EP3751973A1 - Wärmeableitungsanordnung und aktionskamera - Google Patents

Wärmeableitungsanordnung und aktionskamera Download PDF

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Publication number
EP3751973A1
EP3751973A1 EP19742275.1A EP19742275A EP3751973A1 EP 3751973 A1 EP3751973 A1 EP 3751973A1 EP 19742275 A EP19742275 A EP 19742275A EP 3751973 A1 EP3751973 A1 EP 3751973A1
Authority
EP
European Patent Office
Prior art keywords
heat dissipation
heat
action camera
cover
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP19742275.1A
Other languages
English (en)
French (fr)
Other versions
EP3751973B1 (de
EP3751973A4 (de
Inventor
Shengjia GUO
Guisheng NONG
Kunpeng JING
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SZ DJI Technology Co Ltd
Original Assignee
SZ DJI Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SZ DJI Technology Co Ltd filed Critical SZ DJI Technology Co Ltd
Publication of EP3751973A1 publication Critical patent/EP3751973A1/de
Publication of EP3751973A4 publication Critical patent/EP3751973A4/de
Application granted granted Critical
Publication of EP3751973B1 publication Critical patent/EP3751973B1/de
Not-in-force legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/52—Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/55—Details of cameras or camera bodies; Accessories therefor with provision for heating or cooling, e.g. in aircraft
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/51—Housings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20309—Evaporators
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20318—Condensers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof

