EP3615746B1 - Procédé de fabrication d'un panneau de plancher à couche d'isolation acoustique - Google Patents

Procédé de fabrication d'un panneau de plancher à couche d'isolation acoustique Download PDF

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Publication number
EP3615746B1
EP3615746B1 EP18728036.7A EP18728036A EP3615746B1 EP 3615746 B1 EP3615746 B1 EP 3615746B1 EP 18728036 A EP18728036 A EP 18728036A EP 3615746 B1 EP3615746 B1 EP 3615746B1
Authority
EP
European Patent Office
Prior art keywords
layer
sound
holding profile
floor panel
floor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP18728036.7A
Other languages
German (de)
English (en)
Other versions
EP3615746A1 (fr
Inventor
Ralf Eisermann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Windmoeller GmbH
Original Assignee
Windmoeller GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Windmoeller GmbH filed Critical Windmoeller GmbH
Priority to PL18728036T priority Critical patent/PL3615746T3/pl
Publication of EP3615746A1 publication Critical patent/EP3615746A1/fr
Application granted granted Critical
Publication of EP3615746B1 publication Critical patent/EP3615746B1/fr
Active legal-status Critical Current
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Classifications

    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
    • E04F15/00—Flooring
    • E04F15/18—Separately-laid insulating layers; Other additional insulating measures; Floating floors
    • E04F15/20—Separately-laid insulating layers; Other additional insulating measures; Floating floors for sound insulation
    • E04F15/206—Layered panels for sound insulation
    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
    • E04F15/00—Flooring
    • E04F15/02—Flooring or floor layers composed of a number of similar elements
    • E04F15/0215—Flooring or floor layers composed of a number of similar elements specially adapted for being adhesively fixed to an underlayer; Fastening means therefor; Fixing by means of plastics materials hardening after application
    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
    • E04F15/00—Flooring
    • E04F15/02—Flooring or floor layers composed of a number of similar elements
    • E04F15/10—Flooring or floor layers composed of a number of similar elements of other materials, e.g. fibrous or chipped materials, organic plastics, magnesite tiles, hardboard, or with a top layer of other materials
    • E04F15/102—Flooring or floor layers composed of a number of similar elements of other materials, e.g. fibrous or chipped materials, organic plastics, magnesite tiles, hardboard, or with a top layer of other materials of fibrous or chipped materials, e.g. bonded with synthetic resins
    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
    • E04F15/00—Flooring
    • E04F15/02—Flooring or floor layers composed of a number of similar elements
    • E04F15/10—Flooring or floor layers composed of a number of similar elements of other materials, e.g. fibrous or chipped materials, organic plastics, magnesite tiles, hardboard, or with a top layer of other materials
    • E04F15/107—Flooring or floor layers composed of a number of similar elements of other materials, e.g. fibrous or chipped materials, organic plastics, magnesite tiles, hardboard, or with a top layer of other materials composed of several layers, e.g. sandwich panels

