EP3537540B1 - Elektromagnetische entkoppelung - Google Patents

Elektromagnetische entkoppelung Download PDF

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Publication number
EP3537540B1
EP3537540B1 EP19161560.8A EP19161560A EP3537540B1 EP 3537540 B1 EP3537540 B1 EP 3537540B1 EP 19161560 A EP19161560 A EP 19161560A EP 3537540 B1 EP3537540 B1 EP 3537540B1
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EP
European Patent Office
Prior art keywords
electrically conductive
microelectronic circuit
antenna
vias
area
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EP19161560.8A
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English (en)
French (fr)
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EP3537540A1 (de
Inventor
Fabien Leroy
Christopher Barratt
Chakib El Hassani
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Insight Sip
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Insight Sip
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
    • H01Q1/521—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure reducing the coupling between adjacent antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/28—Combinations of substantially independent non-interacting antenna units or systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
    • H01Q9/0421—Substantially flat resonant element parallel to ground plane, e.g. patch antenna with a shorting wall or a shorting pin at one end of the element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/30—Resonant antennas with feed to end of elongated active element, e.g. unipole
    • H01Q9/42—Resonant antennas with feed to end of elongated active element, e.g. unipole with folded element, the folded parts being spaced apart a small fraction of the operating wavelength

Definitions

  • GHz gigahertz
  • So-called “wireless” communicating systems which are used more and more on a daily basis, and often almost permanently, by an ever-increasing population of users, all have antennas to receive and, most often also, to transmit signals in the frequency band defined by the technical standard that governs them.
  • These are mainly mobile phones, in particular those complying with the so-called GSM standard, an acronym for “global system for mobile communications” which defines a communication standard with worldwide geographic coverage.
  • GPS Another very widely used communicating system, which requires a very sensitive receiving antenna, is GPS, an acronym for “global positioning system”.
  • GPS global positioning system
  • GPS receivers are more and more often present in mobile phones and in all kinds of so-called smart phones which also include all the functions of a personal digital assistant and the possibility of connecting to the global network of the Internet.
  • the wireless network can on the contrary be designed to cover only a restricted geographical area like Wi-Fi, or even very restricted, like the so-called “Bluetooth ® ” standard which allows communication up to ten meters from terminals between them.
  • the antennas of the above devices must nevertheless be able to maintain optimal efficiency throughout the frequency band where they must operate. This efficiency depends on losses which are intrinsic to the antenna and which are most commonly measured using the so-called “S” parameters, from the English “scattering parameters” which make it possible to qualify the behavior of the antenna between the propagation medium on the one hand and the electronic control circuit on the other hand.
  • S parameters have been designed and are used to measure and qualify the behavior of linear passive or active circuits operating in the frequency range mentioned above, often referred to as microwave or radio frequencies (RF) in the technical literature. on these subjects.
  • the adaptation of the antenna is notably defined by the parameter S11 which represents the reflection losses of the antenna. It is expressed in decibels (dB). The lower the value of S11, the better the adaptation and therefore the better the overall efficiency of the antenna.
  • the parameter S11 which is frequency dependent, makes it possible to define the bandwidth of the antenna, that is to say the frequency band in which S11 remains below a given threshold which is typically defined at a level of - 6dB. Under these conditions, a quarter of the power delivered by the electronic control circuit is lost by reflection and three quarters are therefore usefully radiated by the antenna.
  • the bandwidth of an antenna can be more or less wide. It is often expressed as a percentage of its central frequency. An antenna with a bandwidth of a few percent is considered to have a narrow operating band. This type of antenna is well suited for certain applications. For example, for a GPS receiver, an antenna with a bandwidth of around 2% is sufficient.
  • An antenna with a bandwidth equal to or greater than 15% is considered to have a wide operating bandwidth. Those whose bandwidth is greater than or equal to 20% benefit from very high bandwidth. It should be noted here that to qualify this type of antenna the acronym “UWB”, from the English “ultra wide band”, is also often used.
  • a very wideband antenna potentially offers many advantages.
  • a single broadband antenna can then cover several radio frequency standards simultaneously. This reduces the number of antennas that must be installed in multi-service wireless devices such as smart phones. which not only gives a certain advantage in terms of cost but also allows us to overcome technical problems that are difficult to resolve otherwise, such as parasitic couplings which can occur between the different antennas of the same smartphone.
  • this type of device presents a first drawback relating to the efficiency of this UWB antenna. Due to its electrical connection with the electronic circuit only at the level of the carrying sides of the antenna, parts of the antenna remain relatively electrically distant from the microelectronic circuit, implying an increase in the electrical resistance of the antenna in certain places.
  • the carrying sides of the antenna occupy a substantial space on the microelectronic circuit implying non-negligible design constraints.
  • a method of manufacturing an antenna comprising the manufacture of a pillar (21) for connecting a main plane of a circuit with an antenna radiating element (22) raised relative to the circuit.
  • a sealing part (50) makes it possible to embed the pillar and the surface of the main plane.
  • the present invention relates to a method according to claim 1.
  • the present invention allows the production of an elevated antenna, preferably with a wide bandwidth, of the UWB type.
  • the raised positioning of the antenna allows an increase in the compactness of the device for transmitting and/or receiving radio frequency signals.
  • the present invention makes it possible to arrange a plurality of components under the antenna in order to maximize the compactness of the device for transmitting and/or receiving radio frequency signals.
