EP3537542B1 - 3d-antenne - Google Patents

3d-antenne Download PDF

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Publication number
EP3537542B1
EP3537542B1 EP19161567.3A EP19161567A EP3537542B1 EP 3537542 B1 EP3537542 B1 EP 3537542B1 EP 19161567 A EP19161567 A EP 19161567A EP 3537542 B1 EP3537542 B1 EP 3537542B1
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EP
European Patent Office
Prior art keywords
electrically conductive
substrate
electrical conductive
antenna
conductive tracks
Prior art date
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EP19161567.3A
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English (en)
French (fr)
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EP3537542A1 (de
Inventor
Fabien Leroy
Christopher Barratt
Chakib El Hassani
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Insight Sip
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Insight Sip
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Publication of EP3537542A1 publication Critical patent/EP3537542A1/de
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q11/00—Electrically-long antennas having dimensions more than twice the shortest operating wavelength and consisting of conductive active radiating elements
    • H01Q11/02—Non-resonant antennas, e.g. travelling-wave antenna
    • H01Q11/08—Helical antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/30—Resonant antennas with feed to end of elongated active element, e.g. unipole
    • H01Q9/42—Resonant antennas with feed to end of elongated active element, e.g. unipole with folded element, the folded parts being spaced apart a small fraction of the operating wavelength

Definitions

  • GHz gigahertz
  • wireless communicating systems which are used more and more daily, and often almost permanently, by an ever-growing population of users, all have antennas to receive and, most often also, to transmit signals in the frequency band defined by the technical standard which governs them.
  • GSM Global System for Mobile communications
  • GPS Global positioning system
  • the wireless network can be designed to cover only a limited geographical area such as Wi-Fi, or even a very small one, such as standard called “Bluetooth®” which allows communication up to ten meters from terminals between them.
  • the antennas of the above devices must nevertheless be able to maintain optimum efficiency throughout the entire band. frequencies where they must operate.
  • the antennas thus formed have two portions, each being arranged on either side of the substrate.
  • This type of solution does not provide an improvement in the distance between the strands if the substrate is thin, as is the case in electronic standards.
  • the cost of the substrate would be very high because it would be very thick and moreover a significant increase in the thickness of the substrate would lead to an increase in the total thickness of the module, which would then be problematic for the integration of the latter.
  • the present invention aims to resolve at least in part the problems set out above.
  • the other objects, features and advantages of the present invention will become apparent on examination of the following description and the accompanying drawings. It is understood that other advantages can be incorporated.
  • the present invention offers a much more efficient process, employing an overmolding, preferably in polymer material.
  • the connections between the portions of the antenna located in the two planes of the antenna are made by means of conductive vias, advantageously but not limited to, made from electric conductive wires.
  • the vias are produced before the overmolding, the latter then making it possible to fill the interstitial spaces between the vias and making it possible to construct an interface element between the planes receiving the two superimposed portions of the antenna.
  • the first portion is formed on the surface of the substrate configured to carry at least part of the microelectronic circuit.
  • the first portion is formed inside the substrate configured to carry at least part of said microelectronic circuit.
  • the first plurality of disjoint electrical conductive tracks is formed buried at the level of the first zone in the substrate.
  • a plurality of additional electrically conductive vias is formed emerging from the substrate so as to be able to be electrically connected at least in part with said first connection element and so that each additional electric conductor via is electrically connected to at least a buried electrically conductive track.
  • each additional electrical conductor via is connected to at least one electrical conductor via of the first plurality of electrically conductive vias.
  • two planes parallel to each other two planes not exhibiting any coplanar deviation, or exhibiting a negligible difference with regard to industrial tolerances, in particular less than 10 degrees and preferably less than 5 degrees.
  • a “substrate” means a support configured to carry at least one microelectronic circuit and which can comprise one or more layers stacked relative to one another and each comprising one or more materials.
  • the expressions “electrically connected”, “electrically connected” or even “electrically connected”, or their equivalents, express an electrical continuity, that is to say the continuity of the electric current, between two elements. without excluding the presence of one or more additional elements between the two elements considered.
  • an element A electrically connected to an element B implies that the electric current can flow between A and B without excluding the presence of an additional element C arranged between A and B. It should be noted that a direct physical contact between A and B is thus not obligatory.
  • connection element means, for example, an element C ensuring electrical continuity between a first element A and a second element B.
  • This connection element C can comprise one or more elements C1, C2, etc. ... partly or wholly forming the connection element C.
  • the electric current can flow between A and B through C, and more particularly through C1 and C2, partly forming at least C.
  • a turn is understood to mean an open loop which initiates a propeller movement.
  • a turn is understood in the present description of one or more electrically conductive elements arranged relative to each other so as to form an open loop partially defining at least a portion of a helix.
  • the present invention finds, as its preferred field of application, antennas in a package or AIP, acronym for “antenna in package”.
  • AIP acronym for “antenna in package”.
  • This field covers all the solutions which make it possible to implement in a single device: the radiofrequency chip for transmitting and receiving radiofrequency signals; the antenna (s) and their matching networks as well as other radio frequency components.
  • the present invention is based at least in part on a manufacturing technique which, surprisingly, is found to be in perfect harmony with the requirements demanded by this technical field.
  • vias are manufactured to form conductive elements between a part raised above the substrate and the surface of the latter.
