EP3859971A4 - COMPOSITE SUBSTRATE, PIEZOELECTRIC ELEMENT AND METHOD FOR MAKING A COMPOSITE SUBSTRATE - Google Patents

COMPOSITE SUBSTRATE, PIEZOELECTRIC ELEMENT AND METHOD FOR MAKING A COMPOSITE SUBSTRATE Download PDF

Info

Publication number
EP3859971A4
EP3859971A4 EP19866251.2A EP19866251A EP3859971A4 EP 3859971 A4 EP3859971 A4 EP 3859971A4 EP 19866251 A EP19866251 A EP 19866251A EP 3859971 A4 EP3859971 A4 EP 3859971A4
Authority
EP
European Patent Office
Prior art keywords
composite substrate
piezoelectric element
manufacturing
manufacturing composite
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP19866251.2A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP3859971A1 (en
Inventor
Motohiro Umehara
Kuniaki Mitsuda
Kazuyoshi Fujimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Publication of EP3859971A1 publication Critical patent/EP3859971A1/en
Publication of EP3859971A4 publication Critical patent/EP3859971A4/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/704—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings
    • H10N30/706—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings characterised by the underlying bases, e.g. substrates
    • H10N30/708—Intermediate layers, e.g. barrier, adhesion or growth control buffer layers
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02543—Characteristics of substrate, e.g. cutting angles
    • H03H9/02559—Characteristics of substrate, e.g. cutting angles of lithium niobate or lithium-tantalate substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/072—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
    • H10N30/073—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies by fusion of metals or by adhesives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
    • H10N30/085—Shaping or machining of piezoelectric or electrostrictive bodies by machining
    • H10N30/086—Shaping or machining of piezoelectric or electrostrictive bodies by machining by polishing or grinding
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02543—Characteristics of substrate, e.g. cutting angles
    • H03H9/02574—Characteristics of substrate, e.g. cutting angles of combined substrates, multilayered substrates, piezoelectrical layers on not-piezoelectrical substrate

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
EP19866251.2A 2018-09-25 2019-09-24 COMPOSITE SUBSTRATE, PIEZOELECTRIC ELEMENT AND METHOD FOR MAKING A COMPOSITE SUBSTRATE Pending EP3859971A4 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018178801 2018-09-25
JP2018181814 2018-09-27
PCT/JP2019/037272 WO2020067013A1 (ja) 2018-09-25 2019-09-24 複合基板、圧電素子および複合基板の製造方法

Publications (2)

Publication Number Publication Date
EP3859971A1 EP3859971A1 (en) 2021-08-04
EP3859971A4 true EP3859971A4 (en) 2022-07-06

Family

ID=69949676

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19866251.2A Pending EP3859971A4 (en) 2018-09-25 2019-09-24 COMPOSITE SUBSTRATE, PIEZOELECTRIC ELEMENT AND METHOD FOR MAKING A COMPOSITE SUBSTRATE

Country Status (6)

Country Link
US (1) US20220021368A1 (zh)
EP (1) EP3859971A4 (zh)
JP (3) JP7194194B2 (zh)
CN (1) CN112740551A (zh)
TW (1) TWI747050B (zh)
WO (1) WO2020067013A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220007691A (ko) * 2020-04-21 2022-01-18 지난 징젱 일렉트로닉스 씨오., 엘티디. 복합 기판 및 이의 제조방법
CN113872557B (zh) * 2021-09-29 2022-07-12 北京超材信息科技有限公司 用于声表面波器件的复合衬底及制造方法、声表面波器件
TWI792857B (zh) * 2022-01-12 2023-02-11 合晶科技股份有限公司 複合基板及其製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017163722A1 (ja) * 2016-03-25 2017-09-28 日本碍子株式会社 接合方法
WO2018016169A1 (ja) * 2016-07-20 2018-01-25 信越化学工業株式会社 弾性表面波デバイス用複合基板の製造方法