  • the present invention also makes it possible to raise an antenna relative to the microelectronic circuit by means of electrically conductive vias so as to allow these vias to be arranged in places having a relatively restricted free surface at the substrate.
  • the present invention makes it possible to distribute the electrical connections of the antenna at the level of various areas of small areas of the substrate.
  • the overmolding makes it possible to serve as a support for the first electrically conductive surface, improving its mechanical support while protecting the microelectronic components found molded inside said overmolding.
  • the production of the first electrically conductive surface by deposition of at least one electrically conductive element allows better dimensional control of the first electrically conductive surface therefore improving the performance of the antenna.
  • the present invention makes it possible to dispense with any mechanical manipulation of the antennal elements in order to place on the substrate. Consequently, any risk of poor positioning or poor welding is reduced or even eliminated.
  • connection elements extending through the overmolding, these connection elements potentially but not limited to being produced by a technique using electrical conductive wires.
  • the presence of a plurality of conductive elements is essential for achieving good electrical conduction and/or mechanical resistance of the assembly between the electrically conductive surface of the antenna and the connecting element.
  • the American patent publication in question only proposes a single massive pillar, which cannot be made from an electrically conducting wire, and the technique implementing exposure by engraving of its distal end would be uncertain and imprecise. and to say the least tedious if it is even imagined to use a plurality of connecting elements from this American publication.
  • the present invention ensures a phase of preparation of the first surface which receives the first electrically conductive surface of the first antenna without involving chemically and/or thermally aggressive steps, via polishing.
  • the aforementioned American prior art involves engraving, by laser.
  • the present invention allows great freedom of shape definition for the first electrically conductive surface of the first antenna, insofar as the polishing offers a complete and well prepared surface to receive said electrically conductive surface.
  • the latter can be formed by deposits of a conventional nature, without any particular prior preparation, unlike the aforementioned American document in which the antenna is embedded in a resin.
  • two planes parallel to each other are defined as two planes having no coplanar difference or having a negligible difference with regard to industrial tolerances, in particular less than 10 degrees and preferably less than 5 degrees.
  • a wide bandwidth antenna also called “UWB” means an antenna configured to operate on a frequency band ranging from a few megahertz to a few tens of gigahertz, for example between 3000 MHz and 11000 MHz.
  • the present invention finds its preferred field of application in box antennas or AIP, acronym for “antenna in package”. This This field covers all the solutions which make it possible to install in the same device: the radio frequency chip for transmitting and receiving radio frequency signals; the antenna or antennas and their matching networks as well as other radio frequency components.
  • the present invention is based at least in part on a manufacturing technique which surprisingly happens to be in perfect adequacy with the requirements demanded by this technical field.
  • vias are manufactured to form conductive elements between a part raised above the substrate and the surface of the latter.
  • the present invention advantageously takes advantage of the Bond Via Array (BVA TM ) technique (see in particular the article “BVA: Molded Cu Wire Contact Solution for Very High Density Package-on-Package ( PoP) Applications, Vern Solberg and Ilyas Mohammed Invensas Corporation, 02/06/2013) which allows the construction of vias connected to a microelectronic circuit extending perpendicular to the extension plane of the microelectronic circuit.
  • BVA TM Bond Via Array
  • FIG 4a represents a microelectronic circuit 2 in a sectional view.
  • This microelectronic circuit 2 comprises a substrate 3 and a plurality of microelectronic components 4.
  • connection elements 12, 32 are electrically conductive vias 12, 32.
  • connection elements are formed from an electrically conducting micro-wire soldered to a part of the microelectronic circuit 2 and then straightened in a vertical position, that is to say in a direction orthogonal to the plane d main extension of substrate 3.
  • the electrical conductive vias 12, 32 have a diameter, depending on their transverse dimension, of between 10 ⁇ m and 500 ⁇ m, preferably between 20 ⁇ m and 250 ⁇ m and advantageously equal to 50 ⁇ m.
  • the spacing between two electrical conductive vias 12, 32 is between 150 ⁇ m and 50000 ⁇ m, preferably between 200 ⁇ m and 3000 ⁇ m and advantageously between 250 ⁇ m and 1000 ⁇ m.
  • the height dimension of the conductive vias 12, 32 is between 100 ⁇ m and 5000 ⁇ m, preferably between 750 ⁇ m and 3000 ⁇ m and advantageously equal to 1500 ⁇ m.
  • the electrically conductive vias 12, 32 comprise at least one electrically conductive material taken from at least: Copper, Gold, Silver, Aluminum, or an alloy formed by all or part of these elements.
  • connection elements then form electrical conductive vias 12, 32 extending from the substrate 3 in a direction orthogonal to the main extension plane of the substrate 3.
  • This step of forming the electrical conductive vias 12, 32 will be described at greater length below through the figures 5a to 5c .
  • Each electrical conductor via 12, 32 has a proximal end 12a, 32a secured to the substrate 3 and a distal end 12b, 32b intended to be secured to at least one metallized surface to be formed.
  • FIG. 4c represents the step of overmolding the microelectronic circuit 2.
  • This overmolding is advantageously produced from one or more resin-type polymers 5 commonly used in microelectronics.
  • this resin 5 is deposited in a height dimension less than the height dimension of the connection elements 12, 32.
  • the overmolding is carried out in such a way that the resin 5 covers the connecting elements 12, 32, that is to say that the resin 5 used for the overmolding is preferably deposited according to a height dimension greater than the height dimension of the connection elements 12, 32.
  • the distal end 12b, 32b of the electrical conductive vias 12, 32 is then embedded in the resin 5.