  • the present invention advantageously takes advantage of the Bond Via Array (BVA TM) technique (see in particular the article " BVA: Molded Cu Wire Contact Solution for Very High Density Package-on-Package (PoP) Applications, Vern Solberg and Ilyas Mohammed Invensas Corporation, 06/02/2013 ) which allows the construction of vias connected on a microelectronic circuit extending perpendicularly to the extension plane of the microelectronic circuit.
  • BVA TM Bond Via Array
  • the figure 3a shows a microelectronic circuit 2 in a sectional view.
  • This microelectronic circuit 2 comprises a substrate 3 and a plurality of microelectronic components 4.
  • connection elements 12, 32 are electrically conductive vias 12, 32.
  • connection elements are formed from an electrically conductive micro-wire soldered to a part of the microelectronic circuit 2 and then rectified in a vertical position, that is to say in a direction orthogonal to the plane d. main extension of the substrate 3.
  • the electrically conductive vias 12, 32 have a diameter, according to their transverse dimension, of between 10 ⁇ m and 500 ⁇ m, preferably between 20 ⁇ m and 250 ⁇ m and advantageously equal to 50 ⁇ m.
  • the spacing between two electrically conductive vias 12, 32 is between 150 ⁇ m and 50,000 ⁇ m, preferably between 200 ⁇ m and 3000 ⁇ m and advantageously between 250 ⁇ m and 1000 ⁇ m.
  • the height dimension of the conductive vias 12, 32 is between 100 ⁇ m and 5000 ⁇ m, preferably between 750 ⁇ m and 3000 ⁇ m and advantageously equal to 1500 ⁇ m.
  • the electrically conductive vias 12, 32 comprise at least one electrically conductive material taken from at least: copper, gold, silver, aluminum, or an alloy formed by all or part of these elements.
  • connection elements then form electrically conductive vias 12, 32 extending from the substrate 3 in a direction orthogonal to the main extension plane of the substrate 3.
  • This step of forming the electrically conductive vias 12, 32 will be described at greater length below through the figures 4a to 4c .
  • Each electrically conductive via 12, 32 has a proximal end 12a, 32a integral with the substrate 3 and a distal end 12b, 32b intended to be integral with at least one metallized surface to be formed.
  • the figure 3c represents the step of overmolding the microelectronic circuit 2. This overmolding is advantageously carried out from one or more polymers 5 of resin type commonly used in microelectronics.
  • the overmolding is carried out so that the resin 5 covers the connecting elements 12, 32, that is to say that the resin 5 used for the overmolding is preferably deposited in a dimension in height greater than the dimension in height of the connecting elements 12, 32.
  • the distal end 12b, 32b of the electrically conductive vias 12, 32 is then embedded in the resin 5.
  • the height dimension of the resin 5 is between 100 ⁇ m and 5000 ⁇ m, preferably between 750 ⁇ m and 3000 ⁇ m and advantageously equal to 1500 ⁇ m. It is understood that the use of an overmolding technique, in particular with a resin, makes it possible to take advantage of a liquid phase for the establishment of the overmolding element at the appropriate places and by surrounding the vias, then, after solidification of the overmolding material (typically by polymerization of the resin) to have an intermediate element between the two planes for forming the antenna portions. The solid overmolding element is in fact used to construct the antenna portions of the upper plane.
  • a mechanical-chemical polishing step of the CMP type may be necessary in order to reduce the height dimension of the resin 5 at least to the height dimension of the connecting elements 12, 32 in order to expose at least the end distal 12b, 32b of the electrically conductive vias 12, 32.
  • this polishing step makes it possible on the one hand to define a raised flat surface relative to the microelectronic circuit 2 and on the other hand to expose the connection elements 12, 32, and preferably by locally spreading the distal end. 12b, 32b of the conductive vias electrics 12, 32 relative to said flat surface.
  • This spreading phenomenon comes from the polishing of the distal end 12b, 32b of the connecting elements 12, 32.
  • this local spreading of the material of which the connecting elements 12, 32 are composed participates in the mechanical and mainly electrical connection of the electrically conductive vias 12, 32 with the electrically conductive surface or surfaces to be formed.
  • the figure 3e represents the formation of two electrically conductive surfaces 11, 31.
  • the formation of each of these electrically conductive surfaces 11, 31 comprises at least the deposition of at least one electrically conductive material.
  • this deposit can be a deposit by selective plasma spraying, for example, or by any other type of deposit allowing the formation of said electrically conductive surfaces.
  • the deposition technique used is configured to allow the electrical connection between the distal end 12b, 32b of the electrically conductive vias 12, 32 and the electrically conductive material deposited.
  • the electrically conductive material deposited is taken from at least: Copper, Nickel, Gold, Silver, Aluminum, Palladium or an alloy formed by all or part of these elements.
  • the two electrically conductive surfaces 11, 31 are formed at the same time and preferably from the same deposit of one or more electrically conductive materials.
  • a mask can be used to form from the same deposit two electrically conductive surfaces 11, 31 separate, that is to say not integral with each other in their respective extension plane. .
  • one or more masks can be used in order to form one or more electrically conductive surfaces 11, 31 distinct from each other and / or having particular geometries, such as for example tracks, discs, circles, etc. ...
  • the figure 4a shows a substrate 3 comprising an electrically conductive zone 62 and an electrically non-conductive zone 63.
