EP3537541A1 - Elektromagnetische entkoppelung - Google Patents

Elektromagnetische entkoppelung Download PDF

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Publication number
EP3537541A1
EP3537541A1 EP19161565.7A EP19161565A EP3537541A1 EP 3537541 A1 EP3537541 A1 EP 3537541A1 EP 19161565 A EP19161565 A EP 19161565A EP 3537541 A1 EP3537541 A1 EP 3537541A1
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EP
European Patent Office
Prior art keywords
antenna
microelectronic circuit
extension
zone
vias
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Granted
Application number
EP19161565.7A
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English (en)
French (fr)
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EP3537541B1 (de
Inventor
Fabien Leroy
Christopher Barratt
Michel BEGHIN
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Insight Sip
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Insight Sip
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Publication of EP3537541A1 publication Critical patent/EP3537541A1/de
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
    • H01Q1/521—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure reducing the coupling between adjacent antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/28—Combinations of substantially independent non-interacting antenna units or systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
    • H01Q9/0421—Substantially flat resonant element parallel to ground plane, e.g. patch antenna with a shorting wall or a shorting pin at one end of the element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/30—Resonant antennas with feed to end of elongated active element, e.g. unipole
    • H01Q9/42—Resonant antennas with feed to end of elongated active element, e.g. unipole with folded element, the folded parts being spaced apart a small fraction of the operating wavelength

Definitions

  • GHz gigahertz
  • wireless communicating systems which are increasingly used daily, and often almost permanently, by an ever-increasing user population, all have antennas for receiving and, more often than not, to transmit signals in the frequency band defined by the technical standard that governs them. It is mainly mobile phones, including those obeying the so-called GSM standard, the acronym for "global system for mobile communications" which defines a communication standard whose geographical coverage is worldwide.
  • GPS Global positioning system
  • the wireless network can be designed to cover only a limited geographical area such as Wi-Fi, or even very restricted, such as the standard called “Bluetooth®” which allows communication up to ten meters of terminals between them.
  • the antennas of the above devices must nevertheless be able to maintain optimum efficiency in the entire band of frequencies where they must operate. This efficiency depends on losses which are intrinsic to the antenna and which are measured most commonly using the so-called "S" parameters, of the English “scattering parameters” which make it possible to qualify the behavior of the antenna between the propagation medium on the one hand and the electronic control circuit on the other hand.
  • S parameters have been designed and are used to measure and qualify the behavior of passive or active linear circuits operating in the frequency range referred to above often referred to as microwave or radio frequency (RF) in the technical literature. on these topics.
  • the adaptation of the antenna is defined in particular by the parameter S11 which represents the losses by reflection of the antenna. It is expressed in decibels (dB). The lower the value of S11, the better the adaptation and therefore the better the overall efficiency of the antenna.
  • the parameter S11 which is frequency dependent, makes it possible to define the bandwidth of the antenna, that is to say the frequency band in which S11 remains below a given threshold which is typically defined at a level of - 6dB. Under these conditions, a quarter of the power delivered by the electronic control circuit is lost by reflection and three quarters are therefore usefully radiated by the antenna.
  • the bandwidth of an antenna can be more or less wide. It is often expressed as a percentage of its center frequency. An antenna whose bandwidth is a few percent is considered to have a narrow band of operation. This type of antenna is well suited for certain applications. For example, for a GPS receiver, an antenna whose bandwidth is of the order of 2% is sufficient.
  • An antenna with a bandwidth equal to or greater than 15% is considered to have a wide bandwidth. Those whose bandwidth is greater than or equal to 20% benefit from a very wide bandwidth. Note that to qualify this type of antennas the acronym "UWB”, the English “ultra wide band”, is also often used.
  • a very broadband antenna potentially offers many advantages.
  • a single broadband antenna can then simultaneously cover several radio frequency standards. This makes it possible to reduce the number of antennas that must be able to be implemented in multiservice wireless devices such as smart phones, which gives not only a certain advantage in terms of cost but also allows to overcome technical problems that are difficult to solve otherwise, such as the parasitic coupling that can occur between the different antennas of the same smart phone.
  • the patent publication US 2014/085158 A1 discloses an antenna device with a part for decoupling between two antennas placed in a plane. This device may have different shapes, depending on the folding configuration of the metal element that constitutes it. The manufacturing methods of such a decoupling part are very rudimentary.