  • the height dimension of the resin 5 is between 100 ⁇ m and 5000 ⁇ m, preferably between 750 ⁇ m and 3000 ⁇ m and advantageously equal to 1500 ⁇ m.
  • a mechanical-chemical polishing step of the CMP type may be necessary in order to reduce the height dimension of the resin 5 at least up to the height dimension of the connecting elements 12, 32 in order to expose at least the end distal 12b, 32b of the electrical conductor vias 12, 32.
  • this polishing step makes it possible on the one hand to define a raised flat surface relative to the microelectronic circuit 2 and on the other hand to expose the connection elements 12, 32, and preferably by locally spreading the distal end 12b, 32b electrical conductive vias 12, 32 relative to said flat surface.
  • This spreading phenomenon comes from the polishing of the distal end 12b, 32b of the connecting elements 12, 32.
  • this local spreading of the material of which the connecting elements 12, 32 are composed contributes to the mechanical and mainly electrical connection of the electrically conductive vias 12, 32 with the electrically conductive surface(s) to be formed.
  • each of these electrically conductive surfaces 11, 31 comprises at least the deposition of at least one electrically conductive material.
  • this deposition can be a deposition by selective plasma spraying for example, or by any other type of deposition allowing the formation of said electrically conductive surfaces.
  • the deposition technique used is configured to allow the electrical connection between the distal end 12b, 32b of the electrically conductive vias 12, 32 and the deposited electrically conductive material.
  • the electrically conductive material deposited is taken from at least: Copper, Nickel, Gold, Silver, Aluminum, Palladium or an alloy formed by all or part of these elements.
  • the two electrically conductive surfaces 11, 31 are formed at the same time and preferably from the same deposit of one or more electrically conductive materials. Additionally, a mask can be used in order to form from the same deposit two disjoint electrical conductive surfaces 11, 31, that is to say not integral with one another in their respective extension plane.
  • one or more masks can be used to form one or more electrically conductive surfaces 11, 31 distinct from each other and/or having particular geometries, such as for example tracks, discs, circles, etc. ...
  • FIG. 5a represents a substrate 3 comprising an electrically conductive zone 62 and an electrically non-conductive zone 63.
  • an electrical conductive wire 61 is welded at the level of the electrical conductive zone 61 as illustrated in figure 5a .
  • the wiring tool 60 unwinds part of the electrically conductive wire 61 before cutting it at the level of the non-electrically conductive zone 62 as illustrated in figure 5b .
  • the cut electrical conductive wire 61 is arranged in an orthogonal position relative to the main plane of the substrate 3 so as to define an electrical conductive via 12, as illustrated in figure 5c .
  • the present invention thus advantageously takes advantage of the BVA TM construction technique to on the one hand increase the compactness of the device for transmitting and/or receiving radio frequency signals and on the other hand to reduce the number of steps in the manufacturing process.
  • This manufacturing process also allows better dimensional precision in the production of electrically conductive surfaces which is an essential factor in the operation of electromagnetic elements given that the resonance frequencies and electromagnetic couplings are directly affected by the dimensional aspect of the electromagnetic elements.
  • UWB elevated wide bandwidth antenna
  • this type of device presents a first drawback relative to the effectiveness of this UWB antenna 10. Due to its electrical connection with the microelectronic circuit 2 only at the level of the flanks 11e carrying the UWB antenna 10, there remain parts of the UWB antenna 10 relatively electrically distant from the microelectronic circuit 2, implying an increase in the electrical resistance of the UWB antenna 10 in certain locations.
  • the 11th carrying flanks of the UWB antenna 10 occupy a significant amount of space on the microelectronic circuit 2 implying significant design constraints.
  • the present invention proposes a method of manufacturing a raised UWB type antenna which at least partly resolves these drawbacks and makes it possible to at least partly respond to the dual problem of efficiency and compactness.
  • the present invention therefore relates to the production of a wide bandwidth antenna called “UWB” raised relative to a microelectronic circuit.
  • the present invention allows the formation of a UWB antenna above a microelectronic circuit so as to reduce the bulk that this type of antenna can represent and so as to increase its effectiveness via a greater distribution of mechanical and electrical connections of said UWB antenna with the microelectronic circuit.
  • the present invention relates to a device for transmitting and/or receiving radio frequency signals comprising at least one microelectronic circuit extending in a main plane of extension and in a main direction of extension .
  • this device for transmitting and/or receiving radio frequency signals is further characterized in that it comprises a first antenna, preferably broadband of the UWB type, carried by a first zone of said microelectronic circuit and s extending along a first extension plane, preferably parallel to said main extension plane and preferably positioned facing a portion of the microelectronic circuit;
  • the first antenna comprises at least a first structure raised relative to said microelectronic circuit and at least a first element for connecting said raised structure to said microelectronic circuit.
  • a device for transmitting and/or receiving radio frequency signals comprising a first antenna 10 of the UWB type.
  • This device for transmitting and/or receiving radio frequency signals traditionally presents a microelectronic circuit 2 arranged on a substrate 3 and comprising a plurality of microelectronic components 4.
  • This microelectronic circuit 2 extends along a main extension plane and has a main dimension of extension in a main direction.
  • the first antenna 10 for example of the UWB type, has a first electrically conductive surface 11 raised by means of a first plurality of electrically conductive vias 12 electrically connecting this first electrically conductive surface 11 to the microelectronic circuit 2 and arranged above a first zone of the microelectronic circuit 2.