  • an electrically conductive wire 61 is soldered at the level of the electrically conductive zone 61 as illustrated in figure 4a .
  • the wiring tool 60 unwinds part of the electrically conductive wire 61 before cutting it at the level of the non-electrically conductive zone 63 as illustrated in figure 4b .
  • the electrically conductive wire 61 cut is arranged in an orthogonal position relative to the main plane of the substrate 3 so as to define an electrically conductive via 12, as illustrated in figure 4c .
  • the present invention thus advantageously takes advantage of the BVA TM construction technique for, on the one hand, increasing the compactness of the device for transmitting and / or receiving radiofrequency signals and, on the other hand, to reduce the number of steps in the manufacturing process.
  • This manufacturing process also allows better dimensional accuracy in the production of electrically conductive surfaces which is an essential factor in the operation of electromagnetic elements given that the resonance frequencies and electromagnetic couplings are directly affected by the dimensional aspect of the electromagnetic elements. electromagnetic elements.
  • this process is compatible with electronic mass production processes, it has the advantage of being integrable into the assembly flow and industrial packaging, therefore the cost is significantly reduced and reliability increased.
  • the preferred field of application of the present invention is packaged or AIP antennas. These devices are confronted with problems of efficiency and compactness.
  • antennas configured to operate below Gigahertz, otherwise known as sub-GHz, have been widely used in the radio communication world because they make it possible to ensure a long-distance connection, for example up to several tens of kilometers.
  • a certain number of them include systems operating at low or sub-GHz frequencies, in particular for ensuring long-distance communication, such as the LoRa standard, for example.
  • an antenna consisting of a lambda / 4 type resonator, that is to say whose dimensions correspond to a quarter of the wavelength at which it must operate has a total length of 75 mm at 1 GHz and 93, 8 mm at 800 MHz.
  • an antenna 50 folded on itself, as presented figure 5e does not give satisfactory performance.
  • the present invention relates to a helical antenna having folds on planes of which or at least a little different from the main extension plane of the substrate and of which each strands or conductive tracks disjoint electrical cables are connected to mechanical and electrical connection elements, such as electrically conductive vias, for example.
  • the distance separating the different planes can then be optimized during the design of the device by adjusting the height dimension of said mechanical and electrical connection elements in order to avoid electromagnetic coupling between the separate electrical conductive tracks of the device.
  • helical antenna For example, this distance may be of the order of 1000 ⁇ m, which represents a distance approximately 5 times greater than that of the state of the art where the distance separating the various planes is of the order of 200 ⁇ m. The increase in this distance relative to the prior art makes it possible to reduce, or even avoid, the electromagnetic coupling between the separate electrical conductive tracks of the helical antenna.
  • the formation of the first plurality of connection elements 53 comprises the formation of the first plurality of electrically conductive vias.
  • each connection element 53 comprises at least one electrically conductive via of the first plurality of electrically conductive vias.
  • each connection element 53 further comprises at least one additional electrical conductor via emerging from the substrate 3 and configured to form an electrical continuity between at least one electrical conductive track separate from the first plurality of separate electrical conductive tracks 51a. buried in the substrate 3 and at least one via an electrical conductor of the first plurality of electrically conductive vias.
  • an additional electrically conductive via can be a so-called “Through-Substrate” via, that is to say opening from a zone buried in the substrate 3 to the surface of the latter.
  • the additional electrical conductor via comprises an extension in a direction orthogonal to the main extension plane of the substrate 3 greater than or equal to its extension in the main extension plane of the substrate 3.
  • an additional electrical conductor via can comprise a “pad” also called a “pellet”, that is to say an extension in the main extension plane of the substrate 3 of greater dimension. to its extension in the substrate 3 according to the thickness of the latter.
  • this manufacturing process makes it possible to resolve the problem of compactness and efficiency by allowing the formation of a helical antenna having a raised portion relative to the microelectronic circuit.
  • the choice of the overmolding material allows the choice of the dielectric permittivity of the medium disposed between the first portion 51 and the second portion 52 of the first antenna 50 and thus better control of the electromagnetic decoupling of each of these two portions 51 and 52 with each other.
  • the present invention also makes it possible to control the height dimension of the connection elements 53 of the first plurality of connection elements 53, more particularly of the electrically conductive vias of the first plurality of electrically conductive vias, and therefore of the distance separating the first portion 51 and second portion 52 of the helical antenna 50, here again in order to improve the electromagnetic decoupling of each of these two parts 51 and 52 from one another.
  • the present invention therefore proposes an industrial manufacturing process making it possible to produce antennas of the folded three-dimensional meander type, also called helical antennas, using technologies from the electronics industry compatible with mass production. This method does not entail any additional production cost given that the steps of forming said helical antenna 50 fit perfectly into existing mass production lines and use the same tools.
  • the substrate 3 on which the helical antenna 50 is formed can remain sufficiently thin and therefore inexpensive.
  • the total thickness of the device for transmitting and / or receiving radiofrequency signals is not affected by the presence of a helical antenna and therefore remains compatible with the thicknesses of the transmitting and / or receiving devices. standard radiofrequency signals.
  • the first portion 51 can be formed at least in part in the substrate 3, the first portion 51 then being said to be “buried” at least in part in the substrate 3.