Definitions

  • the invention relates to a method for producing a floor panel which can be laid on a sub-floor and has a carrier plate with an upper side and a lower side.
  • a floor panel in which the carrier plate or the core is made of MDF or HDF.
  • the floor panel has a first edge with a first retaining profile and a second edge with a second retaining profile that can be connected to the first retaining profile of a floor panel of the same construction.
  • the first retaining profile and the second retaining profile are designed such that they are locked in the connected state in the horizontal direction, that is, parallel to a laying plane of the floor and transversely to the first edge or second edge. It is therefore not possible to pull apart floor panels connected to one another in this way in the horizontal direction across the edges.
  • the first retaining profile and the second retaining profile also ensure locking in the vertical direction (i.e.
  • a coherent floor covering can be provided from several floor panels laid in rows. Due to the holding profiles, which prevent adjacent floor panels from drifting apart, the floor panels can be laid floating on the sub-floor in a simple manner and do not have to be glued to the sub-floor. It is also possible to dispense with an adhesive insert for connecting the floor panels to one another, which simplifies laying.
  • a disadvantage of floating installation is that cavities are created as resonance bodies between the installed floor panels and the subsurface, which are disadvantageous for room sound.
  • the DE 10 2005 024 438 A1 shows a floor panel with a core made of wood material, in which retaining profiles are introduced. Under the core, the floor panel has a soundproofing layer that can be glued to the sub-floor with an adhesive layer. From the WO 00/70168 A1 a sound insulation device for floor coverings is known, the proposed sound insulation material being polyurethane with mineral fillers.
  • the invention is therefore based on the object of providing a method for producing a floor panel that can be easily produced and installed and that has good acoustic properties.
  • the soundproofing material is applied to the carrier layer in liquid form. Only after the liquid sound insulation material has hardened is the sound insulation layer connected to the carrier plate. Any changes in the volume of the sound insulation material associated with the hardening can therefore not lead to undesired stresses in the carrier plate.
  • the density of the sound insulation material is between 800 and 1500 kg / m 3 .
  • the sound insulation layer has a support layer for the sound insulation material on an inside facing the support plate.
  • the carrier layer is a layer of the floor panel on which the
  • Sound insulation material is applied before the sound insulation layer is connected to the carrier plate.
  • the carrier layer for the sound insulation material, the sound insulation material and the full-surface adhesive layer thus form a unit which is then connected to the carrier plate in a suitable manner.
  • the floor panel has very good acoustic properties. This is especially true when the peelable protective layer is peeled off the adhesive layer and the floor panel is adhering to the sub-floor. Thanks to the full-surface adhesive layer, voids between the floor panel and the sub-floor are largely avoided, so that the room noise can be reduced accordingly.
  • a preferred thickness of the sound insulation layer is 1 to 5 mm.
  • a good compromise between the use of materials and good acoustic behavior leads to a thickness of the sound insulation layer of 1.5 to 3 mm.
  • the thickness of the sound insulation layer is 2 mm +/- 10%.
  • the thickness of the soundproofing layer also extends to the carrier layer and the full-surface adhesive layer. The thickness of the carrier layer is, however, much smaller than the thickness of the actual sound insulation material.
  • an easy-to-install floor panel is provided in which the vibrations are additionally restricted by the mass of the sub-floor.
  • the floor panel therefore has particularly favorable behavior with regard to room sound, that is to say the sound that is reflected back into the room from the floor.
  • the floor panel does not necessarily have to be glued to the sub-floor.
  • the removable protective layer remains on the adhesive layer so that it does not take effect. This enables flexible reactions to situations in which the Floor panel is not possible or not desired.
  • cavities between the floor panel and the sub-floor may remain between the floor panel and the sub-floor, for example due to unevenness in the sub-floor, but due to the comparatively heavy sound insulation layer the floor panel has good acoustic properties even without the connection to the sub-floor.
  • the removable protective layer has a non-woven layer. If the removable protective layer remains on the full-surface adhesive layer, the non-woven layer serves to compensate for unevenness between the floor panel and the sub-floor and to reduce the impact sound conducted down through the sub-floor.
  • the sound insulation material is visco-elastic. This means that the sound insulation layer compensates for unevenness between the floor panel and the sub-floor, or more precisely, between the carrier plate and the sub-floor in such a way that it is elastically deformed on the one hand and, on the other hand, adapts to the unevenness like a viscous, plastic mass and can thus fill any cavities .
  • the sound insulation material comprises polyurethane.
  • the polyurethane can be obtained from an aromatic polyol from renewable raw materials, whereby the renewable raw materials can be, for example, vegetable oil such as castor oil, rapeseed oil or palm oil.
  • the soundproofing material can also be made of PVC, another plastic or another material.
  • the density of the sound insulation material can be adjusted with fillers. Sand, chalk, clay, minerals or glass can be used as inorganic fillers. However, organic fillers such as wood or plant fibers or polymer fillers such as polystyrene can also be used. In one embodiment, a density of the sound insulation material set in this way is 1000 to 1100 kg / m 3 .
  • the full-area adhesive layer is preferably permanently elastic.
  • the full-surface adhesive layer therefore does not harden and therefore cannot break if too great tensions occur between the floor panel and the sub-floor.
  • tensions across the laying plane can arise, for example, when the floor panel expands or contracts due to temperature fluctuations or fluctuations in humidity. It is also possible that the sub-floor will settle over time, causing great tension between the floor panel and the sub-floor.
  • the adhesive layer is designed in such a way that it loosens if the tension is too great, but can then develop its effect again due to its permanently elastic property.
  • connection between the floor panel and the sub-floor After the connection between the floor panel and the sub-floor has been released, a new connection, possibly with a small lateral offset compared to the previous state, can be established between the floor panel and sub-floor if the floor panel is pressed against the floor panel by a corresponding force from above, such as the weight of a person the ground is pressed.
  • the connection between adhesive layer and sub-floor, in particular the adhesive layer can be such that the adhesive force parallel to the laying plane is smaller by a factor of x than the adhesive force perpendicular to the laying plane or perpendicular to the sub-floor.