  • This first conductive surface electrical 11 extends along a first extension plane preferably parallel to the main extension plane of the microelectronic circuit 2.
  • the first zone represents at least 25%, preferably at least 50% and advantageously at least 65% of the surface of the microelectronic circuit 2.
  • the first plurality of electrical conductive vias 12 is arranged mainly on a part of the periphery of the microelectronic circuit 2 and in particular mainly on one side of the microelectronic circuit 2.
  • the first plurality of electrical conductive vias 12 can be arranged at a distance from the periphery of the microelectronic circuit 2, for example in an internal zone of the microelectronic circuit 2, that is to say at the level of microelectronic components 4, for example between microelectronic components 4.
  • the number of electrically conductive vias of the first plurality of electrically conductive vias 12 is between 4 and 80, preferably between 8 and 40 and advantageously between 12 and 20.
  • first plurality of electrically conductive vias 12 may comprise electrically conductive vias 12 grouped into several groups so as, for example, to electrically connect certain portions of the first electrically conductive surface 11 at different points of the microelectronic circuit 2 .
  • the spacing between two groups of electrically conductive vias 12 is between 150 ⁇ m and 50000 ⁇ m, preferably between 200 ⁇ m and 10000 ⁇ m and advantageously between 250 ⁇ m and 3000 ⁇ m.
  • the number of electrically conductive vias of the first plurality of electrically conductive vias 12 is greater at one side of the first antenna 10.
  • the first antenna 10 comprises at least one electrically conductive via of the first plurality of electrically conductive vias 12 at each corner of its geometric shape.
  • the first antenna 10 can be arranged cantilevered, that is to say be carried by a plurality of electrically conductive vias 12 only at one or two contiguous sides.
  • the first antenna 10 is integral with microelectronic circuit 2 on two contiguous sides, thus arranging it cantilevered. This proves particularly practical when the microelectronic component(s) 4 located under the first electrically conductive surface 11 prevent the arrangement of electrically conductive vias 12, or when the dimensions of the first electrically conductive surface 11 are such that one or more microelectronic components 4 make it impossible to arrange additional electrical conductor vias 12.
  • this cantilever arrangement allows a distribution of planar currents, for example as in a PIFA type antenna element, that is to say a planar antenna device called “inverted F”.
  • the first electrically conductive surface 11 has a first portion 11a and a second portion 11b connected mechanically and electrically to each other via a third portion 11c so as to define a slot 11d.
  • the second portion 11b has a surface area smaller than that of the first portion 11a, and a transverse extension, perpendicular to the main direction of extension of the microelectronic circuit 2, greater than that of the first portion 11a.
  • first 11a and the second 11b portions having distinct geometries and forming the first electrically conductive surface 11 allows the first antenna 10 to have several resonance frequencies.
  • the resonance frequencies of the different modes governing an antenna depend on the dimensions (width and length) of it and/or of its different parts.
  • this first cantilever antenna 10 allows precise and easy adjustment of the dimensions of the first electrically conductive surface 11 and therefore of the resonant frequencies of said first antenna 10 and this preferably without worrying about the mechanical rigidity of the first antenna 10 given that the first electrically conductive surface 11 is supported by the overmolding, that is to say by the resin 5.
  • the electromagnetic coupling between the resonance modes of the same antenna characterizes its bandwidth.
  • the geometry of the antenna directly influences its electromagnetic characteristics.
  • the electromagnetic coupling between the different resonance modes of the first antenna 10 varies according to the width of the slot 11d separating the first 11a and second 11b portions of the first electrically conductive surface 11.
  • the narrower the slot 11d the greater the electromagnetic coupling between the first portion 11a and the second portion 11b, which may prove particularly advantageous in certain applications.
  • the slot 11d has a width dimension of between a few tens of micrometers and a few hundred micrometers, and preferably being of the order of 100 ⁇ m.
  • the slot 11d has a width dimension of between 1 ⁇ m and 1000 ⁇ m, preferably between 25 ⁇ m and 500 ⁇ m and advantageously between 50 ⁇ m and 150 ⁇ m.
  • the present invention makes it possible to create one or more slots 11d of controlled width. Indeed, it is the process of forming the first electrically conductive surface 11 by physico-chemical deposition which makes it possible to achieve this control and this precision.
  • a first group of electrically conductive vias 12 mechanically and electrically connects the first portion 11a of the first electrically conductive surface 11 to the microelectronic circuit 2
  • a second group of electrically conductive vias 12 mechanically and electrically connects the second portion 11b from the first electrically conductive surface 11 to the microelectronic circuit 2.
  • electrically conductive vias 12 makes it possible to improve the performance of the first antenna 11 by electrically connecting each of the first 11a and second 11b portions of the first electrically conductive surface 11 to the microelectronic circuit 2.
  • the first electrically conductive surface 11 covers at least 25%, preferably at least 50% and advantageously at least 65% of the microelectronic circuit 2.
  • the present invention finds its preferred field of application in box antennas or AIP, acronym for English “antenna in package”, and this area is faced with problems of efficiency and compactness.
  • the present invention advantageously takes advantage of the via formation technique previously presented. Indeed, this technique allows the production of the first antenna 10 raised above the microelectronic circuit. This advantageous arrangement allows a significant gain in compactness. As for efficiency, this manufacturing process allows very good reproducibility of the characteristics of the first antenna, a necessary criterion for the mass production of this type of device.