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3132065B2 (ja) * 1991-08-08 2001-02-05 住友電気工業株式会社 弾性表面波素子及びその製造方法
JPH11122073A (ja) * 1997-10-17 1999-04-30 Kazuhiko Yamanouchi 弾性表面波素子
JP2001053579A (ja) * 1999-06-02 2001-02-23 Matsushita Electric Ind Co Ltd 弾性表面波素子と移動体通信機器
JP3925132B2 (ja) 2000-09-27 2007-06-06 セイコーエプソン株式会社 表面弾性波素子、周波数フィルタ、周波数発振器、電子回路、及び電子機器
JP3929983B2 (ja) * 2004-03-03 2007-06-13 富士通メディアデバイス株式会社 接合基板、弾性表面波素子および弾性表面波デバイス並びにその製造方法
JP4657002B2 (ja) * 2005-05-12 2011-03-23 信越化学工業株式会社 複合圧電基板
JP2008066355A (ja) * 2006-09-05 2008-03-21 Sumitomo Electric Ind Ltd ３族窒化物基板の製造方法、３族窒化物基板、エピタキシャル層付き３族窒化物基板、３族窒化物デバイス、エピタキシャル層付き３族窒化物基板の製造方法、および３族窒化物デバイスの製造方法。
JP5180104B2 (ja) * 2009-01-09 2013-04-10 日本碍子株式会社 弾性表面波素子
JP5539602B1 (ja) * 2012-08-17 2014-07-02 日本碍子株式会社 複合基板，弾性表面波デバイス及び複合基板の製造方法
CN202931260U (zh) * 2012-11-14 2013-05-08 日本碍子株式会社 用于弹性波装置的复合基板
JP2014147054A (ja) 2013-01-30 2014-08-14 Sumitomo Electric Ind Ltd 圧電基板及び弾性表面波素子
JPWO2014129433A1 (ja) * 2013-02-19 2017-02-02 日本碍子株式会社 複合基板及び半導体デバイスの製法
WO2014148648A1 (ja) * 2013-03-21 2014-09-25 日本碍子株式会社 弾性波素子用複合基板および弾性波素子
JP6347553B2 (ja) 2013-05-31 2018-06-27 日本碍子株式会社 複合基板用支持基板および複合基板
JP2015111649A (ja) * 2013-10-30 2015-06-18 京セラ株式会社 金属体付きサファイア構造体、金属体付きサファイア構造体の製造方法、電子機器、および外装体
JP6349979B2 (ja) 2014-06-05 2018-07-04 株式会社デンソー 弾性表面波式センサ
US9576816B2 (en) * 2015-02-13 2017-02-21 Tokyo Electron Limited Method for roughness improvement and selectivity enhancement during arc layer etch using hydrogen
JP2017092791A (ja) * 2015-11-13 2017-05-25 住友金属鉱山株式会社 複合基板の製造方法
NL2018040A (en) * 2015-12-23 2017-06-28 Asml Netherlands Bv Method for removing photosensitive material on a substrate
US9978563B2 (en) * 2016-01-27 2018-05-22 Tokyo Electron Limited Plasma treatment method to meet line edge roughness and other integration objectives
JP6250856B1 (ja) * 2016-07-20 2017-12-20 信越化学工業株式会社 表面弾性波デバイス用複合基板及びその製造方法とこの複合基板を用いた表面弾性波デバイス
JP6998650B2 (ja) * 2016-08-10 2022-01-18 株式会社日本製鋼所 接合基板、弾性表面波素子、弾性表面波デバイスおよび接合基板の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017163722A1 (ja) * 2016-03-25 2017-09-28 日本碍子株式会社 接合方法
WO2018016169A1 (ja) * 2016-07-20 2018-01-25 信越化学工業株式会社 弾性表面波デバイス用複合基板の製造方法

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
ANONYMOUS: "SINGLE CRYSTAL SAPPHIRE", KYOCERA, 1 January 2020 (2020-01-01), pages 1 - 8, XP055917113, Retrieved from the Internet <URL:https://www.kyocera-solutions.se/wp-content/uploads/2020/10/Kyocera_Single_Crystal_Sapphire_web.pdf> [retrieved on 20220502] *
KIM Y. S. ET AL: "Thermal Expansion of Lithium Tantalate and Lithium Niobate Single Crystals", JOURNAL OF APPLIED PHYSICS, vol. 40, no. 11, 1 October 1969 (1969-10-01), 2 Huntington Quadrangle, Melville, NY 11747, pages 4637 - 4641, XP055924868, ISSN: 0021-8979, DOI: 10.1063/1.1657244 *

Also Published As

Publication number Publication date
TWI747050B (zh) 2021-11-21
JP7454622B2 (ja) 2024-03-22
WO2020067013A1 (ja) 2020-04-02
CN112740551A (zh) 2021-04-30
US20220021368A1 (en) 2022-01-20
JP2024056101A (ja) 2024-04-19
TW202018981A (zh) 2020-05-16
JPWO2020067013A1 (ja) 2021-09-02
EP3859971A1 (en) 2021-08-04
JP2022191327A (ja) 2022-12-27
JP7194194B2 (ja) 2022-12-21