  • the device is further characterized in that it further comprises an electromagnetic decoupling module of the first antenna and the second antenna, carried by a third zone of said microelectronic circuit arranged between the first zone and the second zone. , preferably the electromagnetic decoupling module being disposed between the first antenna and the second antenna;
  • the electromagnetic decoupling module comprises at least one raised structure relative to said microelectronic circuit and at least one connecting element of said structure raised to said microelectronic circuit.
  • the decoupling portion is raised relative to the main plane of the microelectronic circuit and is supported by an overmolding, a connecting element in the form of a plurality of vias passing through the overmolding so as to connect the decoupling part. elevated to the rest of the device, and advantageously to the mass.
  • the provisions of the invention make it possible to use a deposition technique, in particular a metal deposition, to form the raised structure, offering great flexibility of shape, with a potentially very small thickness.
  • the assembly is mechanically coherent and stronger than the prior art by the presence of the overmoulding element.
  • the manufacture of the decoupling module can be widely shared with the manufacture of at least one of the antennas.
  • the overmoulding phase and, potentially, the polishing phase of the overmolding can be pooled.
  • this common overmoulding then defines a single electrically conductive deposition plane for forming antenna portions of the decoupling portions.
  • the present invention makes it possible to have a device for transmitting and / or receiving radio frequency signals comprising two antennas having no or very little electromagnetic coupling with each other.
  • the present invention comprises an electromagnetic decoupling module between each of the first and second antennas of the device for transmitting and / or receiving radio frequency signals.
  • This electromagnetic decoupling module advantageously has an electrically conductive surface electrically connected by means of electrically conductive vias to the device for transmitting and / or receiving radio frequency signals.
  • this electromagnetic decoupling module is disposed between the first antenna and the second antenna.
  • the use of an electrically conductive surface accompanied by a plurality of electrical conductive vias extending in a direction orthogonal to said electrical conductive surface makes it possible to reinforce the electromagnetic decoupling between the first and the second antenna.
  • This makes it possible to form an electromagnetic shield comprising two parts, a first part consisting of the electrical conductive surface and a second part consisting of the plurality of electrical conductor vias.
  • the present invention also provides an electromagnetic decoupling module having an electrically conductive surface with respect to a portion of the microelectronic circuit and preferably raised relative to the microelectronic circuit by means of the vias electrically conductive. This allows a greater compactness of the device for transmitting and / or receiving radio frequency signals.
  • the use of electrical conducting vias for raising the elevated structure of the electromagnetic decoupling module provides a surface gain at the level of the microelectronic circuit which can be exploited to place microelectronic components, for example below the electromagnetic decoupling module. .
  • two planes are considered parallel to each other, two planes having no coplanar deviation or having negligible deviation with respect to industrial tolerances, in particular less than 10 degrees and preferably less than 5 degrees.
  • a broadband antenna also called “UWB” means an antenna configured to operate in a frequency band ranging from a few megahertz to a few tens of gigahertz, for example between 3000 MHz and 11000 MHz. MHz.
  • the present invention finds the preferred field of application antennas boxed or AIP, acronym for the English “antenna in package”. This field covers all the solutions that make it possible to implement in one and the same device: the radiofrequency chip for transmitting and receiving the radiofrequency signals; the antenna or antennas and their matching networks as well as other radio frequency components.
  • the present invention rests in part at least on a manufacturing technique which surprisingly happens to be in perfect adequacy with the requirements required by this technical field.
  • vias are manufactured to form conductive elements between a raised portion above the substrate and the surface thereof.
  • the present invention advantageously takes advantage of the Bond Via Array (BVA TM) technique (see in particular the article "BVA: Molded Cu Wire Contact Solution for Very High Density Package-on-Package ( PoP) Applications, Vern Solberg and Ilyas Mohammed Invensas Corporation, 02/06/2013) which allows the construction of connected vias on a circuit microelectronics extending perpendicular to the extension plane of the microelectronic circuit.
  • BVA TM Bond Via Array
  • FIG 4a represents a microelectronic circuit 2 according to a sectional view.
  • This microelectronic circuit 2 comprises a substrate 3 and a plurality of microelectronic components 4.
  • the figure 4b illustrates the formation of the mechanical and electrical connection elements 12, 32. These connecting elements are electrical conductive vias 12, 32.