  • this process allows the resolution of the problem of compactness and efficiency by allowing the formation of a plurality of electrically conductive vias, rather than continuous sections, electrically connecting a type antenna to the microelectronic circuit.
  • UWB raised relative to said microelectronic circuit.
  • Electromagnetic decoupling module
  • the present invention concerns the resolution of a dual problem of efficiency and compactness.
  • AIP devices often have a plurality of antennas, and in particular in the case where it has a UWB antenna, it may be necessary to use a second antenna, of the Bluetooth® type for example, in order to increase the functionality of the device and extend its modularity. It is in this type of situation that the present invention mainly finds application.
  • the present invention relates to a device for transmitting and/or receiving radio frequency signals comprising an electromagnetic decoupling module cleverly arranged between a first antenna and a second antenna.
  • This electromagnetic decoupling module is designed both to allow each antenna to present performances whose characteristics tend to be independent of the presence of another antenna, and while presenting a bulk reduced, through, among other things, clever positioning and design.
  • the electromagnetic decoupling module comprises a raised structure, formed for example of an electrically conductive surface, arranged above a part of a microelectronic circuit between a first antenna and a second antenna, preferably in the same plane only one of the two antennas.
  • the present invention can resort to the use of at least one connection element, for example a plurality of vias electrically connected to the electrical conductive surface and to the microelectronic circuit, making it possible for example to raise said electrically conductive surface of the electromagnetic decoupling module.
  • the use of electrically conductive vias provides the present invention with the possibility of raising the electrically conductive surface relative to the components of the microelectronic circuit, like one of the first and second antenna, and on the other hand to reinforce the electromagnetic shield phenomenon relative to each of the first and second antennas.
  • the electrical conductive vias participate in the electromagnetic shield phenomenon between each of the first and second antennas.
  • FIG. 1 previously presented illustrates the case of a device for transmitting and/or receiving radio frequency signals comprising a first antenna 10 of UWB type and a second antenna 20, illustrated in drawn points in this figure.
  • This device for transmitting and/or receiving radiofrequency signals does not include an electromagnetic decoupling module.
  • This type of device for transmitting and/or receiving radio frequency signals then generally has an efficiency limited by the electromagnetic coupling between its different antennas.
  • this device for transmitting and/or receiving radio frequency signals has a microelectronic circuit 2 arranged on a substrate 3 and comprising a plurality of microelectronic components 4.
  • this device comprises the first antenna 10 which can for example be of the UWB type produced as previously indicated.
  • the second antenna 20, illustrated in dotted lines on the figure 1 and in solid lines in figures 2a And 2b , can for example be an antenna configured for Bluetooth ® applications.
  • the second antenna 20 is arranged at a second zone of the microelectronic circuit and in a second extension plane preferably different from the first extension plane of the first antenna 10, but preferably parallel to it.
  • This second extension plane corresponds for example to the main extension plane of the microelectronic circuit 2.
  • This second antenna 20 has a second electrically conductive surface 21 electrically connected to the microelectronic circuit 2.
  • the second zone represents at least 15%, preferably at least 20% and advantageously at least 25% of the surface of the microelectronic circuit 2.
  • this second antenna 20 may have the shape of a serpentine extending mainly from the microelectronic circuit 2 in a direction substantially collinear with the main direction of extension of the microelectronic circuit 2.
  • the second antenna 20 has a cross section, relative to its main extension dimension, increasing as it extends from the microelectronic circuit 2.
  • the second antenna 20 has a mainly two-dimensional geometric shape.
  • the second antenna 20 is directly electrically and mechanically connected to the microelectronic circuit 2.
  • the transverse extension of the second antenna 20 perpendicular to the main direction of extension of the microelectronic circuit 2 is less than or equal to the transverse extension of the microelectronic circuit 2
  • the longitudinal extension of the second antenna 20 relative to the main direction of extension of the microelectronic circuit 2 is less than or equal to the longitudinal extension of the microelectronic circuit 2.
  • the second antenna 20 may comprise a second electrically conductive surface 21 raised relative to the microelectronic circuit 2 by means for example of a second connection element of the vias type electrical conductors for example and/or of the type solid vertical walls.
  • the figure 3c illustrates the variation of the inverse transmission coefficient S12 40 of this device for transmitting and/or receiving radio frequency signals when no electromagnetic decoupling module is provided.
  • curve 41 corresponds to the case where an electromagnetic decoupling module 30 between the first antenna 10 and the second antenna 20 is produced.
  • this electromagnetic decoupling module 30 in the frequency band located between 4GHz and 7 GHz as an example.
  • an electromagnetic decoupling module 30 allows the device 1 to transmit and/or reception of radio frequency signals to present increased radio frequency characteristics, this by limiting, and preferably by eliminating, the electromagnetic coupling between the first 10 and the second 20 antennas.
  • This electromagnetic decoupling module 30 is represented, according to one embodiment, in the figures 2a And 2b which present a device 1 for transmitting and/or receiving radio frequency signals 1.
  • this device 1 for transmitting and/or receiving radio frequency signals comprises a microelectronic circuit 2 of which a first zone carries a first antenna 10 and a second zone of which carries a second antenna 20.
  • this device 1 for transmitting and/or receiving radio frequency signals has a third zone carrying an electromagnetic decoupling module 30.
  • This electromagnetic decoupling module 30 advantageously comprises a structure raised relative to said microelectronic circuit 2.
  • This third zone is preferably arranged between the first zone and the second zone according to the main direction of extension of the microelectronic circuit 2.
