Classifications

• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B3/00—Simple or compound lenses
  • G02B3/0006—Arrays
  • G02B3/0012—Arrays characterised by the manufacturing method
• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B3/00—Simple or compound lenses
  • G02B3/0006—Arrays
  • G02B3/0037—Arrays characterized by the distribution or form of lenses
  • G02B3/0056—Arrays characterized by the distribution or form of lenses arranged along two different directions in a plane, e.g. honeycomb arrangement of lenses
• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
  • G02B27/30—Collimators
• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B5/00—Optical elements other than lenses
  • G02B5/003—Light absorbing elements
• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B5/00—Optical elements other than lenses
  • G02B5/005—Diaphragms
• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B5/00—Optical elements other than lenses
  • G02B5/20—Filters
  • G02B5/201—Filters in the form of arrays
• • G—PHYSICS
  • G06—COMPUTING; CALCULATING OR COUNTING
  • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
  • G06V10/00—Arrangements for image or video recognition or understanding
  • G06V10/10—Image acquisition
  • G06V10/12—Details of acquisition arrangements; Constructional details thereof
  • G06V10/14—Optical characteristics of the device performing the acquisition or on the illumination arrangements
  • G06V10/143—Sensing or illuminating at different wavelengths
• • G—PHYSICS
  • G06—COMPUTING; CALCULATING OR COUNTING
  • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
  • G06V10/00—Arrangements for image or video recognition or understanding
  • G06V10/10—Image acquisition
  • G06V10/12—Details of acquisition arrangements; Constructional details thereof
  • G06V10/14—Optical characteristics of the device performing the acquisition or on the illumination arrangements
  • G06V10/147—Details of sensors, e.g. sensor lenses
• • G—PHYSICS
  • G06—COMPUTING; CALCULATING OR COUNTING
  • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
  • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
  • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
  • G06V40/12—Fingerprints or palmprints
  • G06V40/13—Sensors therefor
  • G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
  • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
  • H01L27/144—Devices controlled by radiation
  • H01L27/146—Imager structures
  • H01L27/14601—Structural or functional details thereof
  • H01L27/1462—Coatings
  • H01L27/14623—Optical shielding
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
  • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
  • H01L27/144—Devices controlled by radiation
  • H01L27/146—Imager structures
  • H01L27/14601—Structural or functional details thereof
  • H01L27/14625—Optical elements or arrangements associated with the device
  • H01L27/14627—Microlenses
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
  • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
  • H01L27/144—Devices controlled by radiation
  • H01L27/146—Imager structures
  • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
  • H01L27/14685—Process for coatings or optical elements
• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
  • G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
  • G02B1/14—Protective coatings, e.g. hard coatings
• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B2207/00—Coding scheme for general features or characteristics of optical elements and systems of subclass G02B, but not including elements and systems which would be classified in G02B6/00 and subgroups
  • G02B2207/123—Optical louvre elements, e.g. for directional light blocking
• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B5/00—Optical elements other than lenses
  • G02B5/20—Filters
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
  • H10K39/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic radiation-sensitive element covered by group H10K30/00
  • H10K39/30—Devices controlled by radiation
  • H10K39/32—Organic image sensors

Definitions

• the present description relates generally to optical systems and their manufacturing methods.
• An optical system is a set of optical elements, such as mirrors, lenses, diffraction gratings, etc. allowing to modify the trajectory of light rays or the properties of light.
• An example of application of an optical system relates to an image acquisition system in which the optical system is interposed between the sensitive part of an image sensor and the object to be imaged, and makes it possible to form an image. sharp of the object to be imaged on the sensitive part of the image sensor.
• Another application example corresponds to the coupling of the optical system to a single photodetector, such as a photodiode, in order to control the light collected by the photodetector.
• Another example of application relates to a display or projection system in which the optical system covers a light source, for example a display screen, and makes it possible to modify the radiation emitted by the light source, for example angularly filter the radiation from each display pixel
• a conventional optical system it is not possible to use a conventional optical system.
• a conventional optical system between the sensitive part of the image sensor and the object to be imaged. This is particularly the case when the image sensor occupies a large surface, greater than the square centimeter, and the distance between the object to be imaged and the sensitive part of the image sensor is less than the centimeter.
• Another object of an embodiment is that the method of manufacturing the optical system can be implemented on an industrial scale.
• an embodiment provides an optical system comprising a layer comprising a first face intended to receive radiation and a second face opposite to the first face, said layer being opaque to said radiation and comprising through holes or partially through open on the first face, the optical system comprising a matrix of optical elements of micrometric size covering said layer, each optical element being configured to behave like a converging lens with focal length between 1 ym and 100 ym, the distance between the surface equidistant from the first and second faces and the focal points of the optical elements being less than twice the thickness of said layer.
• the optical system is configured to block the rays of said radiation whose incidence relative to a direction orthogonal to the first face is in at least a first range of incidences and to allow rays to pass of said first radiation whose incidence relative to a direction orthogonal to the first face is in at least a second range of incidences distinct from said at least one first range of incidences.
• the matrix of optical elements of micrometric size comprises a matrix of lenses of micrometric size, a matrix of Fresnel lenses of micrometric size, a network of microlenses with gradient index of micrometric size, or a matrix of diffraction gratings of micrometric size.
• the matrix of optical elements of micrometric size comprises a matrix of lenses of micrometric size.
• the focal planes of the micrometric size lenses are combined.
• the micrometric size lenses are circular or hexagonal in base and arranged in hexagonal tiling.
• the micrometric size lenses are square based and arranged in a square tiling.
• the matrix of optical elements of micrometric size comprises a matrix of aspherical lenses of micrometric size.
• each aspherical lens comprises a central portion surrounded by a peripheral portion having a radius of curvature greater than the radius of curvature of the central portion.
• each lens has a conical constant equal to -1 and a radius of curvature in the center between 1/3 and 2/3 of the pitch of the lenses.
• the lenses are spherical lenses and the radius of curvature of the lenses is greater than half the pitch of the lenses and less than the pitch of the lenses.
• the system comprises as many optical elements of micrometric size as holes, the pitch between the optical elements of micrometric size being the same as the pitch between the holes.
• the ratio between the height of the hole, measured perpendicular to the first face, and the width of the hole, measured parallel to the first face varies from 0.1 to 10.
• the holes are arranged like the optical elements, the pitch between adjacent holes of the same row or of the same column varying from 1 ⁇ m to 500 ⁇ m.
• the height of each hole measured in a direction orthogonal to the first face, varies from 0.1 ⁇ m to 1 mm.
• the width of each hole, measured parallel to the first face varies from 0.1 ⁇ m to 100 ⁇ m.
• the optical system comprises a stack of said layer comprising said through or partially through holes and an additional layer comprising additional holes through or partially through aligned with said holes.
• the optical system further comprises a coating covering the matrix of optical elements of micrometric size, the matrix of optical elements of micrometric size being interposed between the coating and said layer, the index of coating refraction being different from the refractive index of air.
• the refractive index of the coating is lower than the refractive index of the matrix of optical elements of micrometric size.
• the coating is in contact with all of each optical element.
• the coating is in contact with each optical element only at the top of said optical element, and delimits an air gap with the rest of said optical element.
• the optical system comprises a support between the matrix of optical elements of micrometric size and said layer.
• the refractive index of the support is greater than the refractive index of said layer.
• the refractive index of the support is greater than the refractive index of the matrix of optical elements of micrometric size.