  • the connecting elements are conducting wires. They are preferably formed from an electrically conductive micro-wire advantageously welded to a part of the microelectronic circuit 2 and then straightened in a vertical position, that is to say in a direction orthogonal to the main extension plane of the substrate 3.
  • the electrical conducting vias 12, 32 have a diameter, according to their transverse dimension, of between 10 .mu.m and 500 .mu.m, preferably between 20 .mu.m and 250 .mu.m and advantageously equal to 50 .mu.m.
  • the spacing between two electrical conductive vias 12, 32 is between 150 ⁇ m and 500 ⁇ m, preferably between 300 ⁇ m and 3000 ⁇ m and advantageously between 250 ⁇ m and 1000 ⁇ m.
  • the height dimension of the conductive vias 12, 32 is between 100 ⁇ m and 5000 ⁇ m, preferably between 750 ⁇ m and 3000 ⁇ m and advantageously equal to 1500 ⁇ m.
  • the electrical conducting vias 12, 32 comprise at least one electrically conductive material is taken from at least: copper, gold, silver, aluminum, or an alloy formed by all or part of these elements.
  • connection elements then form electrical conducting vias 12, 32 extending from the substrate 3 in a direction orthogonal to the main extension plane of the substrate 3.
  • Each via electrical conductor 12, 32 has a proximal end 12a, 32a integral with the substrate 3 and a distal end 12b, 32b intended to be secured to at least one metallized surface to be formed.
  • the figure 4c represents the overmolding step of the microelectronic circuit 2.
  • This overmoulding is advantageously made from one or more resin-type polymers commonly used in microelectronics.
  • this resin 5 is deposited in a height dimension smaller than the height dimension of the connecting elements 12, 32.
  • overmolding is carried out so that the resin 5 covers the connecting elements 12, 32, that is to say that the resin 5 used for overmolding is preferably deposited in a height dimension greater than the dimension in height of the connecting elements 12, 32.
  • the distal end 12b, 32b of the electrical conductive vias 12, 32 is then embedded in the resin 5.
  • the height dimension of the resin 5 is between 100 ⁇ m and 5000 ⁇ m, preferably between 750 ⁇ m and 3000 ⁇ m and advantageously equal to 1500 ⁇ m.
  • an overmolding technique in particular with a resin, makes it possible to take advantage of a liquid phase for placing the overmolding element in the appropriate places and surrounding the vias, and then, after solidification of the overmoulding material (typically by polymerization of the resin) to have a solid element in effect to build the portions of the upper plane of overmolding, in particular by a deposition of conductive material.
  • a CMP type chemical mechanical polishing step may be necessary to reduce the height dimension of the resin at least up to the height dimension of the connecting members 12, 32 to expose at least the end distal 12b, 32b electrical conductive vias 12, 32.
  • this polishing step makes it possible, on the one hand, to define a raised flat surface relative to the microelectronic circuit 2 and, on the other hand, to expose the connection elements 12, 32, and preferably by locally spreading the distal end. 12b, 32b electrical conducting vias 12, 32 relative to said flat surface.
  • This spreading phenomenon comes from the polishing of the distal end 12b, 32b of the connecting elements 12, 32.
  • this local spreading of the material of which the connection elements 12, 32 are composed participates in the mechanical and mainly electrical connection of the electrical conducting vias 12, 32 with the electrical conductive surface (s) to be formed.
  • the figure 4e represents the formation of two electric conductive surfaces 11, 31.
  • the formation of each of these electric conductive surfaces 11, 31 comprises at least the deposition of at least one electrically conductive material.
  • this deposit may be a deposit by selective plasma spraying, for example, or by any other type of deposit allowing the formation of said electric conductive surfaces.
  • the deposition technique used is configured to allow the electrical connection between the distal end 12b, 32b of the electrical conductive vias 12, 32 and the deposited electrical conductive material.
  • the deposited electrical conductive material is taken from at least: copper, nickel, gold, silver, aluminum, palladium or an alloy formed by all or part of these elements.
  • the two electric conductive surfaces 11, 31 are formed at the same time and preferably from the same deposit of one or more electrically conductive materials.
  • a mask can be used to form from the same deposit two electric conductive surfaces 11, 31 disjoint, that is to say not integral with each other in their respective extension plane .
  • one or more masks may be used to form one or more electrically conductive surfaces 11, 31 which are distinct from one another and / or which have particular geometries, such as tracks, discs, circles, etc. ...
