EP3836026B1 - Ic-etikett - Google Patents

Ic-etikett

Info

Publication number
EP3836026B1
EP3836026B1 EP19847933.9A EP19847933A EP3836026B1 EP 3836026 B1 EP3836026 B1 EP 3836026B1 EP 19847933 A EP19847933 A EP 19847933A EP 3836026 B1 EP3836026 B1 EP 3836026B1
Authority
EP
European Patent Office
Prior art keywords
chip
reinforcing member
antenna
tag
cover
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP19847933.9A
Other languages
English (en)
French (fr)
Other versions
EP3836026C0 (de
EP3836026A1 (de
EP3836026A4 (de
Inventor
Toshiharu Shimai
Hirofumi TSUJIMOTO
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitta Corp
Original Assignee
Nitta Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitta Corp filed Critical Nitta Corp
Publication of EP3836026A1 publication Critical patent/EP3836026A1/de
Publication of EP3836026A4 publication Critical patent/EP3836026A4/de
Application granted granted Critical
Publication of EP3836026B1 publication Critical patent/EP3836026B1/de
Publication of EP3836026C0 publication Critical patent/EP3836026C0/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/02—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support

Definitions

  • the present invention relates to an IC tag.
  • Patent Literature 1 discloses an IC tag in which an IC chip is protected by arranging a reinforcing member that is formed using a hard material such as a fiber-reinforced resin on the upper surface and the lower surface of an inlet.
  • EP2506192A2 discloses an RFID tag that includes a first sheet having flexibility and elasticity; an antenna having flexibility and elasticity and configured to be formed on a surface of the first sheet; an IC chip configured to be electrically connected to the antenna; a second sheet having flexibility and elasticity and configured to be attached to the first sheet and to cover the antenna and the IC chip with the first sheet; and a reinforcing member having flexibility and elasticity and configured to cover the IC chip and a connecting portion of the IC chip and the antenna.
  • EP2065841A1 discloses an electronic apparatus that includes a base sheet; a conductive pattern formed on the base sheet; a circuit chip mounted on the base sheet and connected to the conductive pattern; and plural protrusions arranged on at least one of a frontside and a backside of the base sheet to overlap at least a portion of the conductive pattern.
  • the plural protrusions protrude in a direction away from the base sheet.
  • EP2654000A1 discloses an RFID tag that includes a first flexible sheet covering a surface of a base part, an antenna and an IC chip; a second flexible sheet covering an another surface of the base part; a first reinforcing member including third and fourth sheets and covering the chip and a connecting portion of the chip and the antenna, the third sheet having flexibility and elasticity and being disposed on the first sheet, the fourth sheet having flexibility and being disposed on the third sheet; a second reinforcing member including fifth and sixth sheets and covering the chip and the connecting portion, the fifth sheet having flexibility and elasticity and being disposed on the second sheet, the sixth sheet having flexibility and being disposed on the fifth sheet; and an outer member having flexibility and elasticity and covering the first and the second sheets and the first and the second reinforcing members.
  • US2015/314542A1 discloses a product such as a tire that includes a radio frequency identification device (RFID) assembly located along an outer sidewall.
  • the RFID assembly has a thin, flexible, substantially planar, elongated non-conductive rubber, elastomer, or polymer substrate.
  • First and second thin, flexible, elongated, substantially planar first antenna portions formed at least in part of the same conductive rubber, elastomer, or polymer are provided on the substrate. Opposite first and second ends of the first antenna portion have different first and second widths.
  • a chip has opposite first and second ends in operative electrical connection with the first and second antenna portions, respectively, and is located between the outer sidewall and the substrate.
  • Patent Literature 1 Japanese Patent No. 5139239
  • the reinforcing member of the above-described IC tag is made of a hard material, the IC chip can be protected, but when the IC tag is bent, there is a risk that the reinforcing member will break due to the bending.
  • the present invention was made to solve the above-described problem, and aims to provide an IC tag that can protect an IC chip and prevent damage to the reinforcing member.
  • An IC tag according to the present invention is as specified in claim 1.
  • the length in the lengthwise direction of the reinforcing member can be made shorter than the length in the widthwise direction.