• the holes are filled with a solid, liquid or gaseous material with a refractive index lower than the refractive index of the support.
• the tangent arc of the ratio between half the pitch of the optical elements of micrometric size and the thickness of the support is greater than the sine arc of the ratio between the refractive index of the filling material the holes and the refractive index of the support.
• the holes are frustoconical.
• the focal points of the optical elements are located in the second face to within 1 ⁇ m.
• the dimensions of the hole on the first face are equal, or greater, by at most 10%, to the dimensions of the radiation on the first face focused by the optical element in screw - opposite the hole.
• the dimensions of the hole on the second face are equal, or greater, by at most 10%, to the dimensions on the second face of the radiation focused by the optical element in screw opposite the hole.
• An embodiment also provides an image acquisition system comprising an image sensor and an optical system as defined above covering the image sensor and forming an angular filter.
• the image sensor comprises a matrix of photodetectors and the pitch of the optical elements is less than half the pitch of the photodetectors.
• An embodiment also provides a lighting or display or illumination system comprising a light source and an optical system as defined above covering the light source.
• the light source comprises a radiation emission zone located, to the nearest 0.1 ⁇ m, in a plane containing the focal points of the optical elements and, for each hole, the ratio between the height of the hole, measured perpendicular to the first face, and the width of the hole, measured parallel to the first face, is greater than 5, from which it follows that the optical system plays the role of a device for collimating radiation .
• Figure 1 is a sectional view, partial and schematic, of an embodiment of an optical system comprising a layer with apertures and an array of microlenses;
• Figure 2 is a top view of the apertured layer of the optical system shown in Figure 1
• FIG. 3 shows a variant of the optical system of Figure 1 in the case where the microlenses are embedded in a medium with a refractive index greater than 1;
• Figure 4 shows another variant of the optical system of Figure 1
• Figure 5 shows another variant of the optical system of Figure 1
• Figure 6 shows another variant of the optical system of Figure 1
• Figure 7 shows another variant of the optical system of Figure 1
• Figure 8 shows another variant of the optical system of Figure 1
• Figure 9 shows another variant of the optical system of Figure 1
• Figure 10 shows another variant of the optical system of Figure 1
• Figure 11 shows another variant of the optical system of Figure 1
• Figure 12 shows an evolution curve of the transmittance of a layer with openings
• FIG. 13 illustrates the optical properties of angular filters having holes of different shapes
• Figure 14 illustrates other optical properties of the optical system of Figure 1;
• Figure 15 is a sectional view, partial and schematic, of an embodiment of an optical system comprising a layer with apertures and an array of microlenses used for simulations;
• FIG. 16 represents a curve of evolution of the normalized angular transmittance obtained with first dimensions and optical parameters for the optical system of FIG. 15;
• FIG. 17 represents a curve of evolution of the standardized transmittance obtained with second dimensions and optical parameters for the optical system of FIG. 15;
• Figure 18 shows an embodiment of an arrangement of microlenses
• FIG. 19 shows another embodiment of an arrangement of microlenses
• FIG. 20 shows another embodiment of an arrangement of microlenses
• Figure 21 includes, in the left part, a sectional view of the optical system of Figure 1 at a spherical microlens and an opening of the layer with openings and includes, in the right part, a view of above the focusing spot obtained with the microlens shown in the left part;
• Figure 22 is a figure similar to Figure 21 for an aspherical lens
• Figure 23 shows an embodiment of an image acquisition system
• Figure 24 shows an embodiment of a lighting or projection system
• FIG. 25 illustrates a step of an embodiment of a method for manufacturing the optical system shown in FIG. 3;
• Figure 26 illustrates another step in the process
• Figure 27 illustrates another step in the process
• Figure 28 illustrates another step in the process
• FIG. 29 illustrates another step of the method
• FIG. 30 illustrates parameters for obtaining a first form of hole
• FIG. 31 illustrates parameters for obtaining a second form of hole
• FIG. 32 illustrates a step in another embodiment of a method for manufacturing the optical system shown in FIG. 3;
• FIG. 33 illustrates another step of the method.
• the expressions “approximately”, “approximately”, “substantially”, and “of the order of” mean to within 10%, preferably to within 5%.
• the transmittance corresponds to the ratio between the intensity of the radiation leaving the optical system 5 and the intensity of the radiation entering the optical filter.
• a layer or film is said to be opaque to radiation when the transmittance of the radiation through the layer or film is less than 10%.
• a layer or film is said to be transparent to radiation when the transmittance of the radiation through the layer or film is greater than 10%.
• all the elements of the optical system which are opaque to radiation have a transmittance which is less than half, preferably less than one fifth, more preferably less than one tenth, of the weakest transmittance of the elements of the system optics transparent to said radiation.
• an "optical element of micrometric size” is an optical element formed on one face of a support whose maximum dimension, measured parallel to said face, is greater than 1 ⁇ m and less than 1 mm.
• a film or layer is said to be oxygen-tight when the film or oxygen permeability at 40 ° C is less than 1.10 _1 cm 3 / (m 2 * day) .
• Oxygen permeability can be measured using ASTM D3985 titled "Standard Test Method for Oxygen Gas Transmission Rate Through Plastic Film and Sheeting Using a Coulometric Sensor".
• a film or layer is said to be waterproof when the permeability of the film or the layer at water at 40 ° C. is less than 1.10 1q / (m 2 * day).
• Water permeability can be measured using ASTM F1249 titled "Standard Test Method for Water Vapor Transmission Rate Through Plastic Film and Sheeting Using a Modulated Infrared Sensor".
• the refractive index of a solid, liquid, or gaseous material corresponds to the refractive index of the material for the range of wavelengths of the useful radiation. Unless otherwise indicated, the refractive index is considered to be substantially constant over the wavelength range of the useful radiation, for example equal to the mean of the refractive index over the wavelength range of the useful radiation.
• one possibility consists in covering the sensor of images of an optical system of simple structure playing the role of an angular filter, comprising an opaque layer crossed by openings, and covered with a matrix of optical elements of micrometric size, for example a matrix of lenses micrometric size, or microlens, an array of microlenses with a gradient index of micrometric size, or a matrix of diffraction gratings of micrometric size or nanometric size, each optical element of micrometric or nanometric size being associated with an opening of the layer with openings.
• a matrix of optical elements of micrometric size for example a matrix of lenses micrometric size, or microlens, an array of microlenses with a gradient index of micrometric size, or a matrix of diffraction gratings of micrometric size or nanometric size, each optical element of micrometric or nanometric size being associated with an opening of the layer with openings.
• each optical element of micrometric size corresponds to a lens of micrometric size, or microlens.
• each optical element of micrometric size can correspond to a Fresnel lens of micrometric size, to a lens with micrometric size index gradient or micrometric size diffraction grating.
• Figure 1 is a sectional view, partial and schematic, of an embodiment of an optical system 5.
• the optical system 5, comprises, from bottom to top in Figure
• a matrix of optical elements 14 of micrometric size for example a matrix of microlenses 14 covering the intermediate layer 12, the intermediate layer 12 then being able to play the role of support for the matrix of microlenses 14, the intermediate layer 12 and the matrix of microlenses 14 which can correspond to a monolithic structure.
• FIG. 1 shows by way of example two rays R and R ′ passing through the optical system 5.
• the initial incidence of the radius R is called the angle between the radius R before having passed through the microlens 14, and a direction D perpendicular to the face 11, and the final angle of the ray R is called the angle between the ray R after having passed through the microlens 14, and a direction D perpendicular to the face 11.
