EP3527053A1 - Ensemble dissipateur de chaleur et procédé de fabrication - Google Patents

Ensemble dissipateur de chaleur et procédé de fabrication

Info

Publication number
EP3527053A1
EP3527053A1 EP17772367.3A EP17772367A EP3527053A1 EP 3527053 A1 EP3527053 A1 EP 3527053A1 EP 17772367 A EP17772367 A EP 17772367A EP 3527053 A1 EP3527053 A1 EP 3527053A1
Authority
EP
European Patent Office
Prior art keywords
heat
conducting element
circuit board
components
dissipating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP17772367.3A
Other languages
German (de)
English (en)
Inventor
Mathias Häuslmann
Markus Bauernfeind
Hermann Josef Robin
Kurt Michel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ZF Friedrichshafen AG
Original Assignee
ZF Friedrichshafen AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ZF Friedrichshafen AG filed Critical ZF Friedrichshafen AG
Publication of EP3527053A1 publication Critical patent/EP3527053A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y80/00—Products made by additive manufacturing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20936—Liquid coolant with phase change
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2255/00—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes
    • F28F2255/18—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes sintered

Definitions

  • the present invention relates to a heat-dissipating arrangement according to the preamble of patent claim 1 and to a method of manufacturing according to the preamble of patent claim 7.
  • Heat sinks such as heatsinks in power electronics and controllers are used to cool a wide variety of components, e.g. of components or structures on the circuit board. Due to tolerances and existing surface condition, direct contact of the heat sink to the components for the heat conduction is not optimal. Therefore, it was necessary in previously known Enteriermungsstrategien for better heat connection to introduce a gap-bridging and heat-conducting layer, as shown in Figure 1 and provided with reference numeral 4.
  • a gap-bridging and heat-conducting layer 4 may be a thermal paste or a so-called Gapfilier on corresponding
  • Components 3 e.g. Components, structures or vias on the circuit board 2 is arranged.
  • a thermal paste as well as a Gapfilier require a certain layer thickness, the thermal conductivity of such media is usually worse than that of metal, whereby the heat dissipation through the heat sink 1 influenced and the maximum power loss is reduced.
  • a heat-dissipating assembly wherein the heat-dissipating assembly has at least one power module having a circuit board arranged thereon to be cooled components, and at least one arranged on the circuit board and the components to be cooled heat sink, wherein on at least one of the cooled Components each having at least one heat conducting element is arranged, which has a predetermined structure which extends from the circuit board in a direction away from the circuit board in the heat sink and wherein the heat conducting element has a heat dissipating medium in its interior.
  • a power module an arrangement comprising a printed circuit board with at least one electrical power element arranged on the printed circuit board, e.g. a semiconductor element understood.
  • the heat-conducting element is designed as a heat pipe.
  • the heat conducting element has a hollow structure in which the heat dissipating medium is introduced or a hollow structure which is formed such that the heat dissipating medium circulates therein.
  • the heat-conducting element is arranged as a separate component on the at least one of the components to be cooled or integrated into the heat sink by means of a printing process.
  • the heat-conducting element has at least one opening facing the component to be cooled, through which the heat-dissipating medium can exit and contact the component in such a way that it at least partially fills a gap existing between the component and the heat-conducting element ,
  • the heat-dissipating medium is a liquid, a gas, sodium or other suitable material for heat dissipation.
  • a method for producing a heat-dissipating arrangement wherein the heat-dissipating arrangement has at least one power module which has a printed circuit board with which it is to be cooled
  • Printed circuit board is applied, wherein at least a second heat conducting element is integrated in the heat sink in the manufacture of the heat sink, and in a further step, a heat dissipating medium in the second and / or the first
  • the at least one first or second heat-conducting element has an opening through which the heat-dissipating medium is introduced into the heat-conducting element, wherein the opening opens in the direction of the component to allow the heat-dissipating medium, one between the component and to fill the heat-conducting element gap at least partially.
  • the at least one first or second heat-conducting element has an opening through which the heat-dissipating medium is introduced into the heat-conducting element, the opening being closed after being filled with the heat-dissipating medium.
  • the predetermined structure of each of the heat conducting elements is formed such that the heat dissipating medium circulates therein.
  • Heatsink done.
  • the heat dissipating medium provided in the heat-conducting elements an additional improved heat dissipation or
  • the method of fabricating the assembly is simplified or cost effective due to separately disposable components and the ability to use 3D printing for fabrication, or a combination thereof. Further, for each component, a separately cut to this heat conducting element can be made so that the best possible heat dissipation for each component
  • Fig. 1 shows a view of a heat-dissipating arrangement according to the prior art.
  • 2a to 2c respectively show views of different embodiments of a heat-dissipating arrangement according to the present invention.
  • FIG. 3 shows a flowchart of the method according to an embodiment of the present invention.
  • an intermediate layer can be dispensed with because of the method according to the invention.
  • Heat-conducting elements can be integrated directly into the heat sink or integrated as separate components during production.
  • the heat-conducting elements have a special structure and are preferably at least partially filled with a heat-conducting medium, hereinafter referred to as medium.
  • the medium can be in the
  • the heat-conducting element has an open structure in the direction of the component (s) on which it is arranged.
  • the heat-conducting element can also be purchased or manufactured as a separate component, and then on one or more components
  • the integration may be e.g. by transfer printing the circuit board and the components arranged thereon with heat-conducting elements, the heat sink by means of 3D printing.
  • FIGS. 2a to 2c show heat dissipation elements according to different possible embodiments of the present invention.
  • each of the embodiments shown will be discussed separately.
  • a combination of different heat dissipation elements shown in the embodiments can be used.
  • the description refers on components to be cooled.
  • the printed circuit board can also have other components
  • Fig. 2a shows a designed as a heat pipe and on a component 3 of
  • the heat pipe 100 is arranged as a separately manufactured or purchased component on the component 3, is dissipate from the heat.
  • the heat pipe structure is therefore not in direct contact with the component 3. This simplifies the structure of the entire arrangement, since in a direct contact with the component 3, the complex structure of the heat pipe 100 would have to be built up on the component, e.g. by means of a printing process.
