. Additional details of the conventional semiconductor chip package 100 may be understood by referring now also to FIG. 2, which is a plan view of the package substrate 110 but without the lid 115 shown depicted in FIG. 1. A portion of the thermal interface material is cut away to reveal the underlying semiconductor chip 105.
• the conventional capacitors 135 are mounted on the upper surface 130 of the package substrate 110 as individual items in a pick and place operation. In this illustrative arrangement, there are six capacitor groups 140a, 140b, 140c, 140d, 140e and 140f disposed around the periphery of the semiconductor chip 105.
• the package substrate 110 includes large numbers of conductor traces that fan out all over the package substrate 110 but are not shown in FIG. 2. Many of these invisible conductor traces are positioned in memory interface regions 145a and 145b (the areas between the dashed lines) of the package substrate 110. There is typically a greater number and higher density of the conductor traces in the memory interface regions 145a and 145b in order to handle the multitudes of signal pathways between the semiconductor chip 105 and external memory devices (not shown). Because of the size and process limitations associated with mounting the conventional capacitors 135, some of the capacitors 135 in, for example the capacitor groups 140b, 140c, 140e and 140f are positioned over the memory interface areas 145a and 145b.
• FIG. 3 is a portion of the package substrate 110 upon which the capacitor group 140f is positioned.
• the capacitors 135 are individually placed on the upper surface 130 of the package substrate 110.
• a typical conventional capacitor 135 has some length a and a width b. In one conventional arrangement, a is 1.6 mm and b is 0.8 mm.
• FIG. 4 depicts a plan view of two of the capacitors 135.
• Each of the capacitors 135 is mounted on four solder pads 155 of the conventional package substrate 110, which are located proximate the comers of each capacitor 135.
• each capacitor 135 is mounted over the solder pads 155 and a reflow process is performed in order to temporarily liquify the solder pads 155 and thus establish a metallurgical bond with the capacitors 135.
• FIG. 5 is a plan view depicting a semiconductor chip 205 mounted on a circuit board 210, which can be a semiconductor chip package substrate, a circuit card, a system board or other.
• the circuit board 210 can an organic build-up design, a multi-layer prepreg design, a ceramic or other design.
• a thermal interface material 220 of the type depicted in the earlier figures can be placed on the semiconductor chip 205, and is indeed shown partially cut away to reveal the underlying semiconductor chip 205.
• a lid (not shown) of the type depicted in FIG. 1 or other types can also be used to convey heat away from the semiconductor chip 205.
• the upper surface 230 of the circuit board 210 is populated with plural molded passive component groups 233a, 233b, 233c, 233d, 233e, 233f, 233g and 233h.
• Each of the molded passive component groups 233a, 233b, 233c, 233d, 233e, 233f, 233g and 233h consists of plural passive components 235 (shown as dashed boxes) molded inside of a molding material 240.
• the passive components 235 in this illustrative arrangement and the disclosed alternative arrangements can be capacitors, inductors or resistors.
• the passive components 235 are molded inside of the molding material 240 in a process that provides for very tight spacing between the passive components 235 in a given passive component group 233a, 233b, etc. Indeed, whereas the conventional arrangement requires a minimum spacing x of 0.8 mm, the disclosed new arrangements reduce that minimum spacing between passive components 235 to as little as 0.1 mm or perhaps even smaller.
• FIG. 6 is a plan view of the passive component group 233a and the upper surface 230 of the circuit board 210 shown at greater magnification then in FIG. 5.
• FIG. 7 is a sectional view of FIG. 6 taken at section 7-7.
• the following description of the passive component group 233a will be illustrative of the other passive component groups 233b, 233c, 233d, 233e, 233f, 233g and 233h. Turning first to FIG.
• the passive component group 233a consists of plural passive components 235, at least partially embedded or encapsulated, within the molding material 240, which is shown partially cut away to reveal a couple of the passive components 235.
• Each of the passive components 235 includes a central insulating coating 247 and end electrodes 249a and 249b.
• the passive component group 233a includes twelve passive components 235.
• FIG. 7, is a sectional view of FIG. 6 taken at section 7-7.