• Figure 2 is a top view of the layer with openings 10 shown in Figure 1.
• the layer of openings 10 comprises an opaque layer 16 through which holes 18, also called openings.
• the holes 18 are traversing insofar as they extend over the entire thickness of the layer 16.
• the holes 18 may extend only over part of the thickness of the opaque layer 16, a residual portion of the opaque layer 16 remaining at the bottom of the holes 18.
• the thickness of the residual portion of the opaque layer 16 at the bottom of the hole 18 is sufficiently small so that the assembly comprising the hole 18, possibly filled, and the residual portion of the opaque layer 16 at the bottom of the hole 18 can be considered transparent to useful radiation.
• the distribution of the holes 18 follows the distribution of the microlenses 14.
• FIG. 2 corresponds to the case where the microlenses are distributed according to a square mesh.
• the thickness of the layer 16 is called "h", which also corresponds to the height of the holes 18.
• the layer 16 is opaque to all or part of the spectrum of the incident radiation.
• the layer 16 can be opaque to the useful radiation used in operation, for example absorbing and / or reflecting with respect to the useful radiation.
• the layer 16 is absorbent in the visible or part of the visible and / or the near infrared and / or the infrared.
• the refractive index of the material making up the matrix of optical elements 14 is denoted ni.
• the refractive index of the material making up the intermediate layer 12 is denoted n2.
• the material making up layer 16 is denoted n3.
• the refractive index of the filling material for the holes 18 is denoted n4.
• the holes 18 are shown with a circular cross section.
• the cross section of the holes 18 in the top view can be any, for example annular, circular, oval or polygonal, in particular triangular, square or rectangular depending on the manufacturing method used.
• the holes 18 are shown with a constant cross section over the entire thickness of the opaque layer 16.
• the cross section of each hole 18 can vary over the thickness of the opaque layer 16
• the shape of the holes can be adjusted by process parameters such as exposure dose, development time, divergence of the photolithography exposure source as well as the shape of the microlenses.
• the holes 18 are arranged in rows and columns.
• the holes 18 can have substantially the same dimensions.
• the width of a hole 18, measured in the direction of the rows or columns, is called “w".
• the width w corresponds to the diameter of the hole 18 in the case of a hole of circular cross section.
• the holes 18 are arranged regularly in the rows and in the columns.
• the repetition step of the holes 18 is called "p", that is to say the distance in top view of the centers of two successive holes 18 of a row or of a column.
• the arrangement of the holes reproduces the arrangement of the microlenses 14.
• the layer with openings 10 only lets through the rays of the incident useful radiation whose final incidence relative to the upper face 11 of the layer with openings 10 is less than a maximum maximum final angle of incidence, which is defined by the following relation (1) in the case where the material making up the layer 16 is perfectly absorbent and in the case where the width w of the hole 18 at the inlet of the hole is identical to the width w of the hole 18 at the outlet of the hole:
• the angular opening "a" of the layer with openings 10 is equal to twice the maximum maximum final incidence.
• This angular opening a corresponds to the case of a perfectly absorbent material.
• the angular opening a can be greater than the value obtained from equation (1).
• the h / w ratio can vary from 1 to 10, or even be greater than 10.
• the pitch p can vary from 1 ym to 500 ym, preferably from 1 ym to 100 ym, more preferably from 10 ym to 50 ym , for example equal to about 15 ym.
• the height h can vary from 0.1 ⁇ m to 1 mm, preferably from 1 y to 130 ⁇ m, more preferably from 10 ⁇ m to 130 ⁇ m or from 1 ⁇ m to 20 ⁇ m.
• the width w can vary from 0.1 ⁇ m to 100 ⁇ m, preferably from 1 ⁇ m to 10 ⁇ m, for example equal to approximately 2 ⁇ m.
• the holes 18 can all have the same width w. As a variant, the holes 18 can have different widths w.
• the microlenses 14 are converging lenses each having a focal distance f of between 1 ⁇ m and 100 ⁇ m, preferably between 5 ⁇ m and 50 ⁇ m. According to one embodiment, all the microlenses 14 are substantially identical. According to one embodiment, the maximum thickness of the microlenses 14 is between 1 ⁇ m and 20 ⁇ m.
• microlenses 14 and holes 18 make it possible to optimize two important parameters. More precisely, this makes it possible to increase the transmittance at normal incidence while reducing the viewing angle. Without the microlenses 14, optimizing these two parameters requires very low width-to-height ratio openings and a large filling factor, which is very difficult to achieve in practice.
• the addition of microlenses 14 on the holes 18 makes it possible to relax the constraint on the shape factor of the openings and the filling factor.
• Figure 3 is a sectional view of a variant of the optical system 5 shown in Figure 1 wherein the optical system 5 further comprises a coating 20 covering the matrix of microlenses 14.
• the coating 20 comprises for example a stack of several layers, for example two layers 22 and 24, and comprising a face upper 26, the coating 20 possibly not being present, the upper face 26 then corresponding to the upper face of the matrix of microlenses 14.
• the refractive index of the layer 22 is lower than the refractive index or of the matrix of microlenses 14.
• the coating 20 may comprise only the layer 22.
• the role of the layer 22 is to protect the microlenses 14 and / or to form a substantially planar face to simplify assembly with an upper layer not represented.
• the layer 22 preferably has a refractive index lower than that of the microlenses 14 in order to maintain the focusing effect of the microlenses 14.
• the refractive index of the layer 22 is between 1.2 and 1 , 5 and the refractive index of the microlenses 14 is between 1.4 and 1.6.
• FIG. 4 is a sectional view of a variant of the optical system 5 represented in FIG. 3 in which the coating 20 comprises only the layer 24 which corresponds to a film applied against the matrix of microlenses 14.
• the contact zone between the layer 24 and the microlenses 14 can be reduced, for example limited to the tops of the microlenses 14.
• the layer 24 can serve to protect the microlenses 14 and / or form a substantially flat face to simplify assembly with a upper layer not shown.
• the layer 24 can also be an adhesive layer for joining the optical system 5 to an upper layer.
• Figure 5 is a sectional view of another variant of the optical system 5 shown in Figure 1 wherein the apertured layer 10 comprises an additional opaque layer 28 covering the opaque layer 16, on the side of the opaque layer 16 opposite the microlenses 14, and crossed by holes 30 situated in the extension of the holes 18.
• FIG. 6 is a sectional view of a variant of the optical system 5 shown in FIG. 5 in which the layer with openings 10 comprises an intermediate layer 32, transparent to useful radiation, interposed between the opaque layers 16 and 28.
• the layer with openings 10 may comprise a stack of more than two opaque layers, each opaque layer being traversed by holes, the opaque layers of each pair of adjacent opaque layers being spaced or not by one or more transparent layers.
• Figure 7 is a sectional view, partial and schematic, of a variant of the optical system 5 of the embodiment shown in Figure 1 in which the cross section of the holes 18 is not constant.
• the cross section of each hole 18 decreases as one moves away from the microlenses 14.
• the holes 18 have a substantially frustoconical shape.
• the diameter of the holes 18 on the side of the face 11 is between 2 ⁇ m and 10 ⁇ m and the diameter of the holes 18 on the side of the face 13 is between 1 ⁇ m and 5 ⁇ m.
• Figure 8 is a sectional view, partial and schematic, of a variant of the optical system 5 of the embodiment shown in Figure 1 wherein the layer of openings 10 comprises a base layer 34 of a first material at less partially transparent to useful radiation and covered with a coating 36 opaque to useful radiation, for example absorbent and / or reflective with respect to useful radiation.