  • This raised structure advantageously comprises an electrically conductive surface 31 arranged in a third extension plane.
  • the electromagnetic decoupling module 30 comprises at least one connection element extending from the microelectronic circuit 2, preferably from a part of the third zone of the microelectronic circuit 2, towards said raised structure.
  • connection element may comprise a substantially vertical solid wall extending from the microelectronic circuit 2 towards said raised structure.
  • electrically conductive vias 32 in order to form this connection element so as to electrically connect the raised structure, in particular the electrically conductive surface 31, to the microelectronic circuit 2, for example to its ground plan.
  • electrically conductive vias 32 makes it possible to form at least part of an electromagnetic shield for the microelectronic components 4 arranged between the electrically conductive surface 31 and the substrate 3 of the microelectronic circuit 2, in other words for the microelectronic components 4 arranged at the level of the third zone of the microelectronic circuit 2 with regard to the raised structure, preferably with regard to the electrical conductive surface 31.
  • the number of electrically conductive vias of the plurality of electrically conductive vias 32 is between 4 and 100, preferably between 10 and 80 and advantageously between 20 and 40.
  • the electrically conductive surface 31 is supported by the electrically conductive vias 32 at at least 2 corners, preferably at at least three corners and advantageously at each of its corners.
  • the number of electrically conductive vias of the plurality of electrically conductive vias 32 is greater at one side of the electromagnetic decoupling module 30.
  • the third extension plane corresponds to the extension plane of one or other of the first 10 and second 20 antennas, that is to say to the extension plane of their surfaces respective electrical conductors 11 and 21.
  • the electrical conductive surface 31 has a transverse extension perpendicular to the main direction of extension of the microelectronic circuit 2 less than or equal to the transverse extension of the microelectronic circuit 2.
  • the third zone represents at least 15%, preferably at least 25% and advantageously at least 35% of the surface of the microelectronic circuit 2.
  • the electrical conductive surface 31 of the electromagnetic decoupling module 30 has an area at least equal to 25%, preferably 50% and advantageously 75% of the area of one of the surface of the first antenna 10 according to the first extension plane and the surface of the second antenna 20 according to the second extension plane.
  • the electrical conductive surface 31 of the electromagnetic decoupling module 30 has an area at least equal to 10%, preferably 20% and advantageously 30% of the area of the microelectronic circuit 2.
  • the electromagnetic decoupling module 30 and the first antenna 10 can partly comprise at least similar structural characteristics given that they can be formed via the same process and preferably simultaneously.
  • the electrical conductive surface 31 of the electromagnetic decoupling module 30 is arranged in the extension plane of the first electrical conductive surface 11 of the first antenna 10. This arrangement is particularly advantageous because it allows the use of the area of the microelectronic circuit 2 not covered by the first electrically conductive surface 11 of the first antenna 10 and thus the electrically conductive surface 31 has a very small footprint.
  • the use of a plurality of electrically conductive vias 32 extending from the microelectronic circuit 2 towards the electrically conductive surface 31 makes it possible to connect them electrically.
  • These electrical conductor vias 32 therefore participate in electromagnetic decoupling by playing a role complementary to that of the electrical conductive surface 31.
  • the electrically conductive surface 31 is mechanically independent of the first electrically conductive surface 11 and of the second electrically conductive surface 21. Otherwise formulated, this means that the electrically conductive surface 31 does not have a physical contact point direct neither with the first electrically conductive surface 11 nor with the second electrically conductive surface 21.
  • THE figures 3a And 3b present the reflection coefficient S11 of the first antenna 10 as a function of frequency.
  • Curve 42 of the figure 3a corresponds to the situation of the figure 1 , that is to say the absence of an electromagnetic decoupling module.
  • curve 43 of the figure 3b corresponds to the situation of figures 2a And 2b , that is to say the presence of an electromagnetic decoupling module 30.
  • This modification of the reflection coefficient S11 of the first antenna 10 is a marker of the electromagnetic decoupling effect permitted by the electromagnetic decoupling module 30.
  • Curve 44 of the 3d figure corresponds to the situation of the figure 1 , that is to say the absence of an electromagnetic decoupling module.
  • Curve 44 of the figure 3e corresponds to the situation of figures 2a And 2b , that is to say the presence of an electromagnetic decoupling module 30. It will be noted that the presence of an electromagnetic decoupling module 30 has no or very little influence on the performance of the second antenna 20, for example Bluetooth ® type.
  • the electromagnetic decoupling module 30 has a more significant effect in terms of the electromagnetic properties of the first antenna 10 than of the second antenna 20.
  • the electromagnetic decoupling module 30 allows an improvement in electromagnetic performance. of the first antenna 10 having the largest operating frequency band.
  • the technique of forming vias and the method of manufacturing a raised antenna from this technique of forming vias present a synergy with the resolution of the problem of electromagnetic decoupling between the first antenna 10 and the second antenna 20.
  • This technique and this process make it possible to arrange the conductive surface electrical 31 in the same extension plane as the first electrical conductive surface 11 thus allowing better electromagnetic decoupling between the first 10 and the second 20 antennas.
  • the present invention thus makes it possible to increase the efficiency of AIP devices, preferably of the UWB type, without affecting their compactness via, among other things, the use of an original method of forming a raised antenna system advantageously used for the production of a electromagnetic decoupling module for example and an antenna then located in the same extension plane.