  • a plurality of additional electrically conductive vias can then be formed opening out of said substrate 3, at the level of the first zone, so as to allow the electrical connection of the first plurality of disjoint electric conductive tracks 51a buried with the second plurality of separate electrically conductive tracks 52a through the first plurality of connection elements 53, and preferably through the first plurality of electrically conductive vias.
  • the figure 5a shows a substrate 3 having a part comprising a zone intended to receive a plurality of microelectronic components 4 and a zone comprising the first portion 51 of the first antenna 50 to be formed.
  • This first portion 51 comprises the first plurality of disjoint electrical conductive tracks 51a, that is to say separated from each other preferably electrically.
  • the spacing between two separate electrical conductive tracks 51a of the first plurality of separate electrical conductive tracks is between 150 ⁇ m and 10000 ⁇ m, preferably between 300 ⁇ m and 5000 ⁇ m and advantageously between 250 ⁇ m and 1000 ⁇ m.
  • the number of separate electrical conductive tracks 51a of the first plurality of separate electrical conductive tracks is between 2 and 40, preferably between 4 and 20 and advantageously between 6 and 10.
  • the thickness of the separate electrical conductive tracks 51a of the first plurality of separate electrical conductive tracks is between 50 ⁇ m and 1500 ⁇ m, preferably between 100 ⁇ m and 1000 ⁇ m and advantageously between 150 ⁇ m and 500 ⁇ m
  • the separate electrically conductive tracks 51a of the first plurality of separate electrically conductive tracks are produced by means of etching at least one electrically conductive material.
  • the separate electrical conductive tracks 51a of the first plurality of separate electrical conductive tracks have an "L" shape, that is to say that each electrical conductive track 51a comprises a first part of main dimension d. 'extension perpendicular to the main direction of extension of the substrate 3 less than or equal to the transverse dimension of the substrate 3 and a second part disposed at one of the ends of said first part and having an extension dimension perpendicular to said main dimension extension of the first part and much less than this same dimension.
  • the ratio between the extension dimension of the first part and the extension dimension of the second part is greater than 1, preferably more than 5 and advantageously more than 10.
  • an electrically conductive track 51a among the first plurality of separate electrically conductive tracks can comprise a third part electrically connected to the microelectronic circuit 2.
  • the first plurality of disjointed electrical conductive tracks 51a is buried in the substrate 3.
  • a plurality of additional electrically conductive vias is formed emerging from the substrate 3 at the level of the first zone and each additional electric conductor via is intended to be electrically connected to at least one connection element 53, of the first plurality. connecting elements 53, preferably to at least one via an electric conductor of the first plurality of electrically conductive vias.
  • the number of additional electrically conductive vias is proportional to the number of tracks of the first plurality of separate electrically conductive tracks 51a.
  • the figure 5b illustrates the steps of forming the second plurality of electrically conductive vias 32 and of the first plurality of connecting elements 53 comprising the formation of the first plurality of electrically conductive vias, and this preferably simultaneously through the use of the technique of formation of vias previously described through figures 4a to 4c .
  • the spacing between two connection elements 53 of the first plurality of connection elements 53 is between 150 ⁇ m and 50,000 ⁇ m, preferably between 200 ⁇ m and 3000 ⁇ m and advantageously between 250 ⁇ m and 1000 ⁇ m.
  • the spacing between two connecting elements 53 is equal to the spacing between two separate electrical conductive tracks 51a of the first plurality of separate electrical conductive tracks 51.
  • the number of electrically conductive vias of the first plurality of electrically conductive vias is between 4 and 80, preferably between 8 and 40 and advantageously between 12 and 20.
  • the number of electrically conductive vias of the first plurality of electrically conductive vias is proportional to the number of separate electrically conductive tracks 51a of the first plurality of separate electrically conductive tracks, preferably the number of electrically conductive vias of the first plurality of vias electrical conductors is equal to twice the number of disjoint electrical conductor tracks 51a of the first plurality of disjoint electrical conductor tracks.
  • each electrically conducting via of the first plurality of electrically conducting vias can be split so as to have two electrically conducting vias side by side instead of a single via. electrical conductor. Their spacing is then advantageously less than 50 ⁇ m. This makes it possible, for example, to reduce the losses by electrical conductivity in the electrical conductors constituting at least part of the helical antenna 50.
  • the number of connecting elements 53 of the first plurality of connecting elements 53 is equal to the number of disjoint electrical conductive tracks 51a of the first plurality of disjoint electrical conductive tracks multiplied by 2 and subtracted from 1.
  • the height dimension of the electrically conductive vias of the first plurality of electrically conductive vias is between 100 ⁇ m and 5000 ⁇ m, preferably between 750 ⁇ m and 3000 ⁇ m and advantageously equal to 1500 ⁇ m.
  • a part of the electrically conductive vias of the first plurality of electrically conductive vias is formed at, and in electrical continuity with, the second parts of each electrically conductive track separated from the first plurality of electrically conductive tracks 51a and preferably at their ends the most distant from each first part of the disjoint electric conductive tracks of the first plurality of electrically conductive tracks 51a.
  • another part of the electrically conductive vias of the first plurality of electrically conductive vias is formed at the level of the first parts of each separate electrically conductive tracks of the first plurality of electrically conductive tracks 51a and preferably at their ends. more distant from each second part of the disjoint electric conductive tracks of the first plurality of electrically conductive tracks 51a.
  • the second plurality of electrically conductive vias 32 surrounds a plurality of microelectronic components 4.