• the left hand passive component 235 includes the aforementioned insulating coating 247 and electrodes 249a and 249b, which are in ohmic contact with underlying solder pads 257a and 257b.
• the right hand passive component 235 similarly has an insulating central region 247 and electrodes 249a and 249b which are connected to respective underlying solder pads 257a and 257b.
• the passive components 235 can be of virtually any capacitor design, such as multi-plate, single plate, etc., or virtually resistor or inductor design.
• the solder pads 257a and 257b project downward through openings in a solder mask 252 that is formed on the underlying circuit board 210.
• the solder pads 257a and 257b are connected to respective underlying metallization pads 258a and 258b.
• the number of underlying solder pads 257a and 257b for each of the passive components 235 can number more than two and in fact be similar to the solder pads 155 depicted in FIG. 4.
• other numbers such as two or something other than four can be used.
• the molding material 240 at least partially encapsulates the passive components 235 and creates, along with the passive components 235, the aforementioned molded passive component group 233a.
• the molding 240 it is desirable for the molding 240 to cover the upper surfaces 260 of the passive components 235 so as to protect the passive components 235 from materials that could damage or otherwise electrically short the passive components 235, such as, solder thermal interface materials.
• the molding material 240 is molded or otherwise processed to expose the electrodes 249a and 249b of each of the passive components 235 so that metallurgical bonds can be made with the solder pads 257a and 257b.
• any or all of the molded passive component groups 233a, 233b, 233c, 233d, 233e, 233f, 233g and 233h can mounted on the surface 230 of the circuit board 210 or the opposite surface 259 of the circuit board 210 or any disclosed alternatives.
• the circuit board 210 is a land grid array design with plural lands 261. Alternative arrangements can use pin grid arrays, ball grid arrays, others I/Os or no I/Os.
• the passive components 235 can have the same length a 1 and width b 1 as the capacitors 135 depicted in the earlier figures and described above or other lengths and widths. However, because of a different processing technique to be described in more detail below, the passive components 235 can be molded within the molding material 240 with a minimum spacing x, which as noted above, can be a fraction of the conventional minimum spacing x described above. Note that the conventional area 150 of the conventional capacitor grouping 140f depicted in FIG. 3 is superimposed in FIG. 8 around the new molded passive component group 233a. Because of the minimum spacing x 2 , where x 2 ⁇ x,. the passive component group 233a takes up only a fraction of the area 150 of the conventional design. The area A 2 is given by:
• FIG. 9 is a plan view of an alternate exemplary arrangement of a semiconductor chip device 300 that includes plural semiconductor chips 305a, 305b and 305c mounted on a circuit board 310 and in particular the upper surface 330 thereof.
• the circuit board 310 can be configured like the circuit board 210 disclosed elsewhere herein.
• molded passive component groups 333a, 333b, 333c, 333d, 333e, 333f, 333g and 333h are mounted on the upper surface 330 of the circuit board 310.
• the passive component groups 333a are proportionally much smaller than that permitted by the conventional design, for example, the capacitor group 140f depicted above, additional surface area of the circuit board 310 is available to position not one, but three semiconductor chips 305a, 305b and 305c of similar size, without having to position any of the passive component groups 333a, 333b, 333c, 333d, 333e, 333f, 333g and 333h within the confines of the memory interface areas 345a and 345b.
• more passive components 335 of the groups 333a are mounted on the upper surface 330 of the circuit board 310.
• 333b, 333c, 333d, 333e, 333f, 333g and 333h can be positioned on the circuit board 310 while accommodating more and/or bigger semiconductor chips without necessarily constraining the routing of traces in the memory interface areas 345a and 345b.
• a semiconductor chip package 400 depicted in a plan view in FIG. 10, includes semiconductor chips 405a, 405b, 405c, 405d and 405e mounted on a circuit board 410 and in particular on the upper surface 430 thereof.
• the circuit board 410 can be configured like the circuit boards 210 and 310 disclosed elsewhere herein.
• plural molded passive component groups 433a, 433b, 433c and 433d are mounted on the upper surface 430 on either side of the chips 405a, 405b, 405c, 405d and 405e.