  • the heat pipe can also be built on the component or in the heat sink.
  • Heatpipes are known in the art and will not be described in detail here. Basically, they have a closed tubular structure with complex inner branches or capillaries through which a medium which evaporates due to heat supply, circulates to dissipate heat to the outside.
  • FIG. 2 b shows a tower-like heat conducting element 100 with medium located therein for heat dissipation.
  • the medium is immobile, not circulating.
  • FIG. 2c shows a heat-conducting element 100 designed as a tubular dome with a central tube, in which, due to its structure, a circulation of the medium takes place.
  • the embodiments of the heat-conducting element 100 shown in FIGS. 2 b and 2 c, as well as modifications thereof, can be printed directly on the component 3, for example in same step as the heat sink 1.
  • the heat-conducting element 100 can also be manufactured or purchased as a separate component.
  • a heat-dissipating medium for example a fluid or a gas or a special metal such as sodium. This medium may already be present in the component in the separately provided component or be subsequently introduced into the component. If the heat-conducting element 100 is produced together with the heat sink 1, for example by means of a printing process, for example a
  • the medium can be introduced after completion of the heat sink 1 in the heat conducting element 100.
  • an opening may be provided, which is preferably arranged on the side of the heat-conducting element 100, which faces the component 3, which is to be cooled.
  • This opening may remain open, depending on the application, after the medium has been filled or closed, e.g. with a thin layer that can be printed, glued or otherwise fixed. If the opening is not closed, the medium can escape from the opening and at least partially fill a gap, which may be present between the component 3 and the heat-conducting element 100 as a result of the manufacturing process. Thus, this gap can be bridged and the heat dissipation is further improved.
  • the structures of the heat-conducting elements 4 shown in FIGS. 2 b and 2 c are designed differently depending on the component 3 to be warmed up.
  • the exact structure of the heat-conducting elements 100 to be used can be determined by the skilled person based on experience, from experiments or from a calculation or simulation and, as described above, depends on the components to be heat-treated and the available production method.
  • the embodiment shown in Fig. 2b may be formed of a hollow body. This can be upwards, so away from the circuit board 2 and in the
  • Heatsink 1 into broadening and, for example, end in a sphere or other widening or branching structure. It is also a rejuvenation upwards possible. Also, structures filled with the medium are preferably in the heat sink 1 upwards away from the circuit board 2 - branch, conceivable. Other structures are also possible, as long as one for the
  • Heat dissipation takes place and a corresponding heat-conducting medium can be filled. Due to the filling with the medium, these structures should be at least partially hollow, e.g. tube-like, to be able to absorb the medium.
  • the structures shown in Fig. 2b are intended to keep the heat dissipating medium stationary, i. Here, preferably, no circulation of the medium takes place in the interior of the structure or of the heat-conducting element 100.
  • the structure may be constructed such that the medium circulates in two circulations, in this embodiment, as previously described, the medium rises in the middle and falls off again on both sides of the tubular dome , Thus, heat can be dissipated by the flow in the interior of the furnishedleitelements 100 self-sufficient in the heat sink 1.
  • Further examples of possible structures are a tower-like, chimney-like, elongated, hourglass-shaped or other forms with ascending and / or descending branches, in which the medium essentially, preferably completely, circulates independently.
  • Fig. 3 is a flow chart for the preparation of the inventive arrangement is shown.
  • the heat dissipating arrangement has at least one power module, which has a printed circuit board 2 arranged thereon to be cooled components 3 and at least one to be arranged on the circuit board 2 and on the components to be cooled 3 heat sink 1.
  • heat-conducting elements 100 is to be arranged as a separate component, then it is arranged on at least one of the components 3 in a first step S1.
  • a plurality of components 3 can be equipped with a heat-conducting element 100 or only one component 3 is equipped with a heat-conducting element 100.
  • Not all components 3 on the circuit board 2 must be equipped with a heat conducting element 100.
  • heat conduction elements 100 made by another method may also be disposed on the same circuit board 2 but on other components 3, as described later.
  • the heat-conducting element 100 can already have a heat-dissipating medium in its interior, or the medium is used in a further process step, e.g. in the second step or a subsequent step.
  • an opening may be present, which remains open or closed.
  • the closing can be done by means of printing a (thin) layer over the opening. But it can also be a plate or another
  • Closing medium can be used to close the opening and prevent leakage of the medium.
  • the heat sink 1 is arranged above the components 3 of the printed circuit board 2 and the at least one heat-conducting element 100 arranged thereon.
  • the heat sink 1 is thereby preferably printed, as described above, e.g. with a 3D printing process.
  • one or more of the above-described heat conducting elements 100 hereinafter referred to as the second heat conducting element 100, together with the Heat sink in an alternative first step S1 1 is prepared, for example, be printed or, which combines the above-described first and second steps S1 and S2 in a single step S1.
  • both separate heat-conducting elements 100 and one or more second heat-conducting elements 100 are to be combined in one arrangement, a combination of the above-described steps S1, S2 and S1 occurs 1. That is, first in the first step S1, the one or more separate heat-conducting elements 100 are applied and then in the second step S2, the heat sink 1 is applied via these heat-conducting elements 100 and at the same time is applied over other components 3 of the heat sink 1 with one or more integrated second heat-conducting elements 100.
  • the heat-dissipating medium is then introduced into the heat-conducting elements 100, which are not yet filled with it.
  • an opening remain or be present, which remains open or closed.
  • the closing can be done by means of printing a (thin) layer over the opening. But it can also be a plate or other sealing medium used to close the opening and prevent leakage of the medium.
  • Heat sink 1 produced heat conducting elements 100 are provided on a printed circuit board 2.
  • the medium may already be pre-filled, or filled during one of the manufacturing steps or after completion of the arrangement, if possible.
  • the inventive heat dissipating arrangement and the method it is no longer necessary to introduce an intermediate layer between the heat sink and components. Thus, a process step is saved.
  • a wide variety of forms of heat-conducting elements for dissipating the heat can be used in the heat sink, since a transfer printing of the heat-conducting, for example, with the heat sink is possible.
  • Components e.g. Components, structures, vias or through holes heat-dissipating layer, Gapfilier