  • the height dimension of the plurality of electrically conductive vias of the second plurality of electrically conductive vias 32 is identical to the height dimension of the elements of connection of the first plurality of connecting elements 53, and for example of the electrically conductive vias of the first plurality of electrically conductive vias.
  • the figure 5c represents the step of overmolding the microelectronic circuit 2 with a resin-type polymer 5 for example.
  • this resin 5 can be cleverly chosen in order to have electromagnetic properties such as a dielectric permittivity, for example, making it possible to limit the electromagnetic coupling between the first portion 51 and the second portion 52, or even not to degrade the performance of the device.
  • first antenna 50 to be formed.
  • This overmolding step is also the opportunity to overmold the area of the microelectronic circuit 2 intended to accommodate another antenna device such as for example an electromagnetic shielding module 30 which will be described more precisely below.
  • This overmolding is carried out so as to completely embed the second plurality of electrically conductive vias 32 and the first plurality of connecting elements 53, and preferably the first plurality of electrically conductive vias.
  • distal end 32b of the second plurality of electrically conductive vias 32 and the distal end 53b of the first plurality of connection elements 53 are configured to be located in the same plane parallel to the main extension plane of the substrate 3 .
  • this polishing step makes it possible to reduce the height dimension of the resin 5 at least until exposing the distal end 32b of the second plurality of electrically conductive vias 32 and the end distal 53b of the first plurality of connecting elements 53.
  • This polishing step thus makes it possible to define a raised flat surface, called the first surface, relative to the microelectronic circuit 2.
  • the electrically conductive vias of the first plurality of electrically conductive vias project respectively from the raised flat surface, said first surface.
  • an electrically conductive surface 31 of an electromagnetic shielding module 30 can be produced by depositing an electrically conductive material so that the electrically conductive surface 31 is in electrical contact with at least the distal end of at least one electrically conductive vias of the second plurality of electrically conductive vias 32.
  • the second portion of the first antenna 50 is formed, i.e. the second plurality of disjoint electric conductor tracks 52a is formed at the same time as the electrically conductive surface 31.
  • the separate electrical conductive tracks of the second plurality of separate electrical conductive tracks 52a are shaped so as to have geometric shapes complementary to those of the separate electrical conductive tracks of the first plurality of separate electrical conductive tracks 51a.
  • the separate electrical conductive tracks of the second plurality of separate electrical conductive tracks 52a have an “L” shape similar to the shape of the separate electrical conductive tracks of the first plurality of separate electrical conductive tracks 51a. in a head to tail arrangement.
  • the separate electrical conductive tracks of the second plurality of separate electrical conductive tracks 52a are formed so as to each be in electrical contact with at least one connection element 53 of the first plurality of connection elements 53, preferably at the level from its distal end 53b.
  • the first plurality of separate electrical conductive tracks 51a, the second plurality of separate electrical conductive tracks 52a and the first plurality of connecting elements 53 are configured so as to form the first antenna 50 comprising a plurality of turns, each turn being electrically connected to at least one other turn and each turn comprising at least one electrically conductive track of the first plurality of disjoint electric conductor tracks 51a, an electrically conductive track of the second plurality of disjoint electric conductor tracks 52a and at least one connecting element 53 of the first plurality of connecting elements 53 mechanically and electrically connecting said electrically conductive track of the first plurality of separate electrically conductive tracks 51a to said electrically conductive track of the second plurality of separate electrically conductive tracks 52a.
  • the present invention thus makes it possible to produce a helical antenna so on the one hand to maintain great compactness and on the other hand to maximize the electromagnetic decoupling between each strand of the helix thus formed.
  • the free choice of the overmolding element that is to say of the resin 5
  • helical antenna thus formed.
  • Electromagnetic shielding module :
  • the present invention relates to the resolution of a dual problem of efficiency and compactness.
  • the present invention relates to a device for transmitting and / or receiving radiofrequency signals comprising an electromagnetic shielding module cleverly arranged relative to an antenna and to a microelectronic circuit.
  • This electromagnetic shielding module is designed both to allow the antenna to present performance whose characteristics tend to be independent of electromagnetic disturbances and / or of the presence near the microelectronic circuit. , and while having a small footprint, through among other things, a clever positioning and design.
  • the electromagnetic shielding module comprises a raised structure, formed for example of an electrically conductive surface, arranged above a part of a microelectronic circuit, preferably in the same plane as the antenna.
  • the present invention can resort to the use of at least one connecting element, for example a plurality of vias electrically connected to the electrically conductive surface and to the microelectronic circuit, making it possible for example to raise said electrically conductive surface of the electromagnetic shielding module.
  • the use of electrically conductive vias provides the present invention on the one hand with the possibility of raising the electrically conductive surface relative to the components of the microelectronic circuit, like an antenna, and on the other hand. share to reinforce the phenomenon of electromagnetic shield relative to the antenna. Indeed, the electrically conductive vias participate in the electromagnetic shield phenomenon relative to the antenna and to a part of the microelectronic circuit.
  • a device for transmitting and / or receiving radiofrequency signals may comprise a first antenna 50 arranged on a microelectronic circuit 2.
  • This type of device for transmitting and / or receiving radiofrequency signals generally has a efficiency limited by electromagnetic disturbances undergone by the first antenna 50 and by at least part of the microelectronic circuit 2, in particular the microelectronic part for controlling and processing radiofrequency signals. These electromagnetic disturbances can find their origins in the electromagnetic environment outside the device for transmitting and / or receiving radiofrequency signals and / or come from the proximity of the first antenna 50 to the microelectronic circuit 2.