Similar Documents

Publication Publication Date Title
EP3490146A4 (en) METHOD FOR PRODUCING A COMPOSITE SUBSTRATE FOR A SURFACE ACOUSTIC SHAFT DEVICE AND SURFACE ACOUSTIC SHAFT DEVICE WITH A COMPOSITE SUBSTRATE
EP3364471A4 (en) MULTILAYER SUBSTRATE WITH PIEZOELECTRIC THIN LAYER, PIEZOELECTRIC THIN LAYER ELEMENT AND METHOD FOR THE MANUFACTURE THEREOF
EP3540941A4 (en) COMPOSITE SUBSTRATE, SURFACE SOUNDWAVE DEVICE AND METHOD FOR PRODUCING THE COMPOSITE SUBSTRATE
EP3647299A4 (en) MULTI-LAYER CERAMIC SUBSTRATE AND METHOD FOR MANUFACTURING THEREOF
EP3573088A4 (en) COMPOSITE SUBSTRATE AND METHOD FOR MANUFACTURING THE COMPOSITE SUBSTRATE
EP3637486A4 (en) LAYERED SUBSTRATE WITH A PIEZOELECTRIC LAYER, ELEMENT WITH A PIEZOELECTRIC LAYER AND THE MANUFACTURING METHOD FOR A LAYERED SUBSTRATE WITH A PIEZOELECTRIC LAYER
EP3901097A4 (en) Piezoelectric laminate, piezoelectric element, and piezoelectric laminate manufacturing method
EP3418428A4 (en) CERAMIC LAMINATE, CERAMIC INSULATION SUBSTRATE AND METHOD FOR PRODUCING A CERAMIC LAMINATE
EP3869557A4 (en) LIGHT EMITTING ELEMENT AND METHOD OF MANUFACTURE THEREOF
EP3798718A4 (en) COMPOSITE SUBSTRATE FOR ELECTRO-OPTICAL ELEMENT AND ITS MANUFACTURING PROCESS
EP4047671A4 (en) PIEZOELECTRIC FILM AND METHOD FOR MAKING IT
EP3507645A4 (en) PIEZOELECTRIC ACTUATOR, DEFORMABLE MIRROR, AND METHOD FOR MANUFACTURING DEFORMABLE MIRROR
EP3859971A4 (en) COMPOSITE SUBSTRATE, PIEZOELECTRIC ELEMENT AND METHOD FOR MAKING A COMPOSITE SUBSTRATE
EP3748701A4 (en) LIGHT EMITTING ELEMENT AND METHOD OF MANUFACTURE THEREOF
EP3904305A4 (en) SUBSTRATE ATTACHED TO A WATER AND OIL-REPELLENT COATING AND METHOD OF MAKING THEREOF
EP3859802A4 (en) PIEZOELECTRIC DEVICE AND METHOD OF MAKING PIEZOELECTRIC DEVICE
EP4019918A4 (en) ELEMENT AND ITS MANUFACTURING METHOD
EP3340325A4 (en) Piezoelectric element, method for producing same and piezoelectric actuator
EP3671155A4 (en) SURFACE TENSION SENSOR, STRUCTURAL HOLLOW ELEMENT AND METHOD OF MANUFACTURING THEREOF
EP3584821A4 (en) COMPOSITE SEMICONDUCTOR LAMINATE SUBSTRATE, METHOD FOR MANUFACTURING THEREOF, AND SEMICONDUCTOR ELEMENT
EP3950627A4 (en) LAMINATE AND LAMINATE MANUFACTURING PROCESS
EP3761506A4 (en) COMPOSITE SUBSTRATE AND PIEZOELECTRIC ELEMENT
EP3584838A4 (en) NETWORK SUBSTRATE, AND ASSOCIATED MANUFACTURING PROCESS
EP4006002A4 (en) BONDED SUBSTRATE AND METHOD FOR PRODUCING A BONDED SUBSTRATE
EP4082961A4 (en) PIEZOELECTRIC ELEMENT, PIEZOELECTRIC DEVICE AND PRODUCTION METHOD OF A PIEZOELECTRIC ELEMENT

Legal Events

Date Code Title Description
STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE

PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE

17P Request for examination filed

Effective date: 20210319

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DAV Request for validation of the european patent (deleted)
DAX Request for extension of the european patent (deleted)
A4 Supplementary search report drawn up and despatched

Effective date: 20220603

RIC1 Information provided on ipc code assigned before grant

Ipc: H03H 3/08 20060101ALN20220530BHEP

Ipc: H03H 9/02 20060101ALN20220530BHEP

Ipc: H01L 41/313 20130101ALI20220530BHEP

Ipc: H01L 41/08 20060101ALI20220530BHEP

Ipc: H01L 41/337 20130101ALI20220530BHEP

Ipc: H01L 41/312 20130101ALI20220530BHEP

Ipc: H01L 41/187 20060101ALI20220530BHEP

Ipc: H01L 41/113 20060101ALI20220530BHEP

Ipc: H01L 41/09 20060101ALI20220530BHEP

Ipc: H03H 9/25 20060101AFI20220530BHEP

P01 Opt-out of the competence of the unified patent court (upc) registered

Effective date: 20230505