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Claims (15)

  1. Verfahren zum Herstellen einer Vorrichtung (1) zum Senden und/oder Empfangen von Funkfrequenzsignalen, wobei die Vorrichtung (1) zum Senden und/oder Empfangen von Funkfrequenzsignalen mindestens eine mikroelektronische Schaltung (2) umfasst, wobei sich die mikroelektronische Schaltung (2) über eine Haupterstreckungsebene erstreckt, die durch eine Haupterstreckungsrichtung und eine Quererstreckung, senkrecht zur Hauptrichtung definiert wird, wobei die Vorrichtung (1) zum Senden und/oder Empfangen von Funkfrequenzsignalen mindestens eine erste Antenne (10) umfasst, wobei die erste Antenne (10) mindestens eine erste elektrisch leitende Oberfläche (11) umfasst, die sich entlang einer ersten Erstreckungsebene erstreckt, wobei das Verfahren zum Herstellen mindestens die folgenden aufeinanderfolgenden Schritte umfasst:
    • Bereitstellen der mikroelektronischen Schaltung (2);
    • Bilden mindestens eines ersten Anschlusselements der ersten Antenne (10) im Bereich einer ersten Zone der mikroelektronischen Schaltung (2), wobei dieser Schritt des Bildens mindestens eines ersten Anschlusselements das Bilden einer ersten Vielzahl von elektrisch leitenden Durchkontaktierungen (12) umfasst, wobei die erste Vielzahl von elektrisch leitenden Durchkontaktierungen (12) konfiguriert ist, um ein distales Ende (12b) aufzuweisen, das in Bezug auf die erste Erstreckungsebene hervorstehend ist;
    • Umspritzen mindestens der ersten Zone der mikroelektronischen Schaltung (2), um das erste Anschlusselement abzudecken;
    • mindestens einen Schritt des Polierens der Umspritzung, um eine erste Oberfläche zu definieren, die sich im Wesentlichen entlang der ersten Erstreckungsebene erstreckt, und um das distale Ende (12b) der Durchkontaktierungen der ersten Vielzahl von elektrisch leitenden Durchkontaktierungen (12) im Bereich der ersten Oberfläche freizulegen;
    • Bilden der ersten elektrisch leitenden Oberfläche (11) der ersten Antenne (10) im Bereich der ersten Oberfläche in elektrischer Kontinuität mit der ersten Vielzahl der elektrisch leitenden Durchkontaktierungen, wobei das Bilden mindestens das Abscheiden mindestens eines elektrisch leitenden Werkstoffes auf der ersten Oberfläche umfasst.
  2. Verfahren nach dem vorstehenden Anspruch, wobei der Schritt des Bildens des ersten Anschlusselements im Bereich der ersten Zone der mikroelektronischen Schaltung (2) mindestens die folgenden Schritte umfasst:
    • Schweißen eines Endes mindestens eines elektrisch leitenden Drahts (61) im Bereich eines Teils der ersten Zone der mikroelektronischen Schaltung (2);
    • Unterbrechen mindestens eines Teils des im Bereich eines Teils der ersten Zone der mikroelektronischen Schaltung (2) geschweißten elektrisch leitenden Drahts (61);
    • Anordnen des im Bereich eines Teils der ersten Zone der mikroelektronischen Schaltung (2) geschweißten elektrisch leitenden Drahts (61), sodass er eine orthogonale Erstreckungsrichtung zur Haupterstreckungsebene der mikroelektronischen Schaltung (2) aufweist.
  3. Verfahren nach einem der vorstehenden Ansprüche, wobei mindestens ein Teil der Durchkontaktierungen der ersten Vielzahl von elektrisch leitenden Durchkontaktierungen (12) mindestens teilweise im Bereich des Umfangs der ersten Zone der mikroelektronischen Schaltung (2) angeordnet ist.
  4. Verfahren nach einem der vorstehenden Ansprüche, wobei mindestens ein Teil der Durchkontaktierungen der ersten Vielzahl von elektrisch leitenden Durchkontaktierungen (12) mindestens teilweise zwischen einer Vielzahl von mikroelektronischen Komponenten (4), die von der mikroelektronischen Schaltung (2) getragen werden, angeordnet ist.
  5. Verfahren nach einem der vorstehenden Ansprüche, wobei mindestens ein Teil der Durchkontaktierungen der ersten Vielzahl von elektrisch leitenden Durchkontaktierungen (12) derart angeordnet ist, dass der Abstand zwischen zwei aufeinanderfolgenden elektrisch leitenden Durchkontaktierungen der ersten Vielzahl von elektrisch leitenden Durchkontaktierungen (12) zwischen 150 µm und 50 000 µm, vorzugsweise zwischen 200 µm und 3000 µm, und vorteilhafterweise zwischen 250 µm und 1000 µm liegt.
  6. Verfahren nach einem der vorstehenden Ansprüche, wobei der Schritt des Bildens der ersten elektrisch leitenden Oberfläche (11) der ersten Antenne (10) im Bereich der ersten Oberfläche in elektrischer Kontinuität mit mindestens einem Teil der ersten Vielzahl von elektrisch leitenden Durchkontaktierungen mindestens die folgenden Schritte umfasst:
    • Bilden eines ersten Abschnitts (11a) der ersten elektrisch leitenden Oberfläche (11), wobei der erste Abschnitt (11a) eine erste geometrische Form aufweist;
    • Bilden eines zweiten Abschnitts (11b) der ersten elektrisch leitenden Oberfläche (11), wobei der zweite Abschnitt (11b) eine zweite, sich von der ersten geometrischen Form unterscheidende geometrische Form aufweist, wobei der erste Abschnitt (11a) und der zweite Abschnitt (11b) beiderseits mindestens eines Schlitzes (11d) angeordnet sind;
    • Bilden eines dritten Abschnitts (11c) der ersten elektrisch leitenden Oberfläche (11), der dazu bestimmt ist, mindestens teilweise elektrisch an den ersten Abschnitt (11a) und den zweiten Abschnitt (11b) angeschlossen zu werden, und dabei mindestens einen Teil des Schlitzes (11d) beizubehalten.