  • this device for transmitting and / or receiving radiofrequency signals has a microelectronic circuit 2 arranged on a substrate 3 and comprising a plurality of microelectronic components 4.
  • this device comprises the first antenna 50 which can for example be produced as previously indicated.
  • the device 1 for transmitting and / or receiving radiofrequency signals comprises a microelectronic circuit 2, a first zone of which carries the first antenna 50.
  • this device 1 for transmitting and / or receiving radiofrequency signals has a second zone carrying an electromagnetic shielding module 30.
  • This electromagnetic shielding module 30 advantageously comprises a structure raised relative to said microelectronic circuit 2.
  • This raised structure advantageously comprises an electrically conductive surface 31 arranged in a third extension plane.
  • the electromagnetic shielding module 30 comprises at least a second connection element extending from the microelectronic circuit 2, preferably from a part of the second zone of the microelectronic circuit 2, towards said raised structure.
  • the second connection element may comprise a substantially vertical solid wall extending from the microelectronic circuit 2 towards said raised structure.
  • electrically conductive vias 32 in order to form this second connection element so as to electrically connect the raised structure, in particular the electrically conductive surface 31, to the microelectronic circuit 2, for example to its ground plane.
  • the conductive surface 31 of the electromagnetic shielding module 30 is connected to the ground of the microelectronic circuit 2 in order to increase the efficiency of the electromagnetic shielding of the electromagnetic shielding module 30 both relatively to the first. antenna 50 but also relative to the part of the microelectronic circuit 2 arranged under the conductive surface 31.
  • the conductive surface 31 of the electromagnetic shielding module 30 is configured to present a variable or fixed electrical potential, which can be controlled by the microelectronic circuit 2.
  • the use of electrically conductive vias 32 makes it possible to form at least one electromagnetic shielding for the microelectronic components 4 arranged between the electrically conductive surface 31 and the substrate 3 of the microelectronic circuit 2, in other words for the microelectronic components 4 arranged at the level of the second zone of the microelectronic circuit 2 with regard to the raised structure, preferably with regard to the electrically conductive surface 31.
  • the number of electrically conductive vias of the second plurality of electrically conductive vias 32 is between 4 and 100, preferably between 10 and 80 and advantageously between 20 and 40.
  • the electrically conductive surface 31 is supported by the electrically conductive vias 32 at the level of at least 2 corners, preferably at the level of at least three corners and advantageously at the level of each of its corners.
  • the number of electrically conductive vias of the second plurality of electrically conductive vias 32 is greater at the level of one side of the electromagnetic shielding module 30.
  • the third extension plane corresponds to the extension plane of the first antenna 50, that is to say the extension plane of at least one of its electrically conductive surfaces, for example example in the case of a helical antenna 50, it may be the first or the second extension plane.
  • the electrically conductive surface 31 has a transverse extension perpendicular to the main direction of extension of the microelectronic circuit 2 less than or equal to the transverse extension of the microelectronic circuit 2.
  • the second zone represents at least 15%, preferably at least 25% and advantageously at least 35% of the surface of the microelectronic circuit 2.
  • the electrically conductive surface 31 of the electromagnetic shielding module 30 has an area at least equal to 25%, preferably to 50% and advantageously to 75% of the area of one of the surface of the first antenna 50 according to the first extension plane and the surface of the first antenna 50 according to the second extension plane in the case of a helical antenna 50 for example.
  • the electrically conductive surface 31 of the electromagnetic shielding module 30 has an area at least equal to 10%, preferably 20% and advantageously 30% of the area of the microelectronic circuit 2.
  • the electromagnetic shielding module 30 and the first antenna 50 may at least partly comprise similar structural characteristics given that they can be formed by the same method and preferably simultaneously.
  • the electrically conductive surface 31 of the electromagnetic shielding module 30 is arranged in the extension plane of the second portion 52 of the first antenna 50. This arrangement is particularly advantageous because it makes it possible to electromagnetically protect and to use the zone of the microelectronic circuit 2 not covered by the first antenna 50 and thus the electrically conductive surface 31 has a very small size and a high electromagnetic shielding capacity.
  • a second plurality of electrically conductive vias 32 extending from the microelectronic circuit 2 towards the electrically conductive surface 31 makes it possible to connect them electrically.
  • These electrically conductive vias 32 therefore participate in the electromagnetic shielding by playing a role complementary to that of the electrically conductive surface 31.
  • the electrically conductive surface 31 is mechanically independent of the first antenna 50. In other words, this means that the electrically conductive surface 31 does not have a point of direct physical contact nor with the first antenna 50.
  • the technique of forming vias and the method of manufacturing an elevated antenna from this technique of forming vias exhibit synergy with the improvement of the electromagnetic shielding of an antenna and a part at the bottom. less than a microelectronic circuit.
  • This technique and this method in fact make it possible to have the electrically conductive surface 31 in the same plane of extension as the second portion of the first antenna 50, thus allowing better electromagnetic shielding of the helical antenna 50, and advantageously of the part. of the microelectronic circuit 2 located under said electrically conductive surface 31.