Definitions

  • the present disclosure relates to a heat dissipation assembly and an action camera, belonging to the photography technical field.
  • An action camera includes a main chip, a lens module assembly communicatively connected with the main chip, and a housing for receiving the main chip and lens.
  • the lens module assembly is configured to generate optical imaging information based on an object to be photographed and transmit the optical imaging information to the main chip.
  • the main chip is configured to process the optical imaging information and generate corresponding images.
  • the housing for receiving the main chip and the lens is typically made of a plastic material, such that the action camera has excellent anti-collision and anti-dropping functions, which can better protect the action camera.
  • the volume of an action camera cannot be too large.
  • the main chip and imaging sensors included in the lens module assembly can generate a large amount of heat. A portion of the heat causes the operation performance of the main chip and the lens module to degrade. Therefore, how to improve the heat dissipation efficiency without increasing the volume of the action camera has become an emerging issue to be addressed in the industry.
  • embodiments of the present disclosure provide a heat dissipation assembly and an action camera.
  • a heat dissipation assembly for dissipating heat from a heat generating component included in an action camera.
  • the heat generating component includes the main chip of the action camera.
  • the heat dissipation assembly includes: a heat tube and a first heat dissipation panel. An evaporation end and a condensation end of the heat tube are both in thermal contact with the first heat dissipation panel, and the condensation end of the heat tube is located farther away from the main chip relative to the evaporation end of the heat tube.
  • the first heat dissipation panel may be configured to be in thermal contact with the main chip, and may be configured to be in thermal contact with an external housing of the action camera, such that the heat of the main chip may be conducted out through the external housing of the action camera.
  • the heat of the main chip may be conducted out through multiple heat dissipation paths, thereby providing an excellent heat dissipation effect for the main chip.
  • the heat dissipation assembly has a compact structure that occupies a relatively smaller space, and has a relatively small effect on the volume of the action camera, which is advantageous for the portability of the action camera.
  • the present embodiment provides an action camera 1.
  • the action camera 1 includes an external housing 19.
  • the external housing 19 includes a mounting space formed inside for mounting a main chip 11, a lens 15, and a battery 17.
  • the present embodiment and the following embodiments may use a side of the action camera 1 where the lens is located as a front end, and a side opposing the front end as a rear end.
  • a side of the action camera 1 facing the ground may be a down side (or a bottom end), and a side opposing the down side may be an upper side (or top end).
  • a side where the lens 15 is located may be a right side, and the other side may be a left side.
  • a direction pointed by an arrow F may be the front direction
  • a direction pointed by an arrow A may be the upper direction
  • a direction pointed by an arrow R may be a right direction.
  • a portion of the external housing 19 may be made of a plastic material, such as a vertex portion, such that the action camera 1 has an excellent anti-collision and anti-dropping performance, which can better protect the action camera 1.
  • a portion of the external housing 19 may be made of a metal material.
  • a portion of the external housing 19 corresponding to a heat generating component of the action camera 1 may be made of a metal material (an exterior of the portion may be wrapped with a plastic layer), such that the heat of the heat generating component can be quickly transferred out.
  • the external housing 19 may include a middle frame 193.
  • a rear end of the middle frame 193 may be provided with a rear cover 192.
  • the rear cover 192 and the middle frame 193 may be integrally provided or may be detachably connected.
  • a front end of the middle frame may be provided with a front cover.
  • the front cover may be detachably connected with the middle frame 193 for the convenience of subsequent maintenance of the internal parts of the action camera.
  • the rear cover 192 or the middle frame 193 may be at least partially made of a plastic material, such that the action camera 1 has an excellent anti-collision and anti-dropping performance.
  • the rear cover 192 or the middle frame 193 may be at least partially made of a metal material, such that the action camera 1 has an excellent heat dissipation performance.
  • the front cover may be made of a plastic material. Then the front cover is a plastic front cover, such that the action camera 1 has an excellent anti-collision and anti-dropping performance and heat insulation performance.
  • the front cover and the rear cover 192 may both be provided with a display screen.
  • the lens of the action camera 1 may face an object to be photographed, i.e., facing the front side.
  • the display screen on the rear cover 192 may face a user such that the user can view the photographed images.
  • the lens may face the user, and the display screen on the front cover may also face the user such that the user can view the photographed images.
  • the lens and the display screen on the front cover may be provided in a staggered manner, to avoid interference between the two.
  • the main chip 11 may be provided on an electric board 1a disposed inside the external housing 19, and may be configured to process data from various sensors included in the action camera 1.
  • the main chip 11 may be configured to exchange information with an external environment, such as receiving a control command input by a user, and outputting acquired image information, etc.
  • the main chip 11 may also be configured to control an operation state of the action camera 1 based on the data from various sensors, the control command input by the user, and a pre-stored control command, etc. Because the main chip 11 needs to process a large amount of data, a large amount of heat may be generated during the operation. Therefore, the main chip 11 is one of the heat generating components in the action camera 1.