  7. Verfahren nach einem der vorstehenden Ansprüche, wobei der Schritt des Bildens der ersten elektrisch leitenden Oberfläche (11) durch selektives Sprühen von Plasma realisiert wird.
  8. Verfahren nach einem der vorstehenden Ansprüche, umfassend einen Schritt des Bildens mindestens einer zweiten Antenne (20), die im Bereich einer zweiten Zone der mikroelektronischen Schaltung (2) angeordnet ist, und sich entlang einer zweiten Erstreckungsebene erstreckt.
  9. Verfahren nach dem vorstehenden Anspruch, wobei die zweite Antenne (20) gebildet ist, sodass die zweite Erstreckungsebene komplanar zur Haupterstreckungsebene der mikroelektronischen Schaltung (2) ist.
  10. Verfahren nach einem der beiden vorstehenden Ansprüche, umfassend mindestens das Bilden mindestens eines elektromagnetischen Entkoppelungsmoduls (30), welches eine erhöhte Struktur umfasst und im Bereich einer dritten Zone der mikroelektronischen Schaltung (2) angeordnet ist, wobei dieses Bilden mindestens die folgenden Schritte umfasst:
    • Bilden mindestens eines Anschlusselements im Bereich einer dritten Zone der mikroelektronischen Schaltung (2), wobei der Schritt des Bildens des Anschlusselements das Bilden einer Vielzahl von elektrisch leitenden Durchkontaktierungen (32) umfasst;
    • Umspritzen mindestens der dritten Zone der mikroelektronischen Schaltung (2), um das Anschlusselement und die mikroelektronische Schaltung (2) mindestens teilweise abzudecken, um eine dritte Oberfläche zu definieren, die sich im Wesentlichen entlang der dritten Erstreckungsebene erstreckt;
    • Bilden einer erhöhten Struktur des elektromagnetischen Entkoppelungsmoduls (30) im Bereich der dritten Oberfläche, vorzugsweise durch Abscheiden mindestens eines elektrisch leitenden Elements.
  11. Verfahren nach dem vorstehenden Anspruch, wobei der Schritt des Bildens der Vielzahl von elektrisch leitenden Durchkontaktierungen (32) im Bereich der dritten Zone der mikroelektronischen Schaltung (2) mindestens die folgenden Schritte umfasst:
    • Schweißen eines Endes mindestens eines elektrisch leitenden Drahts (61) im Bereich eines Teils der dritten Zone der mikroelektronischen Schaltung (2);
    • Unterbrechen mindestens eines Teils des im Bereich eines Teils der dritten Zone der mikroelektronischen Schaltung (2) geschweißten elektrisch leitenden Drahts (61);
    • Anordnen des im Bereich eines Teils der dritten Zone der mikroelektronischen Schaltung (2) geschweißten elektrisch leitenden Drahts (61), sodass er eine orthogonale Erstreckungsrichtung zur Haupterstreckungsebene der mikroelektronischen Schaltung aufweist.
  12. Verfahren nach einem der beiden vorstehenden Ansprüche, wobei der Schritt des Bildens des elektromagnetischen Entkoppelungsmoduls (30) gleichzeitig mit dem Schritt des Bildens der ersten Antenne (10) realisiert wird.
  13. Verfahren nach einem der drei vorstehenden Ansprüche, wobei der Schritt des Umspritzens der dritten Zone der mikroelektronischen Schaltung (2) gleichzeitig mit dem Schritt des Umspritzens der ersten Zone der mikroelektronischen Schaltung (2) realisiert wird.
  14. Verfahren nach einem der vier vorstehenden Ansprüche, umfassend, nach dem Schritt des Umspritzens der dritten Zone der mikroelektronischen Schaltung (2) mindestens einen Schritt des Polierens der Umspritzung der dritten Zone der mikroelektronischen Schaltung (2), um die dritte Oberfläche zu definieren, und um ein distales Ende mindestens eines Teils der Durchkontaktierungen der Vielzahl von elektrisch leitenden Durchkontaktierungen (32) im Bereich jeweils der dritten Oberfläche freizulegen, und wobei der Schritt des Polierens der Umspritzung der dritten Zone der mikroelektronischen Schaltung (2) gleichzeitig mit dem Polieren der Umspritzung der ersten Zone der mikroelektronischen Schaltung (2) realisiert wird.
  15. Verfahren nach einem der vorstehenden Ansprüche, wobei die Durchkontaktierungen der Vielzahl von elektrisch leitenden Durchkontaktierungen (12) einen Durchmesser entlang ihrer Querabmessung aufweisen, der zwischen 10 µm und 500 µm liegt.
EP19161560.8A 2018-03-09 2019-03-08 Elektromagnetische entkoppelung Active EP3537540B1 (de)

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US8922448B2 (en) * 2012-09-26 2014-12-30 Mediatek Singapore Pte. Ltd. Communication device and antennas with high isolation characteristics
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