  • the present invention thus makes it possible to increase the efficiency of AIP devices without affecting their compactness via, among other things, the use of an original method of forming a raised antenna system advantageously used for the production of an electromagnetic shielding module for example and an antenna then located in the same extension plane.

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  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Waveguide Aerials (AREA)
  • Details Of Aerials (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)

Claims (11)

  1. Verfahren zur Herstellung einer Vorrichtung (1) zum Senden und/ oder Empfangen von Funkfrequenzsignalen, umfassend mindestens ein Substrat (3), das sich über eine Haupterstreckungsebene und in einer Haupterstreckungsrichtung erstreckt, und konfiguriert ist, um mindestens eine mikroelektronische Schaltung (2) zu tragen, wobei die Vorrichtung (1) mindestens eine erste Antenne (50) umfasst, die durch eine erste Zone des Substrats (3) getragen wird, und Folgendes umfassend:
    • mindestens einen ersten Abschnitt (51), der sich über eine erste Erstreckungsebene erstreckt und eine erste Vielzahl von getrennten leitfähigen elektrischen Spuren (51a) umfasst;
    • mindestens einen zweiten Abschnitt (52), der sich über eine zweite Erstreckungsebene, parallel und unterschiedlich zu der ersten Erstreckungsebene erstreckt, wobei der zweite Abschnitt (52) in Bezug auf das Substrat (3) erhöht ist und eine zweite Vielzahl von getrennten leitfähigen elektrischen Spuren (52a) umfasst;
    • mindestens eine erste Vielzahl von Anschlusselementen (53) des zweiten Abschnitts (52) mit dem ersten Abschnitt (51), wobei jedes Anschlusselement (53) der ersten Vielzahl von Anschlusselementen (53) mindestens eine elektrische leitfähige Durchkontaktierung umfasst, die sich zwischen dem zweiten Abschnitt (52) und dem ersten Abschnitt (51) erstreckt, und mindestens teilweise mindestens eine elektrische leitfähige Spur der ersten Vielzahl von getrennten leitfähigen elektrischen Spuren (51a) mit mindestens einer elektrischen leitfähigen Spur der zweiten Vielzahl von getrennten leitfähigen elektrischen Spuren (52a) elektrisch verbindet;
    wobei die erste Vielzahl von getrennten leitfähigen elektrischen Spuren (51a), die zweite Vielzahl von getrennten leitfähigen elektrischen Spuren (52a) und die erste Vielzahl von Anschlusselementen (53) konfiguriert sind, um eine Vielzahl von Windungen zu bilden, wobei jede Windung elektrisch mit mindestens einer anderen Windung verbunden ist und jede Windung mindestens eine elektrische leitfähige Spur der ersten Vielzahl von getrennten leitfähigen elektrischen Spuren (51a), eine elektrische leitfähige Spur der zweiten Vielzahl von getrennten leitfähigen elektrischen Spuren (52a) und mindestens ein Anschlusselement (53) der ersten Vielzahl von Anschlusselementen (53) umfasst, die die elektrische leitfähige Spur der ersten Vielzahl von getrennten leitfähigen elektrischen Spuren (51a) mit der elektrischen leitfähigen Spur der zweiten Vielzahl von getrennten leitfähigen elektrischen Spuren (52a) elektrisch verbindet,
    wobei das Verfahren mindestens die folgenden aufeinanderfolgenden Schritte umfasst:
    - Bereitstellen mindestens eines Substrats (3), das sich über eine Haupterstreckungsebene erstreckt und konfiguriert ist, um mindestens eine mikroelektronische Schaltung (2) zu tragen;
    - Bilden mindestens einer ersten Antenne (50), wobei dieser Bildungsschritt mindestens die folgenden Schritte umfasst:
    Bilden mindestens eines ersten Abschnitts (51) der ersten Antenne (50) im Bereich einer ersten Zone des Substrats (3), der sich über eine erste Erstreckungsebene erstreckt, wobei dieser Bildungsschritt des ersten Abschnitts (51) mindestens einen Bildungsschritt einer ersten Vielzahl von getrennten leitfähigen elektrischen Spuren (51a) im Bereich der ersten Zone des Substrats (3) umfasst;
    Bilden mindestens einer ersten Vielzahl von Anschlusselementen (53) im Bereich der ersten Zone des Substrats (3), wobei dieser Bildungsschritt für jedes Anschlusselement (53) mindestens die Bildung mindestens einer elektrischen leitfähigen Durchkontaktierung umfasst, die mindestens teilweise an mindestens eine elektrische leitfähige Spur der ersten Vielzahl von getrennten leitfähigen elektrischen Spuren (51a) elektrisch angeschlossen ist;
    Überformen mindestens eines Teils des Substrats (3), das ein Überformungselement (5) bildet, das konfiguriert ist, um teilweise mindestens die erste Vielzahl von Anschlusselementen (53) zu überdecken, und um eine erste Oberfläche zu definieren,
    die sich im Wesentlichen über eine zweite Erstreckungsebene erstreckt, wobei das Überformungselement (5) mindestens zwischen dem ersten Abschnitt (51) und dem zweiten Abschnitt (52) angeordnet ist, sodass mindestens ein Teil der ersten Vielzahl von Anschlusselementen (53) das Überformungselement (5) von einer Seite zur anderen durchquert, und wobei das Überformungselement (5) aus mindestens einem Polymerwerkstoff ausgewählt ist;
    Bilden mindestens eines zweiten Abschnitts (52) der ersten Antenne im Bereich der ersten Oberfläche, wobei dieser Bildungsschritt des zweiten Abschnitts mindestens einen Bildungsschritt einer zweiten Vielzahl von getrennten leitfähigen elektrischen Spuren (52a) im Bereich der ersten Oberfläche umfasst, die elektrisch an die erste Vielzahl von Anschlusselementen (53) angeschlossen sind, und
    Verfahren, bei dem der Schritt des Bildens der mindestens einen leitfähigen elektrischen Durchkontaktierung mindestens die folgenden Schritte umfasst:
    - Schweißen eines Endes mindestens eines leitfähigen elektrischen Drahtes (61) im Bereich eines Teils der ersten Zone des Substrats (3);
    - Schneiden mindestens eines Teils des geschweißten leitfähigen elektrischen Drahtes (61) im Bereich eines Teils der ersten Zone des Substrats (3);
    - Anordnen des geschweißten leitfähigen elektrischen Drahtes (61) im Bereich eines Teils der ersten Zone des Substrats (3), sodass er eine Erstreckungsrichtung senkrecht zur Haupterstreckungsebene des Substrats (3) aufweist.