  • the figure 5a represents a substrate 3 comprising an electrical conductive zone 62 and an electrical non-conductive zone 63.
  • an electrical conductor wire 61 is welded at the electrically conductive area 61 as illustrated in FIG. figure 5a .
  • the wiring tool 60 unwinds a portion of the electrical conductor wire 61 before cutting it at the electrical non-conductive area 62 as illustrated in FIG. figure 5b .
  • the electrical conductor wire 61 cut is disposed in a position orthogonal to the main plane of the substrate 3 so as to define an electrical conductive via 12, as illustrated in FIG. figure 5c .
  • the present invention advantageously takes advantage of the BVA TM construction technique to, on the one hand, increase the compactness of the device for transmitting and / or receiving radio frequency signals and, on the other hand, to reduce the number of steps in the manufacturing process.
  • This manufacturing method also allows a better dimensional accuracy in the production of electrical conductive surfaces which is an essential factor in the operation of the electromagnetic elements since the resonance frequencies and the electromagnetic couplings are directly affected by the dimensional aspect of the electromagnetic elements. electromagnetic elements.
  • this allows a great flexibility in the design of the antennas element (s), in particular the possibility of placing one or more antennas in one or more optimal positions relative to their functions.
  • UWB high bandwidth antenna
  • this type of device has a first disadvantage with respect to the efficiency of this UWB antenna 10. Due to its electrical connection with the microelectronic circuit 2 only at the flanks 11e carriers of the antenna UWB 10, there remain parts of the UWB antenna 10 relatively electrically distant microelectronic circuit 2, involving an increase in the electrical resistance of the antenna UWB 10 in some places.
  • flanks 11e carriers of the UWB antenna 10 occupy a significant space on the microelectronic circuit 2 involving significant design constraints.
  • the present invention proposes a method of manufacturing a raised UWB type antenna solving at least in part these disadvantages and making it possible to meet at least partly the dual problem of efficiency and compactness.
  • the present invention therefore relates to the realization of a broadband antenna called "UWB" elevated relative to a microelectronic circuit.
  • the present invention allows the formation of a UWB antenna over a microelectronic circuit so as to reduce the size that this type of antenna can represent and so to increase its efficiency via a greater distribution of mechanical and electrical connections of said UWB antenna with the microelectronic circuit.
  • the present invention relates to a device for transmitting and / or receiving radio frequency signals comprising at least one microelectronic circuit extending in a main extension plane and in a main direction of extension. .
  • this radiofrequency transmission and / or reception device is further characterized in that it comprises a first antenna, preferably a UWB type broadband antenna, carried by a first zone of said microelectronic circuit and extending in a first extension plane, preferably parallel to said main extension plane and preferably disposed facing a portion of the microelectronic circuit.
  • a first antenna preferably a UWB type broadband antenna
  • the first antenna comprises at least a first raised structure relative to said microelectronic circuit and at least a first connecting element of said structure raised to said microelectronic circuit.
  • a device for transmitting and / or receiving radio frequency signals comprising a first antenna 10 of the UWB type.
  • This radiofrequency transmission and / or reception device has traditionally a microelectronic circuit 2 arranged on a substrate 3 and comprising a plurality of microelectronic components 4.
  • This microelectronic circuit 2 extends along a main extension plane and has a main extension dimension in a main direction.
  • the first antenna 10 for example of UWB type, has a first electrically conductive surface 11 raised by means of a first plurality of electrical conductive vias 12 electrically connecting this first electrically conductive surface 11 to the microelectronic circuit 2 and disposed above a first zone of the microelectronic circuit 2.
  • This first electrically conductive surface 11 extends in a first plane of extension preferably parallel to the main plane of extension of the microelectronic circuit 2.
  • the first zone represents at least 25%, preferably at least 50% and advantageously at least 65% of the surface of the microelectronic circuit 2.
  • the first plurality of electrical conductive vias 12 is disposed mainly on a part of the periphery of the microelectronic circuit 2 and in particular mainly on one side of the microelectronic circuit 2.
  • the first plurality of electrical conductor vias 12 may be disposed at a distance from the periphery of the microelectronic circuit 2, for example in an internal zone of the microelectronic circuit 2, that is to say at the level of microelectronic components. 4, for example between microelectronic components 4.
  • the number of electrical conducting vias of the first plurality of electrical conductor vias 12 is between 4 and 80, preferably between 8 and 40 and advantageously between 12 and 20.