• the first material can be a resin.
• the second material can be a metal, for example aluminum (Al) or chromium (Cr), a metal alloy or an organic material. This material can cover the walls holes as shown in FIG. 8, or not depending on the characteristics of the layer 16.
• FIG. 9 is a sectional view, partial and schematic, of another variant of the optical system 5 of the embodiment shown in Figure 1 in which a reflective layer 38 relative to the useful radiation covers the face of the layer with openings 10 opposite to the microlenses 14.
• the holes 18 have a shape adapted to the microlenses 14, for example substantially cylindrical.
• the reflective layer 38 can be a metallic layer, for example a layer of aluminum (Al) or of chromium (Cr).
• FIG. 10 is a figure similar to FIG. 9 for holes 18 of frustoconical shape, the large diameter of each hole 18 being oriented towards the side of the microlenses 14.
• Figure 11 is a sectional view, partial and schematic, of a variant of the optical system 5 of the embodiment shown in Figure 9 in which the reflective layer 38 covers the face of the layer of apertures 10 opposite to the microlenses 14 and possibly the internal side walls of the holes 18.
• inventions illustrated in Figures 9, 10 and 11 advantageously allow to increase the obstruction, either by reflection or by absorption, of the angular filter 5 relative to the oblique light rays.
• the layer 16 is made of a positive photosensitive resin, that is to say a photosensitive resin for which the part of the layer of resin exposed to radiation becomes soluble in a developer and where the part of the photosensitive resin layer which is not exposed to radiation remains insoluble in the developer.
• the opaque layer 16 can be colored resin, for example a colored or black DNQ-Novolaque resin or a DUV photosensitive resin (English acronym for Deep Ultraviolet).
• DNQ-Novolaque resins are based on a mixture of diazonaphthoquinone (DNQ) and a novolak resin (phenolformaldehyde resin).
• DUV resins can include polymers based on polyhydroxystyrenes.
• the layer 16 is made of a negative photosensitive resin, that is to say a photosensitive resin for which the part of the resin layer exposed to radiation becomes insoluble in a developer and where the part of the photosensitive resin layer which is not exposed to radiation remains soluble in the developer.
• a negative photosensitive resin examples include epoxy-based polymer resins, for example the resin marketed under the name SU-8, acrylate resins and thiol-ene polymers excluding stoichiometry (OSTE, acronym for Off-Stoichiometry thiol). -enes polymer).
• the layer 16 is made of a material which can be machined by laser, that is to say a material capable of degrading under the action of laser radiation.
• materials that can be machined by laser are graphite, a thin metal film (typically from 50 nm to 100 nm), plastic materials such as poly (methyl methacrylate) (PMMA, acronym for poly (methyl methacrylate).
• PET polyethylene terephthalate acronym
• PEN polyethylene naphthalate acronym
• COP cyclic olefin polymers
• PI polyimides
• the layer 16 may be made of a black absorbent resin in the visible range and / or the near infrared.
• the layer 16 can also be made of a colored resin absorbing visible light of a given color, for example blue, green, cyan light or infrared light. This may be the case when the optical system 5 is used with an image sensor which is sensitive only to light of given color. This can also be the case when the optical system 5 is used with an image sensor which is sensitive to visible light and a filter of the given color is interposed between the image sensor and the object to be detected. .
• each opaque layer may be in one of the materials mentioned above, the opaque layers possibly being in different materials.
• the holes 18, 30 can be filled with a solid, liquid or gaseous material, in particular air, at least partially transparent to the useful radiation, for example polydimethylsiloxane (PDMS).
• the holes 18, 30 can be filled with a partially absorbent material in order to filter the wavelength of the rays of the useful radiation.
• the optical system 5 can then also play the role of a wavelength filter. This makes it possible to reduce the thickness of the system 5 compared to the case where a color filter distinct from the optical system 5 is present.
• the partially absorbent filler material may be a colored resin or a colored plastic material such as PDMS.
• the filling material for the holes 18, 30 can be selected in order to have an adaptation of the refractive index with the intermediate layer 12 in contact with the layer with openings 10, and / or to stiffen the structure and improve the mechanical strength of the layer with openings 10, and / or to increase the transmission at normal incidence.
• the filling material can also be a liquid or solid adhesive material allowing the assembly of the optical system 5 on another device, for example an image sensor.
• the filling material can also be an epoxy or acrylate adhesive used to encapsulate the device on one side of which the optical system rests, for example an image sensor, considering that the layer 12 is an encapsulating film. In this case, the adhesive fills the holes 18 and is in contact with the face of the image sensor.
• the glue also makes it possible to laminate the optical system 5 on the image sensor.
• the intermediate layer 12 which may not be present, is at least partially transparent to the useful radiation.
• the intermediate layer 12 can be made of a transparent polymer, in particular of PET, PMMA, COP, PEN, polyimide, a layer of dielectric or inorganic polymers (SiN, Si0 2) , or a layer of thin glass.
• the layer 12 and the microlens array 14 can correspond to a monolithic structure.
• the layer 12 can correspond to a protective layer of the device, for example an image sensor, on which the optical system 5 is fixed. If the image sensor is made of organic materials, the layer 12 may correspond to a barrier film which is impermeable to water and oxygen protecting the organic materials.
• this protective layer may correspond to a deposit of SiN of the order of 1 ⁇ m on the face of a film of PET, PEN, COP, and / or PI in contact with the layer with openings 10
• the thickness of the intermediate layer 12 or the thickness of the air film when the intermediate layer 12 is replaced by an air film is between 1 ⁇ m and 500 ⁇ m, preferably between 5 ⁇ m and 50 ⁇ m.
• the thickness of the intermediate layer 12 can correspond to the standard thickness of commercially available films, for example 12 ym, 19 ym, 23 ym, 36 ym, 50 ym , 100 ym.
• one possibility is to form the matrix of microlenses 14 on a base layer common to all the microlenses, the layer of base resting on the intermediate layer and making it possible to adjust the total thickness of the stack comprising the layer 12 and the base layer.
• the coating 20 is at least partially transparent to the useful radiation.
• the coating 20 can have a maximum thickness of 0.1 ⁇ m and 10 mm.
• the upper face 26 may be substantially flat or have a curved shape.
• the layer 22 is a layer which matches the shape of the microlenses 14.
• the layer 22 can be obtained from an optically transparent adhesive (OCA, acronym for Optically Clear Adhesive), in particular a liquid optically transparent adhesive (LOCA, acronym for Liquid Optically Clear Adhesive), or a material with a low refractive index, or an epoxy / acrylate adhesive, or to a film of a gas or a gaseous mixture, for example of the air.
• OCA optically transparent adhesive
• LOCA liquid optically transparent adhesive
• the layer 22 is made of a material having a low refractive index, lower than that of the material of the microlenses 14.
• the layer 22 may be made of a filling material which is a transparent, non-adhesive material.
• the layer 22 corresponds to a film which is applied against the matrix of microlenses 14, for example an OCA film.
• the contact zone between the layer 22 and the microlenses 14 can be reduced, for example limited to the tops of the microlenses.
• the layer 22 can then be made of a material having a higher refractive index than in the case where the layer 22 matches the microlenses 14.
• the layer 22 corresponds to an OCA film which is applied against the microlens matrix 14, the adhesive having properties which allow the film 22 to completely or substantially completely conform to the surface of the microlenses.