  • the above-described IC tag may be as specified in claim 3.
  • the reinforcing member can be made of elastomer.
  • the elastomer can contain glass fibers.
  • the IC tag according to the present invention it is possible to protect the IC chip and to prevent damage to the reinforcing member.
  • FIG. 1 is perspective view of the IC tag according to the present embodiment
  • FIG. 2 is a plan view of FIG. 1
  • FIG. 3 is a cross-sectional view taken along line A-A in FIG. 2
  • FIG. 4 is a cross-sectional view taken along line B-B in FIG. 2
  • FIG. 5 is a plan view of an inlet. As shown in FIGS.
  • the IC tag includes an inlet (tag main body) 10 including a sheet-shaped substrate 1 that is formed into a rectangular shape, an IC chip 2 and an antenna 3 that are arranged on the substrate 1, a sheet-shaped cover 4 that is formed into a rectangular shape and covers the IC chip 2 and the antenna 3. Also, the substrate 1 and the cover 4 are bonded to each other using by a pressure-sensitive adhesive 5. Furthermore, the IC tag includes a reinforcing member 6 that is attached to the inlet 10. Hereinafter, these members will be described in detail.
  • the substrate 1 and the cover 4 are formed in the same shape, and the pressure-sensitive adhesive 5 is disposed so as to completely fill the gap between the substrate 1 and the cover 4. That is, the pressure-sensitive adhesive 5 covers the IC chip 2 and the antenna 3 in such a manner that the IC chip 2 and the antenna 3 are not exposed from the gap between the substrate 1 and the cover 4.
  • the materials of the substrate 1 and the cover 4 there is no particular limitation on the materials of the substrate 1 and the cover 4, and, for example, the materials may be formed using polyethylene, polypropylene, polyethylene terephthalate, polyvinyl chloride, or the like.
  • the thicknesses of the substrate 1 and the cover 4 are, for example, preferably 25 to 200 ⁇ m and more preferably 25 to 100 ⁇ m.
  • the material constituting the substrate 1 and the cover 4 can be made of a transparent material or a colored material. In the present embodiment, a transparent material is used, and the IC chip 2 and the antenna 3 are visible via the substrate 1 or the cover 4.
  • first side 101 and a second side 102 sides of the substrate 1 and the cover 4 in the lengthwise direction are referred to as a first side 101 and a second side 102, and sides of the same in the widthwise direction are referred to as a third side 103 and a fourth side 104, for the sake of convenience of explanation. Accordingly, these sides are connected to each other in the order of the first side 101, the third side 103, the second side 102, and the fourth side 104.
  • the IC chip 2 is a known IC chip having a memory function and there is no particular limitation thereon.
  • the IC chip 2 is electrically connected to the antenna 3, which is made of a conductor such as aluminum or copper.
  • the antenna 3 can be constituted by, for example, a dipole antenna.
  • a dipole antenna as shown in FIG. 5 is used. That is, the antenna 3 includes an impedance matching portion 31 that is arranged near the center in the lengthwise direction of the substrate 1, and a pair of dipole portions 32 that extend in the lengthwise direction of the substrate 1 from the impedance matching portion 31.
  • the impedance matching portion 31 is formed into a rectangular frame shape having first to fourth sides. More specifically, a first side 311 of the impedance matching portion 31 is arranged along a first side 101 of the substrate 1, and a second side 312 is arranged at a position that is slightly spaced apart from a second side 102 of the substrate 1. That is, in the impedance matching portion 31, the first side 311, the third side 313, the second side 312, and the fourth side 314 are joined in the stated order. Also, the IC chip 2 is arranged near the center of the first side 311 of the impedance matching portion 31.
  • the dipole portions 32 have a left-right symmetrical shape, and therefore only one of them will be described.
  • the dipole portion 32 includes a first portion 321 that extends in the form of a straight line along the first side 101 of the substrate 1 from the first side 311 of the impedance matching portion 31, and a second portion 322 that is connected to the end portion of the first portion 321 and is formed into a rectangular wave shape.
  • This kind of antenna 3 can be formed on one surface of the substrate 1 through etching, screen printing, or the like, and thereafter the IC chip 2 can be attached on the antenna 3 through bonding or the like. Also, for example, the information stored in the IC chip 2 can be transmitted and received using UHF-band radio waves by the above-described antenna 3. Note that the IC chip 2 can also be fixed to the antenna 3 through, for example, known flip-chip mounting for an electronic part, or the like.