  • the action camera 1 may also include a heat dissipation assembly.
  • the heat dissipation assembly may be configured to dissipate heat for the heat generating components of the action camera 1.
  • the heat dissipation assembly includes a heat tube 131 and a first heat dissipation panel 132 configured to dissipate heat for the main chip 11.
  • the heat tube 131 includes an evaporation end 1311 and a condensation end 1312.
  • the evaporation end 1311 of the heat tube 131 may be in thermal contact with the main chip 11 to absorb heat of the main chip 11, and to transfer the heat to the condensation end 1312 for release.
  • the condensation end 1312 of the heat tube 131 may be located farther away from the main chip 11 relative to the evaporation end 1311 of the heat tube 131.
  • the condensation end 1312 of the heat tube 131 may extend to a surface extending out of the main chip 11. That is, the condensation end 1312 of the heat tube 131 may not be in contact with the main chip 11 to avoid the influence of the heat released by the condensation end 1312 on the heat dissipation of the main chip 11.
  • the evaporation end 1311 and the condensation end 1312 of the heat tube 131 may both be in thermal contact with the first heat dissipation panel 132.
  • the evaporation end 1311 of the heat tube 131 may be in thermal contact with a portion of the first heat dissipation panel 132 that corresponds to the main chip 11, such that heat of the portion of the first heat dissipation panel 132 that contacts the main chip 11 can be quickly transferred to a portion of the first heat dissipation panel 132 that is far away from the main chip 11 through the evaporation end 1311 and the condensation end 1312, and be further conducted out through the external housing 19 of the action camera 1 that is in thermal contact with the first heat dissipation panel 132.
  • the first heat dissipation panel 132 may extend outwardly from the heat tube 131 until it directly contacts the external housing 19 of the action camera 1, such that the heat of the first heat dissipation panel 132 may be conducted out of the action camera 1 through the external housing 19.
  • At least a portion of the evaporation end 1311 and at least a portion of the condensation end 1312 may be in direct contact with the first heat dissipation panel 132.
  • at least a portion of the heat tube 131 may be provided in contact with a surface of the first heat dissipation panel 132, such that the there is a relatively large contacting area, i.e., heat transfer area, between the heat tube 131 and the first heat dissipation panel 132.
  • the first heat dissipation panel 132 may be provided with a mounting groove. The heat tube 131 may be received in the mounting groove of the first heat dissipation panel 132, which may be advantageous for the compactness of the structure of the action camera 1.
  • the coupling method between the heat tube 131 and the first heat dissipation panel 132 is not limited to this, and this embodiment only provides an example as an illustration, as long as the first heat dissipation panel 132 can be in thermal contact with the heat tube 131 to quickly conduct out the heat of the heat tube 131.
  • the first heat dissipation panel 132 may be configured to directly contact the main chip 11, such that a portion of the heat of the main chip 11 can be quickly transferred to the first heat dissipation panel 132, and further be conducted out through the external housing 19 of the action camera 1 that is in thermal contact with the first heat dissipation panel 132.
  • the heat tube 131 and the first heat dissipation panel 132 may be disposed at the front end of the main chip 11.
  • the first heat dissipation panel 132 may extend outwardly from the heat tube 131 until it contacts the external housing 19 of the action camera 1, such that the heat of the first heat dissipation panel 132 can be conducted out through the external housing 19 of the action camera 1.
  • the area of the surface of the first heat dissipation panel 132 that is in contact with the main chip 11 may be greater than the area of the corresponding surface of the main chip 11, such that the first heat dissipation panel 132 can be in contact with more regions of the main chip 11.
  • the first heat dissipation panel 132 may be in direct contact with the main chip 11.
  • the first heat dissipation panel 132 may directly or indirectly contact the external housing 19.
  • At least a portion of the heat tube 132 may be in direct contact with the first heat dissipation panel 132.
  • At least a portion of the heat tube 132 may be in direct contact with the main chip 11.
  • the heat tube 132 may be in thermal contact with the main chip through the first heat dissipation panel 132.
  • the heat tube 132 may be in indirect contact with the external housing 19.
  • the heat tube 132 may be in thermal contact with the external housing 19 through the first heat dissipation panel 132.
  • a portion of the heat of the main chip 11 may be transferred to the heat tube 131 through a portion of the first heat dissipation panel 132 that is in contact with the main chip 11, and be transferred to a portion of the first heat dissipation panel 132 that is far away from the main chip 11 through the heat tube 131, and further be conducted out through the external housing 19 of the action camera 1 that is in thermal contact with the first heat dissipation panel 132.
  • Another portion of the heat of the main chip 11 may be directly transferred to the first heat dissipation panel 132, and be conducted out through the external housing 19 of the action camera 1 that is in thermal contact with the first heat dissipation panel 132.
  • both of the heat tube 131 and the first heat dissipation panel 132 have heat dissipation functions for the main chip 11.
  • the heat tube 131 can quickly conduct the heat of a portion of the first heat dissipation panel 132 that is in contact with the main chip 11 to another portion of the heat dissipation panel 132 that is far away from the main chip 11, such that the heat of the main chip 11 can be quickly conducted out, that is the temperature increase problem of the main chip 11 can be effectively solved, which is advantageous to ensure the reliability of the operation performance of the action camera 1.