  • first plurality of electrical conductor vias 12 may comprise electrical conductive vias 12 grouped in several groups so for example to electrically connect certain portions of the first electrical conductive surface 11 at different points of the microelectronic circuit 2 .
  • the spacing between two groups of electrical conductive vias 12 is between 150 .mu.m and 50000 .mu.m, preferably between 200 .mu.m and 10000 .mu.m and advantageously between 250 .mu.m and 3000 .mu.m.
  • the number of electrical conducting vias of the first plurality of electrical conductor vias 12 is greater at one side of the first antenna 10.
  • the first antenna 10 comprises at least one electrical conductor via the first plurality of electrical conductor vias 12 at each corner of its geometric shape.
  • the first antenna 10 can be arranged cantilevered, that is to say not be carried by a plurality of electrical conductive vias 12 at one or two contiguous sides.
  • the first antenna 10 is secured to the microelectronic circuit 2 at two contiguous sides, thus providing it cantilevered. This is particularly useful when the microelectronic component (s) 4 located under the first electrical conductive surface (11) prevent the provision of electrical conductor vias (12), or when the dimensions of the first electrical conducting surface (11) are such that one or more microelectronic components (4) make impossible the provision of additional electrical conductors vias 12.
  • this cantilevered arrangement allows a distribution of the planar currents, for example as in an antennal element of the PIFA type, that is to say a planar antennal device called "inverted F".
  • the first electrical conductive surface 11 has a first portion 11a and a second portion 11b mechanically and electrically connected to each other via a third portion 11c so as to define a slot 11d.
  • the second portion 11b has a lower surface than the first portion 11a, and a transverse extension, perpendicular to the main direction of extension of the microelectronic circuit 2, greater than that of the first portion 11a.
  • first 11a and the second 11b portions having distinct geometries and forming the first electrical conductive surface 11 allows the first antenna 10 to have several resonance frequencies.
  • the resonance frequencies of the different modes governing an antenna depend on the dimensions (width and length) of the latter and / or its different parts.
  • this first cantilevered antenna 10 allows a precise and easy adjustment of the dimensions of the first electrically conductive surface 11 and therefore the resonant frequencies of said first antenna 10, preferably without regard to the mechanical rigidity of the first antenna 10 since the first electrical conductive surface 11 is supported by overmolding, that is to say by the resin 5.
  • the electromagnetic coupling between the resonance modes of the same antenna characterizes the bandwidth thereof.
  • the geometry of the antenna directly influences its electromagnetic characteristics.
  • the electromagnetic coupling between the different resonance modes of the first antenna 10 varies according to the width of the slot 11d separating the first 11a and second 11b portions of the first electrical conducting surface 11.
  • the narrower the slot 11d the greater the electromagnetic coupling between the first portion 11a and the second portion 11b, which may be particularly advantageous in certain applications.
  • the slit 11d has a width dimension of between a few tens of micrometers and a few hundred micrometers, and preferably of the order of 100 microns.
  • the slot 11d has a width dimension of between 1 .mu.m and 1000 .mu.m, preferably between 25 .mu.m and 500 .mu.m and advantageously between 50 .mu.m and 150 .mu.m.
  • the present invention makes it possible to create one or more slots 11d of controlled width. Indeed, it is the process of forming the first electrically conductive surface 11 by physico-chemical deposition that achieves this control and accuracy.
  • a first group of electrical conductive vias 12 mechanically and electrically connects the first portion 11a of the first electrical conductive surface 11 to the microelectronic circuit 2
  • a second group of electrical conductive vias 12 mechanically and electrically connects the second portion. 11b of the first electrically conductive surface 11 to the microelectronic circuit 2.
  • the first electrical conductive surface 11 covers at least 25%, preferably at least 50% and advantageously at least 65% of the microelectronic circuit 2.
  • the present invention finds the preferred field of application antennas in a box or AIP, acronym for the English “antenna in package”, and this area is facing problems of efficiency and compactness.
  • the present invention advantageously takes advantage of the vias formation technique previously presented. Indeed, this technique allows the realization of the first antenna 10 raised above the microelectronic circuit. This advantageous arrangement allows a significant gain in compactness. As for the efficiency, this manufacturing method allows a very good reproducibility of the characteristics of the first antenna, a criterion necessary for the mass production of this type of device.