  • the pressure-sensitive adhesive 5 can be formed using, for example, a rubber-based pressure-sensitive adhesive in which the main component is natural rubber or synthetic rubber.
  • a rubber-based pressure-sensitive adhesive in which the main component is natural rubber or synthetic rubber.
  • the thickness of the pressure-sensitive adhesive 5 is preferably 25 to 500 ⁇ m, and more preferably 25 to 100 ⁇ m.
  • the synthetic rubber used as the rubber-based pressure-sensitive adhesive there is no particular limitation on the synthetic rubber used as the rubber-based pressure-sensitive adhesive, and specific examples thereof can include styrene-isoprene-styrene-block copolymer, styrene-butadiene-styrene-block copolymer, hydrogenated styrene-based copolymer, styrene-butadiene rubber (SBR), polyisoprene rubber (IR), polyisobutylene (PIB), and butyl rubber (IIR).
  • SBR styrene-isoprene-styrene-block copolymer
  • IR polyisoprene rubber
  • PIB polyisobutylene
  • IIR butyl rubber
  • the rubber-based pressure-sensitive adhesive 5 may further contain a tackifier, in addition to the above-described natural rubber or synthetic rubber.
  • a tackifier include terpene phenol resins, rosin resins, and petroleum resins.
  • the amount of resin to be used as the tackifier can be selected as appropriate within a range where the pressure-sensitive adhesion performance is not impaired.
  • the rubber-based pressure-sensitive adhesive may optionally contain additives such as a softener, a plasticizer, a filler, an anti-aging agent, and a coloring agent as necessary.
  • the pressure-sensitive adhesive 5 not only the rubber-based pressure-sensitive adhesive but also an acrylic pressure-sensitive adhesive or a silicone pressure-sensitive adhesive can be used.
  • the bonding agent can be made of a curable-type bonding agent whose main component is an acrylic thermosetting resin, an ester-based thermosetting resin, an epoxy-based thermosetting resin, or a poly-imide-based thermosetting resin.
  • an epoxy-based thermosetting resin is to be used as the main component, it is possible to use a novolak-type epoxy resin, a bisphenol-type epoxy resin, a biphenyl-type epoxy resin, an alicyclic epoxy resin, a cyclopentadiene-type epoxy resin, or the like.
  • Various materials can be used also if another acrylic thermosetting resin, ester-based thermosetting resin, or polyimide-based thermosetting resin is used as the main component.
  • the reinforcing member 6 is arranged near the center in the lengthwise direction of the inlet 10 and is formed into a rectangular shape in a plan view so as to cover the IC chip 2. To give a more detailed description, the reinforcing member 6 is arranged so as to surround the inlet 10 over the entire periphery in the widthwise direction. That is, as shown in FIG. 4 , the reinforcing member 6 includes a lower surface portion that covers the substrate 1, an upper surface portion that covers the cover 4, and a pair of side surface portions that join the lower surface portion and the upper surface portion in the thickness direction of the inlet 10, and these portions are formed in one piece.
  • slits that extend in the lengthwise direction are formed in each of the upper surface portion and the lower surface portion. That is, a first slit 61 that extends along the first side 101 of the cover 4, a second slit 62 that is formed near the center in the widthwise direction of the cover 4, and a third slit 63 that extends along the second side 102 of the cover 4 are formed in the upper surface portion. Three slits 61 to 63 are similarly formed also in the lower surface portion.
  • the above-described IC chip 2 is arranged between the first slit 61 and the second slit 62 in the widthwise direction.
  • the reinforcing member 6 is a material with a Shore D hardness that is lower than that of the substrate 1 or a material with the same Shore D hardness as the substrate 1, but for example, the reinforcing member 6 can be formed using an elastic body such as a thermoplastic elastomer or rubber. Specifically, an ester-based elastomer, a styrene-based elastomer, a butadiene-based elastomer, an olefin-based elastomer, a urethane-based elastomer, or the like can be used as the thermoplastic rubber.
  • this kind of reinforcing member 6 preferably has a suitable degree of flexibility, and for example, it is preferable to use a material with a Shore D hardness of less than 80, and more preferable to use a material with a Shore D hardness of 75 or less.
  • the substrate 1 is preferably made of a material with a Shore D hardness of, for example, 80 or more.