  • the factor x can have values between 1.2 to 10, preferably 2 to 5.
  • the material of the full-surface adhesive layer can differ from the actual sound insulation material.
  • the material can be an adhesive that is applied separately to the soundproofing material.
  • a thickness of the adhesive layer (for example 100 to 500 ⁇ m) can be significantly smaller than the thickness of the actual sound insulation material (for example less than 20%).
  • the material of the adhesive layer can be the sound insulation material itself, so that the full-area adhesive layer does not represent a separate layer from the sound insulation material. In this case, the sound insulation material must be adjusted in such a way that an appropriate adhesive effect is achieved at room temperature.
  • An adhesive layer made of glue can be provided between the carrier layer of the sound insulation layer and the carrier plate.
  • the carrier layer of the sound insulation layer can be made of polyester, a preferred material being PET.
  • the carrier layer of the sound insulation layer can also perform the function of a vapor barrier or a vapor barrier, so that moisture cannot reach the carrier plate from the sub-floor.
  • the carrier layer of the soundproofing layer can act as a compensating layer for the decorative layer attached to the top of the carrier plate.
  • the carrier plate is made of a comparatively inexpensive wood material such as MDF or MDF. Preferred thicknesses of the carrier plate are between 4 and 10 mm.
  • the decorative layer can comprise a decorative paper which is soaked in melamine resin.
  • An overlay to protect the decorative layer can be provided over the decorative layer.
  • the overlay can include a paper layer that is also soaked in melamine resin. Mineral particles such as corundum can be used in the overlay to increase abrasion and strength resistance. Coarse corundum (for example 30 to 80 ⁇ m particle size) is preferably arranged below the overlay paper layer and fine corundum (for example 1 to 15 ⁇ m particle size) above the overlay paper layer.
  • the upper layers of the floor panel are classic laminate panels with an MDF / HDF core.
  • this classic structure is supplemented by a soundproofing layer attached to the underside of the core, which can be glued to the sub-floor.
  • the result is a system laminate that combines the classic laminate panel with MDF / HDF core in one unit with a sound insulation system that optionally integrates the sub-floor into the sound insulation.
  • a third edge with a third retaining profile and a fourth edge with a fourth retaining profile are provided, the third retaining profile and the fourth retaining profile of a further floor panel being designed in such a way that, in the connected state, they are parallel to the laying plane and transversely in the horizontal direction are locked to the third edge. It is therefore no longer possible to pull floor panels connected in this way apart horizontally.
  • the third retaining profile and that would retaining profile can also be locked in the connected state in the vertical direction perpendicular to the laying plane. Then it is also not possible to separate floor panels connected in this way by a vertical movement at these edges.
  • the third retaining profile can preferably be connected by a vertical movement relative to the fourth retaining profile (of the further floor panel). If the first retaining profile and the second retaining profile can be connected by angling, a floor panel can be connected to floor panels of a previously laid row and to a floor panel of the same row simultaneously by a single pivoting movement (folddown technology).
  • the advantage of such an installation method is that the adhesive layer previously exposed by peeling off the protective layer is lowered onto the sub-floor from above by the pivoting or folding movement. Moving the floor panels parallel to the laying plane, which would not be practical due to the adhesion between the adhesive layer and the subfloor, is not necessary with this laying method.
  • the various holding profiles are preferably only produced after the sound insulation layer has been connected to the carrier plate.
  • the invention is explained in more detail using an exemplary embodiment shown in the drawing.
  • the single figure shows schematically the layer structure of a floor panel, which is designated with 1 in its entirety.
  • the floor panel is preferably a rectangular panel with a length of 100 cm to 200 cm and a width of 15 cm to 30 cm.
  • a first edge and a second edge parallel to the first edge can also be referred to as longitudinal edges, while a third edge and a fourth edge of the rectangular panel can be referred to as front edges or short edges.
  • the floor panel 1 has a carrier plate or core 10 made of MDF or HDF.
  • a decorative layer 20 is provided, which can comprise a decorative paper soaked in melamine resin.
  • a wear layer 30 is provided above the decorative layer 20. It can comprise a paper layer which, like the decorative paper, can be impregnated in melamine resin.
  • a sound insulation layer 40 is provided on an underside 12 of the carrier plate. It comprises a carrier layer 41, a middle layer 42 on a soundproofing material 43 made of polyurethane and an adhesive layer 44.
  • the adhesive layer 42 is made of a material that is different from the soundproofing material 43.
  • the adhesive layer 44 is covered by a removable protective layer 50.
  • the protective layer 50 can be a siliconized film, for example.
  • the adhesive layer 44 makes it possible to connect the floor panel 1 to a sub-floor 2 in order to avoid voids between the floor panel 1 and sub-floor 2 and to use the mass of the sub-floor 2 for noise reduction.
  • the sub-floor 2 extends parallel to the laying plane of the floor panel 1.
  • the carrier layer 41 can be made of polyester and is connected to the carrier plate 10 together with the composite consisting of carrier layer 41, middle layer 42 with soundproofing material 43, adhesive layer 44 and protective layer 45 during the production of the floor panel.
  • an adhesive layer 60 for example made of glue, is provided on its underside 11.
  • a possible separate compensating layer that can be arranged on the underside of the carrier plate 10 is not shown in the figure. If a separate compensation layer is provided, the carrier layer 41 is connected to the remaining layers 42, 44 and 45 with this compensation layer by means of the adhesive layer 50.
  • polyurethane is applied to the carrier layer 41 as a sound insulation material 43 in liquid form.
  • the polyurethane hardens through the application of heat. After curing has taken place, the adhesive layer 44 and the removable protective layer 45 are then applied.
  • the carrier plate 10 can be pressed together with the layers 20, 30 and any compensating layer to form an intermediate laminate, this intermediate laminate corresponding to a classic laminate panel with an MDF / HDF core.
  • this intermediate laminate On the underside of this intermediate laminate, the composite consisting of carrier layer 41, middle layer 42 with sound-absorbing material 43 and layers 44, 45 is then glued.
  • the processing of the edges of the carrier plate 10 for the production of holding profiles can take place before the carrier layer 41 is glued to the carrier plate 10 or only after the carrier layer 41 has been glued.