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

L'invention concerne un ensemble dissipateur de chaleur, l'ensemble dissipateur de chaleur présentant au moins un module de puissance qui présente une carte de circuit imprimé (2) pourvue, sur le dessus, de composants à refroidir (3), et au moins un dissipateur thermique (1) disposé sur la carte de circuit imprimé (2) et au-dessus des composants à refroidir (3), au moins un élément conducteur de chaleur (100) qui est respectivement disposé sur au moins un des composants à refroidir (3), présente une structure prédéfinie qui s'étend de la carte de circuit imprimé (2) et s'en éloigne pour s'introduire dans le dissipateur thermique (1), et l'élément conducteur de chaleur (100) présente de manière intrinsèque un milieu dissipateur de chaleur.
EP17772367.3A 2016-10-17 2017-09-19 Ensemble dissipateur de chaleur et procédé de fabrication Withdrawn EP3527053A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102016220265.0A DE102016220265A1 (de) 2016-10-17 2016-10-17 Wärme ableitende Anordnung und Verfahren zur Herstellung
PCT/EP2017/073646 WO2018072951A1 (fr) 2016-10-17 2017-09-19 Ensemble dissipateur de chaleur et procédé de fabrication

Publications (1)

Publication Number Publication Date
EP3527053A1 true EP3527053A1 (fr) 2019-08-21

Family

ID=59966731

Family Applications (1)

Application Number Title Priority Date Filing Date
EP17772367.3A Withdrawn EP3527053A1 (fr) 2016-10-17 2017-09-19 Ensemble dissipateur de chaleur et procédé de fabrication

Country Status (6)

Country Link
US (1) US20190378780A1 (fr)
EP (1) EP3527053A1 (fr)
JP (1) JP2019533903A (fr)
CN (1) CN109845424B (fr)
DE (1) DE102016220265A1 (fr)
WO (1) WO2018072951A1 (fr)

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WO2018072951A1 (fr) 2018-04-26
US20190378780A1 (en) 2019-12-12
CN109845424A (zh) 2019-06-04
DE102016220265A1 (de) 2018-04-19
CN109845424B (zh) 2021-11-09

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