• the refractive index of layer 22 is lower than the refractive index of microlenses 14.
• layer 24 can be made of one of the materials indicated above for layer 22 Layer 24 may not be present.
• the thickness of the layer 24 is between 1 ⁇ m and 100 ⁇ m.
• microlenses 14 there are as many microlenses 14 as there are holes 18.
• the arrangement of microlenses 14 follows the arrangement of holes 18.
• the pitch between the optical centers of adjacent microlenses 14 is the same as the pitch p of the holes 18 described above.
• the microlenses 14 can be, in top view, with a polygonal base, in particular square, rectangular, pentagonal or hexagonal.
• the microlenses 14 are, when viewed from above, substantially contiguous. This advantageously makes it possible to increase the transmission of the filter with normal incidence.
• the microlenses 14 may be, in top view, with a circular or oval base.
• the focal planes of the microlenses 14 are combined.
• the focal planes of the microlenses 14 can be located substantially in the thickness of the opaque layer 16 or at a distance from the opaque layer 16.
• the focal planes of the microlenses are located at a distance from the face 11 of between 0 and 1.5 times the thickness h of the opaque layer 16.
• the focal planes of the microlenses are located substantially at the level of the lower face 13 of the layer with openings 10, for example on the lower face 13 to 1 ⁇ m, preferably to within 0.5 ⁇ m, more preferably to the nearest 0.1 ⁇ m.
• the size of the entry of each hole 18 on the side of the face 11 is equal to or slightly greater than the diameter of the light beam refracted by the microlens in the plane of the face 11 and the size of each hole 18 on the side of the face 13 is equal to or slightly greater than the surface of the focused light.
• the size of the entry of each hole 18 on the side of the face 11 can be reduced compared to what has been described previously to avoid coupling with light coming from neighboring microlenses.
• the size of each hole 18 on the side of the face 13 can be reduced compared to what has been described above to avoid coupling with light from neighboring microlenses and / or to reduce the angular opening of the filter. .
• the microlenses 14 all have the same shape. According to another embodiment, the microlenses 14 have different shapes.
• the microlenses 14 can be made of silica, PMMA, a positive photosensitive resin, PET, PEN, COP, PDMS / silicone, epoxy resin or acrylate.
• the microlenses 14 can be formed by creeping of blocks of a photosensitive resin.
• the microlenses 14 can also be formed by molding, in particular by UV molding or thermal molding, of a layer of PET, PEN, COP, PDMS / silicone or epoxy resin or acrylic polymers. To increase the transmittance of the optical system 5, in the case where the diameter of each hole 18 on the side of the face 11 is equal to the diameter of the hole 18 on the side of the face
• the plane of symmetry of the apertured layer 10 lies in the focal plane of the microlenses
• the plane of symmetry of the layer with openings 10 is the equidistant plane of the faces 11 and 13.
• the angle of view "a" of the layer with openings 10 is chosen so that each opening 18 collects the greatest number of rays coming from the associated microlens 14 while minimizing the passage of rays coming from neighboring lenses
• the opening angle "a" is chosen to be less than 2 * arctan (D / 2f) where D is the diameter of the bases of the microlenses in the case of microlenses with circular base, and, more generally, the largest dimension of the base of the microlens.
• FIG. 12 represents a curve C1 of the evolution of the transmittance Tr of an optical system 5 in the absence of the microlens array 14 as a function of the angle of incidence of a collimated incident radiation, the incidences initial and final described above then being confused.
• the transmittance TrO at normal incidence is the transmittance for an incidence equal to 0 °.
• the transmittance Tr at high angles is the limit towards which the transmittance Tr tends when the incidence tends towards ⁇ 90 °.
• the transmittance Tr at high angles is representative of the transparency of the material forming the layer 16 taking into account the fact that the surface reflectivity of the layer 16 increases at high angles. In the example illustrated in FIG. 12, the transmittance Tr at high angles is substantially equal to 5%.
• the refractive index n3 of the layer 16 is strictly lower than the refractive index n2 of the intermediate layer 12. According to another embodiment, the refractive index n3 of the layer 16 is strictly higher than the refractive index n2 of the intermediate layer 12.
• the transmittance Tr at high angles is substantially equal to 0%.
• the angle of view (FWHM, acronym for Full Width at Half Maximum) is the width in angular value at mid-height of the curve Cl.
• the optical coupling (in English crosstalk) for an opening 18 considered of the optical system 5 is equal the ratio between the light intensity at the outlet of an opening 18 adjacent to the opening considered and the light intensity which enters the opening considered.
• FIG. 13 illustrates the differences in optical properties between the angular filter of FIG. 1, represented in the left part of FIG. 13 and whose holes 18 are cylindrical, and the angular filter of FIG. 7, represented in the left part of Figure 13 and whose holes 18 are frustoconical.
• the decrease in light transmission as a function of the initial incidence of the R rays is slower for the angular filter with cylindrical holes than for the angular filter with frustoconical holes.
• the angular selectivity of the angular filter with cylindrical holes is therefore lower than the angular selectivity of the angular filter with frustoconical holes.
• the shape of the holes 18 can be adapted in particular as a function of the desired angular selectivity.
• FIG. 14 is a view similar to FIG. 1 illustrating another optical property of the optical system 5.
• the coupling between neighboring holes 18 is reduced by the selection of the material making up the intermediate layer 12 and the filling material for the holes 18 so as to obtain a total reflection at the interface between the intermediate layer 12 and the holes 18 for the rays whose final incidence is high.
• the refractive index n4 must be lower than the refractive index n2.
• a total reflection is obtained at the interface between the intermediate layer 12 and the holes 18 for the rays whose final incidence is greater than a minimum angle of incidence min which is defined by the relation (2):
• Min arcsin (n4 / n2) (2)
• the arc tangent to the ratio between half the pitch of the microlenses 14 and the thickness of the support 12 is greater than min .
• the minimum angle of incidence min is equal to approximately 42 ° when the holes 18 are filled with air (refractive index n4 equal to 1) and the intermediate layer 12 is made of PMMA ( refractive index n2 equal to 1.48) and the minimum angle of incidence min is equal to approximately 37 ° when the holes 18 are filled with air and the intermediate layer 12 is made of PET (refractive index n2 equal to 1 , 65). More angle min minimum incidence is low, more numerous are the possible implications that allow total reflection. This allows in particular, for a given thickness of the intermediate layer 12, to reduce the pitch between neighboring microlenses 14 by reducing the coupling of light between neighboring holes 18.
• the intermediate layer 12 becomes a light-guiding element which makes it possible to evacuate the non-transmitted light through the holes 18 on the lateral edges of the angular filter 5 after guidance and attenuation in the thickness of the intermediate layer 12.
• the transmittance at normal incidence TrO depends in particular on the filling factor of the microlenses 14, that is to say in top view the ratio between the surface occupied by the microlenses 14 present in a region on the surface of this region. Indeed, the reduction of the interstices separating adjacent microlenses 14 makes it possible to increase the transmittance at normal incidence TrO.
• Figure 15 is a sectional view of a first optical system 5 according to the configuration shown in Figure 3 shown and used to perform simulations.
• the pitch of the microlenses 14 was 20 ⁇ m.
• the microlens array 14 included a common layer 1.5 ⁇ m thick on which the microlenses based, the maximum thickness of which was 6.5 ⁇ m, rested.
• the radius of curvature of the microlenses 14 was 11.1 ⁇ m.