  • this method makes it possible to solve the problem of compactness and efficiency by allowing the formation of a plurality of electrical conductor vias, rather than continuous sections, electrically connecting to the microelectronic circuit an antenna of the following type.
  • UWB elevated relative to said microelectronic circuit.
  • Electromagnetic decoupling module Electromagnetic decoupling module :
  • the present invention relates to solving a dual problem of efficiency and compactness.
  • the AIP devices often have a plurality of antennas, and especially in the case where it has a UWB antenna, it may be necessary to use a second antenna, such as Bluetooth®, to increase the functionality of the device and to extend its modularity. It is in this type of situation that the present invention finds mainly application.
  • the present invention relates to a device for transmitting and / or receiving radiofrequency signals comprising an electromagnetic decoupling module cleverly arranged between a first antenna and a second antenna.
  • This electromagnetic decoupling module is designed both to allow each antenna to present performance whose characteristics tend to be independent of the presence of another antenna, and while having a footprint reduced through, among other things, a clever positioning and design.
  • the electromagnetic decoupling module comprises an elevated structure, formed for example of an electrical conductive surface, disposed above a portion of a microelectronic circuit between a first antenna and a second antenna, preferably in the same plane. than one of the two antennas.
  • the present invention can resort to the use of at least one connecting element, for example a plurality of vias electrically connected to the electrical conductive surface and to the microelectronic circuit, for example to raise said electrically conductive surface of the electromagnetic decoupling module.
  • the use of electrical conductor vias brings to the present invention on the one hand the possibility of raising the electrical conductive surface relative to the components of the microelectronic circuit, like one of the first and the second antenna, and secondly to enhance the electromagnetic shield phenomenon relative to each of the first and second antennas.
  • the vias electrically conductive participate in the phenomenon of electromagnetic shield between each of the first and second antennas.
  • the figure 1 previously presented illustrates the case of a device for transmitting and / or receiving radio frequency signals comprising a first antenna 10 of the UWB type and a second antenna 20 but not having an electromagnetic decoupling module.
  • This type of device for transmitting and / or receiving radio frequency signals generally has limited efficiency by the electromagnetic coupling between its different antennas.
  • this device for transmitting and / or receiving radiofrequency signals has a microelectronic circuit 2 disposed on a substrate 3 and comprising a plurality of microelectronic components 4.
  • this device comprises the first antenna 10 which may for example be of the UWB type produced as previously indicated.
  • the second antenna 20 for example an antenna configured for Bluetooth® applications, is disposed at a second zone of the microelectronic circuit and in a second extension plane preferably different from the first extension plane of the first antenna 10. , but preferably parallel thereto.
  • This second extension plane corresponds, for example, to the main extension plane of the microelectronic circuit 2.
  • This second antenna 20 has a second electrically conductive surface 21 electrically connected to the microelectronic circuit 2.
  • the second zone represents at least 15%, preferably at least 20% and advantageously at least 25% of the surface of the microelectronic circuit 2.
  • this second antenna 20 may have a coil shape extending mainly from the microelectronic circuit 2 according to a direction substantially collinear with the main direction of extension of the microelectronic circuit 2.
  • the second antenna 20 has a cross section, relative to its main extension dimension, increasing as it extends from the microelectronic circuit 2.
  • the second antenna 20 has a substantially two-dimensional geometric shape.
  • the second antenna 20 is directly electrically and mechanically connected to the microelectronic circuit 2.
  • the transverse extension of the second antenna 20 perpendicular to the main direction of extension of the microelectronic circuit 2 is less than or equal to the transverse extension of the microelectronic circuit 2
  • the longitudinal extension of the second antenna 20 relative to the main direction of extension of the microelectronic circuit 2 is less than or equal to the longitudinal extension of the microelectronic circuit 2.
  • the second antenna 20 may comprise a second electrical conductive surface 21 raised relative to the microelectronic circuit 2 by means for example of a second connecting element of the type vias electrical conductors for example and / or of the type solid vertical walls.
  • the figure 3a illustrates the variation of the inverse transmission coefficient S12 40 of this device for transmitting and / or receiving radio frequency signals when no electromagnetic decoupling module is provided.
  • the curve 41 corresponds to the case where an electromagnetic decoupling module 30 between the first antenna 10 and the second antenna 20 is made.
  • this electromagnetic decoupling module 30 in the frequency band between 4GHz and 7 GHz by way of example.