  • the heat dissipation assembly of the present embodiment through configuring the first heat dissipation panel 132 that is in thermal contact with the main chip 11, and the heat tube 131 that is in contact with the first heat dissipation panel 132, and through configuring the first heat dissipation panel 132 to be in thermal contact with the external housing 19 of the action camera 1, the heat of a portion of the first heat dissipation panel 132 that is in contact with the main chip 11 can be quickly transferred to a portion of the main chip 11 that is far away from the main chip 11 through the heat tube 131, and be further conducted out through the external housing 19.
  • the heat of the main chip 11 can be quickly transferred to the heat tube 131 and the first heat dissipation panel 132, and be conducted out of the action camera 1 through the external housing 19 that is in thermal contact with the first heat dissipation panel 132. Therefore, the heat of the main chip 11 can be conducted out through multiple heat dissipation paths, resulting in an excellent heat dissipation effect for the main chip 11.
  • the heat dissipation assembly has a compact structure that occupies a relatively small space, which has a relatively small effect on the volume of the action camera 1, which is advantageous for the portability of the action camera 1.
  • the first heat dissipation panel 132 may include a first surface 1321 and a second surface 1322 that are opposingly disposed. A portion of the first surface 1321 may cover the main chip 11, i.e., a portion of the first surface 1321 may be in contact with the main chip 11.
  • the heat tube 131 may be disposed at the second surface 1322.
  • the first surface 1321 may include a contacting region that is in contact with the main chip 11.
  • the shape of the contacting region may match with the main chip 11.
  • the main chip 11 may have a rectangular shape, and the contacting region may also have a rectangular shape.
  • At least one side of the contacting region may extend outwardly, i.e., extend in a direction away from the main chip 11, and may extend until it can contact the external housing 19 of the action camera 1, such that the first heat dissipation panel 132 is in thermal contact with the external housing 19.
  • At least a portion of the heat tube 131 may be disposed at the second surface 1322, i.e., disposed at a side of the first heat dissipation panel 132 facing away from the main chip 11. In some embodiments, the entire heat tube 131 may be disposed at the second surface 1322. Then, the evaporation end 1311 of the heat tube 131 may be in thermal contact with the main chip 11 through the first heat dissipation panel 132. In other embodiments, the evaporation end 1311 of the heat tube 131 may extend out of the first heat dissipation panel 132, such that the portion of the evaporation end 1311 that extends out of the first heat dissipation panel 132 can contact the main chip 11.
  • the portion of the evaporation end 1311 that extends out of the first heat dissipation panel 132 may bend toward the main chip 11 to contact the main chip 11, or the portion of the evaporation end 1311 that extends out of the first heat dissipation panel 132 may contact the main chip 11 through a heat conducting medium, such as a heat conducting silicone gel.
  • a portion of the heat tube 131 located adjacent the evaporation end 1311 may be obliquely disposed relative to an extending direction of the length of the main chip 11, such that there is a relatively large heat transfer area between the heat tube 131 and the main chip 11, which makes it convenient for the condensation end 1312 to extend out of the main chip 11 to reduce the effect of the condensation end 1312 on the main chip 11.
  • This configuration also makes the structure of the heat dissipation assembly compact, thereby reducing the space occupied by the action camera 1.
  • an angle between a portion of the heat tube 131 located adjacent the evaporation end 1311 and the length direction of the main chip 11 may be 30 degrees, 45 degrees, 60 degrees, etc.
  • a portion of the heat tube 131 located adjacent the condensation end 1312 may be smoothly connected with a portion that is located adjacent the evaporation end 1311.
  • a portion of the heat tube 131 located adjacent the condensation end 1312 may be disposed extending along the length direction of the action camera 1, thereby reducing the space occupied by the action camera 1, which is advantageous for miniaturization and portability of the action camera 1.
  • a groove 1323 may be formed in a region of the second surface 1322 corresponding to the main chip 11.
  • the portion of the heat tube 131 located adjacent the evaporation end 1311 may be disposed in the groove 1323.
  • the shape of the groove 1323 may match with the portion of the heat tube 131 that is located adjacent the evaporation end 1311.
  • the heat dissipation assembly may also include a metal cover 133.
  • the metal cover 133 may be made of a metal material having an excellent thermal conductivity, such that the heat of the first heat dissipation panel 132 can be quickly conducted out.
  • the metal cover 133 may be disposed at a front end of the first heat dissipation panel 132.
  • the metal cover 133 may include a cover body.
  • the cover body may be provided with an avoidance member configured to avoid components such as a display screen and a lens.
  • the cover body may be connected with an edge extending backwardly.
  • the first heat dissipation panel 132 may extend to abut against at least a portion of the edge and/or at least a portion of the cover body, such that the heat of the first heat dissipation panel 132 may be transferred to the metal cover 133.
  • the metal cover 133 may be disposed under the external housing 19 of the action camera 1, and be thermally connected with the first heat dissipation panel 132.
  • the metal cover 133 may be located inside the external housing 19, i.e., the metal cover 133 may be enclosed within the external housing 19, and the metal cover 133 may be in thermal contact with the external housing 19.
  • the external housing 19 may be in contact with air outside of the action camera 1, such that the heat of the first heat dissipation panel 132 may be transferred to the metal cover 133, and the metal cover 133 may dissipate the heat outside of the action camera 1 by exchanging heat with the air outside of the action camera 1 through the external housing 19, thereby realizing heat dissipation.
  • the metal cover 133 can quickly conduct out the heat of the first heat dissipation panel 132, thereby improving the heat dissipation effect for heat generating components of the action camera 1 such as the main chip 11.
  • the heat dissipation assembly may also include a first heat conducting pad.