• the microlenses 14 are immersed in a medium with a refractive index equal to 1.34 like the medium 22 in FIG. 3.
• the thickness of the intermediate layer 12 was 36 ⁇ m.
• the inlet diameter of each hole 18 was 8 ⁇ m and the outlet diameter of each hole 18 was 4 ⁇ m.
• the thickness of the opaque layer 16 was 15 ⁇ m.
• the inventors determined by simulation that the transmittance at normal incidence obtained was 60%.
• FIG. 16 represents a curve C2 of the evolution of the normalized transmittance of the optical system 5 represented in FIG. 15.
• the angle of view defined as the angle at mid-height of the normalized angular transmittance peak, was
• a second optical system 5 according to the configuration shown in Figure 15 was produced.
• the pitch of the microlenses 14 was 12 ⁇ m.
• the matrix of microlenses 14 comprised a common layer of 1.5 ⁇ m in thickness on which the microlenses whose maximum thickness was 2 ⁇ m rested.
• the radius of curvature of the microlenses 14 was 9.9 ⁇ m.
• the thickness of the intermediate layer 12 was 19 ⁇ m.
• Microlenses 14 are located in a medium with a refractive index equal to 1 as illustrated in FIG. 1.
• the inlet diameter of each hole 18 was 5 ⁇ m and the outlet diameter of each hole 18 was 2 ⁇ m.
• the thickness of the opaque layer 16 was 10 ⁇ m.
• the inventors determined by simulation that the transmittance at normal incidence obtained was 64%.
• FIG. 17 represents a curve C3 of the evolution of the normalized transmittance of the second optical system 5.
• the angle of view was 2.4 °.
• the structure of the first optical system 5 with medium 22 with a low refractive index makes it possible to avoid the presence of an air gap between the microlenses 14 and the part to be assembled on the optical system 5.
• the structure of the second optical system 5 without medium 22 requires an air gap which can simplify the manufacturing process and assembly of optical system 5.
• the microlenses 14 were spherical, adjacent and arranged in a hexagonal tiling. However, a transmittance at normal incidence of around 80% can be obtained if a filling factor of the microlenses of 100% is used, in particular as is described in more detail below.
• FIG. 18 is a top view of an embodiment of an arrangement of the microlenses 14 in which each microlens 14 has a circular base.
• the microlenses 14 are arranged in rows and columns according to a square tiling in which, with the exception of the periphery of the array of microlenses, the edge 39 of each microlens 14 is, in top view, inscribed in a square represented by dotted lines, each of these squares having a common side with four other squares. A filling factor of around 78% is then obtained.
• FIG. 19 is a top view of an embodiment of an arrangement of the microlenses 14 in which each microlens 14 has a circular base.
• the microlenses 14 are arranged in a hexagonal pattern in which, with the exception of the periphery of the array of microlenses, the edge of each microlens 14 is inscribed, in top view, in a hexagon represented by dashed lines, each of these hexagons having one side in common with six other hexagons.
• the microlenses 14 are therefore substantially contiguous only at isolated points.
• Such an arrangement makes it possible to achieve a filling factor of 90%, that is to say a filling factor greater than that which can be achieved with an arrangement of microlenses 14 with circular base according to a square paving.
• the radius of curvature of the microlens is less than the pitch P of the microlenses 14.
• FIG. 20 is a top view of an embodiment of an arrangement of the microlenses 14 in which each microlens 14 is of circular base.
• the microlenses 14 are arranged in a hexagonal pattern in which, with the exception of the periphery of the array of microlenses, the theoretical edge 19 of each microlens 14 is circumscribed to a hexagon in top view, each of these hexagons having one side in common with six other hexagons. There is then a partial overlap between adjacent microlenses 14.
• Such an arrangement makes it possible to achieve a filling factor of 100%, that is to say a filling factor greater than the hexagonal paving illustrated in FIG. 19.
• each microlens 14 in the case where each microlens 14 is noticeably spherical, the radius of curvature of the microlens is greater than half the pitch P of microlenses 14.
• each microlens in the case of aspherical microlenses 14, each microlens has a conical constant equal to -1 and a radius of curvature in the center between 1/3 and 2/3 of the pitch of the lenses.
• each microlens 14 has a circular base.
• microlenses other than microlenses with a circular base can be used.
• microlenses 14 with a square base or a hexagonal base can be used. Such an arrangement achieves a filling factor of about 100%. However, it may not be desirable to obtain an overly large filling factor, in particular to reduce the coupling of the light coming from two neighboring microlenses.
• Figure 21 includes, in the left part, a sectional view of part of the optical system 5 of Figure 1 at a microlens 14 and an opening 18 of the layer of openings 10 in a mode in which the microlens 14 is spherical.
• FIG. 21 also comprises, in the right part, a top view of the focusing spot 40 obtained with the spherical microlens 14 represented in the left part. Due to the spherical aberration of the microlens 14, the rays with zero initial incidence do not all focus on a single point. The focusing spot 40 can then have a blurred contour.
• Figure 22 is a figure similar to Figure 21 in an embodiment in which each microlens 14 is aspherical.
• Each aspherical microlens 14 can comprise a convex central portion 42 surrounded by a concave or convex peripheral portion 44.
• the aspherical microlens 14 makes it possible to obtain a sharp focusing spot 40.
• the aspherical microlens 14 makes it possible to increase the transmittance TrO at zero incidence compared to the embodiment in which the microlens is spherical insofar as the aspherical microlens allows to increase the number of rays which are not blocked by the layer with openings 10.
• the peripheral portion 44 is convex and the radius of curvature of the peripheral portion 44 is less than the radius of curvature of the central convex portion 42 of the microlens 14.
• the aspherical microlens 14 makes it possible to reduce the dimensions of the focusing spot 40 relative to a spherical microlens 14, which makes it possible to reduce the width w of the holes 18 and therefore to increase the selectivity of the angular filter.
• a layer of a reflective material can be deposited on the sides of each opening 18.
• a method of roughening the sides of the openings 18 can be implemented. It may be a process using a plasma.
• the arithmetic roughness Ra of the sides of the openings 18 is between 10 nm and 1 ⁇ m.
• FIG. 23 is a sectional, partial and schematic view of an embodiment of an image acquisition system 50 receiving radiation 52.
• the image acquisition system 50 comprises, from bottom to top in figure 23:
• the optical system 5 forming an angular filter and covering the face 56.
• the image sensor 54 comprises, from bottom to top in FIG. 23:
• an electrically insulating layer 62 covering the array of photodetectors 60 and interposed between the array of photodetectors 60 and the optical system 5, the insulating layer 62 delimiting the face 56;
• a transparent layer 64 serving as an adhesive between the layer 62 and the layer with openings 10.
• the image sensor 54 further comprises conductive tracks and switching elements, in particular transistors, not shown, allowing the selection of the photodetectors 60.
• the image acquisition system 50 further comprises , means not shown for processing the signals supplied by the image sensor 60, comprising for example a microprocessor.
• the photodetectors are shown spaced apart by a substantially constant pitch.
• the photodetectors 60 can be made of organic materials.
• the photodetectors 60 may correspond to organic photodiodes (OPD, from the English Organic Photodiode), to organic photoresistors.
• OPD organic photodiodes
• the photodetectors 60 can be made of inorganic materials.
• the photodetectors 60 may correspond to monocrystalline silicon photodiodes associated with a matrix of CMOS transistors or to amorphous silicon photodiodes associated with a matrix of CMOS transistors.