  • the cover 4 can also be formed similarly. Note that this is one specific example of the Shore D hardness, and there is no limitation thereto, and the Shore D hardness of the reinforcing member 6 need only be at least the Shore D hardness of the substrate 1 or less. Also, although the Shore D hardness of the cover 4 may also be made the same as that of the substrate 1, it need not necessarily be the same.
  • glass fibers in the material constituting the reinforcing member 6 in order to improve the heat resistance.
  • a material obtained by including glass fibers in an ester-type elastomer can be used as the reinforcing member 6.
  • the inlet 10 can be accommodated in a mold and the reinforcing member 6 can be molded on the inlet 10 through injection molding.
  • the IC tag constituted as described above can obtain the following effects.
  • antennas can be used as the antenna 3, and it is also possible to use a patch antenna instead of the above-described dipole antenna. That is, there is no particular limitation on the shape and the like of the antenna 3, and various modes are possible. Also, there is no particular limitation on the shape of the IC tag, that is, the shapes of the substrate 1 and the cover 4, and an outer shape that is not a rectangular shape is also possible as long as the outer shape extends in the lengthwise direction and the widthwise direction orthogonal to the lengthwise direction. Also, the substrate 1 and the cover 4 need not have the same shape.
  • the shape in a plan view may also be, for example, a shape that is longer in the lengthwise direction and shorter in the widthwise direction, as shown in FIG. 9 .
  • the shape in a plan view may also be, for example, a shape that is longer in the lengthwise direction and shorter in the widthwise direction, as shown in FIG. 9 .
  • there is no limitation to this and it is also possible to use a circular shape, an elliptical shape, a polygonal shape, or the like instead of the rectangular shape in a plan view.
  • the slits there is no particular limitation on the number and positions of the slits, and two or more slits need only be provided with the IC chip 2 interposed therebetween.
  • the slits can also be provided in only the upper surface or only the lower surface of the inlet 10.
  • the pair of slits 60 are preferably arranged side by side in the lengthwise direction with the IC chip 2 interposed therebetween. That is, the slits are preferably arranged side by side in a direction in which bending is likely to occur.
  • one or more slits 60 can be formed so as to extend in a direction in which bending is likely to occur, and thus bending can be suppressed.
  • the slits may also penetrate through the reinforcing member 6 as slits, or may be grooves.
  • the reinforcing member 6 is arranged near the center in the lengthwise direction of the inlet 10 so as to mainly cover the IC chip 2, but the reinforcing member 6 may also be formed so as to cover a greater number of portions of the inlet 10 as well.
  • the reinforcing member 6 can also be formed so as to cover the entirety of the inlet 10.
  • the reinforcing member 6 is elongated in the lengthwise direction from the state shown in FIGS. 1 and 2 and covers the entirety of the inlet 10. That is, in this example, the reinforcing member 6 is constituted by a central portion 60 shown in FIGS.
  • a slit 601 that extends in the widthwise direction is formed at each predetermined interval in the lengthwise direction in the elongated portion 600. These slits 601 can be formed in both surfaces of the inlet 10. By forming the slits 601 that extend in the widthwise direction in this manner, it is possible to flexibly bend the inlet 10 while protecting the IC chip 2 and the antenna 3 with respect to the bending shown in FIG.
  • the elongated portion 600 is more likely to bend at the locations at which the slits 601 are formed, and therefore, in particular, it is possible to suppress a case in which the force of bending reaches the central portion 60 at which the IC chip 2 is arranged. Accordingly, it is possible to prevent the IC chip 2 and the antenna 3 in the surrounding area of the IC chip 2 from breaking.
  • this mode of the elongated portion 600 of the reinforcing member 6 is one example, and for example, the number and orientations of the slits 601 can be changed as appropriate. Also, the elongated portion 600 need not cover the entirety of the inlet 10, and the elongated portion 60 can also be arranged only on a portion in the lengthwise direction.
  • the pressure-sensitive adhesive 5 is applied over the entire surface between the substrate 1 and the cover 4, but the configuration of the inlet 10 is not limited thereto.
  • the pressure-sensitive adhesive can also be applied to only the peripheral edge of the substrate 1 and the cover 4, and the IC chip 2 and the antenna 3 can be surrounded by the pressure-sensitive adhesive 5.