  • the first heat conducting pad may be in thermal contact with the first heat dissipation panel 132, and the first heat conducting pad may be in thermal contact with the metal cover 133.
  • the first heat conducting pad may have a flake-shaped structure having certain elasticity that is made of a heat conducting medium, such as a flake-shaped structure having certain elasticity that is made of a heat conducting silicone gel.
  • the first heat conducting pad may suitably fill a gap between the first heat dissipation panel 132 and the metal cover 133, such that there is a relatively large contacting area between the first heat dissipation panel 132 and the metal cover 133, thereby improving the heat transfer efficiency between the first heat dissipation panel 132 and the metal cover 133, which is advantageous for improving the heat dissipation effect on the action camera 1.
  • the heat dissipation assembly may include a lens cover 134.
  • At least a portion of the lens cover 134 may be made of a metal material that makes the lens cover 134.
  • the lens cover 134 may be disposed to cover a lens 15 of the action camera 1 to protect the lens 15.
  • the metal cover 133 may be provided with a lens cover mounting member 1331 configured to mount the lens cover 1334.
  • the lens cover mounting member 1331 may be disposed at a right upper portion of the metal cover 133.
  • the lens cover 134 has an excellent heat conductivity, and at least a portion of the lens cover 134 that covers the lens 15 is exposed to the outside, i.e., at least a portion of the lens cover 134 is in contact with the air outside of the action camera 1; additionally, because the lens cover 134 is connected with the lens cover mounting member 1331 of the metal cover 133, i.e., the lens cover 134 is connected and in contact with the metal cover 133, the heat transferred by the first heat dissipation panel 132 to the metal cover 133 can also be quickly conducted out through the lens cover 134.
  • the configuration of the first heat dissipation panel 132 being distributed circumferentially along at least a portion of the lens cover mounting member 1331, such that there is a relatively large contacting area between the first heat dissipation panel 132 and the metal cover 133, which can also avoid the first heat dissipation panel 132 affecting components such as the lens 15, is advantageous for the compactness of the action camera 1, advantageous for the miniaturization of the action camera 1, and advantageous for the portability of the action camera 1.
  • an avoidance member may be disposed in a region of the first heat dissipation panel 132 corresponding to the lens cover mounting member 1331.
  • the avoidance member may be configured to dispose components such as the lens 15.
  • the avoidance member may be an avoidance hole.
  • the first heat dissipation panel 132 may be disposed along the entire circumference of the lens cover mounting member 1331.
  • the avoidance member may be an avoidance groove. Then, the first heat dissipation panel 132 may be disposed along a portion of the circumference of the lens cover mounting member 1331.
  • the lens cover mounting member 1331 may be a protrusion member on the metal cover 133 facing away from the first heat dissipation panel 132.
  • the protrusion member may be provided with a thread.
  • the lens cover 134 may be connected with the metal cover 133 through the thread, such that there is a relatively large contacting area between the metal cover 133 and the lens cover 134, thereby improving the heat transfer efficiency between the metal cover 133 and the lens cover 134, which may be convenient for detaching the lens cover 134.
  • the protrusion member may be provided with an external thread.
  • the lens cover 134 may be provided with an internal thread. As such, at least a portion of the protrusion member may be inserted into the lens cover 134, and the protrusion member may be connected with the lens cover 134 through the threads.
  • the protrusion member may be provided with an internal thread, and the lens cover 134 may be provided with an external thread. As such, at least a portion of the lens cover 134 may be inserted into the protrusion member, and the protrusion member is connected with the lens cover 134 through the threads.
  • the heat conducting ring 1342 may be a heat conducting body to contact and couple with the lens 15, and may conduct out the heat from a contacting surface that contacts the lens 15.
  • a portion of the heat of the heat conducting ring 1342 may be conducted out, thereby realizing the function of dissipating heat from the lens 15.
  • the metal heat dissipation ring 1341 may be a beryllium-copper alloy heat dissipation ring.
  • the beryllium-copper alloy is a highly efficient heat conducting metal material.
  • the heat conductivity is not smaller than 105w/m.k, which is 6 times of that of the stainless steel, and has an excellent heat conducting effect, which can ensure the heat dissipation effect of the action camera 1.
  • the bearing member 1341a may be located at an end of the inner wall of the metal heat dissipation ring 1341.
  • an end of the heat conducting ring 1342 may abut against the bearing member 1341a, and another end of the heat conducting ring 1342 may flush with the end of the metal heat dissipation ring 1341.
  • the bearing member 1341a occupies as little inner wall space of the metal heat dissipation ring 1341 as possible.
  • the remaining portion of the inner wall of the metal heat dissipation ring 1341 may all be configured to contact and couple with the heat conducting ring 1342, to increase the area of the heat conducting ring 1342 to a maximum degree, thereby improving the heat dissipation effect on the lens 15.
  • the bearing member 1341a may be formed at the inner wall of the metal heat dissipation ring 1341 in a ring shape along the circumference of the metal heat dissipation ring 1341, can fully contact the heat conducting ring 1342 to achieve the best supporting effect.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Electromagnetism (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Studio Devices (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
  • Cameras Adapted For Combination With Other Photographic Or Optical Apparatuses (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Blocking Light For Cameras (AREA)
EP19742275.1A 2019-04-28 2019-04-28 Wärmeableitungsanordnung und aktionskamera Not-in-force EP3751973B1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2019/084839 WO2020220166A1 (zh) 2019-04-28 2019-04-28 散热组件及运动相机