• the surface of the image sensor 54 facing the optical system 5 and containing the photodetectors 60 is greater than 1 cm 2 , preferably greater than 5 cm 2 , more preferably greater than 10 cm 2 , in particular greater than 20 cm 2 .
• the upper face 56 of the image sensor 54 can be substantially flat. As a variant, the upper face 56 of the image sensor 54 can be curved.
• the layer 62 is transparent to useful radiation.
• the thickness of the layer 62 is between 10 nm and 50 ⁇ m.
• the layer 62 can be composed of at least one of the materials described above for the layers 22 and 24, in particular in the case where the layer 24 is an adhesive layer. According to one embodiment, the layer 62 is not present.
• the layer 62 can also be sealed against oxygen and / or water. According to another embodiment, the layer 62 is not present and the optical system 62 is directly in contact with the array of photodetectors 60.
• each photodetector 60 is suitable for detecting electromagnetic radiation in a range of wavelengths between 400 nm and 1100 nm. All the photodetectors 60 can be adapted to detect electromagnetic radiation in the same wavelength range. As a variant, the photodetectors 60 can be adapted to detect electromagnetic radiation in ranges of different wavelengths.
• the angular filter 5, covering the image sensor 54 is adapted to filter the incident radiation 52 as a function of the initial incidence of the radiation 52 relative to the upper face 26, in particular so that each photodetector 60 receives only rays whose initial incidence relative to an axis perpendicular to the upper face 26 is less than a maximum initial angle of incidence less than 45 °, preferably less than 30 °, more preferably less than 20 °, even more preferably less at 10, in particular less than 5 °.
• the angular filter 5 is adapted to block the rays of the incident radiation whose initial incidence relative to an axis perpendicular to the upper face 26 is greater than the maximum initial angle of incidence.
• the photodetectors 60 can be distributed in rows and columns.
• the pitch of the photodetectors 60 is the same as the pitch of the holes 18.
• the layer with apertures 10 is then preferably aligned with the image sensor 54 so that each hole 18 faces a photodetector 60
• the ratio between the area of the cross section of an opening 18 and the area in top view of the associated photodetector 18 is between 1/10 and 1/2.
• the pitch p of the holes 18 is smaller than the pitch of the photodetectors 60 of the image sensor 54, for example less than half the pitch of the photodetectors, preferably less than a quarter of the pitch of the photodetectors, more preferably less than one tenth of the pitch of the photodetectors 60. In this case, several holes 18 may be located opposite the same photodetector 60. According to another embodiment, the pitch p of the holes 18 is larger than the pitch of the photodetectors 60 of the image sensor 54. In this case, several photodetectors 60 may be located opposite the same hole 18. Another example of application of the optical system 5 will now be described for a device for collimating a lighting or display system.
• Figure 24 is a sectional view, partial and schematic, of an embodiment of a lighting system 70 providing collimated light.
• the lighting system 70 comprises, from bottom to top in FIG. 24:
• the optical system 5 as described above, covering the light source 72 and receiving the radiation 74 emitted by the light source 72, the coating 20 not being present in FIG. 24, the layer with openings 10 being interposed between the light source 72 and the microlens array 14.
• the emission plane of the light source 72 is close to the focal plane of the optical system 5, preferably located in the focal plane of the optical system 5 to the nearest 0.1 ⁇ m.
• the form factor (height to width ratio) of the holes 18 of the layer 10 is high enough, preferably greater than 5, so that no radius coming out of an opening 18 opposite d 'a given microlens 14 does not pass through a neighboring microlens Indeed, in this case, the outgoing ray would not be collimated.
• the opening angle of the layer 10 can be adjusted by the aspect ratio of the openings 18.
• the optical system 5 plays the role of a collimation device which makes it possible to collimate the radiation 74 supplied by the light source 72.
• the light source 72 is shown with a surface substantially planar emissive. Alternatively, the emitting surface of the light source 72 can be curved. In FIG. 24, the light source 72 is represented as a continuous source extending under the optical system 5. However, it is clear that the source 72 can comprise disjoint light sources, each of these disjoint light sources being able to be aligned with the one of the holes 18.
• FIGS. 25 to 29 are sectional views, partial and schematic, of structures obtained in successive stages of an embodiment of a method for manufacturing the optical system 5 shown in FIG. 3.
• FIG. 25 represents the structure obtained after the formation of the microlens matrix 14 on the intermediate layer 12.
• the microlens matrix 14 can be formed on a support different from the intermediate layer 12, this support being removed before the formation of the intermediate layer 12 when the intermediate layer 12 is present, or before the formation of the layer with openings 10 when the intermediate layer 12 is not present.
• the manufacture of the microlenses 14 comprises the formation of a layer of the material composing the microlenses 14 on the intermediate layer 12 or another support and the deformation of this layer, for example by means of a matrix to form microlenses.
• the microlenses 14 are formed by molding.
• the microlenses 14 are represented in a disjointed or almost disjointed and adjacent manner.
• the matrix of microlenses 14 may comprise a base layer common to all the microlenses as shown in FIG. 14.
• FIG. 26 represents the structure obtained after the formation of the coating 20 on the microlens array 14 when this coating 20 is present.
• the steps described below in relation to FIG. 27 can be carried out directly after the steps described above in relation to FIG. 25.
• the formation of the coating 20 can comprise the steps following:
• liquid layer thus follows the shape of the microlenses 14.
• This layer is preferably self-planarizing, that is to say it forms automatically a substantially flat free face;
• This may include a step of crosslinking the material making up the layer 22, in particular by thermal crosslinking and / or by irradiation with an ultraviolet beam;
• the layer 24 on the layer 22, or in contact with the layer of microlenses 14 when the layer 22 is not present, for example by laminating a film on the layer 22.
• FIG. 27 represents the structure obtained after the formation of the opaque layer 16 on the intermediate layer 12, on the side opposite to the matrix of microlenses 14.
• the opaque layer 16 can be deposited by liquid means, by sputtering or by evaporation. These may in particular be processes of the spinner deposition type, spray coating, heliography, die coating (in English slot-die coating), blade coating (in English blade-coating), flexography or screen printing. Depending on the deposition process used, a step for drying the deposited material may be provided.
• FIG. 28 represents the structure obtained during a step of exposure to collimated radiation 76, passing through microlenses 14, from parts 78 of the opaque layer 16 at the desired locations of the holes 18.
• FIG. 29 represents the structure obtained during a stage of development of the opaque layer 16 which has resulted in the dissolution, in a developer, of the parts 78 of the opaque layer 16 exposed to incident radiation 76, thus forming the holes 18.
• the layer with openings 10 is thus obtained.
• the composition of the developer depends on the nature of the positive photosensitive resin that has been used.
• the method may include subsequent steps comprising filling the holes 18 with a filling material.
• the radiation used to expose the opaque layer 16 depends on the photosensitive resin used.
• the radiation 76 is radiation of wavelengths between approximately 300 nm and 450 nm in the case of a DNQ-Novolac resin or ultraviolet radiation for a DUV photosensitive resin.
• the duration of the exposure of the opaque layer 16 to radiation 76 depends in particular on the type of positive photosensitive resin used and, preferably, is sufficient for the exposed parts 78 of the opaque layer 16 to extend over the entire thickness of the opaque layer 16.
• the exposure of the opaque layer 16 is carried out through microlenses 14.
• the shape of the holes 18 obtained depends in particular on the absorption and diffusion properties of the material making up the layer 16 and on the shape of the incident beam.