Claims (11)

  1. Procédé de fabrication d'un panneau de plancher (1) à poser sur un sous-plancher (2), comprenant
    - une plaque de support (10) avec une face supérieure (11) et une face inférieure (12),
    - une couche décorative (20) fournie au niveau de la face supérieure (11) de la plaque de support (10),
    - un premier chant avec un premier profil de retenue,
    - un deuxième chant avec un deuxième profil de retenue, qui peut être relié au premier profil de retenue d'un panneau de plancher de structure identique, dans lequel le premier profil de retenue et le deuxième profil de retenue sont conçus pour, lorsqu'ils sont dans un état où ils sont reliés, être verrouillés, dans la direction horizontale parallèlement à un plan de pose et transversalement par rapport au premier chant ainsi que dans la direction verticale perpendiculairement au plan de pose,
    - une couche d'isolation acoustique (40) fournie au niveau de la face inférieure (12) de la plaque de support (10) et constituée d'un matériau d'isolation acoustique (43), dans lequel la couche d'isolation acoustique (40) présente, dans la position d'insertion du panneau de plancher (10) et au niveau d'une face extérieure dirigée vers le sous-plancher (2), une couche adhésive (44) couvrant essentiellement toute la surface,
    - une couche de protection (50) retirable destinée à la couche adhésive (44),
    dans lequel la densité du matériau d'isolation acoustique (43) est comprise entre 800 et 1500 kg/m3, dans lequel la couche d'isolation acoustique (40) présente au niveau d'une face intérieure dirigée vers la plaque de support (10) une couche de support (41) destinée au matériau d'isolation acoustique (43), dans lequel le matériau d'isolation acoustique (43) est appliqué sous forme liquide sur la couche de support (41), et dans lequel la couche d'isolation acoustique (40) n'est reliée à la plaque de support (10) qu'après le durcissement du matériau d'isolation acoustique (43) liquide.
  2. Procédé selon la revendication 1, caractérisé en ce que le matériau d'isolation acoustique (43) est viscoélastique.
  3. Procédé selon la revendication 1 ou 2, caractérisé en ce que le matériau d'isolation acoustique (43) comprend du polyuréthane.
  4. Procédé selon la revendication 3, caractérisé en ce que le polyuréthane est composé de composants polyuréthanes aromatiques.
  5. Procédé selon l'une quelconque des revendications 1 à 4, caractérisé en ce que la couche adhésive (44) couvrant toute la surface est élastique de manière permanente.
  6. Procédé selon l'une quelconque des revendications 1 à 5, caractérisé en ce que la couche de protection (50) retirable présente une couche non tissée.
  7. Procédé selon l'une quelconque des revendications 1 à 6, caractérisé en ce que la couche de support (41) de la couche d'isolation acoustique (40) est en polyester.
  8. Procédé selon l'une quelconque des revendications 1 à 7, caractérisé en ce que la plaque de support (10) est en un matériau à base de bois tel que du MDF (panneau de fibres à densité moyenne) ou du HDF (panneau de fibres à haute densité).
  9. Procédé selon l'une quelconque des revendications 1 à 8, caractérisé en ce qu'un troisième chant avec un troisième profil de retenue et un quatrième chant avec un quatrième profil de retenue sont fournis, dans lequel le troisième profil de retenue et le quatrième profil de retenue d'un autre panneau de plancher, lorsqu'ils sont dans un état où ils sont reliés, sont conçus pour être verrouillés dans la direction horizontale parallèlement au plan de pose et transversalement par rapport au troisième chant.
  10. Procédé selon la revendication 9, caractérisé en ce que le troisième profil de retenue et le quatrième profil de retenue, lorsqu'ils sont dans un état où ils sont reliés, sont verrouillés dans la direction verticale perpendiculairement au plan de pose.
  11. Procédé selon la revendication 9 ou 10, caractérisé en ce que le troisième profil de retenue peut être relié grâce à un mouvement vertical par rapport au quatrième profil de retenue.
EP18728036.7A 2017-04-28 2018-04-26 Procédé de fabrication d'un panneau de plancher à couche d'isolation acoustique Active EP3615746B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PL18728036T PL3615746T3 (pl) 2017-04-28 2018-04-26 Sposób wytwarzania panelu podłogowego z warstwą izolacji dźwiękowej