Publications (3)

Publication Number Publication Date
EP3751973A1 true EP3751973A1 (de) 2020-12-16
EP3751973A4 EP3751973A4 (de) 2020-12-16
EP3751973B1 EP3751973B1 (de) 2021-12-15

Family

ID=67855267

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19742275.1A Not-in-force EP3751973B1 (de) 2019-04-28 2019-04-28 Wärmeableitungsanordnung und aktionskamera

Country Status (5)

Country Link
US (2) US10701249B1 (de)
EP (1) EP3751973B1 (de)
JP (1) JP6949127B2 (de)
CN (1) CN110235059B (de)
WO (1) WO2020220166A1 (de)

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US9995990B2 (en) 2015-12-15 2018-06-12 Gopro, Inc. Removable camera lens cover
WO2020220166A1 (zh) * 2019-04-28 2020-11-05 深圳市大疆创新科技有限公司 散热组件及运动相机
TWI747159B (zh) * 2020-02-12 2021-11-21 大陸商深圳市釩德電子有限公司 高效散熱攝像機模組及攝像裝置
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US20200344395A1 (en) 2020-10-29
EP3751973B1 (de) 2021-12-15
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JP6949127B2 (ja) 2021-10-13
CN110235059B (zh) 2022-06-24
WO2020220166A1 (zh) 2020-11-05
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