  2. Verfahren nach dem vorstehenden Anspruch, wobei das Überformungselement (5) derart ausgewählt wird, dass es eine relative dielektrische Permittivität zwischen 2 und 10, vorzugsweise zwischen 2,5 und 5 und vorteilshalber zwischen 3 und 3,5 aufweist.
  3. Verfahren nach einem der vorstehenden Ansprüche, wobei das Überformen konfiguriert ist, dass sich das Überformungselement (5) über eine Höhenabmessung von der mikroelektronischen Schaltung (2) zum zweiten Abschnitt (52) erstreckt, die zwischen 100 µm und 5000 µm, vorzugsweise zwischen 750 µm und 3000 µm enthalten ist, und vorteilhafterweise gleich 1500 µm ist.
  4. Verfahren nach einem der vorstehenden Ansprüche, wobei jedes Anschlusselement (53) der ersten Vielzahl von Anschlusselementen (53) konfiguriert ist, um ein distales Ende aufzuweisen, das aus der zweiten Erstreckungsebene hervorsteht.
  5. Verfahren nach einem der vorstehenden Ansprüche, das nach dem Überformen mindestens einen Polierschritt der Überformung derart umfasst, um die erste Oberfläche zu definieren, und derart, um ein distales Ende mindestens eines Teils der Anschlusselemente (53) der ersten Vielzahl von Anschlusselementen (53) im Bereich der ersten Oberfläche freizulegen.
  6. Verfahren nach einem der vorstehenden Ansprüche, wobei der Schritt des Bildens der ersten Vielzahl von getrennten leitfähigen elektrischen Spuren (51a) und der Schritt des Bildens der zweiten Vielzahl von getrennten leitfähigen elektrischen Spuren (52a) durch selektives Plasmasprühen ausgeführt werden.
  7. Verfahren nach einem der vorstehenden Ansprüche, wobei der Schritt des Überformens derart ausgeführt wird, um eine zweite Oberfläche zu definieren, die dazu bestimmt ist, mindestens einen Teil einer Antennenvorrichtung (10, 30) aufzunehmen, der mindestens übernommen wird aus: einer elektromagnetischen Abschirmvorrichtung (30), einer Antenne (10).
  8. Verfahren nach dem vorstehenden Anspruch, wobei die mindestens eine Antennenvorrichtung (10, 30) elektrisch anhand mindestens einer Vielzahl von elektrischen leitfähigen Durchkontaktierungen (12, 32) an die mikroelektrische Schaltung (2) angeschlossen ist.
  9. Verfahren nach einem der vorstehenden Ansprüche, wobei die erste Vielzahl von getrennten leitfähigen elektrischen Spuren (51a) im Bereich der ersten Zone in dem Substrat (3) eingegraben gebildet ist, und wobei der Schritt des Bildens der ersten Vielzahl von Anschlusselementen (53) weiter für jedes Anschlusselement (53) die Bildung mindestens einer zusätzlichen elektrischen leitfähigen Durchkontaktierung umfasst, die mindestens einen Teil des Substrats (3) durchquert, elektrisch mit mindestens einer elektrischen leitfähigen Spur der ersten Vielzahl von getrennten leitfähigen elektrischen Spuren (51a) verbunden ist, und im Bereich der ersten Zone aus dem Substrat (3) mündet.
  10. Verfahren nach einem der vorstehenden Ansprüche, wobei der Schritt des Überformens derart ausgeführt wird, um die erste Vielzahl von Anschlusselementen (53) vollkommen zu versenken.
  11. Verfahren nach einem der vorstehenden Ansprüche, wobei der Durchmesser der elektrischen leitfähigen Durchkontaktierungen entsprechend ihrer Querabmessung zwischen 10 µm und 500 µm ausgewählt wird.
EP19161567.3A 2018-03-09 2019-03-08 3d-antenne Active EP3537542B1 (de)

Applications Claiming Priority (1)

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FR1852061A FR3078831A1 (fr) 2018-03-09 2018-03-09 Antenne tridimensionnelle

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US6288680B1 (en) * 1998-03-18 2001-09-11 Murata Manufacturing Co., Ltd. Antenna apparatus and mobile communication apparatus using the same

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