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102017109280.3A DE102017109280A1 (de) 2017-04-28 2017-04-28 Fußbodenpaneel mit Schalldämmschicht und Verfahren zur Herstellung des Fußbodenpaneels
PCT/EP2018/060671 WO2018197597A1 (fr) 2017-04-28 2018-04-26 Panneau de plancher à couche d'isolation acoustique et procédé de fabrication du panneau de plancher

Publications (2)

Publication Number Publication Date
EP3615746A1 EP3615746A1 (fr) 2020-03-04
EP3615746B1 true EP3615746B1 (fr) 2021-02-17

Family

ID=62455430

Family Applications (1)

Application Number Title Priority Date Filing Date
EP18728036.7A Active EP3615746B1 (fr) 2017-04-28 2018-04-26 Procédé de fabrication d'un panneau de plancher à couche d'isolation acoustique

Country Status (6)

Country Link
EP (1) EP3615746B1 (fr)
DE (1) DE102017109280A1 (fr)
DK (1) DK3615746T3 (fr)
ES (1) ES2865948T3 (fr)
PL (1) PL3615746T3 (fr)
WO (1) WO2018197597A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023097110A1 (fr) * 2021-11-29 2023-06-01 Shaw Industries Group, Inc. Article acoustique, élément décoratif et système le comprenant

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE1010487A6 (nl) 1996-06-11 1998-10-06 Unilin Beheer Bv Vloerbekleding bestaande uit harde vloerpanelen en werkwijze voor het vervaardigen van dergelijke vloerpanelen.
AU2797700A (en) * 1999-05-18 2000-12-05 Witex Ag Sound-proofing device for floor coverings
DE29908733U1 (de) * 1999-05-18 1999-08-12 Witex Ag Schalldämmvorrichtung für Bodenbeläge
DE10354789B4 (de) 2003-11-21 2011-12-15 hülsta-werke Hüls GmbH & Co. KG. Paneel und Belag
DE102005024438B4 (de) * 2005-05-24 2016-08-18 Hülsta-Werke Hüls Gmbh & Co. Kg Paneel
DE202015106139U1 (de) * 2015-11-13 2017-02-16 Wpt Gmbh Unterlegematte für Fußbodenbeläge

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
None *

Also Published As

Publication number Publication date
PL3615746T3 (pl) 2021-07-05
DK3615746T3 (da) 2021-03-22
EP3615746A1 (fr) 2020-03-04
WO2018197597A1 (fr) 2018-11-01
DE102017109280A1 (de) 2018-10-31
ES2865948T3 (es) 2021-10-18

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