• the opaque layer 16 is preferably located in the focal plane of the microlenses 14 or near the focal plane of the microlenses 14.
• the incident radiation 76 which reaches the microlenses 14 is a radiation substantially collimated so that it is focused by each microlens 14 substantially at the level of the opaque layer 16 or near the opaque layer 16.
• the opaque layer 16 can be offset relative to the focal plane of the microlenses 14 so as to obtain spots of desired dimensions on the opaque layer 16 when the layer opaque 16 is exposed to radiation 76 through microlenses 14.
• the inclination of the radiation 76 relative to the upper face 26 corresponds substantially to the average inclination formed by the radiation intended to be picked up by the photodetectors with the face upper 26 during normal use of the image acquisition system 5.
• the radiation 76 is substantially perpendicular to the face 26.
• the radiation 76 is inclined relative to a direction perpendicular to the face 26 thus making it possible to obtain holes 18 offset with respect to the microlenses 14.
• FIG. 30 illustrates an example of the shapes of the parts 78 exposed when the radiation 76 is strongly diffused by the material making up the layer 16 and is focused substantially in the plane of symmetry of the layer 16. Holes 18 which are substantially cylindrical, such as as shown in Figure 29, can be obtained, that is to say that their cross section is constant.
• the cross section of the holes 18 may not be constant.
• the holes 18 can have a frustoconical shape.
• FIG. 31 illustrates an example of the shapes of the parts 78 exposed when the radiation 76 is little diffused by the material making up the layer 16 and is focused substantially downstream of the layer 16 relative to the microlenses 14. Holes 18 substantially frustoconical, as shown in Figure 7, can be obtained.
• the development and exposure parameters of the resin make it possible to adjust the profile of the holes.
• the incident radiation 76 has a divergence, for example with an angle of divergence greater than 1 °, the angle of divergence of the incident radiation 76 which reaches the microlenses 14 then being adjusted to modulate the width of the holes 18 made in layer 16.
• a layer of a material of suitable refractive index can be temporarily placed on the matrix of microlenses 14 during step d exposure to change the focal length of the microlenses 14 so that the exposed parts 78 have the desired dimensions.
• the light source emitting the exposure radiation 76 whether or not collimated can be moved relative to the matrix of microlenses 14 during the exposure step as a function of the desired shape of the holes 18, for example by modifying the inclination of the light source relative to a direction orthogonal to the face 26 and / or by approaching or moving the light source away from the matrix of microlenses 14.
• the light source emitting the exposure radiation 76 can be moved in a loop, which makes it possible to obtain holes 18 of annular cross section.
• Such a shape of hole allows in particular the production of an angular band-pass filter allowing the passage of rays whose initial incidence relative to a direction orthogonal to the face 26 is in at least a first range of incidences and to be left pass rays whose incidence with respect to a direction orthogonal to the face 26 is in at least one second range of incidences distinct from said at least one first range of incidences.
• the microlenses 14 may have different focal points depending on the wavelength of the exposure radiation 76.
• the layer 16 of photosensitive resin can be sensitive to these different wavelengths.
• each photosensitive layer can be sensitive to radiation at a particular wavelength.
• the exposure step can then comprise exposing the photosensitive layer or the photosensitive layers to radiation at these different wavelengths to obtain holes 18, 30 of desired shape.
• FIGS. 32 and 33 are sectional views, partial and schematic, of structures obtained in successive stages of another embodiment of a method for manufacturing the optical system 5 shown in FIG. 3.
• the initial steps of this embodiment of the manufacturing process include the steps described above in relation to Figures 25 to 29 with the difference that the layer 16 is replaced by a layer of the material intended to fill the holes 18 of the layer with openings 10 and is made of a negative photosensitive resin which is also transparent to useful radiation.
• FIG. 32 represents the structure obtained during a step of revealing the layer of negative photosensitive resin which resulted in the dissolution, in a developer, of the portions of the layer of negative photosensitive resin which have not been exposed to the radiation 76 used in the exposure step, the parts of the negative photosensitive resin layer exposed in the exposure step thus forming pads 80.
• the composition of the developer depends on the nature of the negative photosensitive resin which has been used.
• FIG. 33 represents the structure obtained after the formation of the opaque layer 16 between the studs 80, for example by spinning, spray coating, rotogravure, die coating (in English slot-die coating), coating with the blade (in English blade-coating), flexography or serigraphy.
• the opaque layer is deposited on the entire structure and in particular on the pads 80, and the parts of the opaque layer covering the pads 80 are removed, for example by photolithography, etching or takeoff (in English lift-off).
• the studs 80 thus define the holes 18 in the layer 16.
• the layer with openings 10 is thus obtained.
• the implementation of the lift-off process may require, for each pad 80, that the dimensions of the base of the pad 80, in contact with the layer 12, are smaller than the dimensions of the top of the pad 80.
• the manufacture of pads 80 with such a shape can be obtained by providing, during the step of exposing the negative photosensitive resin layer described previously in relation to FIG. 32, that the focal planes of the microlenses 14 are located in layer 12.
• Another embodiment of a method for manufacturing the optical system 5 shown in Figure 3 comprises the steps described above in relation to Figures 25 to 29 with the difference that the layer 16 is made of a material capable of degrade under the action of radiation 76 especially when the radiation 76 corresponds to laser radiation.
• the illumination of this laser radiation is low enough not to damage the matrix of optical elements of micrometric size 14 and high enough after collimation by the matrix of optical elements of micrometric size 14 to degrade the layer 16 at the level of the parts 78.
• the parts 78 exposed to the radiation 76 are therefore destroyed by this radiation then forming the holes 18 directly.
• the layer with openings 10 is thus obtained.
• the method of manufacturing the optical system can correspond to a reel-to-reel process (in English roll to roll). According to another embodiment, the method of manufacturing the optical system can correspond to a sheet-by-sheet process.
• the layer with openings 10 comprises a stack of at least two layers 16, 28 each comprising holes 18, 30, as shown in FIG. 5 or 6, the first layer 16 with the holes 18 is produced in a first step and the second layer 28 with the holes 30 is produced in a second step, taking into account the presence of the first layer 16, according to any one of the embodiments of the manufacturing process described above.
• the alignment of the holes 18 relative to the microlenses 14 is obtained automatically by the same method of forming the holes 18.
• the apertured layer 10 comprises a stack of at least first and second opaque layers 16, 28 each comprising holes 18, 30, the alignment of the holes 30 of the second opaque layer 28 relative to the holes 18 of the first opaque layer 16 is obtained automatically by the very process of forming the holes 30 in the second opaque layer 28.
• an embodiment of a method for manufacturing the layer with apertures 10 comprises depositing a layer of colored resin on a support, printing patterns in the resin layer by photolithography, and developing of the resin layer so as to keep only the layer with openings 10.
• Another embodiment of a method for manufacturing the layer with openings 10 comprises the formation, by photolithography steps, of a transparent resin mold of shape complementary to the desired shape of the layer with openings 10, filling the mold with the material making up the layer with openings 10, and removing the structure obtained from the mold.
• Another embodiment of a method for manufacturing the apertured layer 10 comprises the perforation of a colored film, for example a film made of PDMS, PMMA, PEC, COP.
• the perforation can be carried out using a micro-perforation tool comprising for example micro-needles to obtain the dimensions of the holes 18 and the pitch of the holes 18 desired.
• An embodiment of a method for manufacturing the layer with openings 10 shown in FIG. 8 comprises the following steps:

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• 2018
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