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Details Of Aerials (AREA)
  • Credit Cards Or The Like (AREA)

Claims (5)

  1. IC-Etikett, die Folgendes umfasst:
    einen plattenförmigen Etikett-Hauptkörper (10) mit einer Außenform, die sich in einer Längsrichtung und einer zur Längsrichtung orthogonalen Breitenrichtung erstreckt; und
    ein Verstärkungselement (6), das entlang der Breitenrichtung angeordnet ist, um eine obere Fläche, eine untere Fläche und seitliche Flächen des Etikett-Hauptkörpers (10) zu bedecken,
    wobei der Etikett-Hauptkörper (10) Folgendes umfasst:
    einen IC-Chip (2);
    eine Antenne (3), die dazu ausgelegt ist, auf dem IC-Chip (2) gespeicherte Informationen elektrisch zu senden und zu empfangen; und
    ein plattenförmiges Substrat (1), das den IC-Chip (2) und die Antenne (3) trägt,
    eine plattenförmige Abdeckung (4), die den IC-Chip (2) und die Antenne (3) bedeckt, wobei der IC-Chip und die Antenne (3) zwischen der Abdeckung (4) und dem Substrat (1) angeordnet sind; und
    ein druckempfindliches Klebemittel (5) oder Haftmittel, welches die Abdeckung (4) und das Substrat (1) haftschlüssig verbindet,
    wobei das Verstärkungselement (6) aus einem Material besteht, das eine Shore-D-Härte aufweist, welche kleiner oder gleich einer Shore-D-Härte des Substrats (1) ist, und derart angeordnet ist, dass es zumindest den IC-Chip (2) bedeckt,
    zumindest zwei Schlitze (61-63) oder Vertiefungen in dem Verstärkungselement (6) ausgebildet sind, und
    der IC-Chip (2) zwischen zwei aus den zumindest zwei Schlitzen (61-63) oder Vertiefungen angeordnet ist.
  2. IC-Etikett nach Anspruch 1, wobei die Länge in der Längsrichtung des Verstärkungselements (6) kürzer ist als die Länge in der Breitenrichtung.
  3. IC-Etikett nach Anspruch 1 oder 2, wobei die zumindest zwei Schlitze (61-63) oder Vertiefungen sich in der Längsrichtung erstrecken.
  4. IC-Etikett nach Anspruch 1 bis 3, wobei das Verstärkungselement (6) aus Elastomer besteht.
  5. IC-Etikett nach Anspruch 4, wobei das Elastomer Glasfasern enthält.
EP19847933.9A 2018-08-10 2019-08-08 Ic-etikett Active EP3836026B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018151346 2018-08-10
PCT/JP2019/031537 WO2020032220A1 (ja) 2018-08-10 2019-08-08 Ｉｃタグ

Publications (4)

Publication Number Publication Date
EP3836026A1 EP3836026A1 (de) 2021-06-16
EP3836026A4 EP3836026A4 (de) 2022-05-11
EP3836026B1 true EP3836026B1 (de) 2026-01-28
EP3836026C0 EP3836026C0 (de) 2026-01-28

Family

ID=69415598

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19847933.9A Active EP3836026B1 (de) 2018-08-10 2019-08-08 Ic-etikett

Country Status (6)

Country Link
US (1) US11436464B2 (de)
EP (1) EP3836026B1 (de)
JP (1) JP7550053B2 (de)
KR (1) KR102757130B1 (de)
CN (1) CN112449702B (de)
WO (1) WO2020032220A1 (de)

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Publication number Priority date Publication date Assignee Title
JP1662552S (de) * 2019-09-06 2020-06-29
USD949834S1 (en) * 2019-09-06 2022-04-26 Murata Manufacturing Co., Ltd. RFID tag
USD973039S1 (en) * 2019-09-06 2022-12-20 Murata Manufacturing Co., Ltd. RFID tag
US12355164B2 (en) 2020-11-18 2025-07-08 Mitsubishi Electric Corporation Antenna structure

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JP5145881B2 (ja) * 2007-11-07 2013-02-20 富士通株式会社 Ｒｆｉｄタグ
JP5145896B2 (ja) * 2007-11-21 2013-02-20 富士通株式会社 電子装置および電子装置製造方法
JP5261325B2 (ja) * 2008-10-09 2013-08-14 日本碍子株式会社 電気的接続体
JP5139239B2 (ja) 2008-11-17 2013-02-06 富士通株式会社 Ｒｆｉｄタグ
JP5718123B2 (ja) 2011-03-30 2015-05-13 富士通株式会社 Ｒｆｉｄタグ
JP5897386B2 (ja) 2012-04-18 2016-03-30 富士通株式会社 Ｒｆｉｄタグ
JP5895681B2 (ja) * 2012-04-18 2016-03-30 Nok株式会社 Ｉｃタグ
CA2921327C (en) * 2012-11-13 2021-06-08 Cooper Tire & Rubber Company Product such as a tire with rfid tag with rubber, elastomer, or polymer antenna
KR20170113599A (ko) * 2015-02-20 2017-10-12 사빅 글로벌 테크놀러지스 비.브이. 개선된 충격 성능을 갖는 보강된 폴리카보네이트 조성물
JP7025095B2 (ja) 2016-06-02 2022-02-24 富士通株式会社 Ｒｆｉｄタグ
EP3470442A1 (de) * 2017-10-11 2019-04-17 Borealis AG Dichtmaterial mit terpolymeren

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CN112449702B (zh) 2024-12-17
WO2020032220A1 (ja) 2020-02-13
JP7550053B2 (ja) 2024-09-12
KR102757130B1 (ko) 2025-01-21
CN112449702A (zh) 2021-03-05
US11436464B2 (en) 2022-09-06
US20210342665A1 (en) 2021-11-04
KR20210042316A (ko) 2021-04-19
EP3836026C0 (de) 2026-01-28
EP3836026A1 (de) 2021-06-16
EP3836026A4 (de) 2022-05-11

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