  • an electromagnetic decoupling module 30 allows the transmission device 1 and / or reception radio frequency signals to have enhanced radio frequency characteristics by limiting, and preferably suppressing, the electromagnetic coupling between the first and second antennas.
  • This electromagnetic decoupling module 30 is represented, according to one embodiment, in the Figures 2a and 2b which have a device 1 for transmitting and / or receiving radio frequency signals 1.
  • this device 1 for transmitting and / or receiving radiofrequency signals comprises a microelectronic circuit 2, a first zone carrying a first antenna 10 and a second zone carrying a second antenna 20.
  • this device 1 for transmitting and / or receiving radio frequency signals has a third zone carrying an electromagnetic decoupling module 30.
  • This electromagnetic decoupling module 30 advantageously comprises an elevated structure relative to said microelectronic circuit 2.
  • This third zone is preferably arranged between the first zone and the second zone in the main direction of extension of the microelectronic circuit 2.
  • This elevated structure advantageously comprises an electrically conductive surface 31 disposed in a third extension plane.
  • the electromagnetic decoupling module 30 comprises at least one connecting element extending from the microelectronic circuit 2, preferably from a portion of the third zone of the microelectronic circuit 2, to said raised structure.
  • the connecting element may comprise a substantially vertical solid wall extending from the microelectronic circuit 2 to said raised structure.
  • electrical conductor vias 32 in order to form this connecting element so as to electrically connect the raised structure, in particular the electrically conductive surface 31, to the microelectronic circuit 2. for example to his plan of mass.
  • electrical conductive vias 32 makes it possible to partially form at least one electromagnetic shielding for the microelectronic components 4 arranged between the electrically conductive surface 31 and the substrate 3 of the microelectronic circuit 2, in other words for the microelectronic components 4 arranged at the level of the third zone of the microelectronic circuit 2 with respect to the raised structure, preferably with respect to the electrically conductive surface 31.
  • the number of electrical conducting vias of the plurality of electrical conductor vias 32 is between 4 and 100, preferably between 10 and 80 and advantageously between 20 and 40.
  • the electrical conductive surface 31 is supported by the electrical conductor vias 32 at at least 2 corners, preferably at least three corners and preferably at each of its corners.
  • the number of electrical conductor vias of the plurality of electrical conductor vias 32 is greater at one side of the electromagnetic decoupling module 30.
  • the third extension plane corresponds to the plane of extension of one or the other of the first 10 and second 20 antennas, that is to say to the plane of extension of their surfaces. respective electric conductors 11 and 21.
  • the electric conductive surface 31 has a transverse extension perpendicular to the main direction of extension of the microelectronic circuit 2 less than or equal to the transverse extension of the microelectronic circuit 2.
  • the third zone represents at least 15%, preferably at least 25% and advantageously at least 35% of the surface of the microelectronic circuit 2.
  • the electrically conductive surface 31 of the electromagnetic decoupling module 30 has an area of at least 25%, preferably 50% and advantageously 75% of the area of one of the surface of the first antenna 10 according to the first extension plane and the surface of the second antenna 20 according to the second extension plane.
  • the electrically conductive surface 31 of the electromagnetic decoupling module 30 has an area of at least 10%, preferably 20% and advantageously 30% of the area of the microelectronic circuit 2.
  • the electrical conductive surface 31 may be polygonal, and preferably rectangular.
  • the connecting element comprises vias on at least two sides of the polygonal structure; it can present via at each intersection between sides.
  • the electrical conductive surface 31 is a surface resulting from a metal deposit.
  • the electromagnetic decoupling module 30 and the first antenna 10 may comprise in part at least similar structural characteristics since they can be formed via the same method and preferably simultaneously.
  • the electrically conductive surface 31 of the electromagnetic decoupling module 30 is disposed in the plane of extension of the first electrical conducting surface 11 of the first antenna 10. This arrangement is particularly advantageous because it makes it possible to use the zone of the microelectronic circuit 2 not covered by the first electrical conductive surface 11 of the first antenna 10 and thus the electrical conductive surface 31 has a very small bulk.
  • the use of a plurality of vias 32 electrical conductors extending from the microelectronic circuit 2 to the electrical conductive surface 31 allows them to be electrically connected.
  • These electrically conductive vias 32 therefore participate in the electromagnetic decoupling by playing a complementary role to that of the electrically conductive surface 31.