• the passive component groups 433a, 433b, 433c and 433d are fabricated using the techniques to be described below, the portions of the upper surface 430 of the circuit board 410 proximate where the chips 405d and 405e, respectively, are mounted is freed up for chip placement as opposed to surface component placement.
• some portions of the passive component groups 433a, 433b, 433c and 433d can be positioned over the memory interface areas 345a and 345b, but this spatial arrangement is compensated by the ability to add additional semiconductor in the form of the chips 405d and 405e on the circuit board 410.
• FIGS. 11, 12, 13, 14 and 15 An exemplary method for fabricating the molded passive component groups of any of the disclosed arrangements can be understood by referring now to FIGS. 11, 12, 13, 14 and 15 and initially to FIG. 11.
• a carrier substrate 511 This can be done using the depicted carrier tape 513 positioned on the carrier substrate 511 or by other removable techniques, such as light or heat activated adhesives or others.
• This processing can performed on wafer scale basis, so there can be scores or more passive component groups 507, 509, etc.
• the carrier substrate 511 can be a carrier wafer or other workpiece composed of glass, silicon or other materials.
• the passive components 235 of the group 507 can be, for example, the passive components 235 of the ultimately molded passive component group 233a depicted in FIG. 5 and the passive components 235 of the passive component group 509 can be, for example, passive components 235 of the ultimately molded passive component group 233h also depicted in FIG. 5.
• the passive components 235 of the group 507 are positioned on the carrier tape 513 with the minimum spacing x 2 and the passive components 235 of the group 509 are similarly mounted on the carrier tape 513 with the minimum spacing x 2 . This tight spacing is permitted by the wafer level process.
• the passive components 235 of the groups 507 and 509 are subjected to a molding process to create a molding material 522.
• the molding material 522 covers the uncovered portions of the carrier tape 513 and fdls the gaps 517 between the passive components 235 of each of the groups 507 and 509, as well as the gaps between passive components that are spaced in and out of the page of each of the groups 507 and 509. In addition, the molding 522 is performed so that the upper surfaces 260 of each of the passive components 235 is covered. The molding material 522 will, through a subsequent singulation process, be broken out into the individual moldings 240 and passive component groups 233a, 233h, etc., depicted in FIG. 5.
• the molding material 522 can be composed of well-known molding compounds, such as Sumitomo EME-G750 or G760 or other molding materials, and compression molded at about 165 °C for about 60 to 120 minutes.
• the carrier wafer 511 remains as a supportive structure for these processes.
• the carrier substrate 511 and the carrier tape 513 are removed to leave a reconstituted combination 532 of the molded passive component groups 233a and 233h, which consist of the passive components 235 of the passive component groups 507 and 509, respectively, at least partially encased by the molding 522. If any of the molding 522 covers the lower sides of the electrodes 249a and 249b of the passive components 235, then a suitable grinding or other material removal process should be performed at this stage to ensure that solder will readily wet to the electrodes during substrate mounting. At this point, it is desirable to singulate the molded passive component group 233a from the molded passive component group 233h as shown in FIG.
• the molded passive component groups for example, the passive component group 233a including the passive components 235 and molding 240 shown in FIG. 15, can be mounted on the underlying solder pads 257a and 257b of the circuit board 210 to establish requisite metallurgical connections with the passive components 235 of the molded passive component group 233a and so on for the other passive component groups 233b, 233c, 233d, 233e, 233f, 233g and 233h (see FIG. 5).
• a suitable reflow can be performed in order to temporarily liquify the solder interconnect pads 257a and 257b followed by a cool down to create the metallurgical bonds with the circuit board 210.
• FIG. 16 is a plan view like FIG. 8, but depicting an alternate exemplary arrangement of a molded passive component group 533a that includes passive components 535 in a molding material 540.
• the left-hand column includes six passive components 535 while the right-hand column includes only two passive components 535.
• the upper left-hand passive component has some dimensions a and b, while the next lower passive component 535 has a smaller footprint.
• the lowermost left-hand passive component 535 is rotated relative to the other passive components 535.

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• General Physics & Mathematics (AREA)
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• 2018
  • 2018-12-07 US US16/213,347 patent/US11495588B2/en active Active
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