  • the electrically conductive surface 31 is mechanically independent of the first electrical conductive surface 11 and the second electrically conductive surface 21. In other words, this means that the electrically conductive surface 31 does not have a physical contact point. direct neither with the first electrical conductive surface 11 nor with the second electrical conductive surface 21.
  • the Figures 3b and 3c show the reflection coefficient S11 of the first antenna 10 as a function of the frequency.
  • Curve 42 of the figure 3b corresponds to the situation of the figure 1 that is to say, the absence of an electromagnetic decoupling module.
  • curve 43 of the figure 3c corresponds to the situation of Figures 2a and 2b , that is to say the presence of an electromagnetic decoupling module 30.
  • This modification of the reflection coefficient S11 of the first antenna 10 is a marker of the electromagnetic decoupling effect enabled by the electromagnetic decoupling module 30.
  • Curve 44 of the figure 3d corresponds to the situation of the figure 1 that is to say, the absence of an electromagnetic decoupling module.
  • Curve 44 of the figure 3e corresponds to the situation of Figures 2a and 2b that is to say the presence of an electromagnetic decoupling module 30. It will be noted that the presence of an electromagnetic decoupling module 30 has only a minor effect on the performance of the second antenna 20, for example Bluetooth® type.
  • the electromagnetic decoupling module 30 has a more striking effect on the electromagnetic properties of the first antenna 10 than the second antenna 20.
  • the electromagnetic decoupling module 30 allows an improvement in the electromagnetic performance of the first antenna 10 having the largest operating frequency band.
  • the vias formation technique and the method of manufacturing an antenna raised from this vias formation technique have a synergy with the resolution of the electromagnetic decoupling problem between the first antenna 10 and the second antenna.
  • Antenna 20 This technique and this method make it possible to have the electrically conductive surface 31 in the same plane of extension as the first electrically conductive surface 11, thus allowing better electromagnetic decoupling between the first 10 and second antennas.
  • the present invention thus makes it possible, in a non-limiting embodiment, to increase the efficiency of the AIP devices without affecting their compactness via, inter alia, the use of an original method of forming an elevated antennal system advantageously used for the production of an electromagnetic decoupling module for example and an antenna then located in the same extension plane.

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EP19161565.7A 2018-03-09 2019-03-08 Elektromagnetische entkoppelung Active EP3537541B1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR1852060A FR3078830B1 (fr) 2018-03-09 2018-03-09 " decouplage electromagnetique "

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EP3537541A1 true EP3537541A1 (de) 2019-09-11
EP3537541B1 EP3537541B1 (de) 2021-10-27

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080259585A1 (en) * 2006-09-27 2008-10-23 Shinko Electric Industries Co., Ltd. Electronic apparatus
EP2006953A1 (de) * 2007-06-21 2008-12-24 Samsung Electronics Co., Ltd. Antennengerät und drahtloses Kommunikationsendgerät
WO2012130044A1 (zh) * 2011-04-01 2012-10-04 华为终端有限公司 一种无线终端及无线终端双天线系统的设计方法
US20140085158A1 (en) 2012-09-26 2014-03-27 National Sun Yat-Sen University Communication device and antennas with high isolation characteristics
US20170018975A1 (en) * 2015-07-14 2017-01-19 Samsung Electro-Mechanics Co., Ltd. Wireless power receiver and method for manufacturing the same

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080259585A1 (en) * 2006-09-27 2008-10-23 Shinko Electric Industries Co., Ltd. Electronic apparatus
EP2006953A1 (de) * 2007-06-21 2008-12-24 Samsung Electronics Co., Ltd. Antennengerät und drahtloses Kommunikationsendgerät
WO2012130044A1 (zh) * 2011-04-01 2012-10-04 华为终端有限公司 一种无线终端及无线终端双天线系统的设计方法
US20140085158A1 (en) 2012-09-26 2014-03-27 National Sun Yat-Sen University Communication device and antennas with high isolation characteristics
US20170018975A1 (en) * 2015-07-14 2017-01-19 Samsung Electro-Mechanics Co., Ltd. Wireless power receiver and method for manufacturing the same

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
VERN SOLBERG; LLYAS MOHAMMED: "BVA: Molded Cu Wire Contact Solution for Very High Density Package-on-Package (PoP) Applications", 2 June 2013, INVENSAS CORPORATION

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EP3537541B1 (de) 2021-10-27
FR3078830B1 (fr) 2022-05-27
FR3078830A1 (fr) 2019-09-13

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